JP6591161B2 - Film-like microstructure transfer device and method for producing film-like microstructure - Google Patents

Description

  The present invention relates to a film-like microstructure transfer device and a method for producing a film-like microstructure.

  Patent Document 1 discloses an invention relating to a method and apparatus for manufacturing a film structure. Patent Document 1 discloses a film structure manufacturing apparatus including a transfer roll, a backup roll provided in the vicinity of the transfer roll, a film feeding unit, and the like. A fine uneven pattern is formed on the peripheral surface of the transfer roll. Then, the transfer film is fed between the transfer roll and the backup roll, and the fine uneven pattern is transferred to the film side.

  Patent Document 2 also discloses a roll-to-roll apparatus including an uneven shape transfer roll and a backup roll.

  Patent Document 3 discloses an optical film for producing an optical film by forming a concave-convex shape formed on a peripheral side surface by pressing the base material on the peripheral side surface of a roll plate while conveying the base material. A manufacturing method is disclosed.

  Further, in Patent Document 3, in the start-up process, rotation of the roll plate and conveyance of the base material are started on the circumferential side surface of the roll plate with a protective material protecting the uneven shape of the circumferential side surface, and the roll plate It is disclosed that when the rotation and the conveyance of the base material stand up in a steady state, the protective material is removed to protect the uneven shape on the peripheral side surface of the roll plate by the base material.

Japanese Patent No. 4976868 JP 2009-220504 A JP 2013-142814 A

  In all of Patent Documents 1 to 3, there is no recognition of the problem of scratching the surface of the transfer roll with the film when the film is brought into contact with the transfer roll. Not presented.

  The present invention has been made in view of the above-described problems. When the surface of the film-like substrate is brought into contact with the outer peripheral surface of the transfer roll, the substrate causes a scratch mark on the outer peripheral surface of the transfer roll. An object of the present invention is to provide a film-like microstructure transfer device and a method for producing a film-like microstructure that can prevent the above-described problem.

  The film-like microstructure transfer device of the present invention is provided so as to be able to contact and separate from the transfer roll through a transfer roll having a fine uneven pattern formed on the outer peripheral surface, and a film-like substrate that runs in the longitudinal direction, A pair of nip rolls provided on the front side and the rear side of the transfer roll in the conveying direction of the transfer roll, respectively, for holding the substrate together with the transfer roll when approaching the transfer roll; A path guide roll that moves across the movement line of the nip roll and is provided on at least one of the transfer roll on the front side or the back side in the transport direction of the base material.

  According to this configuration, the path guide roll can avoid contact between the base material and the transfer roll, and can prevent the transfer roll from rubbing during paper feeding.

  In the film-like microstructure transfer device of the present invention, a film feeding portion for feeding out the base material provided on the front side of the transfer roll in the direction of transport of the base material, and a rear side of the transfer roll in the direction of transport of the base material. Between the film take-up portion that winds the provided base material, the front nip roll provided on the front side in the transport direction of the base material, and the film feeding portion, and on the rear side in the transport direction of the base material It is preferable to further comprise a brake part provided at least one of the rear nip roll provided and the film winding part.

The method for producing a film-like microstructure according to the present invention includes a contact step in which an outer peripheral surface on which a fine concavo-convex pattern of a transfer roll is formed and a surface of a film-like substrate are brought into contact from the surface direction of the substrate. If, anda transfer step of transferring the fine concavo-convex pattern of the transfer roll to the surface of the substrate while rotating the transfer roller, the contact step, intends line while applying tension to the substrate it, and, movably disposed across the pass line and the moving line of the pair of nip rolls provided respectively in the transport direction front and back of the substrate of the transfer roll of said substrate, and said transfer roll The path guide roll provided on at least one of the front side and the rear side in the transport direction of the base material is in a state in which the base material is pulled away from the transfer roll while applying tension to the base material. of Placed al, the substrate is moved to a second position where the contact with the said transfer roll, after Tsu taken up the surplus of the substrate, the nip roll, the transfer through the substrate It is characterized by being pressed against a roll .

  According to this configuration, by applying tension to the base material in the contact step, movement of the base material in the transport direction can be suppressed, and scratches can be prevented.

  In the method for producing a film-like microstructure of the present invention, it is preferable that the transfer roll is synchronized with the substrate.

  In the method for producing a film-like microstructure of the present invention, the transfer roll is formed by increasing the holding angle with the transfer roll, increasing the tension of the base material, and reducing the driving resistance of the transfer roll. It is preferable to synchronize with the base material.

In the method for producing a film-like microstructure of the present invention, the surface pressure of the nip roll is preferably 0.05 to 0.2 kgf / cm ² .

  In the method for producing a film-like microstructure according to the present invention, in a state in which one of the nip rolls located on the opposite side of the direction in which the excess of the base material is wound and the transfer roll is in contact with the transfer roll It is preferable to wind up the excess of the base material.

  In the method for producing a film-like microstructure of the present invention, a brake is applied on the opposite side across the transfer roll and the direction of winding the excess of the substrate, and the excess of the substrate is wound up. preferable.

  ADVANTAGE OF THE INVENTION According to this invention, when making the surface of a film-form base material contact | abut on the outer peripheral surface of a transfer roll, it can prevent that an abrasion mark is made on the outer peripheral surface of a transfer roll by a base material.

It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment. It is the schematic which shows the transfer apparatus used for the duplication process of the 2nd film-shaped mold of the manufacturing method of the film-shaped mold which concerns on this Embodiment. It is explanatory drawing which shows the manufacturing method of the nth film mold which concerns on this Embodiment. It is a section schematic diagram of a film-like mold.

  Hereinafter, an embodiment of the present invention (hereinafter abbreviated as “embodiment”) will be described in detail. In addition, this invention is not limited to the following embodiment, It can implement by changing variously within the range of the meaning.

  In the present embodiment, when the production of the film-like microstructure is started, the outer peripheral surface of the transfer roll is brought into contact with the film-like base material, and the generation of scratch marks on the outer peripheral surface of the transfer roll is prevented.

  A fine concavo-convex pattern is formed on the outer peripheral surface of the transfer roll, and the fine concavo-convex pattern is transferred to the transfer layer of the substrate to produce a film-like microstructure. Here, the “film-like microstructure” refers to a film having a fine uneven pattern transferred to a transfer layer of a base material, and a film-like mold (secondary material or intermediate material) and a film-like structure (permanent material, etc.). including. “Film” and “film shape” refer to a thin plate having flexibility, and do not limit the thickness, material, or the like.

  When the film-like microstructure is started, the rotation of the transfer roll and the conveyance of the substrate are synchronized when the surface of the film-like substrate is brought into contact with the outer peripheral surface of the transfer roll on which the fine uneven pattern is formed. If not, the fine concavo-convex pattern may be damaged by contact impact.

  Therefore, in the present embodiment, prior to the transfer step, the outer peripheral surface on which the fine uneven pattern of the transfer roll is formed and the surface of the film-like substrate are brought into contact with each other from the surface direction of the substrate. By carrying out the process while applying tension to the substrate, rubbing on the outer peripheral surface of the transfer roll is prevented.

  Hereinafter, the manufacturing method of the film-like microstructure according to the present embodiment will be described with reference to the transfer device of the present embodiment. In the present embodiment, a film mold will be described as an example.

(First film mold production process)
FIG. 1 is a schematic view of a transfer device used in the first film-shaped mold manufacturing method according to the present embodiment.

  A transfer apparatus 100 illustrated in FIG. 1 includes a feeding drive unit 102 that feeds out the mold base 101 and a winding drive unit 104 that winds up the mold base 101. Between the feeding drive unit 102 and the winding drive unit 104, a coating unit that coats the photocurable resin on the mold base 101 in order from the upstream side to the downstream side in the conveyance direction MD of the mold base 101. 105, a guide roll 106, a transfer roll (cylindrical mold) 107 having a fine concavo-convex pattern on the outer peripheral surface, and the photocurable resin on the mold base 101 and the outer peripheral surface of the transfer roll 107 are brought into close contact with each other. A pressing unit 108 including nip rolls 108a and 108b and a light source 109 for irradiating light to the photocurable resin are provided.

  In addition, when apply | coating photocurable resin using a solvent, you may further provide the drying furnace 111 which dries the solvent in photocurable resin.

  Here, the nip rolls 108a and 108b are provided so as to be able to come into contact with and separate from the transfer roll 107 via the mold base 101 that travels in the longitudinal direction (conveyance direction MD). For example, as shown in FIG. 1, the nip roll 108 a moves along the movement line I.

  Further, on the front side of the transfer base 107 in the conveyance direction of the mold base material 101, a pass guide roll 112 is provided on the front side of the mold base material 101 in the pass direction (conveyance path) and the mold base material 101 in the conveyance direction. The nip roll 108a is provided so as to be movable across the movement line I. That is, in the present embodiment, the pass guide roll 112 is arranged on the pass line of the mold base 101 between the front nip roll 108a and the transfer roll 107 in a state where the front nip roll 108a is separated from the transfer roll 107. On the other hand, it is configured to be movable between an upper first position A (indicated by a dashed line in FIG. 1) and a lower second position B (indicated by a solid line in FIG. 1). That is, the first position is a position where the pass guide roll 112 is not in contact with the mold base 101, and the second position is the pass guide roll 112 is in contact with the mold base 101, In this position, the mold base 101 is separated from the transfer roll 107.

  Further, a first brake unit 113 is provided between the front nip roll 108 a provided on the front side in the conveyance direction of the mold base 101 and the feeding drive unit 102 with respect to the transfer roll 107. On the other hand, a second brake portion 114 is provided between the rear side nip roll 108 b provided after the mold base 101 in the conveying direction with respect to the transfer roll 107 and the winding drive unit 104.

  Using the transfer apparatus 100 having the above-described configuration, a first film mold is produced as follows.

(Contact process)
In the present embodiment, prior to the transfer process, the outer peripheral surface of the transfer roll 107 on which the fine unevenness pattern is formed and the surface of the mold base 101 are brought into contact with each other from the surface direction of the mold base 101. This process is called a contact process.

  2-6 is the schematic of the transfer apparatus used for the manufacturing method of the 1st film mold which concerns on this Embodiment, and has shown especially the contact process. As shown in FIG. 2, the path guide roll 112 is disposed at the second position. In this state, the mold base material 101 is fed from the feed driving unit 102, and the mold base material 101 is passed through as shown by a one-dot chain line in FIG. In other words, the mold base 101 is passed through the path guide roll 112 without being brought into contact with the transfer roll 107.

  Next, as shown in FIG. 3, the 1st brake part 113 and the 2nd brake part 114 are made into ON state. Next, the feeding drive unit 102 and the winding drive unit 104 are operated. At this time, the feeding drive unit 102 and the winding drive unit 104 are driven with a torque of 30 N.

  Next, as shown in FIG. 4, the first brake unit 113 is turned off, the path guide roll 112 is moved to the first position, and the mold base 101 is brought into contact with the transfer roll 107. Next, the mold base 101 is pressure-bonded to the outer peripheral surface of the transfer roll 107 with a front nip roll 108 a provided on the front side in the conveyance direction of the mold base 101.

  Next, as shown in FIG. 5, the first brake unit 113 is turned on and the second brake unit 114 is turned off. Then, the mold base 101 is pressure-bonded to the outer peripheral surface of the transfer roll 107 with the rear nip roll 108 b provided on the rear side in the conveyance direction of the mold base 101.

  Next, as shown in FIG. 6, the second brake unit 114 is turned on. As a result, the outer peripheral surface of the transfer roll 107 on which the fine concavo-convex pattern is formed and the surface of the film-shaped mold base are brought into contact with each other from the surface direction of the mold base, and tension is applied to the mold base 101. You can apply.

  As described above, in the abutting step, as shown in FIG. 2, the path guide roll 112 avoids contact between the mold base 101 and the transfer roll 107, and scratches the transfer roll 107 during paper passing. Can be prevented.

  Further, in the abutting step, by applying tension to the mold base 101, the movement of the mold base 101 in the conveying direction can be suppressed and scratch marks can be prevented, and the nip roll abutted on the transfer roll 107. Since the speeds 108a and 108b are suppressed and the impact is reduced, damage to the transfer roll 107 can be reduced.

  In order to prevent the transfer roll 107 from rubbing in a state where the mold base 101 is in contact with the transfer roll 107, it is very important that the transfer roll 107 is synchronized with the mold base 101.

  In particular, at the moment when the mold base 101 starts to move from a stopped state, the transfer roll 107 does not follow the movement of the mold base 101, and the rubbing easily occurs. By increasing the holding angle with the transfer roll 107, increasing the contact area, reducing the driving resistance of the transfer roll 107, and increasing the tension of the mold base 101, the transfer roll 107 is connected to the mold base 101. Synchronize and suppress fraying.

The pressing force of the nip rolls 108a and 108b to the transfer roll 107 applies a force that can securely press the coated resin into the fine concavo-convex pattern of the transfer roll 107 via the mold base 101, and damages the fine concavo-convex pattern. It is necessary to keep it at a level not to give. In particular, the pressing force when pressing against the transfer roll 107 is preferably 0.05 to 0.2 kgf / cm ² .

  In the abutting step, rubbing is most likely to occur because the mold guide 101 is moved from the first position where the mold base 101 is separated from the transfer roll 107 to the transfer roll 107. It is moved to the second position where the contact is brought about, and the excess portion of the mold base 101 generated by the shortening of the path length eliminates the tension and comes into contact with the transfer roll 107.

  In order to prevent the transfer roll 107 from being rubbed due to the looseness of the mold base 101, it is important to always apply tension by winding the surplus portion of the mold base 101 by the feeding drive unit 102 or the winding drive unit 104. It is.

  First, in the contact step, the path guide roll 112 is moved from the first position where the mold base 101 is separated from the transfer roll 107 to the state where the mold base 101 is in contact with the transfer roll 107. When moving to the position 2, in order to prevent the transfer roll 107 from being rubbed due to the looseness of the mold base material 101, a tension is always applied by winding the surplus portion of the mold base material 101 by the feeding drive unit 102. Next, the mold base 101 is fixed by the nip roll 108a while maintaining the tension. With this fixing, the mold base 101 can be braked.

  Similarly, in order to fix the mold base 101 between the transfer roll 107 and the winding drive unit 104 by the transfer roll 107 and the nip roll 108b, the second brake unit 114 is released. By releasing the surplus portion of the mold base 101 by the take-up driving unit 104, a tension can be always applied. Next, the mold base 101 is fixed by the nip roll 108b while maintaining the tension. With this fixing, the mold base 101 can be braked.

  In the abutting step, a part of the mold base 101 is fixed by the first brake part 113 or the second brake part 114, and the surplus portion of the mold base 101 is provided by the feeding drive part 102 on the opposite side across the transfer roll 107. It is desirable to suppress the movement in the MD direction at the contact portion between the transfer roll 107 and the mold base 101 and to contact the stopped transfer roll 107 without rubbing by winding in one direction.

  As described above, it is fixed by the first brake part 113 or the second brake part 114, and the excess part of the mold base 101 is taken up by the winding drive part 104 or the feeding drive part 102 on the opposite side across the transfer roll 107. By keeping the mold base 101 in contact with the transfer roll 107, the movement in the MD direction can be suppressed and the stopped transfer roll 107 can be contacted without scratching. .

  As a method for fixing the mold base 101, the first brake part 113 or the second brake part 114 located on the opposite side of the direction in which the excess part of the mold base 101 is wound and the transfer roll 107 is used. In addition, it is possible to use nip rolls 108 a and 108 b positioned on the opposite side of the direction in which the excess of the mold base 101 is wound and the transfer roll 107. In order to brake the mold substrate 101 using the nip rolls 108 a and 108 b, it is preferable that a part of the nip rolls 101 a and 108 b is in direct contact with the transfer roll 107.

(Transfer process)
FIG. 7 is a schematic view of a transfer device used in the first film mold manufacturing method according to the present embodiment, and particularly shows a transfer process. As shown in FIG. 7, the 1st brake part 113 and the 2nd brake part 114 are made into an OFF state, the delivery drive part 102 and the winding drive part 104 are driven, and the mold base material 101 is conveyed. The photocurable resin layer (transfer layer) is formed by applying the photocurable resin onto the light-transmitting mold base material 101 fed from the feeding drive unit 102 by the coating unit 105. The mold base 101 with the photocurable resin layer is supplied to the transfer roll 107 through the guide roll 106.

  Next, while rotating the transfer roll 107 and the nip rolls 108a and 108b, the outer peripheral surface of the transfer roll 107 is brought into close contact with the photocurable resin layer to transfer the fine uneven pattern onto the surface of the photocurable resin layer.

  A fine uneven pattern is formed on the outer peripheral surface of the transfer roll 107, and the photocurable resin layer and the fine uneven pattern are in close contact with each other. The mold base 101 has a configuration in which a photocurable resin layer is formed with a predetermined thickness on a film-like base.

  The fine concavo-convex pattern is a pillar shape including a plurality of conical, pyramidal, or elliptical cone-shaped convex portions, or a hole shape or a line-and-space shape including a plurality of conical, pyramid-shaped, or elliptical conical-shaped concave portions. Here, the “pillar shape” is a “shape in which a plurality of columnar bodies (conical states) are arranged”, and the “hole shape” is a “shape in which a plurality of columnar (conical) holes are formed”. is there.

  The scale of the fine concavo-convex pattern is not particularly specified because it depends on the application to be used, but it refers to tens of nanometers to tens of micrometers. The scale may be the size, diameter, depth, and pitch of one microstructure. A random structure can be one of the fine structures.

  As an example of the size, the fine concavo-convex pattern has, for example, a pitch P of about 100 nm to 3000 nm (preferably 200 nm or more) and a protrusion width D of about 30 nm to 3000 nm (preferably 100 nm or more). Further, the height H of the convex portion is about several tens of nm to several tens of μm. The pitch P is defined by a size obtained by adding the widths of adjacent convex portions and concave portions, an intermediate width between adjacent convex portions, or an intermediate width between adjacent concave portions. Moreover, the film thickness of the photocurable resin layer of the mold base 101 is about 1 to 20 μm.

  Subsequently, the photocurable resin layer is irradiated with light from the light source 109 to photocur the photocurable resin layer to form a cured resin layer.

  Thus, the first film mold 103 having a fine uneven pattern on the surface can be produced. Then, as shown in FIG. 7, the first film mold 103 is wound up by the winding drive unit 104.

  In addition, in the manufacturing process of the 1st film-form mold 103, in order to protect the fine uneven | corrugated pattern transcribe | transferred from the transfer roll 107 to the 1st film-form mold 103, it protects on the photocurable resin layer after photocuring. A film (cover film) may be laminated.

(Second film mold replication process)
FIG. 8 is a schematic view showing a transfer device used in the second film-shaped mold duplication process of the film-shaped mold manufacturing method according to the present embodiment.

  The transfer apparatus 200 shown in FIG. 8 includes a first delivery roll 202 for delivering the transfer target substrate 201 and a first take-up roll 204 for winding the completed second film mold 203. . Between the first delivery roll 202 and the first take-up roll 204, the first film-like mold 103 is placed on the surface of the substrate 201 to be transferred in order from the upstream side to the downstream side in the transport direction MD. Application means 205 for applying a photocurable resin, a second delivery roll 206 for delivering the first film mold 103, and for bonding the first film mold 103 and the substrate 201 to be transferred. A bonding unit 207, a guide roll 208, a pressing unit 209 for bringing the first film mold 103 and the transferred substrate 201 into close contact, a light source 210 for irradiating light to the photocurable resin layer, and a guide A roll 211 and a second take-up roll 212 for taking up the first film mold 103 are provided.

  The bonding means 207 is composed of a pair of laminate rolls 207a and 207b. The pressing means 209 presses the first film mold 103 and the transferred substrate 201 against the rubber roll 209a on which the first film mold 103 and the transferred substrate 201 are conveyed on the outer peripheral surface thereof. Nip rolls 209b and 209c.

  Further, when the photocurable resin is dissolved in a solvent and applied to the transfer base material 201, a drying furnace 213 can be provided on the downstream side of the applying unit 205. Further, a drying furnace 214 may be provided on the downstream side of the bonding unit 207.

  Further, the first delivery roll 202 and the second delivery roll 206 may be interchanged. That is, a photocurable resin may be applied on the unevenness forming surface of the cured resin layer of the first film mold 103.

  Using the transfer device 200 having such a configuration, the second film-shaped mold is duplicated as follows.

  First, the substrate 201 to be transferred is fed from the first feed roll 202, and the photocurable resin is directly applied on the surface by the coating means 205 to form a photocurable resin layer.

  Next, the unevenness forming surface of the resin cured product layer of the first film mold 103 unwound from the second delivery roll 206 by the bonding means 207 is applied to the photocurable resin layer on the substrate 201 to be transferred. to paste together.

  At this time, the photocurable resin layer on the transferred substrate 201 is bonded to the resin application region on the unevenness forming surface of the cured resin layer of the first film mold 103. The first film-like mold 103 and the transferred substrate 201 can be aligned, for example, by installing a film meandering adjustment device.

  The first film mold 103 and the substrate 201 to be transferred are supplied to the pressing unit 209 through the guide roll 208. In the pressing means 209, the uneven surface of the cured resin layer of the first film mold 103 is brought into close contact with the photocurable resin layer. In this state, the light curable resin is irradiated with light from the light source 210 to photocur the photocurable resin. The adhesion by the pressing means 209 can prevent uncured by oxygen.

  Thereafter, the first film-shaped mold 103 and the substrate to be transferred 201 are conveyed to the guide roll 211, where the substrate to be transferred has a cured resin layer formed on the surface from the first film-shaped mold 103. 201, that is, the second film mold 203 is peeled off. At this time, the inverted shape of the fine uneven structure of the first film mold 103 is transferred to the second film mold 203.

  Thereafter, the second film-shaped mold 203 is wound around the first winding roll 204. On the other hand, the first film mold 103 is wound around the second winding roll 212.

(Preparation of nth film mold)
In the film-shaped mold manufacturing method according to the present embodiment described above, the second film-shaped mold 203 is duplicated using the first film-shaped mold 103 produced by transferring the fine concavo-convex pattern from the transfer roll 107 as an original plate. Explained the case. However, it is also possible to further replicate the third film mold using the second film mold 203 as an original plate. That is, the present invention can be applied from the (n−1) th (n is an integer of 2 or more) film-shaped mold to the method for producing the n-th film-shaped mold.

  FIG. 9 is an explanatory view showing a method of manufacturing the nth film mold according to the present embodiment. As shown in FIG. 9, a first film mold M-1 is prepared using a cylindrical mold M-0 as an original plate, and a second film mold M1 is formed using the first film mold M-1 as an original plate. -2 can be duplicated. Further, the third film mold M-3 can be duplicated using the second film mold M-2 as an original plate. Similarly, the nth film mold M-n can be duplicated using the n-1th film mold M- (n-1) as an original plate.

  That is, the (n-1) th film mold M- (n-1) used for replicating the nth film mold M-n is the previous (n-2) th film mold M-. (N-2) (not shown) was used as an original plate.

  Any of the second to n-th film molds M-2 to M-n manufactured as described above can be used for mass-producing the product P with a fine concavo-convex structure using this as an original plate.

(Application example of nth film mold)
The nth film mold obtained by the method for manufacturing a film mold according to the present embodiment described above includes, for example, the manufacture of an antireflection material, the production of a resist mask, a cell culture medium, a super-water-repellent process, It can be applied to hydrophilic processing and is useful. For example, a film having a periodic fine concavo-convex structure including a pillar shape, a cone shape, a pyramid shape, and a cone shape can be used as an antireflection film having a moth-eye structure having an antireflection effect. Here, the moth-eye structure refers to a structure in which submicron-order pyramidal uneven structures are arranged in a two-dimensional pattern such as an eyelet. In such a fine structure, a nano-order fine concavo-convex structure formed on the surface induces a smooth curvature gradient, and no reflection caused by a difference in refractive index at the interface occurs. Therefore, it is suitable as an antireflection film. It can be used. Moreover, a resist mask can be produced on the surface of the substrate to be etched using the nth film mold obtained by the method for manufacturing a film mold according to the present embodiment.

  In this embodiment, the path guide roll 112 is disposed between the transfer roll 107 and the front nip roll 108a, but may be disposed between the transfer roll 107 and the rear nip roll 108b. You may arrange | position in both of these.

  Hereafter, the component of the manufacturing method of the film mold which concerns on this Embodiment is demonstrated in detail.

(Applying means)
Examples of the coating method of the photocurable resin onto the film-like substrate by the coating means 105 and 205 include a coating method using a known coating coater or impregnation coating coater. Specific examples include coating methods using a gravure coater, micro gravure coater, blade coater, wire bar coater, air knife coater, dip coater, comma knife coater, spray coater, curtain coater, spin coater, laminator and the like. These coating methods may use one type of coating method as needed, or may be used in combination of two or more types of coating methods. In addition, these coating methods are preferably applied in a continuous manner from the viewpoint of productivity. A continuous coating method using a dip coater, comma knife coater, gravure coater or laminator is particularly preferred.

(light source)
The light sources 109 and 210 used for light irradiation to the photocurable resin are not particularly limited, and various light sources can be used depending on the application and equipment. For example, a high pressure mercury lamp, a low pressure mercury lamp, an electrodeless lamp, a metal halide lamp, an excimer lamp, an LED lamp, a xenon pulse ultraviolet lamp, or the like can be used. Further, photocurable resins can amount exposed to ultraviolet rays or visible light having a wavelength 200nm~500nm is cured by irradiation so as to ^{100mJ / cm 2 ~2000mJ / cm 2} . Further, from the viewpoint of preventing the inhibition of the photocuring reaction due to oxygen, it is desirable to irradiate light with a low oxygen concentration during light irradiation.

(Transfer roll)
The transfer roll 107 is more preferably seamless. If there is a seam, the final product with a fine uneven pattern will be cut off where there is no fine uneven pattern corresponding to the seam, which will not only reduce the yield, but will add extra work for continuous production. Sexuality also deteriorates.

  The fine concavo-convex pattern of the transfer roll 107 is formed by a cylindrical method by a processing method such as a laser cutting method, an electron beam drawing method, a photolithography method, a direct drawing lithography method using a semiconductor laser, an interference exposure method, an electroforming method, or an anodizing method. It can form directly on the outer peripheral surface of a substrate. Among these, from the viewpoint of obtaining a transfer roll that is seamless to a fine concavo-convex pattern, a photolithography method, a direct drawing lithography method using a semiconductor laser, an interference exposure method, an electroforming method, and an anodizing method are preferable, and a semiconductor laser is used. The direct drawing lithography method, the interference exposure method, and the anodic oxidation method that are used are more preferable.

  Further, as the transfer roll 107, a fine structure formed on the surface of the flat substrate by the above processing method is transferred to a resin material (film), and this film is bonded to the outer peripheral surface of the transfer roll with high positional accuracy. Also good. Moreover, the fine structure formed on the surface of the flat substrate by the above processing method may be transferred to a thin film such as nickel by electroforming, and the thin film wound around a roller may be used.

  As a material of the transfer roll 107, it is desirable to use a material that can easily form a fine uneven pattern and has excellent durability. From such a viewpoint, a glass roll, a quartz glass roll, a nickel electroformed roll, a chromium electroformed roll, an aluminum roll, or a SUS roll (stainless steel roll) is preferable.

  As the base material for the nickel electroforming roll and the chromium electroforming roll, a conductive material having conductivity can be used. As the conductive material, for example, materials such as iron, carbon steel, chrome steel, cemented carbide, steel for mold (for example, maraging steel), stainless steel, aluminum alloy and the like are preferably used.

  It is desirable to perform a mold release process on the surface of the transfer roll 107. By performing the mold release treatment, the surface free energy of the transfer roll 107 can be reduced, so that even when continuously transferred to a photo-curing resin, good releasability and a fine uneven pattern pattern shape are maintained. can do. Moreover, since the mold release property of the transfer roll 107 is reflected from the first film mold 103 to the second film mold 203 to be replicated, it is preferable to perform a mold release process.

  A commercially available release agent and surface treatment agent can be used for the release treatment. Examples of commercially available mold release agents and surface treatment agents include OPTOOL (registered trademark) (manufactured by Daikin Chemical Industry Co., Ltd.), Durasurf (registered trademark) (manufactured by Daikin Chemical Industry Co., Ltd.), Novec (registered trademark) series (3M Company). Manufactured). Moreover, as a mold release agent and a surface treatment agent, a suitable mold release agent and a surface treatment agent can be selected suitably by the combination with the kind of material of the transfer roll 107, and the photocurable resin transcribe | transferred.

(Film mold)
The film mold will be described below. FIG. 10 is a schematic cross-sectional view of a film mold. FIG. 10 illustrates the first film mold 103. As shown in FIG. 10, the first film mold 103 has a cured resin layer 117 formed on a film substrate 115. As shown in FIG. 10, a fine uneven pattern 116 is formed on the surface of the cured resin layer 117. The fine concavo-convex pattern 116 shown in FIG. 10 is a shape obtained by transferring the fine concavo-convex pattern of the transfer roll 107, that is, a reverse shape (reverse pattern) of the fine concavo-convex pattern. The fine concavo-convex pattern 116 is a pillar shape including a plurality of conical, pyramidal, or elliptical cone-shaped convex portions, or a hole shape or a line-and-space shape including a plurality of conical, pyramid-shaped, or elliptical conical concave portions. As an example of the size, the fine uneven pattern 116 has, for example, a pitch P of about 100 nm to 3000 nm (preferably 200 nm or more), a protrusion width D of about 30 nm to 3000 nm (preferably 100 nm or more), and a protrusion. The height H1 is about several tens of nm to several tens of μm. The pitch P is defined by a size obtained by adding the widths of adjacent convex portions and concave portions, an intermediate width between adjacent convex portions, or an intermediate width between adjacent concave portions.

(Film substrate)
A light-transmissive film-like substrate can be used as the mold substrate 101 used in the production of the first film-like mold and the transfer-receiving substrate 201 used for duplicating the second film-like mold.

  The film-like substrate is not particularly limited as long as it is mainly composed of a material that has a substantially light-transmitting property with respect to a light source used in the ultraviolet / visible light region, but has excellent handling properties and workability. A resin material is preferable. Examples of such resin materials include polymethyl methacrylate resin, polycarbonate resin, polystyrene resin, cycloolefin resin (COP), cross-linked polyethylene resin, polyvinyl chloride resin, polyarylate resin, polyphenylene ether resin, and modified polyphenylene ether resin. , Polyetherimide resin, polyether sulfone resin, polysulfone resin, polyether ketone resin, amorphous thermoplastic resin such as triacetyl cellulose (TAC) resin, polyethylene terephthalate (PET) resin, polyethylene naphthalate resin And crystalline thermoplastic resins such as polyethylene resin, polypropylene resin, polybutylene terephthalate resin, aromatic polyester resin, polyacetal resin, and polyamide resin.

  Although the thickness of a film-like base material is based also on material, Preferably it is 20-200 micrometers, More preferably, it is 50-150 micrometers, More preferably, it is 50-100 micrometers. If it is 200 micrometers or less, the transmittance | permeability of the ultraviolet-ray used for the light source of optical nanoimprint is favorable, and sufficient light quantity for photocuring can be obtained. If it is 20 micrometers, since the rigidity as a film can be hold | maintained, handling is easy.

  The surface of the film-like substrate can be subjected to primer treatment, atmospheric pressure plasma treatment, and corona treatment in order to improve adhesion to the photocurable resin.

(Photo curable resin)
The photocurable resin layer is formed of a photocurable resin. Photocurable resins are transferability, peelability from the original plate, adhesion to film-like substrates, viscosity, film-forming properties, photosensitivity, mechanical properties after curing, and peelability from the resin layer during resin mold preparation. Select with consideration.

  As the photocurable resin, for example, various acrylate compounds and methacrylate compounds that can be polymerized by a photopolymerization initiator, epoxy compounds, isocyanate compounds, thiol compounds, silicone compounds, and the like can be used. Among these, acrylate compounds, methacrylate compounds, epoxy compounds, and silicone compounds are preferably used, and acrylate compounds and methacrylate compounds are more preferably used. These compounds may be used alone or in combination of a plurality of types such as a combination of an epoxy compound and an acrylate compound.

  Examples of the acrylate compound and methacrylate compound include aromatic (meth) acrylates such as (meth) acrylic acid, phenoxyethyl acrylate, and benzyl acrylate.

  Examples of the acrylate compound and the methacrylate compound include EO-modified glycerol tri (meth) acrylate, ECH-modified glycerol tri (meth) acrylate, and PO-modified glycerol tri (meth) acrylate.

  Moreover, as a photocurable resin, the fluorine-containing compound by which the hydrogen in hydrocarbon was substituted by the fluorine among the said acrylate compound, a methacrylate compound, an epoxy compound, an isocyanate compound, and a silicone type compound can be used. By using the fluorine-containing compound, the surface free energy after curing is reduced, and the transferred product (first film mold 103 and first film mold 103 and the first film mold 103) from the original plate (transfer roll 107 and first film mold 103) in the transfer step The releasability of the second film mold 203) is improved.

  The fluorine-containing (meth) acrylate preferably has a polyfluoroalkylene chain and / or a perfluoro (polyoxyalkylene) chain and a polymerizable group.

  The photocurable resin preferably contains a photopolymerization initiator in order to improve photosensitivity. Examples of the photopolymerization initiator include a photoradical polymerization initiator, a photoacid generator, and a photobase generator. The photopolymerization initiator can be selected in consideration of the light source wavelength to be used, the substrate (transparent sheet), various physical properties, and the like. Examples of commercially available initiators include “IRGACURE (registered trademark, the same applies hereinafter)” manufactured by BASF (for example, IRGACURE651, 184, 500, 2959, 127, 754, 907, 369, 379, 379EG, 819, 1800, 784, OXE01, OXE02) and “DAROCUR (registered trademark, the same applies hereinafter)” (for example, DAROCUR1173, MBF, TPO, 4265) and the like.

  As a photocurable resin, what contains a sensitizer for a photosensitivity improvement is preferable. Examples of such a sensitizer include Michler's ketone and 4,4'-bis (diethylamino) benzophenone. Moreover, a sensitizer may be used individually by 1 type and may use multiple types as a mixture.

  The viscosity of the photocurable resin can be adjusted by adding a solvent. As the solvent, N, N-dimethylformamide, N-methyl-2-pyrrolidone, N-ethyl-2-pyrrolidone, and the like are preferable. These solvents may be used alone or in combination of two or more. Among these solvents, N-vinyl-2-pyrrolidone, N-methyl-2-pyrrolidone, acetone, methyl ethyl ketone, and isopropyl alcohol are preferable.

  In addition, the mold base material in this Embodiment is applied to all shapes, such as a metal mold | die other than roll shape.

  Hereinafter, the present invention will be described in detail by way of examples and comparative examples carried out in order to clarify the effects of the present invention. In addition, this invention is not limited at all by the following examples.

Example 1
With the winding side brake turned on, the feeding drive unit is operated, and the nip roll is brought into contact with the transfer roll through the mold base at a surface pressure of 0.05 kgf / cm ² at a film tension of 30 N on the feeding side. did.

  As a result, the excess mold base material was always wound up by the feeding-side drive unit, so that the movement of the film in the MD direction was suppressed, and the scratch marks on the transfer roll were reduced to 1 to 2 mm.

(Comparative Example 1)
With the winding-side brake turned on, the feeding drive unit is operated, and the nip roll is applied to the transfer roll through the mold base at a surface pressure of 0.2 kgf / cm ² or more with a film tension of 30 N on the feeding side. Touched.

  As a result, it was confirmed that the fine uneven pattern of the transfer roll was damaged. Further, when one nip roll arranged on both sides of the transfer roll hits one side (uneven load), it was confirmed that the fine uneven pattern of the transfer roll was damaged at the portion where the nip roll contacted first.

(Comparative Example 2)
With the winding-side brake turned on, the feeding drive unit is operated, and the nip roll is applied to the transfer roll through the mold base at a surface pressure of 0.04 kgf / cm ² or less with a film tension of 30 N on the feeding side. However, the nip roll was separated from the transfer roll due to fluctuations in tension, and the contact process could not be completed.

(Comparative Example 3)
With the winding-side brake turned on, the feeding drive unit is not operated, the film tension on the feeding side is not applied, and the nip roll is transferred through the mold base material at a surface pressure of 0.05 kgf / cm ² . Abutted.

  As a result, the excess mold base material was rubbed against the transfer roll while moving in the MD direction by gravity, and a 10-50 mm rub mark was generated on the transfer roll.

(Example 2)
With the winding-side brake turned on, the pass guide roll provided on the transfer roll front side of the mold base in the conveying direction is applied with a tension of 30 N by the feeding side drive unit, and the mold base is removed from the transfer roll. The mold base is moved from the first position where it is separated to the second position where the mold base is in contact with the transfer roll, and the nip roll is moved through the mold base at a surface pressure of 0.05 kgf / cm ² . In contact with the transfer roll. As a result, no scratch marks were generated on the transfer roll.

(Comparative Example 4)
A path guide roll provided on the transfer roll in front of the mold substrate in the conveying direction while applying a tension of 30 N to the mold substrate by the feeding side driving unit and the winding side driving unit without applying a brake on the winding side. Is moved from the first position where the mold substrate is separated from the transfer roll to the second position where the mold substrate is in contact with the transfer roll, and the nip roll is moved to a surface pressure of 0.05 kgf / in contact with the transfer roll through the film at cm ^2.

  As a result, the film contacted while moving in the MD direction, and scratches of 1 to 2 mm were generated on the transfer roll.

  The present invention can be applied to a method for producing a film-like microstructure for forming a fine concavo-convex pattern, and the obtained film-like microstructure is, for example, production of an antireflection material, production of a resist mask, It can be suitably applied to cell culture media, superhydrophobic processing and superhydrophilic processing.

100, 200 Transfer device 101 Mold substrate 103, 203 Film mold 105, 205 Application means 107 Transfer roll 108, 209 Press means 108a, 108b, 209b, 209c Nip roll 109, 210 Light source 112 Path guide roll 113 First brake section 114 2nd brake part 115 Film-like base material 117 Resin hardened material layer

Claims (8)

A transfer roll having a fine uneven pattern formed on the outer peripheral surface;
The base of the transfer roll, which is provided so as to be able to come into contact with and separate from the transfer roll via a film-like base material running in the longitudinal direction, and holds the base material together with the transfer roll when approaching the transfer roll. A pair of nip rolls provided respectively on the front side and the rear side in the conveying direction of the material;
A path guide roll that moves across the pass line of the base material and the movement line of the nip roll, and is provided on at least one of the transfer roll front side or rear side of the base material,
A film-like microstructure transfer device comprising: A film feeding portion for feeding out the base material provided on the front side in the transport direction of the base material of the transfer roll;
A film winding unit that winds up the base material provided on the back side of the transfer roll in the base material conveyance direction;
Between the nip roll on the front side provided on the front side in the transport direction of the base material and the film feeding portion, and on the rear side in the transport direction of the base material, the nip roll on the rear side and the film winding portion, A brake part provided on at least one of
The film-like microstructure transfer device according to claim 1, further comprising: An abutting step of abutting the outer peripheral surface on which the fine uneven pattern of the transfer roll is formed and the surface of the film-like substrate from the surface direction of the substrate;
A transfer step of transferring the fine concavo-convex pattern of the transfer roll to the surface of the substrate while rotating the transfer roll,
The contact step includes
Line Ukoto while applying tension to the substrate and,
Movably disposed across the pass line and the moving line of the pair of nip rolls the respectively provided in the transport direction front and back of the base material of the transfer roll of the substrate, and the substrate of the transfer roll From a first position where the base material is pulled away from the transfer roll while applying a tension to the base material, the path guide roll provided on at least one of the transport direction front side or the rear side, is moved to the second position in a state where the substrate is in contact with the transfer roll, after Tsu taken up the surplus of the substrate, the nip rolls press the transfer roll through the base A method for producing a film-like microstructure characterized by being applied .   4. The method for producing a film-like microstructure according to claim 3, wherein the transfer roll is synchronized with the substrate.   2. The transfer roll is synchronized with the base material by increasing a holding angle with the transfer roll, increasing a tension of the base material, and reducing a driving resistance of the transfer roll. 4. A method for producing a film-like microstructure according to 4. Surface pressure of the nip rolls, the production method of the film-like microstructure according to claims 3 to claim 5, characterized in that the 0.05~0.2kgf / cm ^2.   Winding the surplus portion of the base material in a state in which one of the nip rolls located on the opposite side of the transfer roll and the direction of winding the surplus portion of the base material is in contact with the transfer roll The method for producing a film-like microstructure according to any one of claims 3 to 6.   7. The brake according to claim 3, wherein a brake is applied on a side opposite to a direction in which the surplus portion of the base material is wound and the transfer roll, and the surplus portion of the base material is wound up. The manufacturing method of the film-form microstructure described in 2.

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