JP6591068B2 - Sls設備又はslm設備の少なくとも1つの走査システムを較正するための方法 - Google Patents
Sls設備又はslm設備の少なくとも1つの走査システムを較正するための方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
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- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37017—Calibration of vision system, set correct attidude of sensor to workpiece
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49018—Laser sintering of powder in layers, selective laser sintering SLS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Description
2 構造フィールド
3 レーザ
4 ビーム
5 ビームスプリッタ
6a/b 走査格子、走査システム
7 プロセッサ及びメモリ
8a/b 走査格子
8c/d 位置ラインパターン
9 較正されたカメラ
10 出口
11 入口
15 ディスプレイ
16 キーボード
Claims (10)
- レーザ焼結(SLS)設備又はレーザ溶融(SLM)設備(1)の少なくとも1つの走査システム(6a/6b)を較正するための方法であって、前記設備内では、構造過程において構造フィールドで焼結可能な又は溶融可能な構造材料を溶解又は溶融させ、これによりこの冷却後に選択的に構造材料を凝固化させるために、少なくとも1つのビーム源から集められたビーム(4)が前記少なくとも1つの走査システム(6a/6b)を用いて構造フィールド(2)へ偏向される、前記方法において、
前記少なくとも1つの走査システム(6a/6b)によって前記構造フィールド(2)の層の表面に少なくとも1つのラインパターンを生成するステップであって、前記少なくとも1つのラインパターンが、目標ラインパターンが永続的に付されて提供される較正プレートの表面の上側へ映写され、前記少なくとも1つの走査システム(6a/6b)によって生成される前記ラインパターンの前記目標ラインパターンとの差異が、前記構造フィールド(2)の上方に配置されたカメラ(9)によって検出され、メモリ(7)に読み込まれる前記少なくとも1つのラインパターンを生成するステップと、
前記ラインパターンのひずみの補正のための情報を含む、前記少なくとも1つの走査システム(6a/6b)に関する補正データの演算によって、前記ラインパターンのフィールド補正を行うステップと、
前記較正プレートの表面で、一時的に視認可能であり、前記構造フィールド(2)の上方のカメラ(9)で検出可能な前記ラインパターンの前記差異を計測し、該差異を、前記走査システム(6a/6b)によって生成された前記ラインパターンと前記較正プレートに永続的に付された前記目標ラインパターンとが一致するように補正するステップと、
を備えた方法。 - 前記ラインパターンのひずみの補正を行うための前記ラインパターンのフィールド補正によって較正されたカメラ(9)を用いながら、前記構造フィールド(2)を照射するステップと、
前記カメラ(9)を用いて検出し、前記ラインパターンのひずみが既に補正されたラインパターンをメモリ(7)に読み込むステップと、
回転、オフセット、スケーリング、及び/又は複数の走査システム(6a/6b)の相互の相対的変位に関する別の補正データを、前記複数の走査システム(6a/6b)のいずれかに適用することで、前記複数の走査システム(6a/6b)のいずれか及び該走査システムによって生成されたラインパターンが、相互に整向及び調節がなされるように、前記別の補正データを算出するステップを備えた請求項1に記載の方法。 - 前記複数の走査システム(6a/6b)について、前記別の補正データを算出するステップを備える請求項2に記載の方法。
- 前記複数の走査システム(6a/6b)について算出された補正データが、組み合わされた補正データセットへ統合される請求項3に記載の方法。
- 前記構造フィールド(2)の外側の境界に関して、前記別の補正データを算出するステップを備える請求項2又は3に記載の方法。
- 隣接する走査システム(6a/6b)に対応する前記ラインパターンが、互いに交差する請求項2〜5のいずれか1項に記載の方法。
- 隣接する走査システム(6a/6b)の前記ラインパターンが、互いに離れて並んで配置されている請求項2〜5のいずれか1項に記載の方法。
- 相互の回転、相互のオフセット、相互のスケーリング、若しくは変位によって生じる、隣接するラインパターン又は範囲ごとに重なるラインパターンの差異を、ディスプレイ(15)に表示するステップを備えた請求項2〜7のいずれか1項に記載の方法。
- 前記走査システム(6a/6b)のレーザビーム(4)が、前記構造フィールド(2)の上方に設けられた前記カメラ(9)によって検出可能である常に視認可能なラインパターンを生成するように、前記表面に照射される請求項1〜8のいずれか1項に記載の方法。
- 前記少なくとも1つの走査システム(6a/6b)を備える場合に、回転、スケーリング、及び変位についての算出された補正値が、構造チャンバ内における前記ラインパターンの位置又は前記構造チャンバのエッジ部に関する位置である請求項1〜9のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE102016106403.3 | 2016-04-07 | ||
DE102016106403.3A DE102016106403A1 (de) | 2016-04-07 | 2016-04-07 | Verfahren zur Kalibrierung wenigstens eines Scannsystems, einer SLS- oder SLM-Anlage |
PCT/EP2017/052273 WO2017174226A1 (de) | 2016-04-07 | 2017-02-02 | Verfahren zur kalibrierung wenigstens eines scannsystems, einer sls- oder slm-anlage |
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JP2018526254A JP2018526254A (ja) | 2018-09-13 |
JP6591068B2 true JP6591068B2 (ja) | 2019-10-16 |
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US (1) | US11014196B2 (ja) |
EP (1) | EP3439854B1 (ja) |
JP (1) | JP6591068B2 (ja) |
CN (1) | CN107708971B (ja) |
DE (1) | DE102016106403A1 (ja) |
WO (1) | WO2017174226A1 (ja) |
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DE102017219559A1 (de) | 2017-11-03 | 2019-05-09 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zur Vermessung eines Basiselements einer Bauzylinder-Anordnung, mit Ablenkung eines Messlaserstrahls durch eine Scanner-Optik |
US10919218B2 (en) * | 2017-11-08 | 2021-02-16 | General Electric Company | Interlace calibration and methods of use thereof |
EP3735330A1 (en) * | 2017-11-10 | 2020-11-11 | General Electric Company | Scan field variation compensation |
CN109159424B (zh) * | 2018-08-20 | 2020-11-06 | 湖南华曙高科技有限责任公司 | 用于三维物体制造的扫描控制方法及其装置、可读存储介质 |
EP3626433B1 (en) | 2018-09-19 | 2021-08-04 | Concept Laser GmbH | Method for calibrating an irradiation device |
EP3626437A1 (en) * | 2018-09-21 | 2020-03-25 | Concept Laser GmbH | Method for calibrating an apparatus for additively manufacturing threedimensional objects |
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- 2016-04-07 DE DE102016106403.3A patent/DE102016106403A1/de not_active Ceased
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2017
- 2017-02-02 EP EP17703945.0A patent/EP3439854B1/de active Active
- 2017-02-02 CN CN201780002040.1A patent/CN107708971B/zh not_active Expired - Fee Related
- 2017-02-02 WO PCT/EP2017/052273 patent/WO2017174226A1/de unknown
- 2017-02-02 US US16/083,840 patent/US11014196B2/en active Active
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EP3439854B1 (de) | 2020-08-05 |
WO2017174226A1 (de) | 2017-10-12 |
US20190134747A1 (en) | 2019-05-09 |
CN107708971A (zh) | 2018-02-16 |
JP2018526254A (ja) | 2018-09-13 |
DE102016106403A1 (de) | 2017-10-12 |
US11014196B2 (en) | 2021-05-25 |
EP3439854A1 (de) | 2019-02-13 |
CN107708971B (zh) | 2020-12-22 |
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