JP6589431B2 - Bonded body, bonding method, and electronic apparatus - Google Patents

Description

  The present invention relates to a joined body, a joining method, and an electronic device.

  A joining method for joining (adhering) two members (base materials) to each other using an adhesive such as an epoxy adhesive, a urethane adhesive, or a silicone adhesive is widely known.

  When two members are bonded to each other using such an adhesive, a liquid or paste adhesive is applied to the bonding surface, the members are bonded to each other through the applied adhesive, Alternatively, the adhesive is generally cured (solidified) by the action of light. As a joining method, a method using a catalyst curing type adhesive that cures by a catalytic action is known (for example, see Patent Document 1).

  For example, in the method described in Patent Document 1, a silicone rubber composition sheet that is cured by the catalytic action of a platinum catalyst is used. In such a method, a paste-like platinum catalyst is applied to the adherend surface and dried, and then an uncured silicone rubber composition sheet is placed in contact with the platinum catalyst between the adherend surface and the adhesion surface of the object. In this state, the silicone rubber composition sheet is cured by catalytic action.

Japanese Patent Laid-Open No. 2000-8002

  However, the method described in Patent Document 1 has a problem in that an uncured or semi-cured bonding material (silicone rubber composition sheet) may remain in an unexpected state.

  For example, when a nozzle plate of a printer head and a member adjacent thereto are joined, the joining material protrudes to the vicinity of the nozzle holes of the nozzle plate, which may affect the ink ejection characteristics. In particular, in recent years, the pitch of the nozzle holes has been narrowed, and along with this, the problem due to the protruding bonding material as described above becomes significant.

  An object of the present invention is to provide a bonded body and a bonding method capable of reducing the protrusion of a bonded material after curing and realizing high-precision bonding, and excellent in reliability provided with such a bonded body. To provide electronic equipment.

The above object is achieved by the present invention described below.
The joined body of the present invention comprises a first member to be joined comprising a first surface and a first through hole having a first opening that is open to the first surface;
A second member to be joined comprising a second surface and a second through hole having a second opening communicating with the first through hole and opening in the second surface;
A catalyst provided on at least one of the first surface and the second surface;
Between the first surface and the second surface, the first opening and the second opening are disposed in a plan view of the first surface, and are cured by the action of the catalyst, A bonding material bonding the first bonded member and the second bonded member;
It is characterized by having.

  According to such a joined body, for example, an uncured or semi-cured joining material protrudes into the first through hole and the second through hole by using the first through hole and the second through hole as a solvent flow path. Can be reduced. On the other hand, desired portions of the first surface and the second surface around the first through hole and the second through hole can be selectively joined with high accuracy.

  In the joined body of the present invention, the thickness of the catalyst is preferably in the range of 10 nm to 1000 nm.

  As a result, it is possible to realize a high-definition bonding by suitably exerting the catalytic action and increasing the bonding strength between the first surface and the second surface and reducing the layer thickness of the entire layer made of the catalyst and the bonding material. it can.

  In the joined body of the present invention, the thickness of the joining material is preferably in the range of 0.5 μm or more and 5.0 μm or less.

  Thereby, the effect | action of a catalyst can be efficiently produced in the thickness direction whole region of a joining material, and high intensity | strength joining can be implement | achieved.

  In the joined body of the present invention, it is preferable that a width of at least one of the first opening and the second opening is in a range of 1 μm to 10 μm.

  The effect of the present invention can be remarkably exhibited in the bonding with such a minute structure.

A joining method of the present invention includes a first member to be joined, which includes a first surface and a first through hole having a first opening that is open to the first surface;
A second member to be joined, comprising: a second surface; and a second through hole having a second opening that is open to the second surface;
A catalyst,
A bonding material;
A step of preparing a solvent;
Disposing the catalyst on the first surface so as to surround the first opening in a plan view of the first surface;
The first surface and the second surface are bonded via the catalyst and the bonding material so that at least a part of the first opening and the second opening overlap each other in plan view of the first surface. Process,
Removing at least a portion of the uncured or semi-cured bonding material using the solvent;
It is characterized by including.

  According to such a joining method, for example, an uncured or semi-cured joining material protrudes from the first through hole and the second through hole by using the first through hole and the second through hole as a solvent flow path. Can be reduced. On the other hand, desired portions of the first surface and the second surface around the first through hole and the second through hole can be selectively joined with high accuracy.

  In the joining method of the present invention, it is preferable that in the preparing step, the catalyst contains platinum.

  Thereby, a catalyst can be arrange | positioned by highly accurate thickness, a shape, and a position using vapor phase film-forming methods, such as vapor deposition. In particular, when the bonding material is a silicone-based bonding material, the effect of accelerating the curing of the bonding material by catalytic action can be remarkably exhibited.

In the joining method of the present invention, it is preferable that the catalyst is disposed using a vapor deposition method in the placing step.
Thereby, a catalyst can be arrange | positioned with a highly accurate thickness, a shape, and a position.

In the bonding method of the present invention, it is preferable that the catalyst is arranged using a screen printing method in the arranging step.
Thereby, a catalyst can be arrange | positioned with a highly accurate thickness, a shape, and a position.

In the joining method of the present invention, it is preferable that the joining step includes a step of disposing the film-like joining material on the catalyst.
Thereby, a joining material can be formed with uniform thickness.

In the bonding method of the present invention, it is preferable that the bonding step includes a step of arranging the bonding material using a screen printing method.
Thereby, a joining material can be formed with a highly accurate thickness, shape, and position.

  In the joining method of the present invention, it is preferable that the joining material is heated and cured in the joining step.

  Thereby, a joining material can be hardened in a shorter time, or high intensity | strength joining can be implement | achieved.

The electronic device of the present invention includes the joined body of the present invention.
According to such an electronic device, it is possible to improve reliability by reducing the protrusion of the bonding material and realizing highly accurate bonding.

It is sectional drawing which shows the droplet discharge head which is an example of the conjugate | zygote of this invention. FIG. 2 is a partial enlarged cross-sectional view of the droplet discharge head shown in FIG. 1. It is a figure for demonstrating the joining method used for manufacture of the droplet discharge head shown in FIG. It is a figure for demonstrating the joining method used for manufacture of the droplet discharge head shown in FIG. It is a figure for demonstrating the joining method used for manufacture of the droplet discharge head shown in FIG. It is a figure for demonstrating the joining method used for manufacture of the droplet discharge head shown in FIG. It is a figure for demonstrating the joining method used for manufacture of the droplet discharge head shown in FIG. It is sectional drawing which shows the droplet discharge apparatus which is an example of an electronic device provided with the conjugate | zygote of this invention.

  Hereinafter, the joined body, joining method, and electronic device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

[Droplet discharge head (joint)]
First, a droplet discharge head which is an example of the joined body of the present invention will be described.
FIG. 1 is a cross-sectional view showing a droplet discharge head as an example of the joined body of the present invention, and FIG. 2 is a partially enlarged cross-sectional view of the droplet discharge head shown in FIG. In the following, for convenience of explanation, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other, and the tip side of the illustrated arrow is “+ side” and the base side is “−”. Side ". In the following, the direction parallel to the X axis is referred to as the “X axis direction”, the direction parallel to the Y axis is referred to as the “Y axis direction”, and the direction parallel to the Z axis is referred to as the “Z axis direction”. The + Z side (upper side in FIG. 1) is referred to as “upper”, and the −Z side (lower side in FIG. 1) is referred to as “lower”.

  The droplet discharge head 1 shown in FIGS. 1 and 2 is used by being mounted on, for example, a droplet discharge apparatus 100 (printing apparatus) as described later.

  As shown in FIG. 1, the droplet discharge head 1 includes a nozzle substrate 21 (second bonded member), a stacked body 20, a plurality of piezoelectric elements 25, wirings 28, an IC (Integrated Circuit) package 9, and the like. ,have.

  The laminated body 20 is configured by laminating a flow path forming substrate 22 (first bonded member), a vibration plate 23, a reservoir forming substrate 24, and a compliance substrate 26 in this order from the nozzle substrate 21 side. As for these substrates which these laminated bodies 20 have, two adjacent substrates are mutually joined, for example through the adhesive agent, the heat welding film, etc.

  Further, as shown in FIG. 2, the nozzle substrate 21 and the flow path forming substrate 22 of the stacked body 20 are bonded via the adhesive layer 5.

  Such a droplet discharge head 1 is formed on the nozzle substrate 21 by changing the pressure in the pressure generating chamber 221 formed on the flow path forming substrate 22 by the piezoelectric element 25 vibrating the vibration plate 23. The ink 300 is ejected as droplets from the ejection holes 211.

Hereinafter, each part of the droplet discharge head 1 will be briefly described in sequence.
(Nozzle substrate)
As shown in FIG. 2, the nozzle substrate 21 has a plurality of ejection holes 211 (second through holes) penetrating in the thickness direction. Here, of both openings of each ejection hole 211, the opening 2111 (upper end opening) opened on the surface (second surface) of the nozzle substrate 21 on the stacked body 20 side constitutes a “second opening”.

  In the present embodiment, the plurality of discharge holes 211 are arranged in a matrix. More specifically, the nozzle substrate 21 has a long shape whose longitudinal direction is the Y-axis direction, and the plurality of ejection holes 211 are arranged in n rows (n-direction) in the longitudinal direction (Y-axis direction) of the nozzle substrate 21. Are integers of 1 or more), and are arranged in two rows in the width direction (X-axis direction).

  Although it does not specifically limit as a constituent material of the nozzle substrate 21, For example, it is preferable that they are a silicon material or stainless steel. Since such a material is excellent in chemical resistance, even if it is exposed to the ink 300 for a long time, it is possible to reliably prevent the nozzle substrate 21 from being altered or deteriorated. Moreover, since these materials are excellent in workability, the nozzle substrate 21 with high dimensional accuracy can be obtained. For this reason, the highly reliable droplet discharge head 1 is obtained.

  The nozzle substrate 21 can be obtained, for example, by forming the discharge holes 211 by etching, laser processing or the like on a substrate made of the material as described above.

  The opening width of the discharge hole 211 is preferably in the range of 1 μm to 10 μm, more preferably in the range of 2 μm to 8 μm, and still more preferably in the range of 3 μm to 7 μm. . Thereby, the droplet discharge head 1 is smaller and can realize higher-definition image formation.

(Flow path forming substrate)
A plurality of flow paths 220 (first through holes) having pressure generation chambers 221 are formed in the flow path forming substrate 22. In each channel 220, the ink 300 passes toward each ejection hole 211. Here, each flow path 220 penetrates the flow path forming substrate 22 in the thickness direction, and the surface (first surface) of the flow path forming substrate 22 on the nozzle substrate 21 side of both openings of each flow path 220. The opening 2201 (lower end opening) that is open at ()) constitutes the “first opening”.

  The constituent material of the flow path forming substrate 22 is not particularly limited, and for example, the same material as the constituent material of the nozzle substrate 21 described above can be used.

  Such a flow path forming substrate 22 can be obtained, for example, by forming the flow path 220 by etching on a substrate made of the material as described above.

(Diaphragm)
The diaphragm 23 is configured to vibrate in the thickness direction, and part of the diaphragm 23 faces the pressure generation chamber 221.

  The diaphragm 23 is configured by laminating an elastic film 231 and a lower electrode film 232 in order from the flow path forming substrate 22 side.

  The elastic film 231 is made of, for example, a silicon oxide film. The lower electrode film 232 is made of, for example, a metal film. The lower electrode film 232 also functions as a common electrode for the plurality of piezoelectric elements 25.

(Reservoir forming substrate)
The reservoir forming substrate 24 is provided with a plurality of reservoirs 241 for temporarily storing the ink 300. The plurality of reservoirs 241 are provided corresponding to the plurality of flow paths 220 and communicate with the flow paths 220, respectively.

  In addition, a recess that covers the piezoelectric element 25 is formed on the lower surface of the reservoir forming substrate 24.

(Piezoelectric element)
The plurality of piezoelectric elements 25 are provided corresponding to the plurality of discharge holes 211 and the plurality of pressure generation chambers 221 described above, respectively.

  Each piezoelectric element 25 has a piezoelectric film 251 provided on the lower electrode film 232 included in the diaphragm 23 and an upper electrode film 252 provided on the piezoelectric film 251. In addition, it can be said that the lower electrode film 232 included in the above-described diaphragm 23 constitutes a part of each piezoelectric element 25.

In each of such piezoelectric elements 25, when a voltage is applied between the lower electrode film 232 and the upper electrode film 252, the piezoelectric film 251 is deformed by the piezoelectric effect. By this deformation, the diaphragm 23 can be vibrated in the thickness direction.
A terminal 27 is electrically connected to each upper electrode film 252.

(Compliance board)
The compliance substrate 26 is configured by laminating a sealing film 261 and a fixing plate 262 in order from the reservoir forming substrate 24 side.

  The sealing film 261 is made of a flexible material such as polyphenylene sulfide. The fixed plate 262 is made of a relatively hard material such as a metal material such as stainless steel.

  The compliance substrate 26 is formed with an introduction port 264 that penetrates the sealing film 261 and the fixing plate 262 all at once. The introduction port 264 communicates with the reservoir 241 and is a portion for introducing the ink 300 into the reservoir 241.

(wiring)
The wiring 28 is provided on the reservoir forming substrate 24. The wiring 28 is electrically connected to the terminal 27 described above. The wiring 28 is connected to a terminal 93 included in the IC package 9 described later.

(IC package)
The IC package 9 includes a drive circuit for driving the piezoelectric element 25.

  The plurality of terminals 93 protruding from the IC package 9 are electrically connected to the plurality of terminals 27 described above via the wiring 28. For this reason, the piezoelectric element 25 and the IC package 9 are electrically connected via the wiring 28.

(Adhesive layer)
As shown in FIG. 2, the adhesive layer 5 is bonded to the nozzle substrate 21 and the flow path forming substrate 22 described above.

  The adhesive layer 5 includes a catalyst 51 (catalyst layer) provided on the lower surface 225 (first surface) of the flow path forming substrate 22 and a bonding material 52 provided on the upper surface 215 (second surface) of the nozzle substrate 21. (Bonding material layer). The catalyst 51 and the bonding material 52 are in contact with each other.

  The catalyst 51 is not particularly limited as long as it exhibits a catalytic action capable of curing the bonding material having catalyst curing characteristics, and is made of a material containing a metal such as platinum (Pt).

  The bonding material 52 is cured between the nozzle substrate 21 and the flow path forming substrate 22 by the action of the catalyst 51 (catalytic action), thereby bonding the nozzle substrate 21 and the flow path forming substrate 22 together. The bonding material 52 is not particularly limited as long as it is cured by a catalytic action (having catalytic curing characteristics), but preferably has excellent resistance to a solvent after curing, for example, curable properties such as silicone resins. It is comprised with the material containing resin.

[Joint method]
Hereinafter, the bonding method of the present invention will be described by taking as an example the case where the nozzle substrate 21 and the flow path forming substrate 22 of the droplet discharge head 1 described above are bonded.

  3 to 7 are diagrams for explaining a joining method used for manufacturing the droplet discharge head shown in FIG.

  The method of joining the nozzle substrate 21 and the flow path forming substrate 22 includes: [1] preparing the nozzle substrate 21 and the laminate 20 having the flow path forming substrate 22; [2] lower surface of the flow path forming substrate 22 A step of disposing the catalyst 51 on 225, [3] a step of bonding the nozzle substrate 21 and the flow path forming substrate 22 through the catalyst 51 and the bonding material 52, and [4] uncured or semi-cured using a solvent. Removing at least a part of the cured bonding material 53. Hereinafter, each process is demonstrated one by one.

[1]
First, as shown in FIG. 3, the laminate 20 having the flow path forming substrate 22 in which the flow path 220 is formed is prepared. Further, although not shown, the nozzle substrate 21 in which the discharge holes 211 are formed is prepared.

[2]
Next, as shown in FIG. 4, the catalyst 51 is formed (deposited) on the lower surface 225 of the flow path forming substrate 22. At this time, the catalyst 51 is provided so as to surround the opening 2201 (first opening) on the lower end side of the flow path 220 in plan view. Further, the catalyst 51 is provided so as to remove the portion 2251 in the vicinity of the flow path 220 on the lower surface 225.

  Examples of the formation method of the catalyst 51 include a printing method such as a screen printing method and an ink jet printing method, a coating method such as a die coating method and a spin coating method, a vapor deposition method such as vacuum vapor deposition, and the like. The method which combined independently or 2 types or more can be used. Among these, it is particularly preferable to use at least one of a vapor deposition method and a printing method, and it is more preferable to use either a vapor deposition method or a screen printing method. Thereby, the catalyst 51 can be arrange | positioned with a highly accurate thickness, a shape, and a position.

  The thickness of the catalyst 51 is preferably in the range of 10 nm to 1000 nm, more preferably in the range of 10 nm to 500 nm, and still more preferably in the range of 10 nm to 100 nm. Thereby, in the step [3] joining described later, the catalytic action of the catalyst 51 is suitably exhibited to increase the joining strength between the lower surface 225 and the upper surface 215, and the entire layer composed of the catalyst 51 and the joining material 52 is formed. High-definition bonding can be realized by reducing the thickness.

  Further, as described above, the catalyst 51 is made of a material containing a metal such as platinum (Pt), for example. By using a material containing a metal such as platinum (Pt), the catalyst 51 can be disposed with a highly accurate thickness, shape, and position using a vapor phase film formation method such as vapor deposition. In particular, in the [3] bonding step described later, when the bonding material 50 is a silicone-based bonding material, the effect of promoting the curing of the bonding material 50 by a catalytic action can be significantly exhibited.

[3]
3-1.
Next, as shown in FIG. 5, an uncured or semi-cured bonding material 50 is disposed on the catalyst 51. At this time, the bonding material 50 is disposed so as to cover the catalyst 51.

  Further, the bonding material 50 may be in a liquid form (including a paste form) or a solid form at room temperature (for example, 25 ° C.).

  When the bonding material 50 is solid, the bonding material 50 in the form of a film (sheet) formed in advance can be used. As described above, the [3] bonding step includes the step of disposing the film-like bonding material 50 on the catalyst 51, whereby the bonding material 50 can be formed with a uniform thickness. And the thickness of the bonding material 52 after curing finally obtained can be easily controlled. Therefore, the uniformity of the thickness of the bonding material 52 after curing can be further improved.

  When the bonding material 50 is liquid, examples of the method for forming the bonding material 50 include a printing method such as a screen printing method and an inkjet printing method, a coating method such as a die coating method and a spin coating method, and the like. One method can be used alone, or two or more methods can be used in combination. Among these, it is preferable to use a printing method, and it is more preferable to use a screen printing method. By using the screen printing method, the bonding material 50 can be formed with a highly accurate thickness, shape, and position.

3-2
Next, as shown in FIG. 6, the nozzle substrate 21 is bonded to the flow path forming substrate 22 through the catalyst 51 and the bonding material 50. Thereby, hardening of the joining material 50 is started by the action of the catalyst 51, and the joining material 50a is formed.

  Here, the portion of the bonding material 50 that is in contact with the catalyst 51 is mainly cured, and the portion that is not in contact with the catalyst 51 remains uncured or semi-cured. Therefore, the bonding material 50a includes the cured bonding material 52 and the bonding material 53 that remains uncured or semi-cured. The flow path forming substrate 22 and the nozzle substrate 21 are bonded together by the cured bonding material 52.

  At this time, the nozzle substrate 21 is arranged so that the ejection hole 211 and the flow path 220 overlap in plan view. That is, the opening 2111 (second opening) of the discharge hole 211 on the upper surface 215 (second surface) of the nozzle substrate 21 and the opening 2201 (first) of the flow path 220 on the lower surface 225 (first surface) of the flow path forming substrate 22. Are arranged so as to overlap with each other in plan view.

  [3] In the bonding step, it is preferable to apply energy such as heat, light, and pressure to the bonding material 50 in a state where the nozzle substrate 21 is bonded to the flow path forming substrate 22. More preferably, the material 50 is heated. Thereby, the joining material 50 can be hardened in a shorter time, or high strength joining can be realized. The energy to be applied can be determined as appropriate depending on the type of the bonding material 50.

  The thickness of the obtained bonding material 52 is preferably in the range of 0.5 μm or more and 5 μm or less, more preferably in the range of 0.5 μm or more and 4 μm or less, and 1.0 μm or more and 3.0 μm or less. More preferably, it is in the range. Thereby, the effect | action of the catalyst 51 can be efficiently produced in the thickness direction whole region of the joining material 50, and high intensity | strength joining can be implement | achieved.

[4]
Next, as shown in FIG. 7, at least a part of the uncured or semi-cured bonding material 53 is removed using a solvent P. At this time, the solvent P is circulated from the inlet 264 to the reservoir 241, the flow path 220, and the discharge hole 211.

  The solvent P is determined according to the type of the bonding material 50 and is not particularly limited as long as the uncured or semi-cured bonding material 53 can be dissolved. The same kind of solvent can be used.

  According to the bonding method as described above, the uncured or semi-cured bonding material 53 protrudes and remains in the flow path 220 and the discharge hole 211 using the flow path 220 and the discharge hole 211 as the flow path of the solvent P. This can be reduced. Here, the uncured bonding material 53 can be easily dissolved by the solvent P. Therefore, it is possible to prevent or reduce the bonding material 53 from remaining in the flow path 220 and the discharge hole 211. Therefore, it is possible to prevent the ejection holes 211 from being blocked by the bonding material 53 and causing troubles in the outflow of ink.

  Further, desired portions of the lower surface 225 and the upper surface 215 around the flow path 220 and the discharge hole 211 can be selectively bonded with high accuracy. Here, since the catalyst 51 is disposed on the lower surface 225 excluding the flow path 220, only the portion of the bonding material 50 that is in contact with the catalyst 51 can be selectively cured. Therefore, the lower surface 225 of the flow path forming substrate 22 and the upper surface 215 of the nozzle substrate 21 can be bonded with high accuracy.

  Further, with such a joining method, even the droplet discharge head 1 having the discharge hole 211 having a relatively small opening width as described above, the lower surface 225 of the flow path forming substrate 22 and the nozzle substrate 21 are used. The upper surface 215 can be bonded with higher accuracy. That is, the effect of the present invention can be remarkably exhibited in bonding with a minute structure.

[Droplet discharge device]
Next, as an example of the droplet discharge device of the present invention, a droplet discharge device 100 including the above-described droplet discharge head 1 will be described.

  FIG. 8 is a cross-sectional view showing a droplet discharge device which is an example of an electronic apparatus including the joined body of the present invention.

  A droplet discharge apparatus 100 (printing apparatus) illustrated in FIG. 8 is a printing apparatus that prints on a recording medium 200 by an inkjet method. The droplet discharge apparatus 100 conveys the apparatus main body 50A, recording head units 20A and 20B on which the droplet discharge head 1 is mounted, ink cartridges 30A and 30B for supplying ink 300, and recording head units 20A and 20B. A carriage 40 that moves the carriage 40, and a carriage shaft 60 that supports (guides) the carriage 40 in a movable manner.

  The ink cartridge 30A is detachably attached to the recording head unit 20A, and the ink 300 (black ink composition) can be supplied to the recording head unit 20A in the attached state.

  The ink cartridge 30B is also detachably attached to the recording head unit 20B, and the ink 300 (color ink composition) can be supplied to the recording head unit 20B in the attached state.

  The moving mechanism 70 includes a drive motor 701 and a timing belt 702 connected to the drive motor 701. The driving force (rotational force) of the driving motor 701 is transmitted to the carriage 40 via the timing belt 702, so that the carriage 40 can be moved along the carriage shaft 60 direction together with the recording head units 20A and 20B. .

In addition, the apparatus main body 50A is provided with a platen 80 below the carriage shaft 60 along the axial direction thereof. A recording medium 200 fed by a paper feed roller (not shown) is transported onto the platen 80. Then, ink 300 is ejected onto the recording medium 200 on the platen 80 and printing is performed.
According to such a droplet discharge device, high-definition droplet discharge can be realized.

  The bonded body, the bonding method, and the electronic device of the present invention have been described above with respect to the illustrated embodiment. However, the present invention is not limited to this, and the discharge head and the electronic device are examples of the bonded body. Each part constituting a droplet and a droplet discharge device can be replaced with any component that can exhibit the same function. Moreover, arbitrary components may be added.

  Further, in the above-described embodiment, the example in which the bonded body of the present invention is applied to the droplet discharge head has been described. However, the bonded body of the present invention is not limited to this, and the first bonded body including the first through hole. The present invention is applicable to each joined body that joins a member and a second member to be joined having a second through hole communicating with the first through hole.

  In the above-described embodiment, the example in which the electronic apparatus of the present invention is applied to the droplet discharge device has been described. However, the electronic apparatus of the present invention is not limited to this, and may include the joined body of the present invention. For example, it is applicable to each electronic device.

  In the above-described embodiment, the case where the flow path forming substrate and the nozzle substrate are bonded to each other has been described as an example. For example, two adjacent substrates included in the laminate of the droplet discharge heads are bonded to each other according to the present invention. It may be joined by a method.

DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 5 ... Adhesive layer, 9 ... Package, 20 ... Laminated body, 20A ... Recording head unit, 20B ... Recording head unit, 21 ... Nozzle substrate, 22 ... Flow path formation substrate, 23 ... Vibration plate, 24 ... reservoir forming substrate, 25 ... piezoelectric element, 26 ... compliance substrate, 27 ... terminal, 28 ... wiring, 30A ... ink cartridge, 30B ... ink cartridge, 40 ... carriage, 50 ... bonding material, 50A ... device body, 50a ... Joining material, 51 ... catalyst, 52 ... joining material, 53 ... joining material, 60 ... carriage shaft, 70 ... moving mechanism, 80 ... platen, 93 ... terminal, 100 ... droplet ejection device, 200 ... recording medium, 211 ... ejection Holes, 215 ... upper surface, 220 ... flow path, 221 ... pressure generating chamber, 225 ... lower surface, 231 ... elastic membrane, 232 ... lower electrode membrane, 241 ... reservoir, 25 ... Piezoelectric film, 252 ... Upper electrode film, 261 ... Sealing film, 262 ... Fixing plate, 264 ... Inlet, 300 ... Ink, 701 ... Drive motor, 702 ... Timing belt, 2201 ... Opening, 2111 ... Opening, 2251 ... part, P ... solvent

Claims (9)

A first member to be joined, comprising: a first surface; and a first through hole having a first opening that is open to the first surface;
A second member to be joined comprising a second surface and a second through hole having a second opening communicating with the first through hole and opening in the second surface;
A catalyst provided on at least one of the first surface and the second surface;
Between the first surface and the second surface, the first opening and the second opening are disposed in a plan view of the first surface, and are cured by the action of the catalyst, a bonding material that bonds the first said and workpieces second member to be joined, were closed,
The joined body is characterized in that a width of at least one of the first opening and the second opening is in a range of 1 μm to 10 μm . A first member to be joined, comprising: a first surface; and a first through hole having a first opening that is open to the first surface;
A second member to be joined, comprising: a second surface; and a second through hole having a second opening that is open to the second surface;
A catalyst,
A bonding material;
A step of preparing a solvent;
Disposing the catalyst on the first surface so as to surround the first opening in a plan view of the first surface;
The first surface and the second surface are bonded via the catalyst and the bonding material so that at least a part of the first opening and the second opening overlap each other in a plan view of the first surface. Process,
And a step of removing at least a part of the uncured or semi-cured bonding material using the solvent. The joining method according to claim 2 , wherein in the preparing step, the catalyst contains platinum. The joining method according to claim 2 or 3 , wherein, in the arranging step, the catalyst is arranged using a vapor deposition method. The joining method according to claim 2 or 3 , wherein, in the arranging step, the catalyst is arranged using a screen printing method. In the step of the bonding, the bonding method according to any one of claims 2 to 5 comprising the steps of placing a film of the bonding material on the catalyst. In the step of the bonding, the bonding method according to any one of claims 2 to 5 comprising the step of arranging the bonding material by a screen printing method. In the step of the bonding, the bonding method according to any one of claims 2 to 7 is cured by heating the bonding material. An electronic apparatus comprising the joined body according to claim 1 .

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