JP2001030488A - Ink-jet head and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly apply an adhesive to the periphery of an open part by arranging recesses zigzag at a plurality of open parts on a joined face of one member having the plurality of open parts formed therein. SOLUTION: A plurality of open parts 42 as channel holes are arranged at one member 41, and recesses 43 are formed zigzag with respect to the open parts 42 on a joined face of the member 41 to the other member. The recesses 43 and open parts 42 are equal in shape and size. A distance (d) between the open part 42 and recess 43 in a direction orthogonal to an arrangement direction of the recesses 43 is not smaller than approximately 50 μm to secure a bond margin and nor larger than approximately 100 μm for the recesses 43 to trap and secure an adhesive layer. When the one member 41 is formed of a stainless steel material, the open parts 42 and recesses 43 can be formed simultaneously by photolithography or spray type wet etching.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head, and more particularly to an ink jet head in which at least two members are joined by an adhesive.

[0002]

2. Description of the Related Art Generally, an ink jet head used as a recording head in an ink jet recording apparatus used as an image forming apparatus (image recording apparatus) such as a printer, a facsimile, a copying machine, a plotter, etc. has a plurality of nozzles for ejecting ink droplets, A flow path forming member that forms an ink liquid chamber (also referred to as a discharge chamber, a pressurized liquid chamber, an ink flow path, a pressurized chamber, a pressure chamber, etc.) communicating with each nozzle, and ink in each ink liquid chamber. Electromechanical conversion elements such as piezoelectric elements that generate energy for ejecting ink droplets from nozzles when pressurized, or electrothermal conversion elements such as heaters, or energy generation including electrostatic force generation means such as diaphragms and electrodes Means (actuator means), and the actuator means is driven in accordance with the image information so that ink droplets are emitted from required nozzles. Issued not to record the image.

[0003] Such various ink jet heads include:
For example, as described in JP-A-10-138469, a nozzle plate, a liquid chamber partition member (flow path forming member,
A liquid chamber forming member), a vibration plate, a piezoelectric element, etc., which are laminated and joined, and cover the liquid chamber forming member (first substrate) as described in JP-A-5-50601. It is formed by joining a plurality of members, such as joining a lid member and joining a nozzle plate having a nozzle formed on the front surface of the head.

In this case, it is known that a silicon substrate or the like is directly bonded or eutectic bonded to join a plurality of members. However, when such a bonding method cannot be used, an adhesive is generally used. Is used.
As a method of applying an adhesive, a method of applying an adhesive by a screen printing method through a predetermined pattern mask is known. In this screen printing method, an adhesive application amount is applied to a member having a fine pattern. Becomes excessive.

Therefore, a flexographic printing method, a transfer method and the like are used. As a transfer method, for example,
As described in JP-A-200419, an adhesive is placed on a first roll and rotated, and the adhesive on the first roll is spread evenly by a doctor blade. A resin member having a convex portion on the first roll A method in which the adhesive spread on the first roll is transferred to the resin member of the second roll by pressing the second roll attached with the first roll, and the resin member of the second roll is pressed against the joining surface of the member and transferred. Are known.

Further, as described in JP-A-5-24203, a groove is formed in a portion having a large bonding area, and a thin adhesive layer is formed on a flexible base material. There is also known a method in which the adhesive is appropriately swelled by transferring it onto the surface of a member to be adhered to obtain a sufficient adhesive force.

[0007]

However, even in the above-mentioned flexographic printing method and the transfer method described in JP-A-10-100149, the thickness of the adhesive applied according to the transfer direction and the processing pattern of the member is limited. Becomes uneven. Also, as described in JP-A-5-24203, even in the method of forming a groove in a portion having a large bonding area, if a transfer method using a roller is adopted, the flow formed on the member may be reduced. Unevenness in the applied film thickness of the adhesive layer caused by the step and the transfer direction at the openings such as the recesses, through holes, and through holes that constitute the path cannot be avoided.

That is, as shown in FIG. 18, a member 100 having a plurality of openings 101, 101,...
Next, when the transfer roller 102 is moved in the direction of the arrow using the transfer roller 102 to transfer and apply the adhesive 103,
The coating thickness of the adhesive 103 on the member 100 is
Due to the presence of 1, 101,..., Approximately three regions are generated as shown in FIGS. 19 and 20, namely, a thick region a, an intermediate region b, and a thin region c.

Here, the influence of the thick region a generated on the front side in the transfer direction of the through holes 101, 101... Is small, but the region c with a thin coating film thickness around the through holes 101, 101. Such a problem arises that an insufficient adhesive force cannot be obtained or the adhesive force becomes non-uniform, thereby deteriorating the ink sealability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a highly reliable ink jet head by ensuring a coating thickness of an adhesive around an opening.

[0011]

In order to solve the above-mentioned problems, an ink jet head according to the present invention has a plurality of openings arranged side by side, and a joining surface of one of the members is staggered with respect to the plurality of openings. Has a plurality of depressions arranged in the same manner. The “opening of one member” in this specification means a portion having at least an opening, such as a through hole, a through hole, or a recess formed in one of the two members to be joined.

Here, one of the members may be formed of a stainless steel material to form an oxide film on the joint surface. In this case, the oxide film can be formed by annealing treatment or plasma treatment.

As the adhesive, a polyimide adhesive can be used. In this case, the thickness of the adhesive is 1 μm.
It is preferable to set it within the range of 4 μm. Alternatively, an epoxy adhesive can be used as the adhesive, and in this case, it is preferable that the film thickness of the adhesive does not exceed 2 μm.

Further, the present invention is preferably applied to a case where the opening of one of the members is an ink passage groove or an ink passage hole.

In the method of manufacturing an ink jet head according to the present invention, an adhesive is transferred and applied from a dent side to an opening side of one member by a transfer roller.

[0016]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory cross-sectional view showing an example of a piezo-type inkjet head to which the present invention is applied, and FIG. 2 is an explanatory plan view showing FIG. 1 in a transparent state.

This ink jet head is, for example, SU
A through hole (through hole) 2 serving as an opening for forming a discharge chamber is formed in a liquid chamber substrate 1 made of an S substrate or the like, and a diaphragm 3 formed by Ni electroforming or the like on the lower surface of the liquid chamber substrate 1 And a laminated piezoelectric element 4 is provided on the outer surface of the diaphragm 3 to constitute an actuator section. The liquid chamber substrate 1 and the diaphragm 3 can also be formed, for example, by forming an impurity diffusion layer of boron or the like on a single crystal silicon substrate and performing anisotropic etching using this as an etching stop layer.

On the liquid chamber substrate 1, a fluid resistance forming plate 6, a common ink flow path forming plate 7, and a nozzle plate 8 are sequentially laminated and bonded with an adhesive such as a polyimide adhesive or an epoxy adhesive. By joining, a plurality of nozzle holes 9, a plurality of discharge chambers 10 communicating with each nozzle hole 9, a common ink flow path (common ink chamber) 11 for supplying ink to these plurality of pressurizing chambers 10, An ink flow path such as an ink supply path 12 serving as a fluid resistance part for supplying ink from the common ink flow path 11 to the pressure chamber 10 and a nozzle communication path 13 communicating the nozzle hole 9 with the pressure chamber 10 is formed. I have.

Here, a through-hole (through-hole) 15 as an opening for forming the ink supply passage 12 and a through-hole 16 for forming the nozzle communication passage 13 are formed in the fluid resistance forming plate 6 to form a common ink flow path. The forming plate 7 has a through hole 17 forming the common ink chamber 11 and the through hole 18 forming the nozzle communication passage 13, and the nozzle plate 8 has a plurality of nozzle holes 9 corresponding to each ejection chamber 10. are doing.

In the ink jet head configured as described above, when a driving voltage is applied to the piezoelectric element 4, the piezoelectric element 4 is displaced in the stacking direction, and the diaphragm 3 is deformed and displaced toward the discharge chamber 10 to discharge. The internal volume of the chamber 10 decreases, the pressure in the ejection chamber 10 increases, and ink droplets are ejected from the nozzle holes 9 through the nozzle communication passage 13.

Next, FIG. 3 is an explanatory sectional view showing an example of an electrostatic ink jet head to which the present invention is applied, and FIG.
It is a plane explanatory view showing in a transmission state. This ink jet head includes a liquid chamber substrate 21 made of a single crystal silicon substrate or the like, and a lid member 22 provided above the liquid chamber substrate 21.
An electrode substrate 23 provided below the liquid chamber substrate 21, and a nozzle plate 24 provided on the front side of the liquid chamber substrate 21 and the lid member 22.
And

By laminating the liquid chamber substrate 21, the lid member 22, and the electrode substrate 23, a plurality of discharge chambers 26 in which the respective nozzle holes 25 of the nozzle plate 24 communicate, and ink is supplied to the respective discharge chambers 26. Common ink flow path (common ink chamber)
27, an ink supply path 28 serving as a fluid resistance part for supplying ink from the common ink flow path 27 to the ejection chamber 26, and a nozzle hole 2
An ink flow path such as a nozzle communication path 29 that communicates the discharge chamber 5 with the discharge chamber 26 is formed.

The liquid chamber substrate 21 has a recess 31 serving as an opening for forming a discharge chamber 27 and a deformable diaphragm 30 which is a bottom of the discharge chamber 27 and forms a wall surface thereof. Common ink flow path 3 for supplying ink
1 and a nozzle communication passage 2
A groove 33, which is an opening for forming the groove 9, is provided.

The lid member 22 has an ink supply path 28.
And an ink supply port 35 for supplying ink to the common ink channel 27 from outside. Further, an electrode 36 facing the diaphragm 30 is provided on the electrode substrate 23, and the electrode 36 and the diaphragm 30 constitute an actuator section. The surface of the electrode 36 is protected by an insulating film 37.

Here, the liquid chamber substrate 21 and the electrode substrate 23 are bonded by a bonding method such as direct bonding, anodic bonding, or eutectic bonding, and the liquid chamber substrate 21 and the lid member 22 are connected to each other by a polyimide-based adhesive or an epoxy-based. The nozzle plate 24 is adhesively bonded with an adhesive such as an adhesive.

In this ink jet head, when a driving voltage is applied between the diaphragm 30 and the electrode 36, the diaphragm 30 is deformed by electrostatic force, and
As the internal volume changes, ink droplets are ejected from the nozzle holes 25.

The application of the present invention to two members joined by an adhesive in these ink jet heads will be described with reference to FIGS. In each of the heads, for example, the liquid chamber substrate 1 and the flow path forming plate 6, the common ink chamber forming plate 7 and the nozzle plate 7, or the liquid chamber substrate 21
The present invention can be applied to the bonding of the adhesive and the lid member 22 and the liquid chamber substrate 21 to the nozzle plate 24 and the like. In the following, the liquid chamber substrates 1 and 21, the common ink chamber forming plate 7, and the like are referred to as "one member" to generically represent them, and the grooves, concave portions,
The holes and the like are referred to as “openings”.

First, an embodiment of the present invention will be described with reference to FIGS. FIG. 5 is an explanatory plan view of one member, and FIG. 6 is an explanatory sectional view taken along line AA of FIG. On one member 41, a plurality of openings 42 which are flow path holes are arranged and formed. And this one member 41
Has a plurality of depressions 43 formed in a staggered manner with respect to the plurality of openings 42 on the joint surface with the other member.

The shape and size of the recess 43 are determined by the size of the opening 4.
It is preferably equal to the shape and size of 2. The distance d between the opening 42 and the depression 43 in the direction orthogonal to the arrangement direction of the depressions 43 is 50 μm or more for securing the glue allowance, and for ensuring the adhesion of the adhesive layer by the depressions 43. Is preferably 100 μm or less. In this case, the distance s of the clearance between the opening 42 and the depression 43 is s.
Becomes larger than the distance d (s> d).

Here, when the one member 41 is formed of, for example, a stainless steel material, the opening 42 and the depression 43 can be formed simultaneously by photolithography or wet etching by a spray method. Similarly, when a single crystal silicon substrate or the like is used for one of the members 41, the depression 43 can be formed by etching.

By forming the depressions 43 in a staggered manner with respect to the opening 42 on the joining surface of the one member 41 having the opening 42, the adhesive is transferred by the transfer method using a roller. However, uniformity of the adhesive layer at least around the opening 42 can be ensured.

To confirm this, as shown in FIG. 7, for example, a thin layer of the adhesive 44 is formed on a resin plate by a doctor roll or anilox roll, and the roller 45 on which the plate is mounted is rotated. Then, the adhesive 44 was transferred to the joint surface of the one member 41 with the direction from the dent 43 toward the opening 42 (the direction of the arrow in the figure) as the transfer direction.

As a result, as shown in FIGS. 8 and 9, the applied film thickness of the adhesive 44 includes a thick region a, an intermediate region b, and a thin region c. In this case, the region c where the thickness of the adhesive 44 is small is formed only in the peripheral portion on the downstream side in the transfer direction of the depressions 43, 43 because the depressions 43, 43 are formed. Are not generated around the periphery of the opening 42, and the entire periphery of the opening 42 has a uniform film thickness (intermediate region b).
Could be applied.

Next, a plurality of depressions 43 are formed in a plurality of openings 42.
As a comparative example, as shown in FIGS. 10 and 11, as one comparative example, a groove united in the arrangement direction of the openings 42 of the one member 41 in order to confirm the effect of forming a pattern arranged in a staggered manner. 51 was formed, and the adhesive was transferred and applied in the same manner as described above.

As a result, as shown in FIGS. 12 and 13, not only a region c having a thin coating film of the adhesive 44 is formed on the upstream side of the groove portion 51 in the transfer direction, but also the adhesive 44 An area c with a thin coating film was generated. When a region where the thickness of the applied adhesive film is small occurs between the openings 42 in this manner, an adhesion failure occurs at this portion and a leak between bits (between channels) occurs.

In the comparative example, the distance d in the direction orthogonal to the arrangement direction between the opening 42 and the groove 51 is the same as the distance s of the overlap margin, and the distance d is the same as in the above embodiment. If this is done, the glue margin will be narrowed and poor adhesion will occur. Therefore, in the comparative example, if the distance s of the glue allowance is the same as in the above-described embodiment, the distance d is shorter than in the above-described embodiment. It becomes thin.

Next, the surface treatment of one member 41 and the state of application of the adhesive will be described. One member 41 was degreased (washed) with an organic solvent such as acetone, and dried, and then the next sample was prepared. Sample 1: No surface treatment Sample 2: As a surface treatment, a heat treatment of 300-1 hr (in air) was performed. Sample 3: Oxygen plasma treatment (R
F; power 450 W, 2 Toor).

Then, a polyimide adhesive (viscosity: 10 Poise) was applied to each of the samples 1, 2, and 3. This adhesive is applied on the printing plate of the resin material as described above.
A method was used in which a thin adhesive layer was formed by a doctor roll and an anilox roll, and this printing plate was transferred to the joining surface of one member 41 by a mounting roll.

Next, the applied adhesive was leveled and pre-dried at 50 ° C. for 10 minutes and at 170 ° C. for 20 minutes, and the solvent was uniformly evaporated and formed into a film at 250 ° C. for 10 minutes. Since the polyimide adhesive does not have tackiness, it is excellent in dust resistance and transportability.

After going through these steps, samples 1, 2,
For No. 3, the state of formation of the adhesive layer was observed, and the film thickness was measured. As shown in FIG. 14, the sample 1 has a thin region c around the opening 42 due to poor wettability of the member surface.
And the uniformity of the adhesive layer is inferior to those of Samples 2 and 3, for example. On the other hand, in Samples 2 and 3, as shown in FIG. 15, a thin region c was not generated around the opening 42, and the uniformity of the adhesive coating film thickness was smaller than that of Sample 1. Improvements were seen.

In this case, when an adhesive was applied to the sample 3 which had passed 5 hours after the surface treatment (oxygen plasma), the same uniformity as that of the sample 2 was obtained. However, 24 hours after the surface treatment. When the adhesive was applied to the sample, the uniformity deteriorated and was equivalent to that of sample 1. For sample 2, an adhesive was applied to a sample 48 hours after surface treatment (annealed at 300 ° C.)
Deterioration of uniformity was hardly observed.

That is, when a stainless steel material is used for one of the members, annealing is performed at a temperature of 250 ° C. or more to form an oxide film on the bonding surface, thereby cleaning the bonding surface (removing adhered organic substances) and The wettability can be increased, the adhesive can be uniformly applied, the ink sealing properties can be improved, and the bonding strength can be improved. When the oxide film is formed by the annealing treatment, the storage time from the surface treatment to the application of the adhesive can be longer than when the oxide film is formed by the plasma treatment.

Further, when a stainless steel material is used for one of the members, an oxide film is formed on the bonding surface by plasma treatment, whereby the cleaning of the bonding surface (removal of attached organic substances) and the wettability can be improved. This makes it possible to apply the adhesive uniformly, thereby improving the ink sealing property and improving the bonding strength.

Next, the film thickness of the polyimide adhesive will be described. Sample 2 described above (300 ° C.-1 hr)
(The surface of which has been subjected to the heat treatment of Example 1), and the bonding is performed using only the applied film thickness of the polyimide adhesive as a parameter. The application conditions are the same as above, and the joining conditions are
The other member is aligned with and superimposed on one member 41, and pressurized (10 kgf / cm ² ) and heated (280 ° C.-
(1 min). In addition, 15 at 180 dpi pitch
Using a head having a 0-bit nozzle hole (φ = 25 μm) and a flow path hole, ink leak and clogging were evaluated.
Table 1 shows the results.

[0045]

[Table 1]

As can be seen from Table 1, when the coating thickness of the adhesive layer is about 1 μm or more, the sealing property can be secured.
When the thickness is 4 μm or less, clogging of the nozzle hole due to protrusion of the adhesive can be suppressed. Therefore, when a polyimide-based adhesive is used, it is preferable that the applied film thickness be 1 μm or more and 4 μm or less.

When a polyimide-based adhesive is used as the adhesive, bonding with good ink resistance and a high Young's modulus can be performed. In addition, after the adhesive is applied, it is possible to join after the primary effect is applied and the tackiness is eliminated, so that the dust resistance and the transportability are excellent. Furthermore, since it is thermoplastic, there is no bleeding (melting and flowing), and the protrusion of the adhesive can be reduced.

Next, a description will be given of a coating film thickness when an epoxy adhesive is used as the adhesive. Using Sample 2 described above (surface-treated by heat treatment at 300 ° C. for 1 hour), bonding was performed using only the applied film thickness of the epoxy adhesive as a parameter. The application conditions are the same as described above, and the bonding conditions are as follows: one member 41 is aligned with another member so as to be overlapped, and pressurized (2 kgf / cm ² ).
And by heating (130 ° C.). In addition, 180dp
Using a head having nozzle holes (φ = 25 μm) of 150 bits at i-pitch and flow path holes, ink leak and clogging were evaluated. The results are shown in Table 2.

[0049]

[Table 2]

As can be seen from Table 2, when the coating thickness of the adhesive layer is about 2 μm or less, the sealing property can be ensured, and the clogging of the nozzle hole due to the protrusion of the adhesive can be suppressed. Therefore, when an epoxy-based adhesive is used, it is preferable that the thickness of the applied film be not more than 2 μm.

By using an epoxy adhesive as an adhesive, it is possible to perform a strong bonding with good ink resistance.

Next, another embodiment of the present invention will be described with reference to FIG.
6 and FIG. FIG. 16 is an explanatory plan view of one member, and FIG. 17 is an explanatory sectional view taken along line EE in FIG. This embodiment is an example in which the present invention is applied to a head having a discharge chamber shape such as a flow channel such as the ink jet head described with reference to FIGS. A plurality of 52 are arranged and formed. The one member 41 has a plurality of depressions 43 formed in a staggered manner with respect to the plurality of openings 52 on the joint surface with the other member.

It is preferable that the shape and size of the depression 43 be a circular shape having substantially the same diameter as the width of the opening 52 (width in the arrangement direction) as shown in FIGS. The distance d between the opening 52 and the depression 43 in the direction orthogonal to the arrangement direction of the depressions 43 is 50 μm or more for securing the glue allowance, and for ensuring the supplement of the adhesive layer by the depressions 43. It is preferably 100 μm or less. In this case, the distance s of the margin between the opening 52 and the depression 43 is larger than the distance d (s> d).

Here, when the one member 41 is formed of, for example, a stainless steel material, the opening 42 and the depression 43 can be formed simultaneously by photolithography or wet etching by a spray method. Similarly, when a single crystal silicon substrate or the like is used for one of the members 41, the depression 43 can be formed by etching.

By forming the depressions 43 in a staggered manner with respect to the opening 52 on the joining surface of the one member 41 having such a groove-shaped opening 52, the adhesive is transferred by a roller transfer method. Even in the case of transfer, uniformity of the adhesive layer at least around the opening 52 can be ensured.

[0056]

As described above, according to the ink jet head according to the present invention, the depressions arranged in a staggered manner with respect to the plurality of openings are formed on the joining surface of one of the members in which the plurality of openings are arranged. With this configuration, the adhesive can be applied uniformly and reliably around the opening, and the reliability is improved.

Here, by forming one member from a stainless steel material and forming an oxide film on the joint surface, it is possible to clean the joint surface and to uniformly apply the adhesive by improving the wettability. . In this case, the oxide film can be formed by annealing treatment or plasma treatment, and in the case of annealing treatment, the storage time from surface treatment to bonding can be lengthened.

By using a polyimide-based adhesive as the adhesive, the ink resistance, dust resistance, and transportability are improved, and the protrusion of the adhesive can be reduced. In particular,
By setting the thickness of the adhesive within the range of 1 μm to 4 μm,
Bonding in which almost no adhesive sticks out can be performed. Alternatively, by using an epoxy-based adhesive as an adhesive, good ink resistance and strong bonding can be achieved. In particular, by controlling the thickness of the adhesive so as not to exceed 2 μm, almost all of the adhesive is used. Bonding that does not protrude can be performed.

Further, by applying the present invention to the case where the opening of one of the members is an ink passage groove or an ink passage hole, the ink sealing property is good, and the drop of the ink droplet ejection efficiency due to the protrusion of the adhesive is small. An ink jet head can be obtained.

According to the method of manufacturing an ink jet head according to the present invention, since the adhesive is applied by the transfer roller from the concave side to the opening side of one of the members, the adhesive is surely applied around the opening. Can be.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing an example of a piezo type inkjet head to which the present invention is applied.

FIG. 2 is an explanatory plan view of FIG. 1;

FIG. 3 is an explanatory sectional view showing an example of an electrostatic inkjet head to which the present invention is applied.

FIG. 4 is an explanatory plan view of FIG. 1;

FIG. 5 is an explanatory plan view of one member illustrating an embodiment of the present invention.

FIG. 6 is an explanatory sectional view taken along the line AA in FIG. 5;

FIG. 7 is an explanatory view illustrating a method of applying an adhesive to one member.

FIG. 8 is an explanatory plan view illustrating an application state of an adhesive on one member according to the embodiment of the present invention.

FIG. 9 is an explanatory sectional view taken along line BB in FIG. 8;

FIG. 10 is an explanatory plan view illustrating one member according to a comparative embodiment.

FIG. 11 is an explanatory sectional view taken along line CC in FIG. 10;

FIG. 12 is an explanatory plan view illustrating an applied state of an adhesive on one member according to a comparative embodiment.

FIG. 13 is an explanatory sectional view taken along line DD in FIG. 10;

FIG. 14 is an explanatory plan view for explaining a surface treatment and a coating state of one member;

FIG. 15 is an explanatory plan view for explaining a surface treatment and a coating state of one member.

FIG. 16 is an explanatory plan view of one member according to another embodiment of the present invention.

FIG. 17 is an explanatory sectional view taken along line EE in FIG. 16;

FIG. 18 is an explanatory view illustrating a conventional method of applying an adhesive to one member.

FIG. 19 is an explanatory plan view illustrating the state of application of an adhesive on one member of the related art.

20 is an explanatory sectional view taken along the line FF in FIG. 19;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Liquid chamber board, 2 ... Vibration plate, 3 ... Recess, 4 ... Piezoelectric element,
6 ... flow path forming plate, 7 ... common ink chamber forming plate, 8 ... nozzle plate, 21 ... liquid chamber substrate, 22 ... electrode substrate, 23 ... lid member,
Reference numeral 24: nozzle plate, 30: diaphragm, 35: electrode, 41: one member, 42, 52: opening, 43: dent, 44: adhesive.

Claims (9)

[Claims] 1. An ink jet head in which one member formed by arranging a plurality of openings is joined to another member via an adhesive, the joining surface of the one member is staggered with respect to the plurality of openings. An inkjet head having a plurality of depressions arranged in a shape. 2. The ink jet head according to claim 1, wherein said one member is made of stainless steel, and an oxide film is formed on said joint surface. 3. An ink jet head according to claim 1, wherein said oxide film is formed by an annealing process or a plasma process. 4. The ink jet head according to claim 1, wherein said adhesive is a polyimide-based adhesive. 5. The ink jet head according to claim 4, wherein the thickness of the adhesive is in a range of 1 μm to 4 μm. 6. The ink jet head according to claim 1, wherein the adhesive is an epoxy adhesive. 7. The ink jet head according to claim 6, wherein the thickness of the adhesive does not exceed 2 μm. 8. The ink jet head according to claim 1, wherein the opening of the one member is an ink flow channel or an ink flow channel hole. 9. A method for manufacturing an ink-jet head for manufacturing the ink-jet head according to claim 1,
A method of manufacturing an ink jet head, wherein an adhesive is transferred and applied from a concave side to an opening side of the one member by a transfer roller.