JP2008230016A - Manufacturing method of liquid jetting head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the method for manufacturing a liquid jetting head improved for a working and production efficiency. <P>SOLUTION: The method concerned comprises the bending process of bending circuit boards 35 by impressing the circuit boards 35 to the side of an electric conduction pad 36 of a wiring substrate 37 in the same direction with using open rims 38a, 38b of an opening 38 as fulcrums after inserting the circuit board 35 through the opening 38 of the wiring substrate 37 while holding two or more piezoelectric element units 17 in a compartment 18 and the joining process of joining the wiring to the electric conduction pad 36 while impressing the head ends of the bent circuit boards 35 onto the wiring substrate 37. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid by driving a piezoelectric element, and more particularly, to a method of connecting wiring of a circuit board connected to a piezoelectric element to a conductive pad of a wiring board.

  As a typical example of a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from nozzle openings using pressure generated by displacement of a piezoelectric element is known. Specifically, a piezoelectric element (piezoelectric vibrator) is provided via a diaphragm in a region facing the pressure generating chamber communicating with the nozzle opening, and a voltage is applied to the piezoelectric element to contract or expand the piezoelectric element. Is known in which a pressure generating chamber is pressurized and ink droplets are ejected from a nozzle opening (see, for example, Patent Document 1). A piezoelectric element constituting such an ink jet recording head is housed in a housing portion of a head case (base), and a conductive pad on a wiring board (upper closing plate) provided on the head case via a circuit board. And are electrically connected. That is, one end of the circuit board is connected to the piezoelectric element, and the other end is connected to the conductive pad.

  In addition, as an ink jet recording head, a head case (head holder) provided with a plurality of accommodating portions and a plurality of piezoelectric element units (piezoelectric vibrator units) mounted in the head case (for example, a patent) Reference 2).

JP 2004-74740 A Japanese Unexamined Patent Publication No. 2000-218774 (3rd page, FIGS. 4 and 7)

  However, in the case of an ink jet recording head having a plurality of piezoelectric element units, it is cumbersome to bend each circuit board connected to each piezoelectric element unit and connect it to a conductive pad, which reduces work efficiency and production efficiency. There is a problem of end.

  Such a problem exists not only in a manufacturing method of an ink jet recording head that ejects ink but also in a manufacturing method of a liquid ejecting head that ejects liquid other than ink.

  SUMMARY An advantage of some aspects of the invention is that it provides a method of manufacturing a liquid jet head with improved work efficiency and production efficiency.

  The present invention includes a plurality of pressure generation chambers communicating with nozzle openings for ejecting liquid, a piezoelectric element that applies pressure for discharging liquid to each pressure generation chamber, and a wiring whose base end side is connected to the piezoelectric element. A piezoelectric element unit including a circuit board having a head, a head case having an accommodating portion for accommodating a plurality of piezoelectric element units, and a wiring board tip connected to each piezoelectric element unit fixed on the head case. A plurality of circuit boards extending to the outside through openings provided in the wiring board, bent on the wiring board, and leading ends of the wirings. A method of manufacturing a liquid jet head connected to a conductive pad, wherein a plurality of piezoelectric element units are housed in a housing portion, and a plurality of circuit boards are inserted into openings of a wiring board, By pressing the road board toward the conductive pad side of the wiring board in the same direction with the opening edge of the opening as a fulcrum, the bending process of bending a plurality of circuit boards, and the tip of the folded circuit board on the wiring board And a bonding step of bonding the wiring to the conductive pad while pressing.

  According to this, since the plurality of circuit boards extended to the outside through the opening of the wiring board are pressed and bent in the same direction with the opening edge of the opening as a fulcrum, the circuit board can be easily bent. In addition, it can be easily joined to the wiring board by pressing the circuit board that has been bent by bending.

  In the bending step of the method of manufacturing a liquid jet head according to the present invention, the circuit board may be bent using each opening edge provided at a location corresponding to each circuit board as a fulcrum.

  According to this, it is possible to easily bend the circuit board for each circuit board with the opening edge as a fulcrum.

  In the bending step of the manufacturing method of the liquid jet head according to the present invention, the circuit board may be bent to the side of each of the conductive pads provided at a location corresponding to each circuit board.

  In this way, it is possible to increase the degree of freedom in adjusting the length of the circuit board and designing the layout of the wiring board.

  In the bending step of the manufacturing method of the liquid jet head of the present invention, a plurality of circuit boards may be bent by moving a bending tool for bending the circuit board in the same direction.

  According to this, the bending operation can be easily performed by moving the bending tool in the same direction.

  The bending tool of the liquid jet head manufacturing method of the present invention may be configured to bend a plurality of circuit boards by rotating the rotating member in the same direction.

  According to this, the circuit board can be easily bent using the rotation of the rotating member.

  The bending tool of the liquid jet head manufacturing method of the present invention may be configured to bend a plurality of circuit boards by pressing and moving the pressing member in the same direction.

  According to this, a circuit board can be easily bent using the press of a pressing member.

  The pressing member of the method of manufacturing a liquid jet head according to the present invention may be configured to bend a plurality of circuit boards and join the circuit boards to the wiring board.

  According to this, since the circuit board is bent and the wiring board is joined at the same time, the working efficiency can be improved.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1A is a schematic cross-sectional view showing an ink jet recording head which is an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 1B is a schematic plan view of a wiring board. FIG. 2 is a cross-sectional view of the main part of the ink jet recording head.

As shown in the figure, the ink jet recording head 10 of the present embodiment includes a flow path forming substrate 12 having a plurality of pressure generation chambers 11 and a nozzle having a plurality of nozzle openings 13 communicating with each pressure generation chamber 11. The plate 14, the vibration plate 15 provided on the surface of the flow path forming substrate 12 opposite to the nozzle plate 14, and the piezoelectric element 16 provided in a region corresponding to each pressure generation chamber 11 on the vibration plate 15. It has a piezoelectric element unit 17 and a head case 19 having an accommodating portion 18 that is fixed on the diaphragm 15 and accommodates the piezoelectric element unit 17.

  In the flow path forming substrate 12, a plurality of pressure generating chambers 11 are partitioned by a partition wall and arranged in parallel in the width direction on the surface layer portion on one side. For example, in the present embodiment, a plurality of pressure generation chambers 11 are arranged in parallel on the flow path forming substrate 12, and ink is supplied to each pressure generation chamber 11 outside the row of each pressure generation chamber 11. A reservoir 21 is provided penetrating the flow path forming substrate 12 in the thickness direction. Each pressure generating chamber 11 and the reservoir 21 communicate with each other via an ink supply path 22. In this embodiment, the ink supply path 22 is formed with a width narrower than that of the pressure generation chamber 11, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 21 into the pressure generation chamber 11. Further, a nozzle communication hole 23 penetrating the flow path forming substrate 12 is formed on the end side of the pressure generating chamber 11 opposite to the reservoir 21. In this embodiment, the flow path forming substrate 12 is made of a silicon single crystal substrate, and the pressure generating chamber 11 and the like provided in the flow path forming substrate 12 are formed by etching the flow path forming substrate 12. ing.

  A nozzle plate 14 in which nozzle openings 13 are formed is bonded to one surface side of the flow path forming substrate 12 via an adhesive or a heat welding film, and each nozzle opening 13 is provided in the flow path forming substrate 12. In addition, the pressure generating chambers 11 communicate with each other through the nozzle communication holes 23. Further, a diaphragm 15 is bonded to the other surface side of the flow path forming substrate 12, that is, the opening surface side of the pressure generating chamber 11, and each pressure generating chamber 11 is sealed by the diaphragm 15.

  The diaphragm 15 is formed of a composite plate of an elastic film 24 made of an elastic member such as a resin film and a support plate 25 made of, for example, a metal material that supports the elastic film 24, and is elastic. The membrane 24 side is bonded to the flow path forming substrate 12. For example, in the present embodiment, the elastic film 24 is made of a PPS (polyphenylene sulfide) film having a thickness of about several μm, and the support plate 25 is made of a stainless steel plate (SUS) having a thickness of about several tens of μm. In addition, an island portion 26 with which the tip end portion of the piezoelectric element 16 abuts is provided in a region of the diaphragm 15 facing each pressure generating chamber 11. That is, a thin portion 27 thinner than other regions is formed in a region of the diaphragm 15 facing the peripheral edge of each pressure generating chamber 11, and an island portion 26 is provided inside each thin portion 27. ing. Further, in the present embodiment, in the region facing the reservoir 21 of the vibration plate 15, as in the case of the thin portion 27, the support portion 25 is removed by etching and the compliance portion 28 that is substantially composed only of an elastic film is provided. It has been. The compliance section 28 absorbs the pressure change by the deformation of the elastic film 24 of the compliance section 28 when the pressure change in the reservoir 21 occurs, and always keeps the pressure in the reservoir 21 constant. Fulfill.

  Each piezoelectric element 16 constituting the piezoelectric element unit 17 is fixed in a state where the tip of the active region is in contact with the island portion 26 of the diaphragm 15.

  Here, the piezoelectric element 16 which is a pressure generating means for generating a pressure for ejecting ink droplets into the pressure generating chamber 11 is integrally formed in one piezoelectric element unit 17 in this embodiment. That is, a piezoelectric element forming member 32 is formed by laminating piezoelectric materials 29 and electrode forming materials 30 and 31 alternately in a sandwich shape, and the piezoelectric element forming members 32 correspond to the respective pressure generating chambers 11. Each piezoelectric element 16 is formed by cutting on the comb teeth. That is, in this embodiment, the plurality of piezoelectric elements 16 are integrally formed. An inactive region that does not contribute to the vibration of the piezoelectric element 16 (piezoelectric element forming member 32), that is, the base end side of the piezoelectric element 16 is fixed to the fixed substrate 33. In the vicinity of the base end portion of the piezoelectric element 16, a circuit board 35 (35 a, 35 b) having a wiring 34 for supplying a signal for driving each piezoelectric element 16 is provided on the surface opposite to the fixed substrate 33. In this embodiment, the piezoelectric element unit 17 is configured by the piezoelectric element 16 (piezoelectric element forming member 32), the fixed substrate 33, and the circuit substrate 35 (35a, 35b).

  Such a piezoelectric element unit 17 is fixed in a state where the tip of the piezoelectric element 16 is in contact with the island part 26 of the diaphragm 15 described above. For example, in the present embodiment, the head case 19 is fixed on the diaphragm 15 as described above, and the piezoelectric element unit 17 is accommodated in the accommodating portion 18 of the head case 19 and the piezoelectric element 16 is fixed. The fixed substrate 33 thus fixed is fixed to the head case 19 on the surface opposite to the piezoelectric element 16.

  The head case 19 is provided with a plurality of accommodating portions 18 in which the piezoelectric element units 17 are accommodated.

  In the present embodiment, four accommodating portions 18 are arranged in parallel, and two piezoelectric element units 17 are arranged in one accommodating portion 18 so that two piezoelectric elements 16 face each other. That is, the ink jet recording head 10 of this embodiment is provided with a total of eight piezoelectric element units 17. In the ink jet recording head 10 of this embodiment, since the nozzle openings 13 are provided for each piezoelectric element unit 17, eight nozzle openings 13 are provided.

  On the head case 19, a wiring board 37 provided with a plurality of conductive pads 36 (36a, 36b) to which the wirings 34 of the circuit board 35 (35a, 35b) are respectively connected is fixed. The housing part 18 of the case 19 is substantially closed by the wiring board 37. A slit-like opening 38 is formed in the wiring board 37 in a region facing the housing part 18 of the head case 19, and the circuit board 35 (35 a, 35 b) is connected to the housing part from the opening 38 of the wiring board 37. 18 is drawn to the outside.

  Note that one opening 38 of the wiring board 37 is provided for each accommodating portion 18, that is, four openings are provided in the present embodiment, and two piezoelectric element units 17 provided in one accommodating portion 18 are provided. The two circuit boards 35 (35a, 35b) connected to each of the two are drawn out from one opening 38.

  Here, the circuit board 35 (35a, 35b) constituting the piezoelectric element unit 17 is, in this embodiment, a flexible printed circuit board (FPC) on which a driving IC (not shown) for driving the piezoelectric element 16 is mounted, For example, it consists of a tape carrier package (TCP), a chip on film (COF), or the like. And each wiring 34 of the circuit board 35 is connected to the electrode forming materials 30 and 31 which comprise the piezoelectric element 16 by the solder | pewter, anisotropic conductive material, etc. in the base end part side, for example. On the other hand, on the tip end side, each wiring 34 is joined to each conductive pad 36 (36 a, 36 b) of the wiring board 37. Specifically, each wiring board 37 is bent along the surface of the wiring board 37 with the leading end of the circuit board 35 (35a, 35b) drawn out from the opening 38 of the wiring board 37 to the outside of the housing part 18. 34 is bonded to each conductive pad 36 (36 a, 36 b) of the wiring substrate 37. That is, it is bent at about 90 degrees at the opening edge (38a, 38b) of the opening 38 of the wiring board 37 provided at a position corresponding to each of the circuit boards 35 (35a, 35b), and is formed on the surface of the wiring board 37. The conductive pads 36 (36a, 36b) provided at positions corresponding to the circuit boards 35 (35a, 35b) are joined.

  In such an ink jet recording head 10, when ejecting ink droplets, the volume of each pressure generating chamber 11 is changed by deformation of the piezoelectric element 16 and the diaphragm 15 to eject ink droplets from a predetermined nozzle opening 13. It is like that. Specifically, when ink is supplied to the reservoir 21 from an ink cartridge (not shown), the ink is distributed to each pressure generating chamber 11 via the ink supply path 22. Actually, the piezoelectric element 16 is contracted by applying a voltage to the piezoelectric element 16. As a result, the diaphragm 15 is deformed together with the piezoelectric element 16 to expand the volume of the pressure generating chamber 11, and ink is drawn into the pressure generating chamber 11. Then, after the ink is filled up to the nozzle opening 13, the voltage applied to the electrode forming materials 30 and 31 of the piezoelectric element 16 is released according to the recording signal supplied through the wiring substrate 37. As a result, the piezoelectric element 16 is expanded to return to the original state, and the diaphragm 15 is also displaced to return to the original state. As a result, the volume of the pressure generation chamber 11 contracts, the pressure in the pressure generation chamber 11 increases, and ink droplets are ejected from the nozzle openings 13.

  Here, the manufacturing method of the ink jet recording head 10 of the present embodiment will be described in detail. 3 and 5 to 7 are schematic cross-sectional views showing the manufacturing process of the ink jet recording head according to Embodiment 1 of the present invention, and FIG. 4 is the ink jet recording according to Embodiment 1 of the present invention. It is a schematic sectional drawing and a top view showing a manufacturing process of a head.

  First, as shown in FIG. 3, the piezoelectric element unit 17 is fixed in the accommodating portion 18 of the head case 19. Note that the base end portion of the circuit board 35 is bonded to the piezoelectric element unit 17 in advance, and when the piezoelectric element unit 17 is fixed in the housing portion 18 of the head case 19, the tip of the circuit board 35 (35a, 35b). The part protrudes from the opening of the accommodating part 18.

  Next, as shown in FIG. 4, the circuit board 35 (35 a, 35 b) is aligned by the alignment tool 100. Here, the alignment tool 100 has a plurality of comb teeth portions 101 provided in a comb shape. The interval between the plurality of comb-teeth portions 101 provided in a comb-teeth shape of the alignment tool 100 is the same as or narrower than the openings 38 provided in the wiring board 37.

  Then, by sandwiching the two circuit boards 35 (35a, 35b) connected to the piezoelectric element unit 17 fixed in each accommodating part 18 between the comb teeth 101 of the alignment tool 100, the circuit board 35 (35a , 35b) can be aligned in accordance with the opening width and interval of the opening 38 of the wiring board 37.

  In the present embodiment, the two circuit boards 35 are sandwiched between the two comb-tooth portions 101 of the alignment tool 100. However, the present invention is not limited to this. For example, the interval between the circuit boards 35 adjacent to each other is set. In the case of being wide, a plurality of circuit boards 35 may be aligned by sandwiching one circuit board 35 between two comb teeth portions 101.

  Next, as shown in FIG. 5A, the plurality of circuit boards 35 (35 a, 35 b) are inserted through the openings 38 of the wiring board 37, and the wiring board 37 is joined to the head case 19. At this time, the plurality of circuit boards 35 (35a, 35b) are aligned by the alignment tool 100 in accordance with the opening width and interval of the openings 38 of the wiring board 37, and thus the plurality of circuit boards 35 (35a, 35b). Can be easily inserted into each opening 38 of the wiring board 37. That is, since the circuit board 35 (35a, 35b) is made of a film-like material that is relatively soft and easy to bend, such as TCP or COF, the tip end portion is inclined by its own weight in the absence of the alignment tool 100. It is difficult and complicated to simultaneously insert the circuit board 35 (35a, 35b) into the openings 38 of the wiring board 37. For this reason, the work efficiency and the production efficiency can be improved by inserting the plurality of circuit boards 35 into the openings 38 of the wiring board 37 using the alignment tool 100 as described above.

  Next, as shown in FIG. 5B, the alignment tool 100 is pulled out from between the head case 19 and the wiring board 37 to fix the wiring board 37 to the head case 19. That is, when the wiring board 37 and the head case 19 are joined, if the alignment tool 100 exists between them, the alignment tool 100 cannot be joined because it interferes, so the alignment tool 100 is excluded in advance. There is a need. Since the alignment tool 100 is provided in a comb-teeth shape, even if the circuit board 35 (35a, 35b) is inserted through the opening 38 of the wiring board 37, the alignment tool 100 is connected to the wiring board 37 and the head. It can be pulled out from between the case 19.

  Next, as shown in FIG. 6, the bending tool is moved in the same direction to bend the plurality of circuit boards 35 (35a, 35b) (bending step). In the present embodiment, the bending tool 110 uses a rotating member, and for example, a roller 110 can be employed. The roller 110 is rotated on the wiring board 37 in the same direction as shown in the figure. As a result, the plurality of circuit boards 35 (35a, 35b) projecting from the housing part 18 of the head case 19 through the openings 38 of the wiring board 37 to the outside are provided with the opening edges 38a, 38b corresponding to the respective portions. Are bent toward the wiring board 37 at the same time as being pressed. In other words, bending is applied to the plurality of circuit boards 35 (35a, 35b). In this way, the circuit board 35 (35a, 35b) remains in its original state even after the rotating member is removed from the circuit board 35 by sliding the circuit board 35 against the wiring board 37 side by the rotating member. A sufficient amount of bending is ensured without returning to step (b).

  If necessary, the roller 110 can be rotated and moved in the same direction a plurality of times for bending. Further, the circuit board 35 may be bent while the roller 110 is heated by a heating means or the like according to characteristics such as the material and thickness of the circuit board 35. Thereby, even if it is the circuit board 35 which is easy to return to an original state, sufficient bending amount is ensured, without returning to an original state. Incidentally, as a heating temperature by a heating means, about 100-200 degreeC is mentioned, for example.

  Thus, by performing the bending process of simultaneously bending the plurality of circuit boards 35 (35a, 35b) with the roller 110, the manufacturing time can be shortened and the working efficiency and the manufacturing efficiency can be improved. In addition, the circuit board 35 can be easily and reliably formed by sliding the circuit board 35 while pressing the circuit board 35 toward the wiring board 37 with the bending tool 110. Furthermore, since the fulcrum to be bent is provided for each of the circuit boards 35a and 35b, it is possible to efficiently perform the setting.

  Next, as shown in FIG. 7, each wiring 34 of the circuit board 35 (35a, 35b) is joined (fused) to the conductive pad 36 (36a, 36b) of the wiring board 37 (joining step). Specifically, the plurality of circuit boards 35 (35a) are pressed while pressing the tip portions of the plurality of circuit boards 35 (35a, 35b) onto the wiring board 37 by the bonding tool 120 heated to a predetermined temperature, for example, about 500 ° C. , 35b) are simultaneously solder-bonded (fused) to the conductive pads 36 (36a, 36b) provided at locations corresponding to the respective wirings 34. The method for heating the bonding tool 120 is not particularly limited. For example, when the bonding tool 120 is made of a metal material having a predetermined resistance, a predetermined voltage is applied to the bonding tool 120 so that the bonding tool 120 is heated. The device itself may be heated, or may be heated using, for example, a thermocouple.

  In the present embodiment, the joining tool 120 joins the two circuit boards 35 to the respective conductive pads 36 at the same time. That is, the front end surface that presses and heats the circuit board 35 of the joining tool 120 is formed in a larger area than the two conductive pads 36.

  Then, the bonding of the circuit board 35 and the conductive pad 36 by the bonding tool 120 is repeated a plurality of times, in the present embodiment, four times, thereby bonding the eight circuit boards 35 and the conductive pads 36, as shown in FIG. Such an ink jet recording head 10 can be formed.

  Note that four bonding tools 120 may be provided, and the eight circuit boards 35 (35a, 35b) and the conductive pads 36 (36a, 36b) may be bonded at the same time. A bonding tool having an area capable of bonding the conductive pad 36 and the conductive pad 36 at the same time may be used. In any case, by simultaneously bonding to the plurality of circuit boards 35 and the corresponding conductive pads 36, it is possible to shorten the manufacturing time and improve the work efficiency and the production efficiency.

(Other embodiments)
FIG. 8 is a diagram illustrating a manufacturing process of a recording head using a pressing member as a bending tool. In the present embodiment, a plurality of circuit boards 35 (35a, 35b) are bent using a pressing member 130 instead of the rotating member used in the first embodiment. Specifically, the pressing member 130 is pressed and moved in the same direction with respect to the circuit board 35 (35a, 35b) from the diagonally upward direction toward the circuit board 35 (35a, 35b). As a result, the plurality of circuit boards 35 (35a, 35b) projecting from the housing part 18 of the head case 19 through the openings 38 of the wiring board 37 to the outside are provided with the opening edges 38a, 38b corresponding to the respective portions. Are bent toward the wiring board 37 at the same time while being pressed. In other words, bending is applied to the plurality of circuit boards 35 (35a, 35b). In this way, the circuit board 35 (35a, 35b) remains in its original state even after the rotating member is removed from the circuit board 35 by sliding the circuit board 35 against the wiring board 37 side by the rotating member. A sufficient amount of bending is ensured without returning to step (b). The shape of the pressing member can be adopted if the pressing surface of the circuit board 35 (35a, 35b) is substantially flat.

  Furthermore, the circuit board 35 (35a, 35b) can be pressed with the pressing member 130, and the circuit board 35 (35a, 35b) and the conductive pad 36 (36a, 36b) can be joined using a heating means. For example, the pressing member 130 may be heated by applying a predetermined voltage to the pressing member 130 using the pressing member 130 made of a metal material having a predetermined resistance.

(Modification)
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above. For example, in the first embodiment described above, the alignment of the circuit boards 35 (35a, 35b) using the alignment tool 100, the bending step of bending the plurality of circuit boards 35 (35a, 35b), and the plurality of circuit boards 35 (35a, 35b). ) Is bonded to each conductive pad 36 (36a, 36b). However, the present invention is configured to perform a bending step of bending at least a plurality of circuit boards 35 (35a, 35b) in the same direction. In other words, the alignment of the circuit boards 35 using the alignment tool 100 and the bonding process of bonding the plurality of circuit boards 35 to the respective conductive pads 36 at the same time may not be performed. That is, for example, the circuit board 35 may be inserted into the opening 38 of the wiring board 37 without using the alignment tool 100, and the circuit board 35 and the conductive pad 36 are joined to each circuit board 35. It may be. Incidentally, as in the first embodiment described above, the circuit board 35 is aligned using the alignment tool 100, the bending process of bending the plurality of circuit boards 35 at the same time, and the bonding process of simultaneously bonding the plurality of circuit boards 35 to the respective conductive pads 36. By performing the above, work efficiency and production efficiency can be further improved.

  In the first embodiment described above, the inkjet recording head 10 in which the two piezoelectric element units 17 are accommodated in the single accommodating portion 18 so that the piezoelectric elements 16 face each other is illustrated. The number of piezoelectric element units 17 accommodated in 18 and the arrangement direction of the piezoelectric element units 17 are not particularly limited thereto. For example, one piezoelectric element unit 17 may be accommodated in one accommodating portion, and the plurality of piezoelectric element units 17 are in the same direction, that is, one side of the parallel arrangement direction of the piezoelectric element units 17 is a fixed substrate. 33, and the other side in the juxtaposed direction may be arranged to be the piezoelectric element 16.

  Furthermore, in the first embodiment described above, the longitudinal vibration type piezoelectric element 16 that expands and contracts in the axial direction by alternately stacking piezoelectric materials and electrode forming materials as pressure generating means for causing a pressure change in the pressure generating chamber 11 is provided. However, the present invention is not particularly limited to this. For example, an actuator device having a thin film type piezoelectric element that is bent and deformed by film formation and lithography, and a green sheet is attached. An actuator device having a thick film type piezoelectric element formed by the method can be used. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, it is possible to use a so-called electrostatic actuator that deforms the diaphragm by electrostatic force and ejects droplets from the nozzle openings.

  In the first embodiment described above, an ink jet recording head has been described as an example of a liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads, and ejects liquids other than ink. Of course, the present invention can also be applied to a manufacturing method of a liquid jet head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

FIG. 2 is a schematic cross-sectional view of a recording head according to Embodiment 1 and a schematic plan view of a wiring board. FIG. 3 is a cross-sectional view of a main part of the recording head according to the first embodiment. FIG. 3 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment. FIG. 3 is a schematic cross-sectional view and a top view illustrating a manufacturing process of the recording head according to the first embodiment. FIG. 3 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment. FIG. 3 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment. FIG. 3 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to the first embodiment. FIG. 10 is a schematic cross-sectional view illustrating a manufacturing process of a recording head according to another embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Recording head, 17 ... Piezoelectric element unit, 18 ... Accommodating part, 19 ... Head case, 34 ... Wiring, 35, 35a, 35b ... Circuit board, 36, 36a, 36b ... Conductive pad, 37 ... Wiring board, 38 ... Opening portions, 38a, 38b ... opening edge portions, 100 ... alignment tools, 101 ... comb teeth portions, 110 ... rollers as bending tools, 120 ... joining tools, 130 ... pressing members as bending tools.

Claims (7)

A circuit board having a plurality of pressure generating chambers communicating with nozzle openings for ejecting liquid, a piezoelectric element for applying a pressure for discharging liquid to each pressure generating chamber, and a wiring whose base end side is connected to the piezoelectric element A piezoelectric element unit including: a head case having an accommodating portion in which a plurality of piezoelectric element units are accommodated; and a tip portion of the wiring of the circuit board connected to each piezoelectric element unit fixed on the head case A plurality of circuit boards extending to the outside through openings provided in the wiring board, and bent on the wiring board, A method of manufacturing a liquid jet head in which a leading end of a wiring is connected to the conductive pad,
A plurality of piezoelectric element units are accommodated in the accommodating portion, and after the plurality of circuit boards are inserted into the openings of the wiring board, the plurality of circuit boards are arranged in the same direction with the opening edge of the opening as a fulcrum. Bending step of bending the plurality of circuit boards by pressing to the conductive pad side of the wiring board;
And a bonding step of bonding the wiring to the conductive pad while pressing the bent front end portion of the circuit board onto the wiring substrate. The method of manufacturing a liquid jet head according to claim 1,
In the bending step, the circuit board is bent using each opening edge portion provided at a location corresponding to each circuit board as a fulcrum. In the manufacturing method of the liquid jet head according to claim 1 or 2,
In the bending step, the circuit board is bent to the side of each conductive pad provided at a location corresponding to each circuit board. In the manufacturing method of the liquid jet head according to any one of claims 1 to 3,
In the bending step, the plurality of circuit boards are bent by moving a bending tool for bending the circuit boards in the same direction. The method of manufacturing a liquid jet head according to claim 4,
The method of manufacturing a liquid ejecting head, wherein the bending tool bends the plurality of circuit boards by rotating and rotating a rotating member in the same direction. The method of manufacturing a liquid jet head according to claim 4,
The method of manufacturing a liquid ejecting head, wherein the bending tool bends the plurality of circuit boards by pressing and moving a pressing member in the same direction. The method of manufacturing a liquid jet head according to claim 6.
The method of manufacturing a liquid jet head, wherein the pressing member bends the plurality of circuit boards and joins the circuit board to the wiring board.

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