JP2009119634A - Manufacturing device for liquid injection head, manufacturing method therefor, and manufacturing device for work piece - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device for a liquid injection head enhanced in reliability and production efficiency, a manufacturing method therefor, and a manufacturing device for a work piece. <P>SOLUTION: A plurality of piezoelectric element units 17 is stored in a storage part 18, each circuit board 35 is inserted into an opening part 38 of a wiring board 37, the plurality of circuit boards 35 is bent thereafter at the same time, by pressing the circuit boards 35 toward a conductive pad side of the wiring board 37 by a transparent member 61 of a pressing tool 60, using an open edge part of the opening part 38 as a fulcrum, and a wire 34 is joined to a conductive pad 36 by irradiating a solder provided in the conductive pad 36 with a laser beam from a laser beam irradiation device 70, while pressing each tip part of the circuit boards 35 on the wiring board 37 by the transparent member 61. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a liquid ejecting head manufacturing apparatus, a manufacturing method thereof, and a work manufacturing apparatus, and more particularly to a method of connecting wiring of a circuit board connected to a piezoelectric element to a conductive pad of a wiring board.

  As a typical example of a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from nozzle openings using pressure generated by displacement of a piezoelectric element is known. Specifically, a piezoelectric element (piezoelectric vibrator) is provided via a diaphragm in a region facing the pressure generating chamber communicating with the nozzle opening, and a voltage is applied to the piezoelectric element to contract or expand the piezoelectric element. Is known in which a pressure generating chamber is pressurized and ink droplets are ejected from a nozzle opening (see, for example, Patent Document 1). A piezoelectric element constituting such an ink jet recording head is housed in a housing portion of a head case (base), and a conductive pad on a wiring board (upper closing plate) provided on the head case via a circuit board. And are electrically connected.

  The circuit board is connected to the wiring board after its base end is bent while its base end is connected to the piezoelectric element. For example, the tip of each circuit board is bent with a jig, and then heat is applied to the solder that is in contact with the tip of the bent circuit board and the wiring board through the circuit board using a pulse heat method. The circuit board and the wiring board are joined.

JP 2004-74740 A

  However, when the circuit board is heated and bonded to the wiring board by a pulse heat method or the like, it is necessary to perform air blow to cool the circuit board or the like after bonding, and foreign substances are mixed into the ink jet recording head by this air blow, There arises a problem that reliability is lowered. In addition, the cycle time for manufacturing the ink jet recording head is increased by the time required for this cooling, resulting in a problem that the production efficiency is lowered. Furthermore, if the circuit board is not sufficiently bent, a gap is generated between the solder provided in advance on the wiring board and the circuit board. There is a possibility that the heat to be transmitted is not transmitted to the solder and damages the circuit board, for example.

  Such a problem exists not only in an ink jet recording head that ejects ink, but also in a case where a circuit board is attached to a liquid ejecting head that ejects a liquid other than ink or a work including a wiring board.

  In view of such circumstances, it is an object of the present invention to provide a liquid jet head manufacturing apparatus, a manufacturing method thereof, and a workpiece manufacturing apparatus with improved reliability and production efficiency.

An aspect of the present invention that solves the above problems includes a plurality of pressure generation chambers that communicate with nozzle openings for ejecting liquid, a piezoelectric element that applies pressure for discharging liquid to each pressure generation chamber, and a base end side of the pressure generation chamber. A piezoelectric element unit including a circuit board having wiring connected to the piezoelectric element, a head case having a housing portion in which the piezoelectric element unit is accommodated, and a tip of the wiring of the circuit board fixed on the head case A wiring board having a conductive pad to which the part is connected, and the circuit board is extended to the outside through an opening provided in the wiring board and reaches the wiring board. An apparatus for manufacturing a liquid jet head in which a leading end of the wiring is connected via a solder provided on the conductive pad in a bent state, and irradiates a laser beam capable of applying heat to the solder. And a transparent member formed of a member that transmits laser light from the laser light irradiation device, and the transparent member is attached to one surface facing the wiring board corresponding to the piezoelectric element unit. A pressing jig provided with a pressing member provided with a penetrating portion in a region facing the transparent member, and the pressing jig is inserted through the opening of the wiring board through the transparent member. The circuit board is bent to the conductive pad side of the wiring board, and the circuit board is pressed to the wiring board side so that a tip portion of the wiring is in contact with the solder. And an apparatus for manufacturing a liquid jet head, wherein the solder is irradiated with a laser beam through the transparent member, and a tip portion of the wiring is joined to the conductive pad by the solder. A.
In such an embodiment, excessive heat is not applied to the solder by the laser beam. This eliminates the need for air blow for cooling the circuit board and the like as in the prior art. Therefore, it is possible to save the time for the air blow and improve the production efficiency of the liquid jet head. In addition, foreign matter can not be mixed by air blow, and a highly reliable liquid jet head can be manufactured.

  Here, it is preferable that a plurality of the piezoelectric element units are accommodated in the head case, and the transparent member is attached to the pressing member via an elastic body for each of the plurality of piezoelectric element units. According to this, even if the height of the solder provided on the conductive pad of each piezoelectric element unit varies, each transparent member can press each circuit board following the height of each solder. As a result, since the bonding can be reliably performed without generating a gap between each wiring and the solder provided on the conductive pad, the yield of the liquid jet head can be improved.

According to another aspect of the present invention, a plurality of pressure generating chambers communicating with nozzle openings for ejecting liquid, a piezoelectric element that applies pressure for discharging liquid to each pressure generating chamber, and a base end side on the piezoelectric element are provided. A piezoelectric element unit including a circuit board having a wiring to be connected; a head case having an accommodating portion in which the piezoelectric element unit is accommodated; and a distal end portion of the wiring of the circuit board fixed on the head case. A wiring board having a conductive pad to be connected, and the circuit board is extended to the outside through an opening provided in the wiring board and is bent so as to reach the wiring board. In the liquid jet head manufacturing method, the tip end of the wiring is connected via solder provided on the conductive pad in a state where the piezoelectric element unit is accommodated in the accommodating portion. A first step of inserting the circuit board into the opening of the wiring board, a transparent member formed of a member that transmits laser light, and the transparent member on the one surface facing the wiring board. The conductive pad of the wiring board using the pressing edge provided with a pressing member provided corresponding to the transparent member and provided with a penetrating portion in a region facing the transparent member, with the opening edge of the opening as a fulcrum A second step of bending the circuit board to the side by the transparent member, a third step of moving the pressing member to the wiring substrate side and bringing the tip of the wiring into contact with the solder, the penetrating portion, and And a fourth step of irradiating the solder with a laser beam through the transparent member to bond the tip of the wiring to the conductive pad with the solder. In the production method.
In this aspect, since the solder is heated by the laser beam, no extra heat is applied to the circuit board or the like. This eliminates the need for air blow for cooling the circuit board and the like as in the prior art. Therefore, it is possible to save the time for the air blow and improve the production efficiency of the liquid jet head. In addition, foreign matter can not be mixed by air blow, and a highly reliable liquid jet head can be manufactured.

  Further, in the fourth step, each solder provided on each of the plurality of conductive pads is preheated by irradiating laser light, and then the pressing member is further moved to the wiring board side, and the laser is again emitted. It is preferable to irradiate each solder with light and to join the tip of the wiring to each conductive pad with the solder. According to this, even if there is a variation in the height of each solder, the variation is eliminated by preheating and pressing, and the height of each solder becomes uniform. As a result, the solder and the wiring provided on the conductive pad can be reliably adhered and bonded without any gap. As a result, the yield of the liquid jet head is improved.

Another aspect of the present invention is a workpiece manufacturing apparatus for attaching a circuit board on which wiring connected to the wiring board via solder is attached to a work having the wiring board, and can apply heat to the solder. The transparent member is attached to the transparent member formed on a laser beam irradiating device that irradiates laser light, a transparent member formed by a member that transmits the laser light from the laser beam irradiating device, and the wiring board, and attached to the transparent member. A pressing jig provided with a pressing member provided with a penetrating portion in an opposing region, and the pressing jig bends the circuit board to the conductive pad side of the wiring board via the transparent member. The circuit board is pressed toward the wiring board so that the wiring comes into contact with the solder, and the laser beam irradiation device is placed on the solder via the penetrating portion and the transparent member. In apparatus for manufacturing a workpiece, characterized in that for bonding the wiring by irradiation of light in the solder to the conductive pads.
In this aspect, it is possible to reliably bond the circuit board to the wiring board for all workpieces having the wiring board.

Hereinafter, the present invention will be described in detail based on embodiments.
<Embodiment 1>
FIG. 1 is a schematic cross-sectional view showing an ink jet recording head that is an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view of a main part of the ink jet recording head.

  As shown in the figure, the ink jet recording head 10 of the present embodiment includes a flow path forming substrate 12 having a plurality of pressure generation chambers 11 and a nozzle having a plurality of nozzle openings 13 communicating with each pressure generation chamber 11. The plate 14, the vibration plate 15 provided on the surface of the flow path forming substrate 12 opposite to the nozzle plate 14, and the piezoelectric element 16 provided in a region corresponding to each pressure generation chamber 11 on the vibration plate 15. It has a piezoelectric element unit 17 and a head case 19 having an accommodating portion 18 that is fixed on the vibration plate 15 and accommodates the piezoelectric element unit 17.

  In the flow path forming substrate 12, a plurality of pressure generating chambers 11 are partitioned by a partition wall and arranged in parallel in the width direction on the surface layer portion on one side. For example, in the present embodiment, a plurality of pressure generation chambers 11 are arranged in parallel on the flow path forming substrate 12, and ink is supplied to each pressure generation chamber 11 outside the row of each pressure generation chamber 11. A reservoir 21 is provided penetrating the flow path forming substrate 12 in the thickness direction. Each pressure generating chamber 11 and the reservoir 21 communicate with each other via an ink supply path 22. In this embodiment, the ink supply path 22 is formed with a width narrower than that of the pressure generation chamber 11, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 21 into the pressure generation chamber 11. Further, a nozzle communication hole 23 penetrating the flow path forming substrate 12 is formed on the end side of the pressure generating chamber 11 opposite to the reservoir 21. In this embodiment, the flow path forming substrate 12 is made of a silicon single crystal substrate, and the pressure generating chamber 11 and the like provided in the flow path forming substrate 12 are formed by etching the flow path forming substrate 12. ing.

  A nozzle plate 14 in which nozzle openings 13 are formed is bonded to one surface side of the flow path forming substrate 12 via an adhesive or a heat welding film, and each nozzle opening 13 is provided in the flow path forming substrate 12. In addition, the pressure generating chambers 11 communicate with each other through the nozzle communication holes 23. Further, a diaphragm 15 is bonded to the other surface side of the flow path forming substrate 12, that is, the opening surface side of the pressure generating chamber 11, and each pressure generating chamber 11 is sealed by the diaphragm 15.

  The diaphragm 15 is formed of a composite plate of an elastic film 24 made of an elastic member such as a resin film and a support plate 25 made of, for example, a metal material that supports the elastic film 24, and is elastic. The membrane 24 side is bonded to the flow path forming substrate 12. For example, in the present embodiment, the elastic film 24 is made of a PPS (polyphenylene sulfide) film having a thickness of about several μm, and the support plate 25 is made of a stainless steel plate (SUS) having a thickness of about several tens of μm. In addition, an island portion 26 with which the tip end portion of the piezoelectric element 16 abuts is provided in a region of the diaphragm 15 facing each pressure generating chamber 11. That is, a thin portion 27 thinner than other regions is formed in a region of the diaphragm 15 facing the peripheral edge of each pressure generating chamber 11, and an island portion 26 is provided inside each thin portion 27. ing. Further, in the present embodiment, in the region facing the reservoir 21 of the vibration plate 15, as in the case of the thin portion 27, the support portion 25 is removed by etching and the compliance portion 28 that is substantially composed only of an elastic film is provided. It has been. The compliance portion 28 absorbs the pressure change when the elastic film 24 of the compliance portion 28 is deformed when the pressure change in the reservoir 21 occurs, and always keeps the pressure in the reservoir 21 constant. Fulfill.

  Each piezoelectric element 16 constituting the piezoelectric element unit 17 is fixed in a state where the tip of the active region is in contact with the island portion 26 of the diaphragm 15.

  Here, the piezoelectric element 16 which is a pressure generating means for generating a pressure for ejecting ink droplets into the pressure generating chamber 11 is integrally formed in one piezoelectric element unit 17 in this embodiment. That is, a piezoelectric element forming member 32 is formed by laminating piezoelectric materials 29 and electrode forming materials 30 and 31 alternately in a sandwich shape, and the piezoelectric element forming members 32 correspond to the respective pressure generating chambers 11. Each piezoelectric element 16 is formed by cutting on the comb teeth. That is, in this embodiment, the plurality of piezoelectric elements 16 are integrally formed. An inactive region that does not contribute to the vibration of the piezoelectric element 16 (piezoelectric element forming member 32), that is, the base end side of the piezoelectric element 16 is fixed to the fixed substrate 33. A circuit board 35 having a wiring 34 for supplying a signal for driving each piezoelectric element 16 is connected to the surface opposite to the fixed board 33 in the vicinity of the base end portion of the piezoelectric element 16. In the embodiment, the piezoelectric element unit 17 is configured by the piezoelectric element 16 (piezoelectric element forming member 32), the fixed substrate 33, and the circuit substrate 35.

  Such a piezoelectric element unit 17 is fixed in a state where the tip of the piezoelectric element 16 is in contact with the island part 26 of the diaphragm 15 described above. For example, in the present embodiment, the head case 19 is fixed on the diaphragm 15 as described above, and the piezoelectric element unit 17 is accommodated in the accommodating portion 18 of the head case 19 and the piezoelectric element 16 is fixed. The fixed substrate 33 thus fixed is fixed to the head case 19 on the surface opposite to the piezoelectric element 16.

  The head case 19 is provided with a plurality of accommodating portions 18 in which the piezoelectric element units 17 are accommodated.

  In the present embodiment, three accommodating portions 18 are provided side by side, and one piezoelectric element unit 17 is disposed in one accommodating portion 18. That is, the ink jet recording head 10 of the present embodiment is provided with a total of three piezoelectric element units 17. In the ink jet recording head 10 of the present embodiment, since the rows of nozzle openings 13 are provided for each piezoelectric element unit 17, three rows of nozzle openings 13 are provided.

  On the head case 19, a wiring board 37 provided with a plurality of conductive pads 36 to which the wirings 34 of the circuit board 35 are connected is fixed. The substrate 37 is substantially blocked. The wiring board 37 is formed with a slit-like opening 38 in a region facing the housing part 18 of the head case 19, and the circuit board 35 is drawn out of the housing part 18 from the opening 38 of the wiring board 37. It is.

  Note that one opening 38 of the wiring board 37 is provided for each accommodating portion 18, that is, three openings are provided in the present embodiment, and one piezoelectric element unit 17 provided in one accommodating portion 18 is provided. One circuit board 35 connected to is pulled out from one opening 38.

  Here, in the present embodiment, the circuit board 35 constituting the piezoelectric element unit 17 is a flexible printed circuit board (FPC) on which a driving IC (not shown) for driving the piezoelectric element 16 is mounted, for example, a tape carrier package. (TCP), chip on film (COF), flexible flat cable (FFC), and the like. And each wiring 34 of the circuit board 35 is connected to the electrode forming materials 30 and 31 which comprise the piezoelectric element 16 by the solder | pewter, anisotropic conductive material, etc. in the base end part side, for example. On the other hand, on the tip end side, each wiring 34 is joined to each conductive pad 36 of the wiring board 37. Specifically, each wiring 34 is connected to the wiring board 37 in a state where the front end of the circuit board 35 drawn out of the housing portion 18 from the opening 38 of the wiring board 37 is bent along the surface of the wiring board 37. The conductive pads 36 are joined via solder (not shown).

  In such an ink jet recording head 10, when ejecting ink droplets, the volume of each pressure generating chamber 11 is changed by deformation of the piezoelectric element 16 and the diaphragm 15 to eject ink droplets from a predetermined nozzle opening 13. It is like that. Specifically, when ink is supplied to the reservoir 21 from an ink cartridge (not shown), the ink is distributed to each pressure generating chamber 11 via the ink supply path 22. Actually, the piezoelectric element 16 is contracted by applying a voltage to the piezoelectric element 16. As a result, the diaphragm 15 is deformed together with the piezoelectric element 16 to expand the volume of the pressure generating chamber 11, and ink is drawn into the pressure generating chamber 11. Then, after the ink is filled up to the nozzle opening 13, the voltage applied to the electrode forming materials 30 and 31 of the piezoelectric element 16 is released according to a recording signal supplied via the wiring substrate 37. As a result, the piezoelectric element 16 is expanded to return to the original state, and the diaphragm 15 is also displaced to return to the original state. As a result, the volume of the pressure generation chamber 11 contracts, the pressure in the pressure generation chamber 11 increases, and ink droplets are ejected from the nozzle openings 13.

  Here, the manufacturing apparatus of the ink jet recording head 10 according to the first embodiment will be described. FIG. 3A is a plan view of the inkjet recording head manufacturing apparatus according to the first embodiment, and FIG. 3B is a cross-sectional view taken along line AA in FIG.

  The ink jet recording head manufacturing apparatus according to the first embodiment includes a pressing jig 60 that maintains a state in which the circuit board 35 of the ink jet recording head 10 is bent, and a laser light irradiation device 70 that emits laser light. is doing.

  The pressing jig 60 of this embodiment includes a housing member 50, a transparent member 61, and a pressing member 62. The accommodating member 50 is provided with an accommodating portion 53 that can accommodate the ink jet recording head 10. Further, the side wall of the housing member 50 in the direction opposite to the direction in which the circuit board 35 of the ink jet recording head 10 is bent is formed in a stepped shape so that the upper end surface thereof rises outward. The first stage is referred to as a first stage 51 and the second stage is referred to as a second stage 52. The first step portion 51 and the second step portion 52 are provided so that the pressing member 62 is positioned at a predetermined position with respect to the ink jet recording head 10. A detailed description of such positioning will be described later.

  Further, the side wall opposite to the side wall formed in a staircase shape is provided with a recess 54 at the upper end surface. The concave portion 54 is formed in a shape that can be fitted into a convex portion 65 provided on the pressing member 62. The accommodating member 50 may be any member that can fix the ink jet recording head 10 at a predetermined position.

  The transparent member 61 is formed of a member having heat resistance that transmits laser light from the laser light irradiation device and can withstand the temperature at which the solder melts. Although the transparent member 61 of this embodiment is formed of quartz glass, it may be formed of glass such as soda glass. Moreover, although the shape of the transparent member 61 is a rectangular parallelepiped, it is not limited to such a shape. In short, the transparent member 61 only needs to have a shape capable of pressing the entire bent tip of the circuit board 35.

  In the present embodiment, a total of three transparent members 61 are attached to one surface of the pressing member 62 facing the wiring board 37 corresponding to each of the three piezoelectric element units 17. More specifically, two pairs of leaf springs (an example of an elastic body) 63 per piezoelectric element unit 17 are provided on one surface of the pressing member 62 corresponding to the interval between the piezoelectric element units 17. Yes. A transparent member 61 is attached to the set of plate springs 63 via support metal fittings 64, and the transparent member 61 is biased by the plate springs 63 in a direction protruding from the pressing member 62.

  The pressing member 62 is provided with a penetrating portion 66 in a region facing the transparent member 61 attached to the pair of leaf springs 63. Further, on one surface of the pressing member 62 facing the wiring board 37, a convex portion 65 protruding toward the wiring board 37 is provided. The convex portion 65 is formed in a shape that can be fitted into the concave portion 54 provided in the housing member 50. In addition, although the convex part 65 is provided in order to control the downward movement of the press member 62, the detailed description regarding this is mentioned later.

  The laser beam irradiation device 70 irradiates a laser beam that applies heat to solder provided in advance on the conductive pad 36. The wavelength of the laser light is preferably a wavelength that is not absorbed by the circuit board 35 and can apply heat to the solder. In the present embodiment, for example, 980 nm laser light is used.

  When the pressing jig 60 is operated in a predetermined procedure (details will be described later), the convex portion 65 of the pressing member 62 is fitted into the concave portion 54 of the accommodating member 50, and one end portion of the pressing member 62 is the first of the accommodating member 50. Supported by the stepped portion 51. At this time, the pressing member 62 bends the front end portion of the circuit board 35 inserted through the opening 38 of the wiring board 37 to the conductive pad 36 side of the wiring board 37 through the transparent member 61 and each wiring of the circuit board 35. The state where the tip end portion of 34 is in contact with each conductive pad 36 via solder is maintained. In this state, the other end side of the pressing member 62 (the side opposite to the one side facing the wiring board 37) reaches the bent tip end portion of the circuit board 35 through the through portion 66 and the transparent member 61. A laser beam passage is formed. Therefore, the laser beam irradiation device 70 can irradiate the laser beam toward the tip of each wiring 34 of the circuit board 35 to melt the solder, and join the tip of each wiring 34 to each conductive pad 36.

  According to the ink jet recording head manufacturing apparatus described above, the solder is heated by the laser beam, so that excessive heat is not applied to the circuit board 35 or the like, and air blow for cooling the circuit board or the like is conventionally performed. It becomes unnecessary. Therefore, it is possible to save time for the air blow and improve the production efficiency of the ink jet recording head. In addition, foreign matter can not be mixed by air blow, and a highly reliable ink jet recording head can be manufactured.

  Further, since only the pressing jig 60 is used to bend the circuit board 35 and bring it into intimate contact with the wiring board 37, a heat tool or polyimide for heating and soldering the circuit board and the wiring board as in the prior art. Expensive consumables such as tape are no longer necessary, and costs can be reduced.

  Further, in the ink jet recording head manufacturing apparatus according to the present embodiment, the pressing member 62 presses the circuit board 35 through the transparent member 61 so as to be in close contact with the wiring board 37. There is no gap between the solder provided on the pad 36. Therefore, even if the circuit board 35 is irradiated with the laser beam, the heat generated by the laser beam is transmitted to the solder, so that there is no possibility that the circuit board 35 is damaged by the heat. In addition, since the transparent member 61 irradiates the laser light while pressing the circuit board 35, even if the circuit board 35 is difficult to be wrinkled, the tip of the wiring 34 and the conductive pad 36 can be reliably formed without causing a gap. Can be joined.

  In the ink jet recording head manufacturing apparatus according to the present embodiment, the transparent member 61 is attached to the pressing member 62 via a pair of leaf springs 63 that are independent for each piezoelectric element unit 17. Therefore, even if the solder height provided on the conductive pads 36 of each piezoelectric element unit 17 varies, each transparent member 61 can press each circuit board 35 following the solder height. As a result, it is possible to more reliably prevent a gap from being generated between each wiring 34 and the solder provided on the conductive pad 36.

  In this embodiment, the inkjet recording head manufacturing apparatus in which the pressing jig 60 and the laser light irradiation device 70 are integrally formed is exemplified, but the present invention is not limited to this. For example, the laser light irradiation device 70 is used. It may be separated from the pressing jig 60. Thus, the circuit board 35 can be folded and brought into close contact with the wiring board 37, and the tip of the wiring 34 and the conductive pad 36 can be soldered together, and the efficiency of the manufacturing process of the ink jet recording head can be achieved. Can be further improved.

  Further, since the laser beam irradiation device 70 can freely change the laser output, it is possible to improve the bonding quality by appropriately adjusting the laser output according to the pattern size of the circuit board 35.

  Next, a method for manufacturing the ink jet recording head 10 of this embodiment will be described. 4 to 7 are schematic cross-sectional views illustrating the manufacturing process of the ink jet recording head according to the first embodiment. In addition, the same code | symbol is attached | subjected to the thing same as the inkjet recording head manufacturing apparatus shown in FIGS. 1-3, and the overlapping description is abbreviate | omitted.

  First, as shown in FIG. 4, the piezoelectric element unit 17 is fixed in the accommodating portion 18 of the head case 19. The base end portion of the circuit board 35 is bonded to the piezoelectric element unit 17 in advance, and when the piezoelectric element unit 17 is fixed in the accommodating portion 18 of the head case 19, the distal end portion of the circuit board 35 is separated from the accommodating portion 18. It will be in a state of protruding outward. A wiring board 37 is attached to the head case 19 such that the tip of the circuit board 35 passes through the opening 38 in the head case 19. Then, the head case 19 is fixed in the housing portion 53 of the housing member 50.

  Next, as shown in FIG. 5, one end portion of the pressing member 62 of the pressing jig 60 is supported by the second step portion 52 provided on one side wall of the housing member 50, and the tip of the convex portion 65 is supported on the other end. It is made to contact | abut to the upper end surface of a side wall. In this way, when the pressing member 62 is supported by the housing member 50, each transparent member 61 is positioned on the side of each circuit board 35.

  Next, as shown in FIG. 6, the pressing member 62 is moved in the horizontal direction. More specifically, the pressing member 62 is moved from one side of the circuit board 35 toward the other side in a state where each transparent member 61 is in contact with one side of each circuit board 35. As a result, the circuit board 35 is pressed and bent toward the surface of the conductive pad 36 of the wiring board 37 with the opening edge of the opening 38 of the wiring board 37 as a fulcrum.

  Further, when the pressing member 62 is moved in the horizontal direction, one end portion of the pressing member 62 is separated from the second step portion 52, and the convex portion 65 is positioned above the concave portion 54. That is, the pressing member 62 can move in the downward direction regulated by the convex portion 65 and the second step portion 52.

  Next, as shown in FIG. 7, the pressing member 62 is lowered to the housing member 50 side. When the pressing member 62 is lowered, one end portion of the pressing member 62 is supported by the first step portion 51, and the convex portion 65 is fitted into the concave portion 54. As described above, when the pressing member 62 is supported by the first step portion 51, the front end portion of the circuit board 35 that has been bent by the transparent member 61 is bent until it comes into close contact with the wiring board 37. The tip of 34 is in close contact with the conductive pad 36 of the wiring board 37 via solder.

  Next, for example, the pressing member 62 is fixed to the housing member 50 with a clamp 80. Then, the laser light irradiation device 70 irradiates the laser light toward the front end portion of the circuit board 35 through the through portion 66 and the transparent member 61 while pressing the front end portion of each circuit board 35 against the wiring board 37 by the transparent member 61. Then, the tips of the wirings 34 of the circuit boards 35 are simultaneously bonded (fused) to the conductive pads 36 to which solder is previously attached.

  According to the method of manufacturing the ink jet recording head described above, the solder is heated by the laser beam, so that excess heat is not applied to the circuit board 35 and the like, and an air blow for cooling the circuit board or the like is performed as in the related art. It becomes unnecessary. Therefore, it is possible to save time for the air blow and improve the production efficiency of the ink jet recording head. In addition, foreign matter can not be mixed by air blow, and a highly reliable ink jet recording head can be manufactured.

  Further, in the ink jet recording head manufacturing apparatus according to the present embodiment, the pressing member 62 presses the circuit board 35 through the transparent member 61 so as to be in close contact with the wiring board 37. There is no gap between the solder provided on the pad 36. Therefore, even if the circuit board 35 is irradiated with the laser beam, the heat generated by the laser beam is transmitted to the solder, so there is no possibility of damaging the circuit board 35. In addition, since the transparent member 61 irradiates the laser light while pressing the circuit board 35, even if the circuit board 35 is difficult to be wrinkled, the tip of the wiring 34 and the conductive pad 36 can be reliably formed without causing a gap. Can be joined.

  A transparent member 61 is attached to the pressing member 62 via a leaf spring 63 independent for each piezoelectric element unit 17. Therefore, even if the solder height provided on the conductive pads 36 of each piezoelectric element unit 17 varies, each transparent member 61 can press each circuit board 35 following the solder height. As a result, it is possible to more reliably prevent a gap from being generated between the tip of each wiring 34 and the solder provided on the conductive pad 36.

  In the present embodiment, after the circuit board 35 is bent using the pressing member 62, the ink jet recording head 10 is housed in the housing member 50, and solder bonding is performed using a laser beam irradiation device. It is not limited. That is, after the circuit board 35 is bent and brought into close contact with the wiring board 37 by using the pressing member 62, the pressing member 62 and the ink jet recording head 10 are taken out from the housing member 50, and the laser beam irradiation device 70 is used at another place. Solder bonding may be performed.

  Thereby, the process of bending the circuit board 35 to be in close contact with the wiring board 37 and the process of soldering the leading end portion of the wiring 34 and the conductive pad 36 can be divided and the efficiency of the manufacturing process of the ink jet recording head can be achieved. Can be further improved.

  Further, since the laser beam irradiation device 70 can freely change the laser output, it is possible to improve the bonding quality by appropriately adjusting the laser output according to the pattern size of the circuit board 35. Utilizing this fact, the tip end portion of the wiring 34 and the conductive pad 36 may be joined as follows.

  First, after the circuit board 35 is bent and brought into close contact with the wiring board 37, each solder provided on each of the plurality of conductive pads 36 corresponding to one piezoelectric element unit 17 is irradiated with laser light having a weak laser output. And preheat. Thereafter, the pressing member 62 is further pressed downward. Then, each solder is irradiated with laser light whose laser output is returned to normal.

  As a result, even if there is a variation in the height of each solder, the variation is eliminated by preheating and pressing, and the height of each solder becomes uniform. As a result, the solder provided on the conductive pad 36 and the tip portion of the wiring 34 can be brought into close contact with each other without any gap. As a result, the yield of the ink jet recording head is improved.

<Other embodiments>
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above. In the first embodiment, the circuit board is bonded to the wiring board, but the present invention is not limited to such a combination. For example, the present invention can also be applied to bonding of thin films such as bonding of COF and FFC. Also, it can be applied to products that have long patterns that are difficult with the pulse heat method.

  In the first embodiment, the ink jet recording head 10 in which one piezoelectric element unit 17 is accommodated in one accommodating portion 18 is illustrated. However, the number of piezoelectric element units 17 accommodated in one accommodating portion 18 is as follows. The invention is not particularly limited to this. For example, a plurality of piezoelectric element units 17 may be accommodated in one accommodating portion 18.

  Furthermore, in the first embodiment described above, the longitudinal vibration type piezoelectric element 16 that expands and contracts in the axial direction by alternately stacking piezoelectric materials and electrode forming materials as pressure generating means for causing a pressure change in the pressure generating chamber 11 is provided. However, the present invention is not particularly limited to this. For example, an actuator device having a thin film type piezoelectric element which is laminated and formed by a film formation and lithography method and a green sheet is pasted. An actuator device having a thick film type piezoelectric element formed by the method can be used. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, it is possible to use a so-called electrostatic actuator that deforms the diaphragm by electrostatic force and ejects droplets from the nozzle openings.

  In the first embodiment described above, an ink jet recording head has been described as an example of a liquid ejecting head. However, the present invention is intended for general work including a liquid ejecting head, and includes a work having a wiring board. It can be applied to the case where a circuit board is bonded to the substrate. Here, as other liquid ejecting heads, for example, various recording heads used in an image recording apparatus such as a printer, a color material ejecting head used for manufacturing a color filter such as a liquid crystal display, an organic EL display, an FED (electric field). Examples thereof include an electrode material ejection head used for electrode formation such as a discharge display, a bioorganic matter ejection head used for biochip production, and the like.

2 is a schematic cross-sectional view of a recording head according to Embodiment 1. FIG. FIG. 3 is a cross-sectional view of a main part of the recording head according to the first embodiment. 2A and 2B are a plan view and a cross-sectional view of the recording head manufacturing apparatus according to the first embodiment. 5 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Recording head, 11 Pressure generation chamber, 12 Flow path formation board | substrate, 13 Nozzle opening, 14 Nozzle plate, 15 Diaphragm, 16 Piezoelectric element, 17 Piezoelectric element unit, 18 accommodating part, 19 Head case, 20 Bulkhead, 21 Reservoir, 22 Ink supply path, 23 Nozzle communication hole, 24 Elastic film, 25 Support plate 26 Island part, 27 Thin part, 28 Compliance part, 29 Piezoelectric material, 30, 31 Electrode forming material, 32 Piezoelectric element forming member, 33 Fixed substrate, 34 wiring, 35 circuit board, 36 conductive pad, 37 wiring board, 38 opening, 50 receiving member, 51 first step, 52 second step, 53 receiving portion, 54 recess, 60 pressing jig, 61 transparent member 62 pressing member, 63 leaf spring, 64 support fitting, 65 convex part, 66 penetrating part, 70 laser light irradiation device, 80 Clamp

Claims (5)

A circuit board having a plurality of pressure generating chambers communicating with nozzle openings for ejecting liquid, a piezoelectric element for applying pressure for discharging liquid to each pressure generating chamber, and a wiring whose base end side is connected to the piezoelectric element A wiring board comprising: a piezoelectric element unit including: a head case having a housing part in which the piezoelectric element unit is housed; and a conductive pad fixed on the head case and connected to a tip of the wiring of the circuit board And the circuit board is extended to the outside through an opening provided in the wiring board, and the leading end of the wiring is bent so as to reach the wiring board. An apparatus for manufacturing a liquid jet head connected via solder provided on the conductive pad,
A laser beam irradiation device for irradiating a laser beam capable of applying heat to the solder;
A transparent member formed of a member that transmits laser light from the laser light irradiation device, and a region facing the transparent member while the transparent member is attached to one surface facing the wiring board and corresponding to the piezoelectric element unit A pressing jig provided with a pressing member provided with a through-hole,
The pressing jig bends the circuit board inserted through the opening of the wiring board to the conductive pad side of the wiring board via the transparent member, and the tip of the wiring contacts the solder. So as to press the circuit board toward the wiring board side,
The laser beam irradiation apparatus is characterized in that the solder is irradiated with a laser beam through the penetrating portion and the transparent member, and a tip portion of the wiring is joined to the conductive pad by the solder. Manufacturing equipment. The apparatus for manufacturing a liquid jet head according to claim 1,
A plurality of the piezoelectric element units are accommodated in the head case,
The liquid ejecting head manufacturing apparatus, wherein the transparent member is attached to the pressing member via an elastic body for each of the plurality of piezoelectric element units. A circuit board having a plurality of pressure generating chambers communicating with nozzle openings for ejecting liquid, a piezoelectric element for applying pressure for discharging liquid to each pressure generating chamber, and a wiring whose base end side is connected to the piezoelectric element Including a piezoelectric element unit, a head case having an accommodating portion for accommodating the piezoelectric element unit, and a wiring having a conductive pad fixed on the head case and connected to the leading end of the wiring of the circuit board A circuit board, and the circuit board is extended to the outside through an opening provided in the wiring board and is bent so as to reach the wiring board. Is a manufacturing method of a liquid jet head connected through solder provided on the conductive pad,
A first step of housing the piezoelectric element unit in the housing part and inserting the circuit board through the opening of the wiring board;
A transparent member formed of a member that transmits laser light, and the transparent member is attached to one surface facing the wiring board corresponding to the piezoelectric element unit, and a through portion is provided in a region facing the transparent member. A second step of bending the circuit board with the transparent member on the side of the conductive pad of the wiring board, using an opening edge of the opening as a fulcrum, using a pressing jig including a pressing member;
A third step of moving the pressing member to the wiring board side to bring the tip of the wiring into contact with the solder;
A liquid ejecting head comprising: a fourth step of irradiating the solder with a laser beam through the penetrating portion and the transparent member to join the leading end portion of the wiring to the conductive pad with the solder. Manufacturing method. In the manufacturing method of the liquid jet head according to claim 3,
In the fourth step, each solder provided on each of the plurality of conductive pads is preheated by irradiating laser light, and then the pressing member is further moved to the wiring board side, and the laser light is again emitted. A method of manufacturing a liquid ejecting head, comprising: irradiating each solder and joining a leading end portion of the wiring to each conductive pad with the solder. A work manufacturing apparatus for attaching a circuit board on which a wiring connected to the wiring board via solder is attached to a work having a wiring board,
A laser beam irradiation device for irradiating a laser beam capable of applying heat to the solder;
A transparent member formed of a member that transmits laser light from the laser light irradiation device and a pressing portion provided with a through portion in a region facing the transparent member, and the transparent member is attached to one surface facing the wiring board A pressing jig provided with a member,
The pressing jig bends the circuit board to the conductive pad side of the wiring board via the transparent member, and presses the circuit board to the wiring board side so that the wiring contacts the solder. ,
The said laser beam irradiation apparatus irradiates a laser beam to the said solder via the said penetration part and the said transparent member, and joins the said wiring to the said conductive pad with the said solder, The manufacturing apparatus of the workpiece | work characterized by the above-mentioned.

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