JP2009148921A - Method of manufacturing liquid jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid jet head permitting costs to be reduced by improving a yield by preventing a board from warping and improving work efficiency. <P>SOLUTION: The liquid jet head manufacturing method includes: an initial curing process in which the initial curing of adhesives 50 and 51 is carried out with both aligned with each other by inserting a first positioning pin 63 provided in a first pressing jig 60 relatedly to a channel forming substrate 12 of a channel forming substrate wafer 112 into a first positioning hole 113 provided in the channel forming substrate 12, and a second positioning hole 115 provided in joining members 14 and 15; and a main curing process in which the main curing of adhesives 50 and 51 for the joined body for which the initial curing ends with a second positioning pin provided in a second pressing jig relatedly to the channel forming substrate wafer 112 inserted into a third positioning hole 114 provided in an area other than the channel forming substrate 12 of the channel forming substrate wafer 112. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid ejecting head that ejects liquid from nozzle openings, and more particularly to a method for manufacturing an ink jet recording head that ejects ink as liquid.

  As a typical example of a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from nozzle openings using pressure generated by displacement of a piezoelectric element is known. Specifically, a pressure generating chamber that communicates with the nozzle opening is provided, and a flow path unit having a flow path forming plate and a vibration plate provided on one side thereof is bonded to the flow path unit via an adhesive. A nozzle plate having a nozzle opening; a piezoelectric element (piezoelectric vibrator) provided corresponding to each pressure generating chamber and fixed to a support substrate; and a case head (base) having a storage chamber for storing the piezoelectric element; (For example, refer to Patent Document 1).

  A plurality of such flow path forming substrates are integrally formed on the flow path forming substrate wafer, and the flow path forming substrate integrally formed on the flow path forming substrate wafer has a nozzle plate, a vibration plate, and the like. These positioning members are positioned and fixed via an adhesive.

JP 2004-74740 A

  However, since it takes time to bond the flow path forming substrate wafer and the bonding substrate via an adhesive, a jig required to perform a plurality of bonding simultaneously when bonding with a single jig. There is a problem that the number of devices increases and the cost becomes high.

  In particular, in the case of manufacturing a large-sized one having a plurality of rows in which pressure generation chambers are arranged in parallel as the flow path forming substrate, in order to prevent warpage during bonding of the flow path forming substrate and the bonding member, It is necessary to cure the adhesive over a long period of time at a relatively low temperature with the flow path forming substrate and the joining member, and in such a case, the jig cannot be used during the curing time, There is a problem that a large storage space is required during the curing time.

  Such a problem exists not only in the method of manufacturing an ink jet recording head but also in the method of manufacturing a liquid ejecting head that ejects liquid other than ink.

  In view of such circumstances, it is an object of the present invention to provide a method of manufacturing a liquid jet head that can prevent warping of a substrate to improve yield and improve work efficiency and reduce cost.

An aspect of the present invention that solves the above problems includes a flow path forming substrate provided with a liquid flow path communicating with a nozzle opening, and a bonding member bonded to one surface side of the flow path forming substrate via an adhesive. A method of manufacturing a liquid jet head comprising: a bonding member that is individually positioned for each flow path forming substrate of a flow path forming substrate wafer in which a plurality of the flow path forming substrates are integrally provided. When adhering via an adhesive, the first pressing jig is provided with a first positioning pin provided corresponding to each of the flow path forming substrates of the flow path forming substrate wafer. In the state in which the flow path forming substrate and the bonding member are aligned by inserting into the first positioning hole provided in the first positioning hole and the second positioning hole provided in the bonding member. The flow path forming substrate wafer and the flow path forming substrate wafer by the pressing jig An initial curing step in which the joint member is pressed against each other and held for a certain period of time to perform initial curing of the adhesive, and a bonded body of the flow path forming substrate wafer and the bonding member after the initial curing step is completed. A third positioning pin provided in a region other than the flow path forming substrate of the flow path forming substrate wafer is provided on a second positioning pin provided corresponding to the flow path forming substrate wafer in the second pressing jig. In the state where the positioning holes are inserted, the second curing jig presses the flow path forming substrate wafer and the joining member together and holds the adhesive for a predetermined time to perform the main curing of the adhesive. And a manufacturing method of a liquid ejecting head.
In this aspect, the work efficiency can be improved as compared with the case where the flow path forming substrate wafer is divided into each flow path forming substrate and the bonding member is bonded to each flow path forming substrate. The manufacturing cost can be reduced by reducing the number of jigs. Further, the first pressing pin is not required for each flow path forming substrate in the second pressing jig, and the cost of the jig can be reduced. And manufacturing cost can be reduced by performing this hardening which requires time at the time of manufacture with the 2nd press jig | tool with low cost.

  Here, in the main curing step, a plurality of the joined bodies are stacked and held on the second positioning pins of the second pressing jig, and the plurality of stacked joined bodies are simultaneously pressed. And it is preferable to hold for a certain period of time. In the main curing step, it is preferable that a protective member is disposed between the plurality of joined bodies held by the second pressing jig. According to this, the main curing process of a plurality of joined bodies can be performed at the same time, the number of jigs can be reduced, the storage place for storing a plurality of jigs can be narrowed, and the cost can be reduced. Can be reduced. Further, by providing a protective member between the joined bodies, it is possible to prevent the laminated joined bodies from being damaged each other.

  The first pressing jig has the second positioning pin inserted into the third positioning hole. In the initial curing step, the first positioning hole has the first positioning hole. And inserting the third positioning hole into the second positioning pin. According to this, it is possible to align the flow path forming substrate wafer to the first pressing jig easily and in a short time, and to position the bonding member to the first pressing jig. The second positioning pin can be easily grasped.

  The bonding member is bonded to one side of the flow path forming substrate and the nozzle opening is provided, and the bonding member is bonded to the other side of the flow path forming substrate and pressure is applied to the pressure generating chamber. It is preferable that the piezoelectric element that causes the change is either one or both of the diaphragm to which the piezoelectric element is fixed. According to this, it is possible to bond the flow path forming substrate wafer, the nozzle plate, the vibration plate and the like at a low cost.

  In the initial curing step and the main curing step, the adhesive is preferably cured at a low temperature. According to this, even if materials having different linear expansion coefficients are bonded to each other at a low temperature, the warp of the substrate can be prevented and a highly accurate liquid jet head can be manufactured.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is a cross-sectional view of an ink jet recording head that is an example of a liquid ejecting head according to Embodiment 1 of the invention. First, an example of an ink jet recording head according to Embodiment 1 of the present invention will be described. However, the present invention can be applied to ink jet recording heads having other configurations.

  As shown in FIG. 1, the ink jet recording head 10 includes a flow path forming substrate 12 having a plurality of pressure generation chambers 11 and a nozzle plate 14 in which a plurality of nozzle openings 13 communicating with the pressure generation chambers 11 are formed. And a flow path unit 16 including a vibration plate 15 provided on the surface of the flow path forming substrate 12 opposite to the nozzle plate 14. Furthermore, a piezoelectric element unit 18 having a piezoelectric element 17 provided in a region corresponding to each pressure generating chamber 11 on the vibration plate 15, and an accommodating portion 19 that is fixed on the vibration plate 15 and accommodates the piezoelectric element unit 18. And a case head 20.

  In the flow path forming substrate 12, a plurality of pressure generating chambers 11 are partitioned by a partition wall 21 and arranged in parallel in the width direction on the surface layer portion on one surface side thereof. For example, in the present embodiment, a plurality of pressure generation chambers 11 are arranged in parallel on the flow path forming substrate 12, and ink is supplied to each pressure generation chamber 11 outside the row of each pressure generation chamber 11. A reservoir 22 is provided so as to penetrate the flow path forming substrate 12 in the thickness direction. Each pressure generation chamber 11 and the reservoir 22 communicate with each other via an ink supply path 23. In this embodiment, the ink supply path 23 is formed with a width narrower than that of the pressure generation chamber 11, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 22 into the pressure generation chamber 11. Further, a nozzle communication hole 24 penetrating the flow path forming substrate 12 is formed on the end side of the pressure generating chamber 11 opposite to the reservoir 22. That is, in the present embodiment, the flow generation substrate 12 is provided with the pressure generation chamber 11, the reservoir 22, the ink supply path 23, and the nozzle communication hole 24 as liquid flow paths. In this embodiment, the flow path forming substrate 12 is made of a silicon single crystal substrate, and the pressure generating chamber 11 and the like provided in the flow path forming substrate 12 are formed by etching the flow path forming substrate 12. ing.

  A nozzle plate 14 in which nozzle openings 13 are formed is bonded to one surface side of the flow path forming substrate 12 via an adhesive 50, and each nozzle opening 13 communicates with a nozzle provided on the flow path forming substrate 12. The pressure generating chambers 11 communicate with each other through the holes 24. That is, in this embodiment, the nozzle plate 14 is cited as a bonding member that is bonded to the flow path forming substrate 12 via an adhesive.

  Further, a diaphragm 15 is bonded to the other surface side of the flow path forming substrate 12, that is, the opening surface side of the pressure generating chamber 11, and each pressure generating chamber 11 is sealed by the diaphragm 15.

  The diaphragm 15 is formed of a composite plate of, for example, an elastic film 25 made of an elastic member such as a resin film and a support plate 26 made of, for example, a metal material that supports the elastic film 25 and is elastic. The film 25 side is bonded to the flow path forming substrate 12. For example, in the present embodiment, the elastic film 25 is made of a PPS (polyphenylene sulfide) film having a thickness of about several μm, and the support plate 26 is made of a stainless steel plate (SUS) having a thickness of about several tens of μm. In addition, an island portion 27 with which the tip end portion of the piezoelectric element 17 abuts is provided in a region of the vibration plate 15 facing each pressure generation chamber 11. That is, a thin portion 28 having a thickness smaller than that of the other regions is formed in a region of the vibration plate 15 facing the peripheral portion of each pressure generating chamber 11, and island portions 27 are provided inside the thin portion 28. ing. Further, in the present embodiment, in the region facing the reservoir 22 of the vibration plate 15, as in the case of the thin portion 28, a compliance portion 29 that is substantially composed only of an elastic film is provided by removing the support plate 26 by etching. It has been. The compliance portion 29 absorbs the pressure change by the deformation of the elastic film 25 of the compliance portion 29 when the pressure change in the reservoir 22 occurs, and always keeps the pressure in the reservoir 22 constant. Fulfill.

  Such a diaphragm 15 is bonded to the flow path forming substrate 12 via an adhesive 51. That is, in the present embodiment, the vibration plate 15 and the nozzle plate 14 are exemplified as the bonding members bonded to the flow path forming substrate 12 via the adhesives 50 and 51.

  Each piezoelectric element 17 constituting the piezoelectric element unit 18 is in contact with the island portion 27 of the diaphragm 15 at the tip of its active region. Actually, the tip surface of each piezoelectric element 17 is bonded to the island portion 27 by the adhesive 30.

  Here, in this embodiment, the piezoelectric element 17 which is a pressure generating means for generating a pressure for ejecting ink droplets into the pressure generating chamber 11 is integrally formed in one piezoelectric element unit 18. That is, a piezoelectric element forming member 34 in which the piezoelectric material 31 and the electrode forming materials 32 and 33 are vertically sandwiched and laminated is formed to correspond to each pressure generating chamber 11. Each piezoelectric element 17 is formed by cutting on the comb teeth. That is, in the present embodiment, the plurality of piezoelectric elements 17 are integrally formed. An inactive region that does not contribute to the vibration of the piezoelectric element 17 (piezoelectric element forming member 34), that is, the base end side of the piezoelectric element 17 is fixed to the fixed substrate 35. In the vicinity of the base end portion of the piezoelectric element 17, a circuit board 37 having a wiring 36 for supplying a signal for driving each piezoelectric element 17 is connected to the surface opposite to the fixed board 35. In the present embodiment, the piezoelectric element unit 18 is configured by the piezoelectric element 17 (piezoelectric element forming member 34) and the fixed substrate 35.

  Such a piezoelectric element unit 18 is fixed in a state where the distal end portion of the piezoelectric element 17 is in contact with the island portion 27 of the diaphragm 15 as described above. For example, in this embodiment, the case head 20 is fixed on the diaphragm 15 as described above, and the piezoelectric element unit 18 is accommodated in the accommodating portion 19 of the case head 20 and the piezoelectric element 17 is fixed. The fixed substrate 35 thus fixed is fixed to the case head 20 on the side opposite to the piezoelectric element 17. Specifically, a stepped portion 38 is provided in the accommodating portion 19 of the case head 20, and the fixed substrate 35 is bonded to the stepped portion 38 of the case head 20 with an adhesive 39.

  Further, a wiring board 41 provided with a plurality of conductive pads 40 to which the respective wirings 36 of the circuit board 37 are connected is fixed on the case head 20. 41 is substantially blocked. The wiring board 41 is formed with a slit-like opening 42 in a region facing the housing part 19 of the case head 20, and the circuit board 37 is drawn out of the housing part 19 from the opening 42 of the wiring board 41. It is.

  Moreover, the circuit board 37 which comprises the piezoelectric element unit 18 consists of chip-on-film (COF) in which the drive IC (not shown) for driving the piezoelectric element 17 was mounted in this embodiment, for example. Each wiring 36 of the circuit board 37 is connected to the electrode forming materials 32 and 33 constituting the piezoelectric element 17 by, for example, solder, anisotropic conductive material, or the like on the base end side. On the other hand, each wiring 36 is joined to each conductive pad 40 of the wiring board 41 on the tip side. Specifically, each wiring 36 is connected to the wiring board 41 in a state in which the tip of the circuit board 37 drawn out of the housing part 19 from the opening 42 of the wiring board 41 is bent along the surface of the wiring board 41. The conductive pads 40 are joined to each other.

  In such an ink jet recording head 10, when ejecting ink droplets, the volume of each pressure generating chamber 11 is changed by deformation of the piezoelectric element 17 and the vibration plate 15 to eject ink droplets from a predetermined nozzle opening 13. It is designed to be discharged. Specifically, when ink is supplied to the reservoir 22 from an ink cartridge (not shown), the ink is distributed to each pressure generating chamber 11 via the ink supply path 23. Actually, the piezoelectric element 17 is contracted by applying a voltage to the piezoelectric element 17. As a result, the diaphragm 15 is deformed together with the piezoelectric element 17 to expand the volume of the pressure generating chamber 11, and ink is drawn into the pressure generating chamber 11. After the ink is filled up to the nozzle opening 13, the voltage applied to the electrode forming materials 32 and 33 of the piezoelectric element 17 is released according to a recording signal supplied via the wiring board. As a result, the piezoelectric element 17 is expanded to return to the original state, and the diaphragm 15 is also displaced to return to the original state. As a result, the volume of the pressure generation chamber 11 contracts, the pressure in the pressure generation chamber 11 increases, and ink droplets are ejected from the nozzle openings 13.

  A manufacturing method of such an ink jet recording head, in particular, a manufacturing method of the flow path unit 16 will be described with reference to FIGS. 2 is a top view of the flow path forming substrate wafer, FIGS. 3 and 5 are exploded perspective views showing a method of manufacturing the ink jet recording head, and FIGS. 4 and 6 are ink jet recording. It is sectional drawing which shows the manufacturing method of a head. Here, FIG.4 and FIG.6 has shown sectional drawing of the AA 'line direction shown in FIG.

  First, as shown in FIG. 3 and FIG. 4, a flow path forming substrate wafer 112 in which a plurality of flow path forming substrates 12 are integrally formed using the first pressing jig 60, and the present embodiment. The nozzle plate 14 and the vibration plate 15 that are joining members are bonded to each other through the adhesives 50 and 51 to perform initial curing of the adhesives 50 and 51 (initial curing step).

  The flow path forming substrate wafer 112 is made of a silicon wafer as shown in FIG. 2, and the pressure generating chamber 11 and the like are formed by etching as described above. In the present embodiment, ten flow path forming substrates 12 are simultaneously formed on one flow path forming substrate wafer 112.

  Further, the flow path forming substrate wafer 112 is provided with a first positioning hole 113 in a region to be the flow path forming substrate 12 in advance. The first positioning holes 113 are for positioning the flow path forming substrate 12 and the nozzle plate 14 and the vibration plate 15 that are bonding members. The two positioning holes 113 are provided. That is, 20 first positioning holes 113 are provided in the flow path forming substrate wafer 112.

  Further, the flow path forming substrate wafer 112 is provided with a third positioning hole 114 used in a main curing step, which will be described in detail later, in a region other than the region to be the flow path forming substrate 12. In the present embodiment, two third positioning holes 114 are provided on the opposite side of the flow path forming substrate wafer 112 from the orientation flat 112a. Further, in the present embodiment, the third positioning hole 114 is formed with an opening area larger than the opening area of the first positioning hole 113.

  The first positioning hole 113 and the third positioning hole 114 can be simultaneously formed by, for example, etching when forming the pressure generating chamber 11 or the like in the flow path forming substrate wafer 112. That is, the flow path forming substrate wafer 112 made of a silicon wafer is anisotropically etched to form the first positioning holes 113 and the third positioning holes 114 with high accuracy so that the openings have a diamond shape. be able to. Note that the shape and manufacturing method of the first positioning hole 113 and the third positioning hole 114 are not particularly limited to this. For example, the first positioning hole 113 and the third positioning hole 114 may be dry-etched, laser processed, or the like. These openings may be formed by mechanical processing, and the opening shape may be circular.

  On the other hand, as shown in FIGS. 3 and 4, the nozzle plate 14 and the vibration plate 15, which are bonded members for each flow path forming substrate 12 of the flow path forming substrate wafer 112, are used for the flow path forming substrate. A second positioning hole 115 that is aligned with the first positioning hole 113 of the wafer 112 is provided. In the present embodiment, the second positioning holes 115 of the nozzle plate 14 and the vibration plate 15 are formed so as to have a rhombus shape like the first positioning holes 113.

  In this embodiment, the two joining members including the nozzle plate 14 and the vibration plate 15 are simultaneously bonded to the flow path forming substrates 12 of the flow path forming substrate wafer 112.

  Here, the first pressing jig 60 that performs the initial curing includes a first base portion 61 and a first pressing portion 62 provided at a position facing the first base portion 61. To do.

  The first base portion 61 is made of a plate-like member provided with a larger outer diameter than the flow path forming substrate wafer 112. The first base 61 is inserted into the first positioning hole 113 of the flow path forming substrate wafer 112 and the second positioning hole 115 of the bonding member on one surface of the first base 61 to position both of them. One positioning pin 63 is provided so as to protrude. The first positioning pin 63 has a cylindrical shape formed with an outer diameter that is inscribed in the first positioning hole 113 and the second positioning hole 115. In the present embodiment, ten flow path forming substrates 12 are formed on the flow path forming substrate wafer 112 at the same time. Twenty first positioning holes 113 are provided in the flow path forming substrate wafer 112. Therefore, 20 first positioning pins 63 are provided.

  The first base 61 of the first pressing jig 60 is provided with second positioning pins 64 that are inserted into the third positioning holes 114 of the flow path forming substrate wafer 112. The second positioning pin 64 has a cylindrical shape formed with an outer diameter that is inscribed in the third positioning hole 114. That is, in the present embodiment, since the third positioning hole 114 having an opening area larger than that of the first positioning hole 113 is provided in the flow path forming substrate wafer 112, the second positioning pin 64 is used for the first positioning hole 64. The outer diameter is larger than that of the pin 63. In addition, since the flow path forming substrate wafer 112 is provided with two third positioning holes 114, two second positioning pins 64 are provided. The second positioning pin 64 is longer than the first positioning pin 63 and protrudes from the first positioning pin 63. This is because, when the flow path forming substrate wafer 112 is positioned and held by the first pressing jig 60, the second positioning pins 64 are first inserted into the third positioning holes 114 of the flow path forming substrate wafer 112. After the first positioning pin 63 is inserted into the first positioning hole 113 of the flow path forming substrate wafer 112, the first positioning pin 63 is inserted into the first positioning hole 63. This is to facilitate the insertion of the pin 63 into the first positioning hole 113.

  Further, the first base portion 61 is provided with two guide pins 65 for guiding the movement of the first pressing portion 62, and the first pressing portion 62 has the guide pin 65 as a guide hole 66. The interval can be adjusted in a state parallel to the first base portion 61 by being inserted into the first base portion 61.

  Then, as shown in FIG. 4, after the first positioning pin 63 of the first pressing jig 60 is inserted into the second positioning hole 115 of the diaphragm 15, the first positioning pin 63 and the second positioning pin The pins 64 are inserted into the flow path forming substrate wafer 112, and then the first positioning pins 63 are inserted into the nozzle plate 14. Accordingly, the diaphragm 15, the flow path forming substrate wafer 112, and the nozzle plate 14 are sequentially stacked from the first base portion 61 side. At this time, adhesives 50 and 51 are applied to either or both of the flow path forming substrate wafer 112 or the vibration plate 15 and the nozzle plate 14.

  Next, the 1st press part 62 is arrange | positioned on the nozzle plate 14, and the 1st press part 62 is hold | maintained for a fixed time in the state pressed against the 1st base part 61 side. For example, it is possible to press with a predetermined load by placing a weight with a predetermined weight on the first pressing portion 62. In the initial curing step of the present embodiment, the adhesives 50 and 51 are cured at a relatively low temperature (normal temperature here) without heating. As a result, it is possible to bond the flow path forming substrate wafer 112 and the nozzle plate 14 and the vibration plate 15 that are bonding members while preventing warpage due to heat.

  In addition, the initial curing process by the first pressing jig 60 is performed until the adhesives 50 and 51 are cured to the extent that the vibration plate 15 and the nozzle plate 14 do not move with respect to the flow path forming substrate wafer 112. That is, the initial curing of the adhesives 50 and 51 is a state in which the surface side of the adhesives 50 and 51 is cured and the flow path forming substrate wafer 112, the nozzle plate 14, and the vibration plate 15 are not cured. Say that. In this embodiment, the protective member 68 is provided on the surface of the first pressing portion 62 that contacts the joining member (here, the nozzle plate 14). The protective member 68 is for preventing the nozzle plate 14 from being damaged. Examples of such a protective member 68 include a film-like fluororesin and a silicone resin.

  As described above, in the present embodiment, since the second positioning pin 64 to be inserted into the third positioning hole 114 provided in the flow path forming substrate wafer 112 is provided in the first pressing jig 60, the bonding is performed. Positioning when inserting the first positioning pin 63 into the nozzle plate 14 or the diaphragm 15 which is a member can be easily performed. That is, by arranging the nozzle plate 14 and the diaphragm 15 using the second positioning pin 64 as an index, the nozzle plate 14 and the diaphragm 15 can be easily and quickly arranged at desired positions. The arrangement of the nozzle plate 14 and the diaphragm 15 may be automated by an automatic picking device or the like, or may be performed manually.

  Then, after the initial curing by the first pressing jig 60 is finished, the adhesives 50 and 51 are fully cured by the second pressing jig 70.

  Here, in this embodiment, the second pressing jig 70 includes a plurality of bonded bodies 200 in which the flow path forming substrate wafer 112 and the bonding members (nozzle plate 14 and vibration plate 15) are bonded in the initial curing step. The second base portion 71 and a second press portion 72 provided at a position opposite to the second base portion 71 are provided to be held while being pressed simultaneously.

  The second base portion 71 is made of a plate-like member provided with a larger outer diameter than the flow path forming substrate wafer 112, and the third positioning hole 114 of the flow path forming substrate wafer 112 is formed on one surface thereof. A second positioning pin 74 to be inserted into is provided. Further, the second positioning pin 74 of the second pressing jig 70 is provided longer than the length of the second positioning pin 64 of the first pressing jig 60. This is because the second positioning jig 74 is formed with a length that can be inserted into the plurality of joined bodies 200 in order to fully cure the plurality of joined bodies 200 by the second pressing jig 70. is there.

  Further, the second base portion 71 is provided with two guide pins 75 for guiding the movement of the second pressing portion 72, and the second pressing portion 72 has the guide pin 75 as a guide hole 76. The interval can be adjusted in a state parallel to the second base portion 71 by being inserted into the second base portion 71.

  Then, as shown in FIG. 6, the bonded body 200 of the flow path forming substrate wafer 112 and the bonding member (nozzle plate 14, vibration plate 15) integrated in the initial curing step is attached to the second pressing jig 70. Are sequentially inserted into the second positioning pins 74. In the present embodiment, five bonded bodies 200 are held by one second pressing jig 70. Further, a protective member 78 is provided between the surface of the second pressing portion 72 that contacts the bonding member (here, the nozzle plate 14) and each of the stacked bonded bodies 200. The protective member 78 is for preventing the nozzle plate 14 from being damaged by the second pressing portion 72 and preventing the stacked bonded bodies 200 from being damaged each other. As such a protection member 78, for example, a film-like fluororesin, a silicone resin, or the like can be given. Of course, in addition to the protective member 78, another metal or resin substrate may be inserted between the laminated assemblies 200.

  Next, the 2nd press part 72 is arrange | positioned on the laminated | stacked conjugate | zygote 200, and it hold | maintains for a fixed time in the state which pressed the 2nd press part 72 to the 2nd base part 71 side. For example, it is possible to press with a predetermined weight by placing a weight having a predetermined weight on the second pressing portion 72. Thereby, the main curing of the adhesives 50 and 51 for bonding the respective flow path forming substrates 12 of the flow path forming substrate wafer 112 to the nozzle plate 14 and the vibration plate 15 which are bonding members can be performed. In the main curing step of the present embodiment, the adhesives 50 and 51 are cured at a relatively low temperature (normal temperature here) without heating. As a result, it is possible to bond the flow path forming substrate wafer 112 and the nozzle plate 14 and the vibration plate 15 that are bonding members while preventing warpage due to heat.

  Further, in the main curing step by the second pressing jig 70, the adhesives 50 and 51 are performed until they are completely cured to the inside. That is, the main curing of the adhesives 50 and 51 means a state in which the adhesives 50 and 51 are completely cured to the inside.

  In this way, the second positioning pin 74 of the second pressing jig 70 is inserted into the third positioning hole 114 of the joined body 200 (flow path forming substrate wafer 112) and aligned, so that the second positioning pin 74 is aligned. A uniform product can be manufactured by equalizing the pressure by the pressing portion 72 within the surface of the bonded body 200. That is, when the second positioning jig 74 is not provided in the second pressing jig 70, the bonded body 200 cannot be aligned with the second pressing jig 70, and the second pressing portion 72 is used. The pressure cannot be made uniform, resulting in variations in products.

  As described above, by bonding the bonding member (in this embodiment, the nozzle plate 14 and the diaphragm 15) to the flow path forming substrate wafer 112 in which the plurality of flow path forming substrates 12 are integrally provided, Compared with dividing the flow path forming substrate wafer 112 into each flow path forming substrate 12 and bonding a bonding member to each flow path forming substrate 12, the working efficiency can be improved and the adhesive used for bonding can be improved. The production cost can be reduced by reducing the number of tools.

  Further, in the adhesion between the flow path forming substrate wafer 112 and the bonding member (nozzle plate 14, diaphragm 15), after the initial curing is performed by the first pressing jig 60, The main curing is performed with a different second pressing jig 70. Accordingly, the first positioning pin 63 is not necessary for the second pressing jig 70, and the cost of the jig itself can be reduced as compared with the first pressing jig 60. Further, since the first positioning pin 63 is not provided on the second pressing jig 70, the nozzle plate 14 is moved by the first positioning pin 63 when the joined body 200 is positioned on the second pressing jig 70. It is possible to prevent the diaphragm 15 and the like from being deformed, and to improve manufacturing efficiency. That is, when the first positioning pin 63 is provided in the second pressing jig 70, the first positioning pin 63 must be inserted into the first positioning hole 113 and the second positioning hole 115 of the joined body 200. This is because the nozzle plate 14 and the diaphragm 15 are deformed by a minute error of the first positioning pin 63, an error at the time of bonding, or the like. Incidentally, the first positioning pins 63 and the second positioning pins 64 and 74 have outer shapes formed with high accuracy so that the flow path forming substrate wafer 112 and the bonding member can be aligned with high accuracy. Such high-precision positioning pins 63, 64 and 74 are very expensive. Therefore, the cost of the second pressing jig 70 can be reduced by not providing the first positioning pin 63 in the second pressing jig 70.

  And the manufacturing cost can be reduced by performing the main hardening which requires time at the time of manufacture of an inkjet recording head with the 2nd pressing jig 70 with low cost. That is, only the initial curing is performed with the expensive first pressing jig 60, and the main curing is performed with the second pressing jig 70 which is less expensive than the first pressing jig 60, thereby reducing the manufacturing cost. can do. In the present embodiment, in the main curing by the second pressing jig 70, the plurality of joined bodies 200 can be main-cured simultaneously, so that the manufacturing cost can be reduced. In addition, since the plurality of bonded bodies 200 can be fully cured by the second pressing jig 70, the place where the jig is placed can be narrowed, thereby reducing the cost.

  After that, for example, the flow path forming substrate wafer 112 is divided into a single chip size flow path forming substrate 12 as shown in FIG. 1, and the piezoelectric element unit 18 and the case head 20 are divided into each flow path forming substrate 12. Are joined to form an ink jet recording head of this embodiment.

(Other embodiments)
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above. For example, in the first embodiment described above, the nozzle plate 14 and the vibration plate 15 are exemplified as the bonding members bonded to the flow path forming substrate 12 via the adhesives 50 and 51. However, only one of the bonding members is used. Alternatively, other members may be used.

  In the first embodiment described above, the first positioning jig 64 inserted into the third positioning hole 114 of the flow path forming substrate wafer 112 is provided in the first pressing jig 60. One pressing jig 60 may not be provided with the second positioning pin 64.

  Further, in the first embodiment described above, the main curing of the plurality of bonded bodies 200 is simultaneously performed by the second pressing jig 70, but the main curing of one bonded body 200 is performed by the second pressing jig 70. Even if it carries out, the several 2nd press jig | tool 70 is prepared with respect to the 1st 1st press jig | tool 60, and the book of several joining body 200 is simultaneously carried out with the some 2nd press jig | tool 70. FIG. Curing can be performed. Therefore, cost can be reduced.

  In the first embodiment described above, the longitudinal vibration type piezoelectric element 17 has been described as the pressure generating means for causing the pressure change in the pressure generating chamber 11, but the present invention is not particularly limited thereto. It is possible to use a thin film type piezoelectric element in which a piezoelectric layer and an upper electrode are sequentially laminated and formed by a lithography method, a thick film type piezoelectric element formed by a method such as attaching a green sheet, and the like. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, it is possible to use one that deforms the diaphragm by electrostatic force and ejects droplets from the nozzle openings.

  In the first embodiment described above, an ink jet recording head has been described as the liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads, and ejects liquid other than ink. Of course, this method can also be applied. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

FIG. 3 is a cross-sectional view of the liquid ejecting head according to the first embodiment of the invention. It is a top view of the wafer for flow path formation substrates concerning Embodiment 1 of the present invention. It is a disassembled perspective view which shows the manufacturing process which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process which concerns on Embodiment 1 of this invention. It is a disassembled perspective view which shows the manufacturing process which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process which concerns on Embodiment 1 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Inkjet recording head, 11 Pressure generation chamber, 12 Flow path formation board, 13 Nozzle opening, 14 Nozzle plate (joining member), 15 Diaphragm (joining member), 16 Flow path unit, 17 Piezoelectric element, 18 Piezoelectric element unit , 19 accommodating section, 20 case head, 35 fixed board, 36 wiring, 37 circuit board, 41 wiring board, 50, 51 adhesive, 60 first pressing jig, 63 first positioning pin, 64 second positioning Pin, 70 second pressing jig, 74 second positioning pin, 112 flow path forming substrate wafer, 113 first positioning hole, 114 second positioning hole, 115 third positioning hole

Claims (6)

A liquid ejecting head manufacturing method comprising: a flow path forming substrate provided with a liquid flow path communicating with a nozzle opening; and a bonding member bonded to one surface side of the flow path forming substrate via an adhesive. And
When bonding the bonding member individually positioned for each flow path forming substrate of the flow path forming substrate wafer in which a plurality of the flow path forming substrates are integrally provided, via an adhesive,
A first positioning hole provided in the first pressing jig corresponding to each of the flow path forming substrates of the flow path forming substrate wafer; a first positioning hole provided in the flow path forming substrate; For the flow path forming substrate by the first pressing jig in a state where the flow path forming substrate and the bonding member are aligned by being inserted into a second positioning hole provided in the bonding member. An initial curing step in which the wafer and the bonding member are pressed against each other and held for a certain period of time to perform initial curing of the adhesive;
A second positioning pin provided on the second pressing jig corresponding to the flow path forming substrate wafer, with the bonded body of the flow path forming substrate wafer and the bonding member having undergone the initial curing step. In the state where the third positioning hole provided in the region other than the flow path forming substrate of the flow path forming substrate wafer is inserted, the second pressing jig and the flow path forming substrate wafer are A liquid curing head manufacturing method comprising: a main curing step in which the bonding member is pressed against each other and held for a predetermined time to perform the main curing of the adhesive.   In the main curing step, a plurality of the joined bodies are stacked and held on the second positioning pins of the second pressing jig, and the plurality of stacked joined bodies are simultaneously pressed to be constant. The method of manufacturing a liquid jet head according to claim 1, wherein the method is maintained for a time.   3. The method of manufacturing a liquid jet head according to claim 2, wherein in the main curing step, a protective member is disposed between the plurality of joined bodies held by the second pressing jig.   The first pressing jig has the second positioning pin inserted into the third positioning hole, and the first positioning hole is inserted into the first positioning pin in the initial curing step. The method of manufacturing a liquid ejecting head according to claim 1, wherein the third positioning hole is inserted into the second positioning pin.   The bonding member is bonded to one surface side of the flow path forming substrate and the nozzle opening is provided, and the bonding member is bonded to the other surface side of the flow path forming substrate to change the pressure in the pressure generating chamber. 5. The method of manufacturing a liquid jet head according to claim 1, wherein the liquid jet head is any one or both of a diaphragm to which a piezoelectric element to be generated is fixed.   The method of manufacturing a liquid jet head according to claim 1, wherein the adhesive is cured at a low temperature in the initial curing step and the main curing step.

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