JP2009119667A - Manufacturing method for liquid injection head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid injection head capable of enhancing a working efficiency and a production efficiency. <P>SOLUTION: A circuit board 60 is moved toward a case head 50 and each wiring film 48 is inserted into each slit-like through-hole 62, under the condition where the wiring films 48 are aligned by a regulation plate 102 inserted into the respective through-holes 62 from an opposite face side opposite to the case head 50 of the circuit board 60, when an end part of each wiring film 48 extracted to an outside of a storage part 51 into each through-hole 62 of the circuit board 60, after storing each piezoelectric element unit 40 into the storage part 51 of the case head 50. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a liquid ejecting head that ejects liquid by driving a piezoelectric element, and more particularly, to a method of connecting wiring of a wiring film connected to a piezoelectric element to a conductive pad of a circuit board.

  As a typical example of a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from a nozzle opening by using pressure due to displacement of a piezoelectric element (piezoelectric vibrator) is known. A plurality of configurations of ink jet recording heads have been proposed. For example, a piezoelectric element unit in which a plurality of piezoelectric elements are fixed to a fixed substrate is housed in a case head (head holder), and each piezoelectric element and There is one in which a connection terminal on a circuit board provided on a case head is electrically connected by wiring (conductive pattern) of a wiring film (flexible cable) (for example, see Patent Document 1).

  Here, each wiring of the wiring film whose one end is connected to the piezoelectric element is connected to the connection terminal of the circuit board in the following procedure, for example. That is, the other end portion of the wiring film is pulled out from a through hole (window) provided in the circuit board, and each end of the drawn wiring film is bent to electrically connect each wiring to the connection terminal.

JP 2000-218774 A

  Thus, when connecting each wiring to the connection terminal, the end portion of the wiring film is inserted into the through hole of the circuit board in a state where the piezoelectric element unit is accommodated in the case head. At this time, the end of the wiring film is often inclined, and there is a problem that the end of the wiring film cannot be easily inserted into the through hole. This is particularly troublesome when a plurality of piezoelectric element units are inserted through the case head.

  For this reason, for example, in a state where the circuit board is arranged facing the case head, a jig or the like is manually inserted into the space between the two to align the wiring films, and the end portions of the wiring films are formed in the through holes. It was inserted.

  However, even if such a jig is used, the work is complicated, and there is a problem that work efficiency and production efficiency are low.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a method of manufacturing a liquid jet head capable of improving work efficiency and production efficiency.

The present invention that solves the above problems provides a flow path unit provided with a pressure generation chamber communicating with a nozzle, and a pressure provided corresponding to each pressure generation chamber to eject droplets into the pressure generation chamber. A plurality of piezoelectric element units each including a plurality of piezoelectric elements and a wiring film having a plurality of wires connected at one end to each piezoelectric element, and a housing portion fixed to the flow path unit and housing each piezoelectric element unit And a circuit board having a plurality of conductive pads fixed to a surface of the case head opposite to the flow path unit and connected to the other ends of the wirings, and the wiring film. Is a liquid ejecting head manufacturing method in which the other end of the wiring is connected to the conductive pad in a state of being inserted into a slit-like through hole provided in the circuit board, The case heads of the circuit board are inserted into the through holes of the circuit board when the end portions of the wiring films drawn out of the housing parts are inserted into the through holes of the circuit board after the piezoelectric element units are housed in the housing head housing parts In a state where the wiring film is aligned with a restriction plate inserted into each through hole from the opposite surface side, the circuit board is moved toward the case head to make the wiring film into the slit-shaped through hole. The liquid jet head manufacturing method is characterized in that the liquid jet head is inserted.
In the present invention, since the wiring film is aligned by the regulation plate inserted into the through hole of the circuit board, the end of the wiring film can be inserted into the through hole of the circuit board very easily, and the work efficiency and Production efficiency is greatly improved. In addition, since the work can be performed in a relatively small space, the work can be automated relatively easily.

  Here, the restriction plate inserted into the through hole is arranged on the side of each wiring film such that the tip portion is located on the case head side with respect to the end of the wiring film, and the restriction plate and the It is preferable to align the wiring film by moving the circuit board in a direction opposite to the direction of inclination of the wiring film and bringing the regulating plate into contact with the surface of the wiring film. Thereby, the inclination of a wiring film can be controlled comparatively easily by the control board inserted in the through-hole of the circuit board. That is, the wiring film can be relatively easily aligned by the restriction plate.

  Further, in the state where the wiring film houses the piezoelectric element unit in the housing portion, a first wiring film in which the inclination direction of the end portion is a first direction along the parallel arrangement direction of the piezoelectric element units; And a second restricting plate corresponding to the first wiring film when the inclined direction of the end portion includes a second wiring film that is a second direction opposite to the first direction. And a second regulating plate corresponding to the second wiring film so that the front end portion is positioned closer to the case head than the end portion of the first wiring film, and the front end portion thereof is the second wiring. Arranged on the side of each wiring film so as to be located on the side of the circuit board from the end of the film, and move the first and second regulating plates and the circuit board in the second direction, 1 restriction plate on the surface of the first wiring film The second restricting plate is disposed outside the second wiring film in the inclined direction in a contact state, and the tip of the second restricting plate is closer to the case head than the end of the second wiring film. The second restricting plate is moved to the case head side so as to be positioned at the position, and the second restricting plate is moved in the first direction by moving the first and second restricting plates and the circuit board. Is brought into contact with the second wiring film, and the circuit board is moved toward the case head in a state where the first and second wiring films are aligned by the first and second regulating plates. It is preferable to do so. Accordingly, even when the inclination direction of the wiring film is not constant, the wiring films can be reliably aligned and the end portions of the wiring films can be inserted through the through holes of the circuit board very easily.

  Further, before the end portion of the wiring film is inserted into the through hole of the circuit board, a molding agent is applied in advance to the peripheral edge of the area of the surface of the case head where the circuit board comes into contact. In addition, after the end portion of the wiring film is inserted into the through-hole, the circuit board is pressed against the case head via the molding agent, and both the circuit board and the circuit board are fixed by the molding agent. It is preferable to close the gap with the case head. Thereby, the clearance gap between a circuit board and a case head can be closed easily and reliably. For example, since these circuit boards and case heads are relatively small components, if the gap between the circuit board and the case head is closed after the circuit board is brought into contact with the case head, the work becomes complicated. As a result, work efficiency is greatly reduced.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is a perspective view illustrating an ink jet recording head which is an example of a liquid ejecting head according to Embodiment 1, and FIG. 2 is a cross-sectional view illustrating an outline of the ink jet recording head.

  As shown in FIGS. 1 and 2, the ink jet recording head 10 of this embodiment generates a pressure for ejecting ink droplets while the flow path unit 20 and the flow path unit 20 are fixed to the lower surface. A case head 50 in which a piezoelectric element unit 40 having a plurality of piezoelectric elements 41 is accommodated, and a circuit board 60 fixed to the upper surface of the case head 50 and connected to each piezoelectric element 41 are provided.

  As shown in FIG. 2, the flow path unit 20 includes a flow path forming substrate 22 having a plurality of pressure generation chambers 21, a nozzle plate 24 in which a plurality of nozzles 23 communicating with each pressure generation chamber 21 are formed, It is comprised with the diaphragm 25 provided in the surface on the opposite side to the nozzle plate 24 of the flow-path formation board | substrate 22. FIG.

  In the flow path forming substrate 22, a plurality of pressure generation chambers 21 are partitioned by a partition wall and arranged in parallel in the width direction on the surface layer portion on one surface side thereof. In addition, a reservoir 26 for supplying ink to each pressure generating chamber 21 is provided in the flow path forming substrate 22 outside the row of the pressure generating chambers 21 so as to penetrate the channel forming substrate 22 in the thickness direction. It has been. Each pressure generating chamber 21 and the reservoir 26 communicate with each other via an ink supply path 27. In this embodiment, the ink supply path 27 is formed with a width narrower than that of the pressure generation chamber 21, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 26 into the pressure generation chamber 21. Further, a nozzle communication hole 28 penetrating the flow path forming substrate 22 is formed on the end side of the pressure generating chamber 21 opposite to the reservoir 26. In this embodiment, the flow path forming substrate 22 is made of a silicon single crystal substrate, and the pressure generating chamber 21 and the like provided in the flow path forming substrate 22 are formed by etching the flow path forming substrate 22. ing.

  A nozzle plate 24 in which nozzles 23 are formed is bonded to one surface side of the flow path forming substrate 22 via an adhesive or a heat welding film, and each nozzle 23 communicates with a nozzle provided on the flow path forming substrate 22. The pressure generation chambers 21 communicate with each other through the holes 28. A vibration plate 25 is joined to the other surface side of the flow path forming substrate 22, that is, the opening surface side of the pressure generation chamber 21, and each pressure generation chamber 21 is sealed by the vibration plate 25.

  The vibration plate 25 is formed of a composite plate of, for example, an elastic film 29 made of an elastic member such as a resin film and a support plate 30 made of, for example, a metal material that supports the elastic film 29. The side is joined to the flow path forming substrate 22. In addition, an island portion 31 with which the tip end portion of the piezoelectric element 41 abuts is provided in a region of the vibration plate 25 facing each pressure generating chamber 21. That is, a thin portion 32 having a thickness smaller than that of other regions is formed in a region of the diaphragm 25 facing the peripheral portion of each pressure generating chamber 21, and island portions 31 are provided inside the thin portion 32. Yes. In addition, in the region facing the reservoir 26 of the vibration plate 25, similarly to the thin portion 32, a support portion 30 is removed by etching, and a compliance portion 33 configured substantially only by an elastic film is provided.

  The tip of each piezoelectric element 41 constituting the piezoelectric element unit 40 is fixed in a state where it abuts on the island portion 31 of the diaphragm 25.

  Here, a plurality of piezoelectric elements 41 constituting each piezoelectric element unit 40 are integrally formed. That is, a piezoelectric element forming member 45 in which the piezoelectric material 42 and the electrode forming materials 43 and 44 are alternately sandwiched and stacked is formed to correspond to each pressure generating chamber 21. A plurality of piezoelectric elements 41 are formed by cutting on the comb teeth. An inactive region (base end side of the piezoelectric element 41) that does not contribute to the vibration of the piezoelectric element 41 (piezoelectric element forming member 45) is fixed to the fixed substrate 46. Further, in the vicinity of the base end portion of the piezoelectric element 41, a wiring film 48 having a plurality of wirings 47 for supplying a signal for driving each piezoelectric element 41 is connected to the surface opposite to the fixed substrate 46. . The piezoelectric element unit 40 is constituted by the piezoelectric element 41 (piezoelectric element forming member 45), the fixed substrate 46, and the wiring film 48.

  As described above, the case head 50 is fixed on the diaphragm 25 of the flow path unit 20, and the piezoelectric element unit 40 is accommodated in the accommodating portion 51 of the case head 50. For example, in the present embodiment, three housing parts 51 are arranged in parallel in the case head 50, and the piezoelectric element unit 40 is housed in each housing part 51. The distal end portion of the piezoelectric element 41 is bonded to the vibration plate 25 and the fixed substrate 46 is fixed to the case head 50.

  The circuit board 60 has a plurality of conductive pads 61 to which the respective wirings 47 of the wiring film 48 are connected, and is bonded to the upper surface of the case head 50. The housing 51 of the case head 50 is substantially blocked by the circuit board 60. In the present embodiment, the circuit board 60 is firmly fixed to the case head 50 by the molding agent 70 (see FIG. 2). The molding agent 70 is provided over the entire outer periphery of the circuit board 60, and the molding agent 70 is sandwiched between the circuit board 60 and the case head 50. Therefore, the gap between the circuit board 60 and the case head 50 at the outer periphery of the circuit board 60 is completely closed by the molding agent 70.

  The circuit board 60 has a slit-like through hole 62 formed in a region facing the housing part 51 of the case head 50, and the wiring film 48 extends from the through hole 62 of the circuit board 60 to the outside of the housing part 51. Has been pulled out.

  In this embodiment, the wiring film 48 of the piezoelectric element unit 40 is a flexible printed circuit board (FPC) on which a driving IC (not shown) for driving the piezoelectric element 41 is mounted, for example, a tape carrier package (TCP ) And chip on film (COF). And the one end part side of each wiring 47 provided in the wiring film 48 is connected to the electrode formation materials 43 and 44 which comprise the piezoelectric element 41 by solder, an anisotropic conductive material, etc., for example. On the other hand, the other end side of each wiring 47 is connected to each conductive pad 61 of the circuit board 60. Specifically, each wiring 47 is connected to the circuit board 60 in a state in which the leading end portion of the wiring film 48 drawn out of the housing portion 51 from the through hole 62 of the circuit board 60 is bent along the surface of the circuit board 60. The conductive pads 61 are joined.

  Hereinafter, a method for manufacturing such an ink jet recording head 10 will be described. 3 and 4 are schematic diagrams for explaining a method of manufacturing the ink jet recording head according to the present embodiment, and FIG. 5 is a schematic diagram of the assembling apparatus according to the present embodiment.

  First, as shown in FIG. 3, the piezoelectric element unit 40 is fixed in the accommodating portion 51 of the case head 50. Note that one end side of the wiring film 48 is fixed to the piezoelectric element unit 40 in advance, and when the piezoelectric element unit 40 is fixed in the housing portion 51 of the case head 50, the tip end portion on the other end side of the wiring film 48 is It will be in the state protruded to the outer side of the accommodating part 51. FIG.

  Thereafter, the circuit board 60 is fixed on the case head 50. At this time, the leading end portion of the wiring film 48 constituting each piezoelectric element unit 40 is inserted into the through hole 62 of the circuit board 60. However, as shown in FIG. 3, when the piezoelectric element unit 40 is housed in the housing portion 51, the tip on the other end side of the wiring film 48 is warped due to internal stress or the like, or inclined due to its own weight. ing. For this reason, even if a circuit board is disposed on the surface of the case head 50, it is difficult to insert the end portion of the wiring film into the through hole as it is. Note that the amount of inclination (angle) of the wiring film 48 in each piezoelectric element unit 40 varies somewhat, but the direction of inclination of the wiring film 48 is constant.

  For this reason, in this embodiment, using the assembling apparatus shown in FIG. 5, the wiring films 48 are aligned by the method described below, and the ends of the wiring films 48 are simultaneously placed in the through holes 62 of the circuit board 60. It was made to insert.

  As shown in FIG. 5, the assembling apparatus 100 used in the manufacturing method of the present embodiment includes a holding means 101 that holds the circuit board 60 and a plurality of regulating plates 102 that respectively correspond to the through holes 62 of the circuit board 60. It comprises. The holding unit 101 is configured to suck and hold the circuit board 60, for example, and is fixed to the first base member 103. The first base member 103 is fixed to the second base member 104 in a state where a predetermined interval is secured. The second base member 103 is supported by a driving unit (not shown) so as to be movable in a three-dimensional direction.

  Each restricting plate 102 is fixed to a support member 105 provided so as to be linearly movable between the first base member 103 and the second base member 104, and is inserted through the first base member 103. A tip portion of the hole 106 is arranged to protrude outside the first base member 103 through the hole 106.

  As described above, the assembly apparatus 100 used in the manufacturing method of the present embodiment can move the circuit board 60 and the restriction plate 102 by the same mechanism, and the restriction plate 102 is a mechanism independent of the circuit board 60. It is configured to be movable in the vertical direction.

  Then, first, as shown in FIG. 4A, the circuit board 60 held by the holding means 101 is disposed on the case head 50, and the support member 105 is lowered to enter each through hole 62 of the circuit board 60. The restriction plate 102 is inserted from the surface opposite to the case head 50. Further, the restricting plate 102 and the circuit board 60 are moved so that the restricting plates 102 are located on the sides of the wiring films 48 arranged side by side, and the leading ends of the restricting plates 102 are the end portions of the wiring film 48. It is lowered so as to be positioned closer to the case head 50 side. In other words, each regulating plate 102 is moved together with the circuit board 60 so that the front end portion of each regulating plate 102 is positioned outside the inclination direction (right direction in the drawing) of the wiring film 48.

  Here, before the circuit board 60 is disposed on the case head 50, a molding agent 70 for fixing the circuit board 60 is applied in advance to the upper surface of the case head 50. Specifically, the molding agent 70 is continuously applied to the outer periphery of the area of the upper surface of the case head 50 where the circuit board 60 is fixed over the entire periphery.

  Next, as shown in FIG. 4B, the regulation plate 102 and the circuit board 60 are moved in the direction opposite to the inclination direction of the wiring film 48 (left direction in the figure), and the regulation plate 102 is moved to one side of the wiring film 48. The inclination of the end of the wiring film 48 is regulated by contacting the surface of the wiring film 48. That is, the end portions of the wiring film 48 that are inclined with respect to the surface (upper surface) of the case head 50 are raised and aligned along a direction substantially perpendicular to the surface of the case head 50.

  The regulation plate 102 that regulates the inclination of the wiring film 48 in this way preferably has a relatively wide width so that it can be inserted into the slit-like through hole 62. Moreover, it is preferable that the front-end | tip part of the control board 102 is formed comparatively thin, and although formed in this embodiment so that thickness may become small gradually, the shape of a front-end | tip part is not specifically limited. .

  Then, in a state where the wiring films 48 are aligned by the restriction plate 102 (in a state where the inclination is restricted), as shown in FIG. 4C, only the circuit board 60 is lowered, that is, the circuit board. By moving 60 toward the case head 50, the leading end of the wiring film 48 is reliably inserted into the through hole 62. In practice, the support member 105 is raised while lowering the second base member 104.

  By aligning the plurality of wiring films 48 using the restriction plate 102 in this way, the end portions of the wiring films 48 can be inserted into the through-holes 62 of the circuit board 60 very easily. Production efficiency is greatly improved. Moreover, since conveyance of the circuit board 60 in the assembling apparatus 100 and driving for regulating the inclination of the wiring film 48 can be made common, the apparatus configuration can be simplified. Therefore, automation of work can be realized relatively easily and inexpensively.

  Further, as described above, since the wiring films are aligned by the restriction plate inserted into the through hole of the circuit board, a plurality of assembly operations can be simultaneously performed using the above-described assembly apparatus or the like. For example, if a predetermined jig or the like is inserted between the case head and the circuit board to restrict the inclination of the wiring film, it is necessary to secure a space around the case head and the circuit board. However, according to the manufacturing method of the present invention, it is not necessary to secure so much space around the case head and the circuit board. Therefore, it is possible to carry out assembling work at the same time using an assembling apparatus or the like.

  If it is confirmed that the wiring film 48 has been inserted into the through hole 62 of the circuit board 60, then the circuit board 60 is pressed onto the molding agent 70 previously applied to the surface of the case head 50, The molding agent 70 is cured in the state. Thereby, the circuit board 60 is securely fixed to the case head 50 by the molding agent 70. Further, the gap between the circuit board 60 and the case head 50 is closed by the molding agent 70. That is, the housing part 51 of the case head 50 is more reliably closed. Therefore, it is possible to prevent a problem such as destruction of the piezoelectric element 41 due to the flow of ink into the housing portion 51.

  In the present embodiment, the molding agent 70 is applied to the case head 50 in advance. For this reason, compared with working after the fixed substrate 46 is disposed on the case head 50, the application area of the molding agent is reduced. That is, the amount of the molding agent used can be suppressed, and the material cost can be reduced. Moreover, since the coating operation becomes relatively simple, it is possible to realize automation of the coating operation.

  After fixing the circuit board 60 to the case head 50, the regulating plate 102 is separated from the wiring film 48, and then the end of each wiring film 48 is bent so that each wiring 47 of the wiring film 48 is connected to the circuit board 60. Bonded (fused) to the conductive pad 61 (see FIG. 2).

(Embodiment 2)
FIG. 6 is a schematic cross-sectional view of the ink jet recording head according to the second embodiment, and FIGS. 7 and 8 are schematic views for explaining the manufacturing method thereof. FIG. 9 is a schematic view of the assembling apparatus according to the second embodiment.

  In the first embodiment, the configuration of the ink jet recording head in which the respective wiring films 48 are inclined in the same direction in the state where the piezoelectric element unit 40 is housed in the housing portion 51 of the case head 50 is exemplified. In contrast, the ink jet recording head 10A according to the present embodiment includes piezoelectric element units 40A and 40B in which the respective wiring films 48 are inclined in different directions while being accommodated in the accommodating portion 51 of the case head 50 (see FIG. 6).

  That is, in the ink jet recording head 10A according to the present embodiment, as shown in FIG. 6, the case head 50A includes accommodating portions 51A and 51B having different sizes, and one piezoelectric element unit is included in one accommodating portion 51A. 40 is accommodated, but the other piezoelectric element unit 40 is accommodated in the other accommodating portion 51B in a direction in which the wiring films 48 face each other.

  In each piezoelectric element unit 40, the inclination direction of the wiring film 48 is constant. That is, the wiring film 48 is inclined toward the piezoelectric element 41 side. Therefore, the end portion of the wiring film (first wiring film) 48A of the piezoelectric element unit (first piezoelectric element unit) 40A accommodated in each of the accommodating portions 51A and 51B in the same direction is the piezoelectric element unit 40. The piezoelectric element unit (the second element) is inclined in a first direction (for example, the left side in the figure) along the parallel arrangement direction, and is accommodated in the accommodating portion 51B in the direction opposite to the piezoelectric element unit 40A. The end portion of the wiring film (second wiring film) 48B of the piezoelectric element unit 40B is inclined in the direction opposite to the first direction (second direction).

  The circuit board 60 is provided with one through hole 62A and 62B for each of the accommodating portions 51A and 51B. Then, one wiring film 48A is drawn out from the through hole 62A corresponding to the accommodating portion 51A, and the two piezoelectric element units 40A and 40B accommodated in the accommodating portion 51B are extracted from the through hole 62B corresponding to the accommodating portion 51B. The wiring films 48A and 48B are drawn out. Since other configurations are the same as those of the ink jet recording head described in the first embodiment, description thereof is omitted.

  When manufacturing an ink jet recording head having such a configuration, for example, using an assembly apparatus 100A shown in FIG. 9, the end of each wiring film 48 is inserted into the through hole 62 of the circuit board 60 in the following procedure. Let

  As shown in FIG. 9, the assembling apparatus 100A includes restriction plates 102A and 102B having relatively different lengths. That is, the first restricting plate 102A corresponding to one piezoelectric element unit 40A having a different inclination direction of the wiring film and the second restricting plate 102B corresponding to the other piezoelectric element unit 40B are provided. In the present embodiment, the first and second restricting plates 102A and 102B provided corresponding to the accommodating portion 51B are integrally provided. Of course, these first and second regulating plates 102A and 102B may be separate bodies. Since the other configuration of the assembly apparatus 100A according to the second embodiment is the same as that of the assembly apparatus according to the first embodiment, description thereof is omitted.

  Using such an assembling apparatus 100A, first, the circuit board 60 held by the holding means 101 is placed on the case head 50 as shown in FIG. That is, the first and second restricting plates 102A and 102B and the circuit board 60 are moved so that the first and second restricting plates 102A and 102B are positioned on the sides of the wiring films 48 arranged in parallel. Let Then, the support member 105 is lowered, and the first and second regulating plates 102A and 102B are inserted into the through holes 62 of the circuit board 60 from the surface opposite to the case head 50, respectively. In the present embodiment, the first restriction plate 102A is inserted into the through hole 62A corresponding to the accommodating portion 51A, and the first and second integrally formed in the through hole 62B corresponding to the accommodating portion 51B. The restriction plates 102A and 102B are inserted.

  At this time, the second regulating plate 102B corresponding to the wiring film 48B is arranged so that the tip of the first regulating plate 102A is closer to the case head 50A than the end of each wiring film 48A inclined in the same direction. The heights of the first and second restricting plates 102A and 102B are adjusted so that the front end portion is positioned closer to the circuit board 60 than the end portion of the wiring film 48B.

  Next, as shown in FIG. 7B, the first and second restricting plates 102A and 102B and the circuit board 60 are opposite to the inclination direction of the wiring film 48A (second direction: right direction in the figure). Move to. Thereby, the first regulating plate 102 abuts on one surface of the wiring film 48A, and the inclination of the end of the wiring film 48A is regulated. In the present embodiment, the first regulating plate 102A is replaced with the wiring film 48A. The first and second restricting plates 102A and 102B and the circuit board 60 are moved until the second restricting plate 102B is positioned on the outer side in the inclination direction of the wiring film 48B while being kept in contact with the surface of the circuit board 60. Let At this time, the wiring film 48A is held in a state inclined by the first regulating plate 102A in the same direction as the wiring film 48B.

  In this state, as shown in FIG. 7C, the support member 105 is further lowered to the case head 50 side, and the tip of the second regulating plate 102A is positioned closer to the case head 50 than the end of the wiring film 48B. In this manner, the heights of the first and second regulating plates 102A and 102B are adjusted.

  Thereafter, as shown in FIG. 8A, the first and second restricting plates 102A and 102B and the circuit board 60 are opposite to the inclination direction of the wiring film 48B (first direction: left direction in the figure). Move to. That is, the first and second restriction plates 102A and 102B and the circuit board 60 are moved so that the respective through holes 62 of the circuit board 60 are positioned on the corresponding accommodating portions. As a result, the second restricting plate 102B comes into contact with the wiring film 48B and the inclination is restricted. Of course, the inclination of the wiring film 48A is regulated by the first regulating plate 102A coming into contact therewith.

  Then, with the wiring films 48A and 48B aligned by the first and second restriction plates 102A and 102B in this way, as shown in FIG. 8B, only the circuit board 60 is lowered, That is, by moving the circuit board 60 toward the case head 50, the tip portions of the wiring films 48A and 48B are reliably inserted into the through holes 62A and 62B, respectively. Since the subsequent steps are the same as those in the first embodiment, description thereof is omitted.

  As described above, in the manufacturing method of the present embodiment, even when the inclination direction of the wiring film is not constant, the end of each wiring film 48 can be inserted into each through hole 62 of the circuit board 60 very easily. Work efficiency and production efficiency are greatly improved.

(Other embodiments)
As mentioned above, although one Embodiment of this invention was described, the basic composition of this invention is not limited to what was mentioned above.

  For example, the operation of the restriction plate in the above-described embodiment has only been described as an example. That is, if the circuit board is moved toward the case head and the wiring film can be inserted into the slit-shaped through hole in a state where the wiring film is aligned with the regulating plate inserted in each through hole, The operation is not particularly limited.

  Further, for example, in the above-described embodiment, as a pressure generation unit that causes a pressure change in the pressure generation chamber, a longitudinal vibration type piezoelectric element that alternately stacks piezoelectric materials and electrode forming materials and expands and contracts in the axial direction is provided. The configuration is exemplified, for example, a thin film type piezoelectric element that is formed by laminating and deforming by film formation and lithography, a thick film type piezoelectric element formed by a method such as attaching a green sheet, etc. Also good. Also, as a pressure generating means, a heating element is arranged in the pressure generating chamber, and droplets are discharged from the nozzle opening by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode. Thus, it is possible to use a so-called electrostatic actuator that deforms the diaphragm by electrostatic force and ejects droplets from the nozzle openings. In any case, the manufacturing method of the present invention can be adopted as long as the wiring film is drawn out from the accommodating portion and the end portion is inserted through the through hole of the circuit board.

  In the above-described embodiments, the ink jet recording head has been described as an example of the liquid ejecting head. However, the present invention is intended for a wide range of liquid ejecting heads, and ejects liquid other than ink. Of course, the present invention can also be applied to a method of manufacturing an ejection head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

3 is a perspective view of a recording head according to Embodiment 1. FIG. 2 is a schematic cross-sectional view of a recording head according to Embodiment 1. FIG. 5 is a schematic cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. FIG. 4 is a schematic diagram illustrating a manufacturing process of the recording head according to the first embodiment. 1 is a schematic view of an assembling apparatus according to Embodiment 1. FIG. 6 is a schematic cross-sectional view of a recording head according to Embodiment 2. FIG. FIG. 6 is a schematic diagram illustrating a manufacturing process of a recording head according to a second embodiment. FIG. 6 is a schematic diagram illustrating a manufacturing process of a recording head according to a second embodiment. It is the schematic of the assembly apparatus which concerns on Embodiment 2. FIG.

Explanation of symbols

  10 ink jet recording head, 20 flow path unit, 21 pressure generating chamber, 22 flow path forming substrate, 23 nozzle, 24 nozzle plate, 25 vibration plate, 26 reservoir, 27 ink supply path, 28 nozzle communication hole, 29 elastic film, 30 support plate, 31 island part, 32 thin part, 33 compliance part, 40 piezoelectric element unit, 41 piezoelectric element, 42 piezoelectric material, 43, 44 electrode forming material, 45 piezoelectric element forming member, 46 fixed substrate, 47 wiring, 48 Wiring film, 50 case head, 51 accommodating portion, 60 circuit board, 61 conductive pad, 62 through hole, 70 molding agent

Claims (4)

A flow path unit provided with a pressure generation chamber communicating with the nozzle, a plurality of piezoelectric elements provided corresponding to each pressure generation chamber and applying pressure for ejecting droplets into the pressure generation chamber, and one end of each piezoelectric element A plurality of piezoelectric element units each including a wiring film having a plurality of wirings connected to the element; a case head having an accommodating portion that is fixed to the flow path unit and accommodates each piezoelectric element unit; and the case head A circuit board having a plurality of conductive pads fixed to a surface opposite to the flow path unit and connected to the other end of the wiring, and the wiring film is provided on the circuit board. A liquid ejecting head manufacturing method in which the other end of the wiring is connected to the conductive pad in a state of being inserted into a through-hole.
After housing each piezoelectric element unit in the housing part of the case head, when inserting the end of each wiring film drawn out of the housing part into the through hole of the circuit board,
The circuit board is moved toward the case head in a state where the wiring film is aligned with a restriction plate inserted into each through hole from the opposite side of the circuit board to the case head. A method of manufacturing a liquid jet head, wherein the liquid jet head is inserted into the slit-shaped through hole.   The restriction plate inserted into the through-hole is arranged on the side of each wiring film so that the front end portion is located on the case head side with respect to the end of the wiring film, and the restriction plate, the circuit board, 2. The wiring film according to claim 1, wherein the wiring film is aligned by moving in a direction opposite to an inclination direction of the wiring film and bringing the regulating plate into contact with a surface of the wiring film. A method for manufacturing a liquid jet head. In the state in which the wiring film houses the piezoelectric element unit in the housing portion, a first wiring film whose end is inclined in a first direction along the parallel direction of the piezoelectric element units, and an end When the inclination direction of the portion includes the second wiring film that is the second direction that is opposite to the first direction,
A first restricting plate corresponding to the first wiring film has a first end corresponding to the second wiring film so that a front end portion thereof is positioned closer to the case head than an end portion of the first wiring film. 2 restricting plates are arranged on the side of each wiring film so that the front end portion is located on the circuit board side with respect to the end of the second wiring film,
The first and second restriction plates and the circuit board are moved in the second direction, and the second restriction plate is in contact with the surface of the first wiring film. A restriction plate is arranged on the outer side in the inclination direction of the second wiring film, and the second restriction plate is positioned so that the front end of the second restriction plate is located closer to the case head than the end of the second wiring film. The restriction plate is moved to the case head side, and the first and second restriction plates and the circuit board are moved in the first direction so that the second restriction plate is brought into contact with the second wiring film. The circuit board is moved toward the case head in a state where the first and second wiring films are in contact with each other and are aligned by the first and second regulating plates. Item 2. A method for manufacturing a liquid jet head according to Item 1.   Before the end of the wiring film is inserted into the through hole of the circuit board, a molding agent is applied all around the periphery of the area of the surface of the case head where the circuit board comes into contact. Then, after the end portion of the wiring film is inserted into the through hole, the circuit board is pressed against the case head through the molding agent, and the circuit board and the case head are fixed together by the molding agent. The method of manufacturing a liquid jet head according to claim 1, wherein a gap between the liquid ejecting head and the head is closed.

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