JP6424935B2 - Liquid jet head and liquid jet apparatus - Google Patents

Description

  The present invention relates to a liquid jet head such as an ink jet recording head and a liquid jet apparatus including the same, and more particularly to a liquid jet head having a wiring member having a wiring terminal corresponding to a pressure generating unit of the liquid jet head. And a liquid ejecting apparatus.

  As a type of liquid jet head that discharges as a droplet from the nozzle by causing pressure fluctuation in the liquid in the pressure chamber, the droplet is jetted by deforming a piezoelectric element (a type of pressure generating unit) joined to the vibrating plate There is one that is configured to In this liquid jet head, the pressure chamber volume is changed by applying a drive voltage (drive pulse) to drive the piezoelectric element, causing pressure fluctuation in the liquid stored in the pressure chamber, and utilizing this pressure fluctuation. Droplets are ejected from the nozzle.

  The piezoelectric element is electrically connected to a film-like wiring member (hereinafter referred to as a flexible cable) on which an IC for driving the piezoelectric element such as COF (chip on film) or TCP (tape carrier package) is mounted. A drive voltage is supplied via a cable (see, for example, Patent Document 1). The piezoelectric element has a lower electrode film, a piezoelectric layer, and an upper electrode film. Generally, one electrode (for example, lower electrode film) is used as a common element electrode common to a plurality of piezoelectric elements. The other electrode (for example, the upper electrode film) is used as an individual element electrode separately patterned on each piezoelectric element. The piezoelectric layer sandwiched between the common element electrode and the individual element electrode is a piezoelectric active portion in which piezoelectric distortion occurs when a drive voltage is applied between the two electrodes.

In the flexible cable described above, for example, a control IC for controlling application of a drive voltage to the piezoelectric element is mounted on the surface of a base film such as polyimide, and a wiring pattern and a wiring terminal are formed, and wiring provided at both ends Wiring patterns other than the terminals and control ICs are covered with an insulating solder resist.
The above-described piezoelectric element is accommodated in a member made of a silicon single crystal substrate called a protective substrate (also referred to as a sealing plate), and the terminal portion of the piezoelectric element is disposed in a wiring space provided in the protective substrate. . Then, one end portion of the flexible cable is inserted into the wiring space portion, and the wiring terminal formed at the one end portion is electrically connected to the corresponding terminal of the piezoelectric element.

JP, 2011-167964, A

  By the way, in the liquid jet head of this type, in order to meet the demand for downsizing, the members constituting the liquid jet head are also miniaturized. With regard to the above-described protective substrate which is one of the constituent members, as the size is reduced, the wiring space also becomes a narrow space within a range in which one end of the flexible cable inserted into the wiring space can be inserted. Furthermore, with the increase in the number of nozzles and the increase in density, the terminals constituting the terminal portion are also arranged with high density, and the distance between the terminals is narrowed. Therefore, at the time of wiring work, it is necessary to bond the wiring terminals and the terminals of the piezoelectric element with high accuracy in a narrow space. In such a case, the thickness of the solder resist which covers portions other than the terminals in a general flexible cable becomes a problem. That is, although the thickness of the solder resist is, for example, about 0.2 mm, when the wiring work is performed in the narrow wiring space described above, the solder resist contacts a member (protective substrate) defining the wiring space. As a result, there is a possibility that the bonding position of the terminals may be shifted.

  Also, in general, there is variation in the application range of the solder resist of the flexible cable, and when the portion not covered with the solder resist comes in contact with the protective substrate made of a silicon single crystal substrate, the protective substrate has conductivity. There is a risk of shorting.

  The present invention has been made in view of such circumstances, and an object thereof is to connect a terminal of a wiring member and a terminal of a pressure generating means more reliably and firmly while preventing a defect such as a contact failure or a short circuit. It is an object of the present invention to provide a liquid jet head and a liquid jet apparatus that can

The present invention has been proposed to achieve the above object, and pressure generation is caused by causing pressure fluctuation in the liquid in the pressure chamber by applying a drive voltage and injecting the liquid from a nozzle connected to the pressure chamber. Means,
A substrate containing the pressure generating means;
A wiring member for supplying the drive voltage to the pressure generating means;
Equipped with
A first terminal portion of the pressure generating means is disposed in a wiring empty portion provided in the base material, and a second terminal portion on one end side of the wiring member is electrically connected to the first terminal portion. A liquid jet head,
The wiring member has a first portion covered by an insulating film and a second portion not covered by the insulating film.
The second portion includes the second terminal portion, and in a state in which the second terminal portion and the first terminal portion are connected, at least the opening on the wiring member insertion side of the wiring empty portion Continue to the outside position,
The base material and the second portion are in contact with the wiring empty portion in a state of covering the bonding portion between the first terminal portion and the second terminal portion in the wiring empty portion. It is characterized in that it is filled with an electrically insulating filler in the absence state.

According to the above configuration, the second portion not covered by the insulating film in the wiring member includes the second terminal portion, and the second terminal portion is connected to the first terminal portion. Since at least the opening of the wiring empty portion continues to a position outside the opening on the wiring member insertion side of the wiring empty portion, that is, the insulating film is not provided in the range to be inserted into the wiring empty portion. The thickness in the range can be reduced. For this reason, wiring work in a relatively narrow wiring space becomes easy, and it is suppressed that the insulating film contacts the base material that defines the wiring space to cause the positional deviation of bonding between the terminals.
Further, the wiring empty portion covers the joint portion between the first terminal portion and the second terminal portion in the wiring empty portion, and the substrate and the second portion are not in contact with each other. Since the filler having the electrical insulation property is filled, the attitude of the wiring member is fixed by the filler, and the second portion of the wiring member is the base material when the base material is made of the conductive material. Short circuit contact is prevented. In addition, since the joint portion between the first terminal portion and the second terminal portion is covered and reinforced with the filler, the connection is made more firmly, and the contact failure and the like are reduced.

  In the above configuration, it is preferable that the filler reaches the first portion outside the opening of the wiring empty portion to cover the entire surface of the second portion.

  According to this configuration, since the entire surface of the second portion is covered with the filler, it is possible to more reliably prevent a short circuit between the second portion and the substrate.

  In the above configuration, the first terminal portion and the second terminal portion are preferably connected by a nonconductive adhesive.

  According to this configuration, even in a configuration in which the pitch between the terminals is relatively narrow, it is difficult to cause a short between the terminals, but the non-conductiveness is weak compared with other adhesives such as a conductive adhesive or solder or the like. In the case of using a conductive adhesive, the junction between the terminals by the non-conductive adhesive is reinforced by the filler, so it is possible to cope with the densification of the terminals.

  The said structure WHEREIN: The said base material is suitable for the structure which consists of a silicon monocrystal substrate.

  According to this configuration, in the configuration in which the base material is formed of the silicon single crystal substrate having conductivity, the movement of the wiring member is restricted by the filler, and thus the second portion of the wiring member may be in contact with the base material. It is suppressed and as a result, a short between the second part and the substrate is prevented.

  Furthermore, a liquid ejecting apparatus according to the present invention includes the liquid ejecting head having any one of the above-described configurations.

FIG. 2 is a perspective view illustrating the configuration of a printer. FIG. 2 is an exploded perspective view of the recording head as viewed obliquely from above. It is an exploded perspective view of a head unit. It is a sectional view of a head unit. It is a schematic diagram explaining the layout of the element electrode of a piezoelectric element, and an element electrode wiring part. It is a front view explaining the composition of a flexible cable. It is a perspective view explaining the composition of a flexible cable.

  Hereinafter, an embodiment for carrying out the present invention will be described with reference to the attached drawings. In the embodiment described below, various limitations are given as preferable specific examples of the present invention, but the scope of the present invention is as long as there is no description to the effect of limiting the present invention in the following description. It is not limited to these aspects. The following description will be made by taking an ink jet recording head (hereinafter, simply referred to as a recording head) mounted on an ink jet printer (a type of liquid jet apparatus of the present invention) as an example of the liquid jet head of the present invention. .

  First, the schematic configuration of the printer will be described with reference to FIG. The printer 1 is a device that ejects liquid ink to the surface of a recording medium 2 such as recording paper to record an image or the like. The printer 1 includes a recording head 3 for jetting ink, a carriage 4 to which the recording head 3 is attached, a carriage moving mechanism 5 for moving the carriage 4 in the main scanning direction, and a platen roller 6 for transferring the recording medium 2 in the subscanning direction. Etc. Here, the above-described ink is a type of liquid of the present invention, and is stored in the ink cartridge 7. The ink cartridge 7 is detachably attached to the recording head 3. The ink cartridge 7 may be disposed on the main body side of the printer 1 and may be supplied to the recording head 3 from the ink cartridge 7 through the ink supply tube.

  The carriage moving mechanism 5 is provided with a timing belt 8. The timing belt 8 is driven by a pulse motor 9 such as a DC motor. Therefore, when the pulse motor 9 is operated, the carriage 4 is guided by the guide rod 10 installed in the printer 1 and reciprocates in the main scanning direction (the width direction of the recording medium 2).

FIG. 2 is an exploded perspective view showing the configuration of the recording head 3. The recording head 3 in the present embodiment is roughly configured by a case 15, a plurality of head units 16, a unit fixing plate 17, and a head cover 18.
The case 15 is a box-like member for accommodating the head unit 16 and the focusing channel (not shown) inside, and the needle holder 19 is formed on the upper surface side. The needle holder 19 is a plate-like member for attaching the ink introduction needle 20, and in the present embodiment, eight ink introduction needles 20 are arranged side by side with the needle holder 19 corresponding to the ink color of the ink cartridge 7. It is arranged. The ink introduction needle 20 is a hollow needle-like member inserted into the ink cartridge 7, and the ink stored in the ink cartridge 7 is introduced into the case 15 from an introduction hole (not shown) opened at the tip. Are introduced to the head unit 16 side through the focusing channel of the

  A metal unit fixing plate 17 having four openings 17 ′ corresponding to each head unit 16 on the bottom side of the case 15 with the four head units 16 positioned side by side in the main scanning direction. And four openings 18 'corresponding to each head unit 16 are fixed by a metal head cover 18 opened.

FIG. 3 is an exploded perspective view showing the configuration of the head unit 16 (liquid jet head in a narrower sense than the recording head 3), and FIG. 4 is a cross-sectional view of the head unit 16. As shown in FIG. In addition, for convenience, the lamination direction of each member is demonstrated as an up-down direction. Further, FIG. 5 is a plan view for explaining the configuration of the element terminal portion of the piezoelectric element 35. FIG.
The head unit 16 in the present embodiment includes the nozzle plate 22, the flow path substrate 23, the protective substrate (protective substrate) 24, the compliance substrate 25, and the like, and is attached to the unit case 26 in a state where these members are stacked. ing.

  The nozzle plate 22 (a type of nozzle forming member) is a plate-like member in which a plurality of nozzles 27 are opened in a row at a pitch corresponding to the dot formation density. In the present embodiment, a nozzle row (a kind of nozzle group) is configured by arranging 360 nozzles 27 in a row at a pitch corresponding to 360 dpi. In the present embodiment, two nozzle rows are formed in the nozzle plate 22.

  The flow path substrate 23 has a very thin elastic film 30 made of silicon dioxide formed on its upper surface (surface on the protective substrate 24 side) by thermal oxidation. As shown in FIG. 4, in the flow path substrate 23, a plurality of pressure chambers 31 partitioned by a plurality of partition walls by anisotropic etching processing are formed corresponding to the respective nozzles 27. A communication empty portion 33 for partitioning a part of the common liquid chamber 32 is formed outside the row of pressure chambers 31 in the flow path substrate 23. The communication empty portion 33 communicates with the pressure chambers 31 via the ink supply path 34.

  On the elastic film 30 on the upper surface of the flow path substrate 23, a metal lower electrode film (common element electrode 46), a piezoelectric layer (not shown) made of lead zirconate titanate (PZT) or the like, and metal A piezoelectric element 35 (a type of pressure generating means) formed by sequentially laminating an upper electrode film (individual element electrode 47) made of the above is formed for each pressure chamber 31. The piezoelectric element 35 is a so-called deflection mode piezoelectric element, and is formed to cover the upper portion of the pressure chamber 31. In the present embodiment, the two piezoelectric element rows corresponding to the two nozzle rows are juxtaposed in the direction orthogonal to the nozzle rows in a state where the piezoelectric elements 35 are alternately viewed in the nozzle row direction. The lower electrode film may be an individual element electrode 47, and the upper electrode film may be a common element electrode 46.

  Electrode wiring portions (terminal portions) 48 and 49 are extended from the respective element electrodes 47 and 46 of the piezoelectric element 35 to central regions between the respective piezoelectric element rows on the elastic film 30 (see FIG. 5). . One end side wiring terminals 53 (a kind of second terminal parts) of the flexible cable 39 are electrically connected to portions corresponding to the electrode terminals of these electrode wiring parts. Each piezoelectric element 35 is configured to be deformed by applying a drive voltage between the individual element electrode and the common element electrode through the flexible cable 39. In the present embodiment, the elastic film 30, the piezoelectric element 35 including the electrodes 46 and 47, and the electrode wiring portions 48 and 49 electrically connected to the electrodes of the piezoelectric element 35 correspond to an actuator unit. The details of the electrode wiring portion and the flexible cable 39 will be described later.

  On the flow path substrate 23 on which the piezoelectric element 35 is formed, a protective substrate 24 (protective substrate) having a through space 36 penetrating in the thickness direction is disposed. Like the flow path substrate 23 and the nozzle plate 22, the protective substrate 24 is manufactured using a silicon single crystal substrate. Further, the through space portion 36 in the protective substrate 24 communicates with the communication space portion 33 of the flow path substrate 23 to partition a part of the common liquid chamber 32. Further, in the area facing the piezoelectric element 35, a housing empty portion 37 having a size that does not hinder the driving of the piezoelectric element 35 is formed in the protective substrate 24. Furthermore, in the protective substrate 24, wiring empty portions 38 penetrating the substrate thickness direction are formed between the adjacent piezoelectric element rows. In the wiring space 38, the individual element electrode terminal 48 of the piezoelectric element 35, the common element electrode terminal 51 (FIG. 5), and the like are arranged in a plan view. The wiring vacant portion 38 is a vacant portion having a rectangular opening elongated in the nozzle row direction in a plan view, and one end portion of the flexible cable 39 is inserted through the opening, and the element electrode terminal of the actuator unit Connected

  The unit case 26 is in communication with the ink introduction port 40 and has an ink introduction path 42 for supplying the ink introduced from the ink introduction needle 20 side to the common liquid chamber 32 side, and is opposed to the flexible portion 41. In the region where the flexible portion 41 is allowed to expand, a concave portion 43 is formed. A hollow 44 penetrating in the thickness direction is opened at the center of the unit case 26, and the flexible cable 39 is inserted into the hollow 44.

  The nozzle plate 22, the flow path substrate 23, the protective substrate 24, the compliance substrate 25, and the unit case 26 are mutually heated by heating with an adhesive, a heat welding film, etc. disposed and stacked therebetween. Bonded to

  The head unit 16 configured as described above takes in the ink from the ink cartridge 7 from the ink introduction port 40 through the ink introduction path 42 to the common liquid chamber 32 side, and the ink flow path from the common liquid chamber 32 to the nozzle 27 Fill (ink type of liquid flow path) with ink. Then, the drive voltage from the flexible cable 39 is applied to the piezoelectric element 35 to bend and deform the piezoelectric element 35 to cause pressure fluctuation in the ink in the corresponding pressure chamber 31, and use the pressure fluctuation of the ink Then, the ink is ejected from the nozzle 27.

  FIG. 5 is a schematic view illustrating the layout of the element electrode of the piezoelectric element 35 and the element electrode wiring portion extending from the element electrode. In the figure, the portions shown by dark hatching are the individual element electrodes 47 and the individual element electrode wiring portions 48 conducting to this, and the portions shown by light hatching are the common element electrodes 46 and the common element electrode wiring portions conducting to this 49. Further, in the same drawing, the vertical direction is the nozzle arraying direction (piezoelectric element arraying direction), and a configuration corresponding to two nozzle arrays is illustrated. In the present embodiment, platinum or gold is used as the material of the electrode film.

  In the present embodiment, common element electrodes 46 (46a, 46b) common to the respective piezoelectric elements 35 are elongated in the same direction along the nozzle row direction on the elastic film 30 which defines a part of the pressure chamber 31. A piezoelectric layer (not shown) and individual element electrodes 47 (47a, 47b) are sequentially laminated on top of this continuously formed in a rectangular shape in plan view and patterned for each piezoelectric element 35. The longitudinal dimension of the individual element electrode 47 is longer than the width of the common element electrode 46 in the short direction. In addition, the dimension in the width direction (short direction) of the individual element electrode 47 is substantially the same as the width of the piezoelectric element 35. Between the adjacent nozzle rows, strip-like individual element electrode terminals 48 (a kind of first terminal portion) in plan view are formed corresponding to the individual element electrodes 47 and conducted to the electrodes 47. The dimension in the longitudinal direction of the individual element electrode terminal 48 is set to such a length as not to contact the adjacent common element electrode 46. Further, the dimension in the width direction (short direction) of the individual element electrode terminal 48 is equal to the dimension of the width of the individual element electrode 47. The individual element electrode terminals 48a corresponding to one (left in the figure) nozzle row and the individual element electrode terminals 48b corresponding to the other (right in the figure) nozzle row are alternately arranged in the nozzle row direction. They are arranged in a row at regular intervals.

  Further, common element electrode portions 49 are formed on both sides of the common element electrodes 46a and 46b in the nozzle row direction. The common element electrode portion 49 extends along the direction orthogonal to the nozzle row direction across the common element electrodes 46a and 46b corresponding to each nozzle row, and the electrode wiring common to these common element electrodes 46a and 46b It is a part. Further, the common element electrode unit 49 is electrically connected to each common element electrode 46 through the branch electrode unit 50. Further, in the common element electrode portion 49, portions located on both sides in the row direction of the individual element electrode terminals 48, that is, a portion surrounded by a broken line circle in FIG. Common element electrode terminal 51 (a kind of first terminal portion).

6 is a front view illustrating the configuration of the flexible cable 39 (a type of wiring member in the present invention), and FIG. 7 is a perspective view illustrating the configuration of the flexible cable 39. In the flexible cable 39 according to the present invention, a control IC 52 for controlling application of a drive voltage to the piezoelectric element 35 is mounted on one surface of a rectangular base film such as polyimide, and an electrode connected to the control IC 52 A pattern of wiring 55 is formed. Further, at one end (lower end in FIG. 6) of the flexible cable 39, a plurality of lines of one end wiring terminals 53 are provided corresponding to the respective element electrode terminals 48 and 51 of the actuator unit, and the other end (FIG. 6) In the upper end portion of), a plurality of other end side wiring terminals 54 connected to a substrate terminal portion of a substrate (not shown) for relaying a signal from the printer main body side are arranged in a plurality. In the flexible cable 39, wiring patterns other than the wiring terminals 53 and 54 and the surface of the control IC 52 are covered with the solder resist 56 (corresponding to the insulating film in the present invention). The portion covered with the solder resist 56 corresponds to the first portion in the present invention. The solder resist 56 is a coating film made of an insulating resin. The hatched portions in FIGS. 6 and 7 indicate the range covered with the solder resist 56.

  At the time of wiring to the actuator unit, one end portion of the flexible cable 39 is a wiring terminal or wiring pattern from a bending line BL1 (see FIG. 6) virtually set between the wiring terminal formation region and the wiring pattern formation region. It is in a state of being bent at a substantially right angle toward the other surface side opposite to the one surface where the etc. is formed (see FIGS. 3, 4 and 7). In this state, the portion where the one end side wiring terminal 53 is formed faces each of the element electrode terminals 48 and 51 on the actuator unit side when attached to the actuator unit. The one side wiring terminal portion 53 of the flexible cable 39 and the corresponding element electrode terminals 48 and 51 on the side of the actuator unit are, for example, non-conductive adhesive (NCP: Non-Conductive Paste) or a sheet thereof. And the flexible cable 39 is attached to the actuator unit. Since this non-conductive adhesive does not contain conductive particles, it is possible to join the element-side terminal and the wiring-side terminal while preventing shorting between adjacent terminals even when the distance between adjacent terminals is relatively narrow. It is. Therefore, it is possible to cope with the increase in density of the terminals. One end of the flexible cable 39 is inserted into the space 44 of the unit case 26 and the wiring space 38 of the protective substrate 24. The one side wiring terminal 53 is connected to the corresponding element electrode terminal 48, 51 on the actuator unit side. Ru.

  Here, in the recording head 3 in the present embodiment, in order to meet the demand for downsizing, the head units 16 are also miniaturized. Therefore, the members constituting the head unit 16 are also miniaturized. With regard to the protective substrate 24 which is one of the constituent members, the wiring empty portion 38 is also as narrow as possible within a range in which one end portion of the flexible cable 39 inserted into the wiring empty portion 38 can be inserted. It is a space. Furthermore, with the increase in the number of nozzles and the increase in density, the terminals constituting the terminal portion are also arranged with high density, and the distance between the terminals is narrowed. Therefore, at the time of wiring work, it is necessary to bond the wiring terminals 53 and the element electrode terminals 48 and 51 with high accuracy in a narrow space. In such a case, the thickness of the solder resist which covers the portions other than the terminals in a general COF or other flexible cable affects the wiring workability and the like. That is, although the thickness of the solder resist is, for example, about 0.2 mm, when the wiring operation is performed in the above relatively narrow wiring space, a member in which the solder resist defines the wiring space (in this embodiment) In contact with the protective substrate 24), there is a possibility that bonding position deviation of the terminals may occur.

  In view of the above, in the recording head 3 according to the present invention, the exposed portion 58 not covered with the solder resist 56 in the range including the wiring terminal 53 at one end of the flexible cable 39 (the second portion in the present invention) Equivalent) is provided. The exposed portion 58 is at least outside the upper opening (the opening on the side where the flexible cable is inserted) of the wiring empty portion 38 in the protective substrate 24 in the state where the wiring terminal 53 and the element electrode terminals 48 and 51 are connected. It is provided up to the position of. That is, the boundary between the exposed portion 58 and the solder resist 56 (BL2 in FIG. 6) is configured to be located outside the upper opening of the wiring empty portion 38 in the protective substrate 24 (the other end side of the flexible cable) ing. More specifically, the distance d from the bending line BL1 on one end side of the flexible cable 39 to the boundary line BL2 between the exposed portion 58 and the solder resist 56 is at least at the protective substrate 24 while taking into consideration the application variation of the solder resist 56. It is set to be longer than the height H (see FIG. 4). According to this configuration, since the solder resist 36 is not provided in the range where the flexible cable 39 is inserted into the wiring space 38, the thickness of the insertion range can be reduced. As a result, the wiring operation in the relatively narrow wiring space 38 is facilitated, and the solder resist 39 contacts the member (protective substrate 24) that defines the wiring space, resulting in the positional deviation of bonding between the terminals. Is suppressed.

  However, when the piezoelectric element 35 is actually driven, when the exposed portion 58 of the flexible cable 39 contacts the conductive protection substrate 24, there is a possibility that a short circuit will occur between the two. For this reason, in the recording head 3 according to the present invention, the protection area 24 covers the bonding area of at least the wiring terminals 53 and the element electrode terminals 48 and 51 in the wiring space 38 in the wiring space 38. The insulating filler 60 is filled in a state where the and the exposed portion 58 do not contact with each other. In the present embodiment, the inside of the wiring space 38 is entirely filled with the filler 60. As the filler 60, a nonconductive resin such as an adhesive is used. Since the posture of the flexible cable 39 is fixed by the filler 60, the exposed portion 58 of the flexible cable 39 is prevented from shorting by coming into contact with the protective substrate 24 made of a silicon single crystal substrate. Further, since the bonding portion between the wiring terminal portion 53 and the element electrode terminals 48 and 51 is covered and reinforced by the filler 60, contact failure and the like are reduced. In order to prevent the short circuit between the exposed portion 58 and the protective substrate 24 more surely, the filler 60 is expanded to a position further above the opening of the wiring empty portion 38 (the other end side of the flexible cable 39). It is desirable to cover the solder resist 56 and cover the entire exposed portion 58 with the filler 60.

In the above-mentioned embodiment, although piezoelectric element 35 was illustrated as pressure generating means concerning the present invention, it is not restricted to this. For example, the present invention is suitable also in the composition which joins the terminal area and wiring terminal area of other actuators, such as a heating element and an electrostatic actuator.
In the above, the ink jet recording head 3 which is a type of liquid jet head has been described as an example, but the present invention relates to the wiring terminal of the wiring member in the wiring space surrounded by the conductive structure. The present invention can also be applied to other liquid jet heads configured such that the element terminals of the pressure generating means are wired. For example, a color material jet head used to manufacture a color filter such as a liquid crystal display, an electrode material jet head used to form an electrode such as an organic EL (Electro Luminescence) display, an FED (planar light emitting display), a biochip The present invention can also be applied to a bio-organic matter jet head or the like used for the production of.

  DESCRIPTION OF SYMBOLS 1 ... Printer, 3 ... Recording head, 16 ... Head unit, 23 ... Flow path board | substrate, 24 ... Protection board, 27 ... Nozzle, 30 ... Elastic film, 31 ... Pressure chamber, 35 ... Piezoelectric element, 39 ... Flexible cable, 46 common element electrode 47 individual element electrode 48 individual element electrode terminal 49 common element electrode portion 51 common element electrode terminal 52 control IC 53 one end side wiring terminal 54 other end side Wiring terminals, 55: Electrode wiring, 56: Solder resist, 58: Exposed portion, 60: Filler

Claims (6)

Pressure generating means for causing pressure fluctuation in the liquid in the pressure chamber by applying a drive voltage and for ejecting the liquid from a nozzle connected to the pressure chamber;
A substrate containing the pressure generating means;
A wiring member for supplying the drive voltage to the pressure generating means;
Equipped with
A first terminal portion of the pressure generating means is disposed in a wiring empty portion provided in the base material, and a second terminal portion on one end side of the wiring member is electrically connected to the first terminal portion. A liquid jet head,
The wiring member has a first portion covered by an insulating film and a second portion not covered by the insulating film.
The second portion includes the second terminal portion, and a position outside the opening on the wiring member insertion side of the wiring empty portion from the connection portion between the second terminal portion and the first terminal portion. substantially extend perpendicular to the bottom surface of the wiring hollow portion to,
The base material and the second portion are in contact with the wiring empty portion in a state of covering the bonding portion between the first terminal portion and the second terminal portion in the wiring empty portion. in the absence, the liquid jet head fillers having an electrical insulation property is characterized that you have been filled.   2. The liquid jet head according to claim 1, wherein the filler reaches the first portion outside the opening of the wiring space and covers the entire surface of the second portion. 3.   The liquid jet head according to claim 1, wherein the first terminal portion and the second terminal portion are connected by a non-conductive adhesive.   The liquid jet head according to any one of claims 1 to 3, wherein the substrate is made of a silicon single crystal substrate. The wiring member is bent at the second portion in the wiring space , and the second terminal portion is substantially parallel to the bottom surface of the wiring space .
The bending line of the bending of the wiring member and the boundary between the first portion and the second portion are longer than the plate thickness of the base in the direction in which the base opens the wiring empty portion. The liquid jet head according to any one of claims 1 to 4, which is separated over the entire width of the wiring member. A liquid ejecting apparatus comprising the liquid ejecting head according to any one of claims 1 to 5.

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