JP2008213277A - Method for manufacturing liquid jet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a liquid jet head simplifying a manufacturing process and reducing the manufacturing cost. <P>SOLUTION: This manufacturing method comprises a preliminary accommodation process of accommodating a piezoelectric element unit 18 into a housing section of a case head 20 without fixing it, a transfer process of transferring an adhesive 30 on a coating table to a tip face of a piezoelectric element 17 and the end face of the case head 20 by a procedure in which after the case head 20 is lowered at a prescribed speed in the vertical direction until the end face of the case head 20 is brought into contact with the adhesive on the coating table, the case head 20 is raised in the vertical direction, the surface of the coating table being coated with the adhesive with a prescribed thickness, a bonding process of bonding the case head 20 with a fluid channel unit 16 by bringing the fluid channel unit 16 into contact with the end face of the case head 20 and concurrently bonding the tip face of the piezoelectric element 17 with a diaphragm 15, and a fixing process of fixing a fixing substrate 35 of the piezoelectric element unit 18 to the case head 20 by injecting an adhesive 39 into a gap therebetween. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid jet head that discharges droplets by driving a piezoelectric element, and more particularly, to a method for manufacturing an ink jet recording head that discharges ink droplets.

  As a typical example of a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from nozzle openings using pressure generated by displacement of a piezoelectric element is known. Specifically, a flow path unit having a pressure generation chamber communicating with the nozzle opening and having a flow path forming plate and a vibration plate provided on one side thereof, and a support substrate provided corresponding to each pressure generation chamber There is known one having a piezoelectric element (piezoelectric vibrator) fixed to the head and a case head (base) having a storage chamber for storing the piezoelectric element (see, for example, Patent Document 1).

JP 2004-74740 A

  The flow path unit constituting such an ink jet recording head, and the piezoelectric element and the case head fixed to the support substrate are generally joined by an adhesive. As a manufacturing method thereof, first, an adhesive is applied to the end surface of the case head on the flow path unit side, for example, by film transfer or the like, and the case head and the flow path unit are joined. Thereafter, an adhesive is applied to the front end surface of the piezoelectric element, for example, by film transfer or the like, and the piezoelectric element is accommodated in the housing portion of the case head to join the front end surface of the piezoelectric element and the diaphragm of the flow path unit. .

  Since the case head and the piezoelectric element are processed in this way, the manufacturing process is extremely complicated, and an apparatus and personnel are required for each step of applying an adhesive to the case head and the piezoelectric element. Therefore, there exists a problem that manufacturing cost will become high.

  Such a problem exists not only in a method for manufacturing an ink jet recording head that discharges ink droplets but also in a method for manufacturing a liquid ejecting head that discharges other droplets.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a method of manufacturing a liquid jet head that can simplify the manufacturing process and reduce the manufacturing cost.

The present invention that solves the above-mentioned problems exposes a piezoelectric element unit that includes a piezoelectric element forming member on which a plurality of piezoelectric elements are formed and a fixed substrate to which the piezoelectric element forming member is fixed, and an end face of the piezoelectric element. A case head in which the piezoelectric element unit is accommodated in a state where the piezoelectric element unit is accommodated and the fixing substrate is fixed by an adhesive; and an end face of the case head where the tip end face of the piezoelectric element is exposed; A liquid jet head manufacturing method comprising: a flow path unit including a flow path forming substrate having a vibration plate to which a tip surface of a piezoelectric element is fixed and a plurality of pressure generation chambers communicating with nozzle openings. The piezoelectric element unit is inserted into the housing portion of the case head so that the front end surface of the piezoelectric element protrudes outward from the end surface of the case head, and in the insertion direction. The case head is arranged such that the piezoelectric element unit is movably accommodated in the accommodating portion, and the tip surface of the piezoelectric element is opposed to a coating base having an adhesive coated on the surface with a predetermined thickness. Then, after lowering the case head at a predetermined speed in the vertical direction until the end surface of the case head contacts the adhesive on the coating table, the case head is raised at the predetermined speed in the vertical direction, A transfer step of transferring the adhesive on the coating table to the tip surface of the piezoelectric element and the end surface of the case head; and the case head and the flow channel unit by bringing the flow channel unit into contact with the end surface of the case head. And bonding the tip of the piezoelectric element onto the diaphragm, and filling the gap between the fixed substrate and the case head of the piezoelectric element unit with an adhesive. In the method of manufacturing a liquid jet head, characterized by comprising a fixing step of fixing both Te.
In the present invention, the adhesive can be simultaneously applied to the end face of the case head on the flow path unit side and the front end face of the piezoelectric element, and the case head and the piezoelectric element can be simultaneously applied to the flow path unit with high accuracy. Can be joined. Therefore, the manufacturing process is reduced, and the apparatus and personnel can be reduced accordingly. Therefore, the manufacturing cost can be greatly reduced.

  Here, it is preferable that the surface of the flow path unit with which the case head abuts and the surface with which the tip surface of the piezoelectric element abuts are in the same plane. As a result, the tip surface of the piezoelectric element protrudes outward from the tip surface of the case head in the temporary housing step, so that the tip surface of the piezoelectric element and the end surface of the case head can be reliably and satisfactorily transferred in the transfer step. The adhesive can be transferred.

  Moreover, it is preferable to pressurize the case head and the piezoelectric element unit to the application table side with a predetermined pressure when transferring the adhesive. Thereby, an adhesive agent can be more reliably and satisfactorily transferred to the case head and the tip surface of the piezoelectric element.

  Moreover, it is preferable that the pressure which pressurizes the said piezoelectric element unit is smaller than the pressure which pressurizes the said case head. Thereby, it is possible to prevent the piezoelectric element from being deformed in the transfer process. Therefore, it is possible to prevent the piezoelectric element from being cracked and the transfer failure from occurring due to the deformation.

  Moreover, it is preferable to apply | coat the said adhesive agent on the resin film removably provided in the surface of the said coating stand. This eliminates the need for a process such as wiping off the adhesive on the coating table, thereby further simplifying the manufacturing process.

  Further, when the adhesive is applied on the resin film, the adhesive is transferred to the end surface of the case head and the front end surface of the piezoelectric element in a state where the resin film is adsorbed and held on the application table. Is preferred. As a result, the adhesive is favorably peeled from the resin film and transferred to the end face of the case head and the tip face of the piezoelectric element.

Hereinafter, the present invention will be described in detail based on embodiments.
FIG. 1 is a cross-sectional view showing an example of an ink jet recording head. As shown in the drawing, an ink jet recording head 10 includes a flow path forming substrate 12 having a plurality of pressure generation chambers 11, a nozzle plate 14 having a plurality of nozzle openings 13 communicating with each pressure generation chamber 11, and The flow path forming substrate 12 includes a flow path unit 16 including a vibration plate 15 provided on a surface opposite to the nozzle plate 14. Furthermore, a piezoelectric element unit 18 having a piezoelectric element 17 provided in a region corresponding to each pressure generating chamber 11 on the vibration plate 15, and an accommodating portion 19 that is fixed on the vibration plate 15 and accommodates the piezoelectric element unit 18. And a case head 20.

  In the flow path forming substrate 12, a plurality of pressure generating chambers 11 are partitioned by a partition wall 21 and arranged in parallel in the width direction on the surface layer portion on one surface side thereof. For example, in the present embodiment, a plurality of pressure generation chambers 11 are arranged in parallel on the flow path forming substrate 12, and ink is supplied to each pressure generation chamber 11 outside the row of each pressure generation chamber 11. A reservoir 22 is provided so as to penetrate the flow path forming substrate 12 in the thickness direction. Each pressure generation chamber 11 and the reservoir 22 communicate with each other via an ink supply path 23. In this embodiment, the ink supply path 23 is formed with a width narrower than that of the pressure generation chamber 11, and plays a role of maintaining a constant flow path resistance of ink flowing from the reservoir 22 into the pressure generation chamber 11. Further, a nozzle communication hole 24 penetrating the flow path forming substrate 12 is formed on the end side of the pressure generating chamber 11 opposite to the reservoir 22. In this embodiment, the flow path forming substrate 12 is made of a silicon single crystal substrate, and the pressure generating chamber 11 and the like provided in the flow path forming substrate 12 are formed by etching the flow path forming substrate 12. ing.

  A nozzle plate 14 in which nozzle openings 13 are formed is bonded to one surface side of the flow path forming substrate 12 via an adhesive or a heat welding film, and each nozzle opening 13 is provided in the flow path forming substrate 12. The pressure generating chambers 11 communicate with each other through the nozzle communication holes 24. Further, a diaphragm 15 is bonded to the other surface side of the flow path forming substrate 12, that is, the opening surface side of the pressure generating chamber 11, and each pressure generating chamber 11 is sealed by the diaphragm 15.

  The diaphragm 15 is formed of a composite plate of, for example, an elastic film 25 made of an elastic member such as a resin film and a support plate 26 made of, for example, a metal material that supports the elastic film 25 and is elastic. The film 25 side is bonded to the flow path forming substrate 12. For example, in the present embodiment, the elastic film 25 is made of a PPS (polyphenylene sulfide) film having a thickness of about several μm, and the support plate 26 is made of a stainless steel plate (SUS) having a thickness of about several tens of μm. In addition, an island portion 27 with which the tip end portion of the piezoelectric element 17 abuts is provided in a region of the vibration plate 15 facing each pressure generation chamber 11. That is, a thin portion 28 having a thickness smaller than that of the other regions is formed in a region of the vibration plate 15 facing the peripheral portion of each pressure generating chamber 11, and island portions 27 are provided inside the thin portion 28. ing. Further, in the present embodiment, in the region facing the reservoir 22 of the vibration plate 15, as in the case of the thin portion 28, a compliance portion 29 that is substantially composed only of an elastic film is provided by removing the support plate 26 by etching. It has been. The compliance portion 29 absorbs the pressure change by the deformation of the elastic film 25 of the compliance portion 29 when the pressure change in the reservoir 22 occurs, and always keeps the pressure in the reservoir 22 constant. Fulfill.

  Each piezoelectric element 17 constituting the piezoelectric element unit 18 is in contact with the island portion 27 of the diaphragm 15 at the tip of its active region. Actually, the tip surface of each piezoelectric element 17 is bonded to the island portion 27 by the adhesive 30.

  Here, in this embodiment, the piezoelectric element 17 which is a pressure generating means for generating a pressure for ejecting ink droplets into the pressure generating chamber 11 is integrally formed in one piezoelectric element unit 18. That is, a piezoelectric element forming member 34 in which the piezoelectric material 31 and the electrode forming materials 32 and 33 are vertically sandwiched and laminated is formed to correspond to each pressure generating chamber 11. Each piezoelectric element 17 is formed by cutting on the comb teeth. That is, in the present embodiment, the plurality of piezoelectric elements 17 are integrally formed. An inactive region that does not contribute to the vibration of the piezoelectric element 17 (piezoelectric element forming member 34), that is, the base end side of the piezoelectric element 17 is fixed to the fixed substrate 35. In the vicinity of the base end portion of the piezoelectric element 17, a circuit board 37 having a wiring 36 for supplying a signal for driving each piezoelectric element 17 is connected to the surface opposite to the fixed board 35. In the embodiment, the piezoelectric element unit 18 is constituted by the piezoelectric element 17 (piezoelectric element forming member 34), the fixed substrate 35, and the circuit substrate 37.

  Such a piezoelectric element unit 18 is fixed in a state where the distal end portion of the piezoelectric element 17 is in contact with the island portion 27 of the diaphragm 15 as described above. For example, in this embodiment, the case head 20 is fixed on the diaphragm 15 as described above, and the piezoelectric element unit 18 is accommodated in the accommodating portion 19 of the case head 20 and the piezoelectric element 17 is fixed. The fixed substrate 35 thus fixed is fixed to the case head 20 on the side opposite to the piezoelectric element 17. Specifically, a stepped portion 38 is provided in the accommodating portion 19 of the case head 20, and the fixed substrate 35 is bonded to the stepped portion 38 of the case head 20 with an adhesive 39.

  Further, a wiring board 41 provided with a plurality of conductive pads 40 to which the respective wirings 36 of the circuit board 37 are connected is fixed on the case head 20, and the housing portion 19 of the case head 20 is connected to the wiring board 41. 41 is substantially blocked. The wiring board 41 is formed with a slit-like opening 42 in a region facing the housing part 19 of the case head 20, and the circuit board 37 is drawn out of the housing part 19 from the opening 42 of the wiring board 41. It is.

  Moreover, the circuit board 37 which comprises the piezoelectric element unit 18 consists of chip-on-film (COF) in which the drive IC (not shown) for driving the piezoelectric element 17 was mounted in this embodiment, for example. Each wiring 36 of the circuit board 37 is connected to the electrode forming materials 32 and 33 constituting the piezoelectric element 17 by, for example, solder, anisotropic conductive material, or the like on the base end side. On the other hand, each wiring 36 is joined to each conductive pad 40 of the wiring board 41 on the tip side. Specifically, each wiring 36 is connected to the wiring board 41 in a state in which the tip of the circuit board 37 drawn out of the housing part 19 from the opening 42 of the wiring board 41 is bent along the surface of the wiring board 41. The conductive pads 40 are joined to each other.

  In such an ink jet recording head 10, when ejecting ink droplets, the volume of each pressure generating chamber 11 is changed by deformation of the piezoelectric element 17 and the vibration plate 15 to eject ink droplets from a predetermined nozzle opening 13. It is designed to be discharged. Specifically, when ink is supplied to the reservoir 22 from an ink cartridge (not shown), the ink is distributed to each pressure generating chamber 11 via the ink supply path 23. Actually, the piezoelectric element 17 is contracted by applying a voltage to the piezoelectric element 17. As a result, the diaphragm 15 is deformed together with the piezoelectric element 17 to expand the volume of the pressure generating chamber 11, and ink is drawn into the pressure generating chamber 11. After the ink is filled up to the nozzle opening 13, the voltage applied to the electrode forming materials 32 and 33 of the piezoelectric element 17 is released according to a recording signal supplied via the wiring board. As a result, the piezoelectric element 17 is stretched and expanded to return to the original state, and the diaphragm 15 is also displaced to return to the original state. As a result, the volume of the pressure generation chamber 11 contracts, the pressure in the pressure generation chamber 11 increases, and ink droplets are ejected from the nozzle openings 13.

  Hereinafter, a method for manufacturing such an ink jet recording head, in particular, a method for assembling the flow path unit 16, the piezoelectric element unit 18, and the case head 20, will be described with reference to FIGS. 2 to 4 are cross-sectional views showing the manufacturing process of the ink jet recording head.

  First, the piezoelectric element unit 18 and the flow path unit 16 are formed. Specifically, although not shown, the piezoelectric element forming member 34 is bonded to the fixed substrate 35, and the piezoelectric element forming member 34 is cut into comb teeth corresponding to each pressure generating chamber 11 as described above. The element unit 18 is formed. On the other hand, the flow path unit 16 is formed by joining the nozzle plate 14 and the vibration plate 15 to the flow path forming substrate 12 in which the pressure generating chambers 11 and the like are formed.

  Then, the piezoelectric element unit 18, the flow path unit 16, and the case head 20 are assembled. As an assembling process, first, as shown in FIG. 2A, the piezoelectric element unit 18 is inserted into the housing portion 19 of the case head 20 and temporarily housed. In addition, temporary accommodation is a state in which the piezoelectric element unit 18 is accommodated in the accommodating portion 19 of the case head 20 but is not fixed by an adhesive. For this reason, in a state where the piezoelectric element unit 18 is temporarily accommodated in the accommodating portion 19, the piezoelectric element unit 18 is movable at least in the insertion direction (vertical direction in the drawing) to the accommodating portion 19. Further, in the temporarily housed state, as shown in FIG. 2 (b), the fixed substrate 35 of the piezoelectric element unit 18 is in direct contact with the stepped portion 38 without an adhesive. 17a protrudes outward from the end surface (end surface on the side where the flow path unit 16 is joined) 20a of the case head 20 by the thickness of the adhesive.

  Next, an adhesive is transferred (applied) to the front end surface 17 a of the piezoelectric element 17 constituting the piezoelectric element unit 18 and the end surface 20 a of the case head 20. Specifically, first, as shown in FIG. 3A, the case head 20 in which the piezoelectric element unit 18 is temporarily accommodated is supported by a predetermined support jig 50, and the piezoelectric element unit 18 and the case head 20, It arrange | positions so that the coating stand 51 with which the adhesive agent 30 for joining the flow path unit 16 was apply | coated may be opposed.

  Here, in the present embodiment, a resin film 52 such as a PET film is placed on the coating table 51, and the adhesive 30 is applied on the resin film 52 with a predetermined thickness. The method for applying the adhesive 30 onto the resin film 52 is not particularly limited. For example, a predetermined amount of the adhesive 30 is dropped onto the resin film 52 and the dropped adhesive 30 is smoothed with a squeegee or the like. What is necessary is just thickness.

  In the present embodiment, the resin film 52 is detachably held on the coating table 51. For example, in the present embodiment, the coating table 51 is provided with a plurality of through holes 53, and these through holes 53 are connected to a suction device (not shown) such as a vacuum pump, for example. The resin film 52 is sucked and held on the coating table 51 by being sucked by the suction device through the plurality of through holes 53.

  Next, as shown in FIG. 3B, the support jig 50 that supports the case head 20 is lowered toward the coating table 51. That is, the case head 20 is lowered in the vertical direction, and the tip surface 17 a of the piezoelectric element 17 and the end surface 20 a of the case head 20 are pressed against the adhesive 30.

  Here, as described above, the front end surface 17 a of the piezoelectric element 17 protrudes outward from the end surface 20 a of the case head 20. For this reason, when the case head 20 is lowered, the tip surface 17 a of the piezoelectric element 17 is first pressed against the adhesive 30. Thereafter, only the case head 20 is further lowered, and the end surface 20 a of the case head 20 is pressed against the adhesive 30. As described above, the case head 20 in which the piezoelectric element unit 18 is temporarily accommodated is lowered toward the adhesive 30, thereby pressing the front end surface 17 a of the piezoelectric element 17 and the end surface 20 a of the case head 20 against the adhesive 30 sequentially. be able to.

  The descending speed of the support jig 50 that supports the case head 20 is not particularly limited, but is preferably a relatively slow speed. Thereby, it is possible to prevent the piezoelectric element 17 from being deformed and broken by an impact abutting against the adhesive 30.

  Thereafter, as shown in FIG. 4A, the support jig 50 that supports the case head 20 is raised in the vertical direction. As a result, the adhesive 30 on the resin film 52 is peeled off and simultaneously transferred to the front end surface 17a of the piezoelectric element 17 and the end surface 20a of the case head 20 with a predetermined thickness. When the support jig 50 is raised, the tip surface 17a of the piezoelectric element 17 is in a state of protruding outward from the end surface 20a of the case head 20 as described above.

  The ascending speed of the support jig 50 does not need to be as slow as the descending speed, but is preferably relatively low. Thereby, the uneven transfer of the adhesive 30 can be prevented. In this embodiment, since the resin film 52 is sucked and held on the coating table 51 as described above, the adhesive 30 is peeled off from the resin film 52 when the support jig 50 is raised. The This can also prevent uneven transfer of the adhesive 30.

  When the front end surface 17a of the piezoelectric element 17 and the end surface 20a of the case head 20 are pressed against the adhesive 30, the front end surface 17a of the piezoelectric element 17 and the end surface 20a of the case head 20 are connected to the piezoelectric element unit 18 or the case head. 20 may be pressed against the adhesive 30 by its own weight, but it is preferable to pressurize the piezoelectric element unit 18 and the case head 20 toward the application table 51 with a predetermined pressure. As a result, the adhesive 30 can be satisfactorily transferred between the front end surface 17 a of the piezoelectric element 17 and the end surface 20 a of the case head 20.

  Since the end surface 20a of the case head 20 has a relatively large area, the thickness of the adhesive transferred varies depending on the pressure difference. Therefore, by pressing the case head 20 with a constant pressure, the adhesive 30 can be transferred to the end surface 20a of the case head 20 with a constant thickness. On the other hand, pressurizing the piezoelectric element unit 18 prevents the tip end surface 17a of the piezoelectric element 17 from inclining against the adhesive 30 and allows the adhesive 30 to be always transferred with a uniform thickness. it can. Note that since the tip surface 17a of the piezoelectric element 17 has a relatively small area, there is almost no change in the thickness of the adhesive due to a difference in pressure.

  Further, when the piezoelectric element unit 18 and the case head 20 are respectively pressurized at a predetermined pressure toward the coating stage 51, the pressure for pressing the piezoelectric element unit 18 is preferably smaller than the pressure for pressing the case head 20. . Thereby, it is possible to prevent the piezoelectric element from being deformed in the transfer process, and it is possible to prevent the piezoelectric element 17 accompanying the deformation and the occurrence of transfer failure.

  Next, as shown in FIG. 4B, the flow path unit 16 is brought into contact with the end surface 20 a of the case head 20 to cure the adhesive 30. Thereby, the case head 20 and the flow path unit 16 are joined, and the piezoelectric element unit 18 and the flow path unit are joined by the adhesive 30. When performing such a joining process, the piezoelectric element unit 18 remains temporarily accommodated in the accommodating portion 19 of the case head 20 as described above. For this reason, the front end surface 17a of the piezoelectric element 17 protrudes from the end surface 20a of the case head 20 as described above. Therefore, when the flow path unit 16 is brought into contact with the end surface 20a of the case head 20, the island portion 27 of the flow path unit 16 is first brought into contact with the front end face 17a of the piezoelectric element 17, and then the piezoelectric element unit 18 flows. By moving together with the path unit 16, the flow path unit 16 contacts the end surface 20 a of the case head 20. In this state, the flow path unit 16 is bonded simultaneously with the case head 20 and the piezoelectric element unit 18 by curing the adhesive 30.

  After the case head 20 and the piezoelectric element unit 18 and the flow path unit 16 are joined in this way, an adhesive 39 is applied to the gap between the fixed substrate 35 of the piezoelectric element unit 18 and the case head 20 as shown in FIG. Pour and cure. As described above, when the flow path unit 16 is brought into contact with the case head 20, the piezoelectric element unit 18 moves together with the flow path unit 16, so that the stepped portion between the fixed substrate 35 of the piezoelectric element unit 18 and the case head 20. A space is formed between 38 and 38. Then, the adhesive 39 is poured into this space and cured. Thereby, the fixed substrate 35 of the piezoelectric element unit 18 is fixed to the case head 20, and the assembly of the flow path unit 16, the piezoelectric element unit 18, and the case head 20 is completed.

  As described above, in the ink jet recording head manufacturing method of the present invention, the adhesive can be simultaneously transferred (applied) to the case head and the piezoelectric element unit. Furthermore, the case head and the piezoelectric element unit can be bonded to the flow path unit 16 at the same time. Therefore, the manufacturing process can be greatly reduced. In addition, the number of devices and personnel can be reduced as the number of manufacturing processes is reduced. Therefore, the manufacturing cost can be greatly reduced.

  Further, when the adhesive 30 is transferred to the case head 20 and the piezoelectric element unit 18, the adhesive remaining on the resin film is discarded, but it is bonded to two members in one step as in this embodiment. By transferring the agent, the amount of adhesive to be discarded can be greatly reduced.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiments, the ink jet recording head has been described as an example of the liquid ejecting head. However, the present invention is widely intended for all liquid ejecting heads and ejects liquids other than ink. Of course, the present invention can also be applied to a method of manufacturing a liquid jet head. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (field emission displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

FIG. 3 is a cross-sectional view of the recording head according to the first embodiment. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Inkjet recording head, 11 Pressure generation chamber, 12 Flow path formation board | substrate, 13 Nozzle opening, 14 Nozzle plate, 15 Diaphragm, 16 Flow path unit, 17 Piezoelectric element, 18 Piezoelectric element unit, 19 Accommodating part, 20 Case head 21 partition wall, 22 reservoir, 23 ink supply path, 24 nozzle communication hole, 25 elastic film, 26 support plate, 27 island part, 28 thin part, 29 compliance part, 30 adhesive, 31 piezoelectric material, 32, 33 electrode formation Material, 34 Piezoelectric element forming member, 35 Fixed substrate, 36 Wiring, 37 Circuit board, 38 Stepped portion, 39 Adhesive, 40 Conductive pad, 41 Wiring substrate, 42 Opening, 50 Support jig, 51 Coating table, 52 Resin Film, 53 through hole

Claims (6)

A piezoelectric element unit comprising a piezoelectric element forming member on which a plurality of piezoelectric elements are formed and a fixed substrate to which the piezoelectric element forming member is fixed; and the piezoelectric element unit with the tip surface of the piezoelectric element exposed A case head having a storage chamber and a fixing substrate fixed by an adhesive is joined to an end surface of the case head where the front end surface of the piezoelectric element is exposed, and the front end surface of the piezoelectric element is fixed. A liquid jet head manufacturing method comprising: a flow path unit including a flow path forming substrate having a vibration plate and provided with a plurality of pressure generation chambers communicating with nozzle openings.
The piezoelectric element unit is inserted into the housing portion of the case head, the tip surface of the piezoelectric element protrudes outward from the end surface of the case head, and the piezoelectric element unit is moved to the housing portion so as to be movable in the insertion direction. A temporary housing process for housing;
The case head is arranged so that the front end surfaces of the piezoelectric elements face each other on a coating table on which adhesive is applied to a predetermined thickness until the end surface of the case head comes into contact with the adhesive on the coating table. After the case head is lowered in the vertical direction at a predetermined speed, the case head is moved up in the vertical direction at a predetermined speed, whereby the tip surface of the piezoelectric element and the end surface of the case head are bonded to the application table. A transfer process for transferring the agent;
A joining step of joining the case head and the flow path unit by bringing the flow path unit into contact with an end face of the case head, and joining the tip end face of the piezoelectric element on the diaphragm;
A fixing step of filling the gap between the fixed substrate of the piezoelectric element unit and the case head with an adhesive and fixing both;
A method of manufacturing a liquid jet head, comprising:   2. The method of manufacturing a liquid jet head according to claim 1, wherein a surface of the flow path unit with which the case head abuts and a surface with which the tip surface of the piezoelectric element abuts are in the same plane.   3. The method of manufacturing a liquid jet head according to claim 1, wherein when the adhesive is transferred, the case head and the piezoelectric element unit are pressed against the coating table with a predetermined pressure.   The method for manufacturing a liquid jet head according to claim 3, wherein a pressure for pressurizing the piezoelectric element unit is smaller than a pressure for pressurizing the case head.   The method of manufacturing a liquid jet head according to claim 1, wherein the adhesive is applied onto a resin film that is detachably provided on a surface of the application table.   The liquid ejecting head according to claim 5, wherein an adhesive is transferred to an end surface of the case head and a front end surface of the piezoelectric element in a state where the resin film is adsorbed and held on the coating table. Method.

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