JP6585529B2 - 部品搭載方法および部品実装装置 - Google Patents

部品搭載方法および部品実装装置 Download PDF

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Publication number
JP6585529B2
JP6585529B2 JP2016052282A JP2016052282A JP6585529B2 JP 6585529 B2 JP6585529 B2 JP 6585529B2 JP 2016052282 A JP2016052282 A JP 2016052282A JP 2016052282 A JP2016052282 A JP 2016052282A JP 6585529 B2 JP6585529 B2 JP 6585529B2
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Japan
Prior art keywords
mark
data acquisition
coordinate system
component mounting
parameter
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JP2016052282A
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English (en)
Japanese (ja)
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JP2017168619A (ja
JP2017168619A5 (enExample
Inventor
鈴木　康弘
康弘 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2016052282A priority Critical patent/JP6585529B2/ja
Priority to KR1020160130682A priority patent/KR101960693B1/ko
Publication of JP2017168619A publication Critical patent/JP2017168619A/ja
Publication of JP2017168619A5 publication Critical patent/JP2017168619A5/ja
Application granted granted Critical
Publication of JP6585529B2 publication Critical patent/JP6585529B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
JP2016052282A 2016-03-16 2016-03-16 部品搭載方法および部品実装装置 Active JP6585529B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016052282A JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置
KR1020160130682A KR101960693B1 (ko) 2016-03-16 2016-10-10 부품 탑재 방법 및 부품 실장 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016052282A JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置

Publications (3)

Publication Number Publication Date
JP2017168619A JP2017168619A (ja) 2017-09-21
JP2017168619A5 JP2017168619A5 (enExample) 2018-11-08
JP6585529B2 true JP6585529B2 (ja) 2019-10-02

Family

ID=59913610

Family Applications (1)

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JP2016052282A Active JP6585529B2 (ja) 2016-03-16 2016-03-16 部品搭載方法および部品実装装置

Country Status (2)

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JP (1) JP6585529B2 (enExample)
KR (1) KR101960693B1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202003761XA (en) * 2017-08-28 2020-05-28 Shinkawa Kk Device and method for linearly moving movable body relative to object
JP7280741B2 (ja) * 2019-04-11 2023-05-24 ヤマハ発動機株式会社 基板作業装置
JP7346358B2 (ja) * 2020-06-08 2023-09-19 ヤマハ発動機株式会社 部品実装方法及び部品実装装置
CN112346266B (zh) * 2020-10-27 2023-01-10 合肥欣奕华智能机器股份有限公司 一种进行器件绑定的方法和装置及设备
CN118313344B (zh) * 2024-06-12 2024-08-06 东莞市通科电子有限公司 一种三极管及其封装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3253218B2 (ja) * 1994-06-28 2002-02-04 ヤマハ発動機株式会社 実装機の位置補正装置
JP4860366B2 (ja) * 2006-06-21 2012-01-25 Ｊｕｋｉ株式会社 表面実装装置
JP4648964B2 (ja) * 2008-06-04 2011-03-09 ヤマハ発動機株式会社 マーク認識システム、マーク認識方法および表面実装機
JP6055301B2 (ja) * 2012-12-19 2016-12-27 ヤマハ発動機株式会社 表面実装機

Also Published As

Publication number Publication date
KR20170107879A (ko) 2017-09-26
JP2017168619A (ja) 2017-09-21
KR101960693B1 (ko) 2019-03-21

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