JP6573834B2 - メモリを有する集積回路デバイスおよび集積回路デバイスにメモリを実装する方法 - Google Patents

メモリを有する集積回路デバイスおよび集積回路デバイスにメモリを実装する方法 Download PDF

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JP6573834B2
JP6573834B2 JP2015561680A JP2015561680A JP6573834B2 JP 6573834 B2 JP6573834 B2 JP 6573834B2 JP 2015561680 A JP2015561680 A JP 2015561680A JP 2015561680 A JP2015561680 A JP 2015561680A JP 6573834 B2 JP6573834 B2 JP 6573834B2
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memory
integrated circuit
programmable
block
circuit device
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JP2016516331A5 (enExample
JP2016516331A (ja
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ウー，エフレム・シィ
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Xilinx Inc
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Xilinx Inc
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components
    • H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components
    • H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form
    • H03K19/17748—Structural details of configuration resources
    • H03K19/1776—Structural details of configuration resources for memories

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  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Logic Circuits (AREA)
  • Static Random-Access Memory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2015561680A 2013-03-07 2014-03-06 メモリを有する集積回路デバイスおよび集積回路デバイスにメモリを実装する方法 Active JP6573834B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/789,313 2013-03-07
US13/789,313 US9153292B2 (en) 2013-03-07 2013-03-07 Integrated circuit devices having memory and methods of implementing memory in an integrated circuit device
PCT/US2014/021404 WO2014138479A1 (en) 2013-03-07 2014-03-06 Integrated circuit devices having memory and methods of implementing memory in an integrated circuit device

Publications (3)

Publication Number Publication Date
JP2016516331A JP2016516331A (ja) 2016-06-02
JP2016516331A5 JP2016516331A5 (enExample) 2017-04-27
JP6573834B2 true JP6573834B2 (ja) 2019-09-11

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JP2015561680A Active JP6573834B2 (ja) 2013-03-07 2014-03-06 メモリを有する集積回路デバイスおよび集積回路デバイスにメモリを実装する方法

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US (1) US9153292B2 (enExample)
EP (1) EP2965429B1 (enExample)
JP (1) JP6573834B2 (enExample)
KR (1) KR102178768B1 (enExample)
CN (1) CN105144585B (enExample)
WO (1) WO2014138479A1 (enExample)

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KR102381158B1 (ko) * 2016-08-15 2022-03-30 자일링크스 인코포레이티드 적층형 실리콘 상호 연결(ssi) 기술 통합을 위한 독립형 인터페이스
TW202537391A (zh) 2016-12-14 2025-09-16 成真股份有限公司 標準大宗商品化現場可編程邏輯閘陣列(fpga)積體電路晶片組成之邏輯驅動器
US11625523B2 (en) 2016-12-14 2023-04-11 iCometrue Company Ltd. Logic drive based on standard commodity FPGA IC chips
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US10957679B2 (en) 2017-08-08 2021-03-23 iCometrue Company Ltd. Logic drive based on standardized commodity programmable logic semiconductor IC chips
US10630296B2 (en) * 2017-09-12 2020-04-21 iCometrue Company Ltd. Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
US10079211B1 (en) * 2017-09-28 2018-09-18 Intel Corporation Modular interconnection repair of multi-die package
US10608642B2 (en) 2018-02-01 2020-03-31 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips comprising non-volatile radom access memory cells
US10623000B2 (en) * 2018-02-14 2020-04-14 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips
US10608638B2 (en) 2018-05-24 2020-03-31 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips
US12476637B2 (en) 2018-05-24 2025-11-18 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips
US11309334B2 (en) 2018-09-11 2022-04-19 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
US10892011B2 (en) 2018-09-11 2021-01-12 iCometrue Company Ltd. Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells
US10937762B2 (en) 2018-10-04 2021-03-02 iCometrue Company Ltd. Logic drive based on multichip package using interconnection bridge
US11616046B2 (en) 2018-11-02 2023-03-28 iCometrue Company Ltd. Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip
US11211334B2 (en) 2018-11-18 2021-12-28 iCometrue Company Ltd. Logic drive based on chip scale package comprising standardized commodity programmable logic IC chip and memory IC chip
US10642946B2 (en) * 2018-12-28 2020-05-05 Intel Corporation Modular periphery tile for integrated circuit device
US11169822B2 (en) * 2019-02-14 2021-11-09 Xilinx, Inc. Configuring programmable logic region via programmable network
US10804255B1 (en) * 2019-05-10 2020-10-13 Xilinx, Inc. Circuit for and method of transmitting a signal in an integrated circuit device
US11227838B2 (en) 2019-07-02 2022-01-18 iCometrue Company Ltd. Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits
US10985154B2 (en) 2019-07-02 2021-04-20 iCometrue Company Ltd. Logic drive based on multichip package comprising standard commodity FPGA IC chip with cryptography circuits
US10797037B1 (en) 2019-07-15 2020-10-06 Xilinx, Inc. Integrated circuit device having a plurality of stacked dies
US11887930B2 (en) 2019-08-05 2024-01-30 iCometrue Company Ltd. Vertical interconnect elevator based on through silicon vias
US11637056B2 (en) 2019-09-20 2023-04-25 iCometrue Company Ltd. 3D chip package based on through-silicon-via interconnection elevator
US11600526B2 (en) 2020-01-22 2023-03-07 iCometrue Company Ltd. Chip package based on through-silicon-via connector and silicon interconnection bridge
US12176278B2 (en) 2021-05-30 2024-12-24 iCometrue Company Ltd. 3D chip package based on vertical-through-via connector
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Also Published As

Publication number Publication date
EP2965429B1 (en) 2018-12-26
CN105144585A (zh) 2015-12-09
JP2016516331A (ja) 2016-06-02
US9153292B2 (en) 2015-10-06
KR20150126400A (ko) 2015-11-11
US20140254232A1 (en) 2014-09-11
EP2965429A1 (en) 2016-01-13
CN105144585B (zh) 2018-08-17
KR102178768B1 (ko) 2020-11-13
WO2014138479A1 (en) 2014-09-12

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