JP6573444B2 - Separation adhesive sheet - Google Patents

Description

  The present invention relates to a spacing adhesive sheet.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) is cut into a predetermined shape and a predetermined size and separated into a plurality of semiconductor chips (hereinafter sometimes simply referred to as chips). It has been practiced that the chips are separated from each other and the distance between the chips is increased before being mounted on an object to be mounted such as a lead frame or a substrate.

  As a separation method for widening the distance between chips (pieces), a frame support means (support means) for supporting a wafer (plate-like member) integrated with the frame via a film (adhesive sheet), and a film surface It is known to move the support mechanism (separation table) relative to each other (for example, see Patent Document 1). In such a method of widening the distance between chips, for example, tension in four directions of + X axis direction, -X axis direction, + Y axis direction, and -Y axis direction is applied to the adhesive sheet. When the detection means detects that the predetermined position has been reached, the operation for increasing the interval is completed.

JP 2012-204747 A

  However, in the conventional method as described in Patent Document 1, in addition to the above four directions, as shown in FIG. 2 (C), the adhesive sheet has a composite direction thereof, that is, a + X axis direction and a + Y axis direction. The composite direction CD1, the composite direction CD2 of the + X axis direction and the −Y axis direction, the composite direction CD3 of the −X axis direction and the + Y axis direction, and the composite direction CD4 of the −X axis direction and the −Y axis direction are also tensioned. Is granted. As a result, there is a difference in the distance between the inner chip and the outer chip. However, since such a difference in distance is extremely small, each chip is assumed to have an evenly expanded distance, and is transported based on a position derived by calculation (hereinafter sometimes referred to as a theoretical position). The product is transported by a transporting means such as a device or a pick-up device, and mounted on an object to be mounted to form a product. As a result, the relative positional relationship between the chip and the mounted object in the product may be slightly shifted, the connection position of wire bonding may be shifted, or the positions of the terminals of the chip and the mounted object may be shifted. As a result, they cannot be connected to each other, and the yield of the product is lowered. Such a problem can occur not only in the manufacture of semiconductor devices but also in, for example, dense mechanical parts and fine decorative items.

  An object of the present invention is to prevent the position of each piece from shifting from the theoretical position as much as possible when the interval between a plurality of pieces formed from a plate-like member is widened. The object is to provide a spacing adhesive sheet.

In order to achieve the object, the separation adhesive sheet of the present invention comprises at least a base material and an adhesive layer laminated on one surface of the base material, and is provided with tension in at least three directions. A separating adhesive sheet that widens the interval between a plurality of pieces formed from a plate-like member adhered to the adhesive layer, and has a top portion in at least three locations within the surface of the separating adhesive sheet. And a polygonal surrounding region that can surround the adherend pasting region to which the plate-like member is stuck when the plate-like member is stuck, and the outer edge direction of the spacing adhesive sheet from each of the top portions. has two sides Ru extends, a non-interference notch to prevent tension in the synthesis direction of the tensile direction is applied to the enclosing region, is divided by the non-interference cutout and surrounding region, the with applying tension to the surrounding area And tension zones to be attached to the frame, connecting the tension zones adjacent to each other and a frame pasting area that is affixed to the frame, that adopts the configuration that.
Further, another separation adhesive sheet of the present invention comprises at least a base material and an adhesive layer laminated on one surface of the base material, and is applied with tension in at least three directions. A separation adhesive sheet that widens the interval between a plurality of pieces formed from a plate-like member adhered to a layer, and has a top at least at three locations within the surface of the separation adhesive sheet, A polygonal surrounding region that can surround the adherend pasting region to which the plate-like member is stuck when the plate-like member is stuck, and one piece extending from the top to the outer edge direction of the separating adhesive sheet, respectively. A non-interfering cut that prevents the tension from being applied in the combined direction of each tension direction with respect to the surrounding area, and the non-interfering cut and the surrounding area. A tension region for applying tension, and It employs a configuration in spaced adhesive sheet according to claim Rukoto.

  According to the present invention as described above, since the separating adhesive sheet has a non-interference cut, when the tension is applied to the surrounding region by applying tension in at least three directions to the surrounding region, It is possible to suppress tension applied to the region in their combined direction as much as possible, and when the interval between the plurality of pieces formed from the plate-like member is widened, the position of each piece Can be prevented as much as possible from deviating from the theoretical position.

  In addition, if the two sides of the non-interfering cut are intermittent cuts, using a general sheet pasting device, a mounting device, etc. in the same manner as a conventional adhesive sheet in which no non-interfering cut is formed. The separating adhesive sheet can be attached to the adherend.

The perspective view of the adhesion sheet for separation concerning one embodiment of the present invention. (A), (B) is the usage example of the adhesive sheet for separation | spacing which concerns on the said one embodiment, (C) is explanatory drawing of a prior art example. The top view of the adhesive sheet for separation | spacing of the modification of this invention. The top view of the adhesive sheet for separation | spacing of the other modification of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the present embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. And Furthermore, in the present embodiment, when viewed from the D1 direction parallel to the Y axis, the direction is indicated by “up” being the arrow direction of the Z axis, “down” being the opposite direction, and “left” being In the X-axis arrow direction, “right” is the opposite direction, “front” is the Y-axis arrow direction, and “rear” is the opposite direction.
In FIG. 1, the separation adhesive sheet AU includes at least a base material BS and an adhesive AD layer laminated on one surface of the base material BS, and is attached by applying tension in at least three directions. A separation adhesive sheet that widens the distance between chips CP as a plurality of pieces formed from a wafer WF as a plate-like member adhered to the agent AD layer, and is within the surface of the separation adhesive sheet AU A polygonal enclosing area AC that has top APs at four locations and can surround the adherend pasting area AW to which the wafer WF is stuck when the wafer WF is stuck, and for the separation from each top AP. A non-interfering cut CU that extends in the outer edge direction of the adhesive sheet AU and prevents tension from being applied in the combined direction of each tension direction with respect to the surrounding area AC, and is divided by the non-interfering cut CU and the surrounding area AC. The A tension area AL that applies tension to the surrounding area AC, and a frame application area AF that is attached to a ring frame RF (see FIG. 2A) as a frame and connects adjacent tension areas AL. Yes.
The non-interfering cut CU is configured by two sides CS extending from each apex AP in the outer edge direction of the separating adhesive sheet AU and an arc portion CT along the inner edge of the ring frame RF.

  The base BS and the adhesive AD layer are not particularly limited, and the base BS is, for example, paper such as fine paper, glassine paper, and coated paper, and a laminate obtained by laminating a thermoplastic resin such as polyethylene on these papers. Paper, polyester (eg, polyethylene terephthalate, polyethylene naphthalate), polyolefin (eg, polypropylene, polyethylene), polyvinyl chloride, polyvinylidene chloride, polystyrene, polycarbonate, polyvinyl alcohol, polyurethane, acrylic resin, cellulose triacetate, cellulose diester Examples include celluloses such as acetate and cellophane, rubbers such as natural rubber and silicon rubber, wood, metal, ceramics, glass, stones, etc., having a thickness of 1 μm to 100 mm, and an adhesive AD layer Is an acrylic, rubber-based, silicone-based adhesive, can be exemplified those having a thickness of 1Myuemu～5mm. The thicknesses of the base material BS and the adhesive AD layer may be equal to or greater than the above-described exemplary thickness in light of technical common sense, or may be equal to or less than the exemplary thickness.

Next, a procedure for widening the interval between the plurality of chips CP formed from the wafer WF using the separation adhesive sheet AU will be described.
First, as shown in FIG. 2A, the wafer WF and the ring frame are arranged such that the wafer WF is arranged in the surrounding area AC and the ring frame RF is arranged at the outer edge of the arc part CT and the tension area AL. The separation adhesive sheet AU is attached to the RF to form an integrated object WK. The wafer WF can be separated into chips CP by wafer cutting means such as a cutting blade or pressurized water, or can be separated into chips CP by wafer weakening means such as laser light or chemicals.
Then, as shown in the figure, the left and right portions of the ring frame RF are placed on the support members 21 so that the wafer WF is positioned above the separation table 30 located between the pair of support members 21 arranged on the left and right. Insert into the groove 21A. Next, when the support member 21 is lowered, as shown in FIG. 2 (B), the four tension regions AL enter the surrounding region AC in the + X axis direction, the −X axis direction, the + Y axis direction, and the −Y axis direction. Directional tension is applied and the distance between the chips CP increases. When the detection means (not shown) such as an optical sensor or an imaging means detects that the chip CP located on the outermost periphery has reached a predetermined position, the lowering of the support member 21 is stopped.
Here, when the non-interference cut CU is not formed in the adhesive sheet AS, tension is applied to the surrounding area AC in addition to the above four directions as well as in the synthesis direction (CD1, CD2, CD3, CD4 direction). Is done. Therefore, as shown in FIG. 2C, each chip CP has a difference in the interval between the inner chip CP and the outer chip CP, and the chips CP can be arranged at theoretical positions. Can not.
On the other hand, in this embodiment, since the separation adhesive sheet AU in which the non-interference cut CU is formed is used, when tension is applied to the surrounding area AC in four directions, the surrounding area AC is not affected. Thus, it is possible to suppress the tension from being applied in the synthesis direction thereof as much as possible.

  Thereafter, a transport means (not shown) such as a transport device or a pickup device holds and transports each chip CP with reference to a theoretical position, and mounts the chip CP on a mounted object such as a lead frame or a substrate.

  According to the embodiment as described above, it is possible to prevent the position of each chip CP from deviating from the theoretical position as much as possible when the interval between the plurality of chips CP formed from the wafer WF is widened. it can.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

As shown in FIGS. 3A and 3B, the separation adhesive sheets AU1 and AU2 are respectively attached to the triangle AP and the pentagonal enclosure regions AC1 and AC2 surrounding the adherend pasting region AW1, respectively. 1/3 circular and 1/5 circular incoherent cuts CU1 and CU2 extending in the direction of the outer edge of the sheets AU1 and AU2, and three and five tension regions AL1 and AL2 that apply tension to the surrounding regions AC1 and AC2. And a frame pasting area AF, or five or more non-interference cuts and five or more tension areas. In this way, the direction and number of tension applied to the wafer WF are changed in accordance with the number of tension regions, and the direction of tension applied to the wafer WF may be three directions or five or more directions.
As shown in FIGS. 3C, 3D, and 3E, the separation adhesive sheets AU3, AU4, and AU5 have a configuration in which the separation adhesive sheets AU, AU1, and AU2 do not include the frame pasting area AF. May be.

As shown in FIGS. 4A, 4B, and 4C, the separation adhesive sheets AU6, AU7, and AU8 are separated from the apexes AP of the quadrangular, triangular, and pentagonal surrounding areas AC, AC1, and AC2, respectively. Adhesive sheets AU6, AU7, AU8, non-interfering cuts CU6, CU7, CU8 consisting of slit-like cuts extending in the outer edge direction, and four, three, five tensile areas AL6 that apply tension to the surrounding area AC1 , AL7, AL8 may be provided, or a frame pasting area connecting the tensile areas AL6, AL7, AL8 adjacent to each other may be further provided.
As shown in FIGS. 4D, 4E, and 4F, the separation adhesive sheets AU9, AU10, and AU11 extend intermittently from the tops AP in the outer edge direction of the separation adhesive sheets AU9, AU10, and AU11, respectively. Provided with non-interfering cuts CU9, CU10, CU11 consisting of regular cuts (cut lines), removing unnecessary sheets US separated by breakage of non-interfering cuts CU9, CU10, or breaking non-interfering cuts CU11 By doing so, the separation adhesive sheets AU, AU3, and AU6 shown in FIGS. 1, 3C, and 4A may be formed.

When attaching the separation adhesive sheet to a plate-like member such as a wafer WF or a ring frame, it may be performed manually, or a sheet attaching device or a mounting device may be used. If the non-interfering cuts CU9, CU10, and CU11 are cut lines as shown in FIGS. 4D, 4E, and 4F, the separation adhesive sheets AU9, AU10, and AU11 are peeled from the release sheet and the plate is removed. The process of affixing to the shaped member or the like can be performed using a general sheet affixing device, a mounting device, or the like, similarly to the conventional adhesive sheet in which the non-interfering cut is not formed.
Each side constituting the non-interference cuts CU, CU1, CU2, and CU9, and the non-interference cuts CU6 to CU8 and CU10 to CU11 may be formed by cuts such as curved lines or broken lines.
In the separation adhesive sheets AU, AU1, AU2, AU9 shown in FIGS. 1, 3A to 3B, and 4D, the separation adhesive sheets AU, AU1 from the top AP of the surrounding area AC, respectively. Only two sides extending in the outer edge direction of AU2, AU9 may be formed, and a non-interference cut may be formed without cutting the arc portion along the inner edge of the ring frame RF.

The surrounding area is an inner area of a polygon formed by straight lines connecting at least three tops at the shortest distance, and any shape can be used as long as it can surround the adherend pasting area. Good.
The shape of the surrounding area may be a shape similar to the shape of the upper surface of the separation table, a shape not similar to it, a shape similar to the adherend affixing region, or a shape not similar However, there is no limitation as long as it is a polygonal shape that can surround the adherend affixing region, and the shape can be determined by the direction and number of tension applied to the adherend affixing region. it can.
The shape of the plate-like member or piece-like body may be other shapes such as a circle, an ellipse, a triangle, or a polygon that is a pentagon or more.

  Further, the material, type, shape, etc. of the separating adhesive sheets AU, AU1 to AU11 in the present invention are not particularly limited. For example, the separation adhesive sheets AU, AU1 to AU11 may be circular, elliptical, polygonal, such as a triangle or a quadrangle, or other shapes. Further, the separation adhesive sheets AU, AU1 to AU11 are, for example, those having an intermediate layer between the base material and the adhesive layer, those having three layers or more such as having a cover layer on the upper surface of the base material, It may be a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer. The double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, or a single layer without an intermediate layer. Or it may be of multiple layers. Furthermore, as a plate-shaped member, for example, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, an information recording substrate such as a circuit board or an optical disk, a glass plate, a steel plate, a ceramic, a wooden plate, a resin plate, or any other member Can also be used as a target, and the piece may be a piece that is a piece. Note that the separation adhesive sheets AU, AU1 to AU11 may be replaced with functional and application readings, and may be any sheet such as a protective sheet, a dicing tape, a die attach film, a die bonding tape, a film, a tape, or the like. .

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the surrounding area is a polygon having a top part at least in three places within the surface of the separating adhesive sheet and surrounding the adherend pasting area to which the plate-like member is stuck, the common general technical knowledge at the time of filing is applied. In view of the above, there is no limitation as long as it is within the technical scope (the description of other configurations is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

AC, AC1, AC2 ... Surrounding area AD ... Adhesive AL, AL1, AL2, AL6, AL7, AL8 ... Tensile area AP ... Top AU, AU1, AU2, AU3, AU4, AU5, AU6, AU7, AU8, AU9, AU10 , AU11 ... Adhesive sheet for separation AW, AW1 ... Adhered body pasting area BS ... Base material CP ... Chip (piece-like body)
CS ... side CU, CU1, CU2, CU3, CU6, CU7, CU8, CU9, CU10, CU1 ... non-interference cut WF ... wafer (plate-like member)

Claims (1)

A plurality of plate members formed of at least a base material and an adhesive layer laminated on one surface of the base material, and formed of a plate-like member bonded to the adhesive layer by applying tension in at least three directions. A spacing adhesive sheet that increases the distance between the flakes of
A polygonal enclosing region having a top portion at least in three places within the surface of the spacing adhesive sheet and capable of enclosing the adherend pasting region to which the plate member is stuck when the plate member is stuck. When,
A non-interference notch that has two sides extending from the top to the outer edge of the separating adhesive sheet and prevents tension from being applied to the surrounding area in the combined direction of each tension direction;
A tension region that is divided by the non-interference cut and surrounding region, and that applies tension to the surrounding region and is attached to the frame;
A separation adhesive sheet, comprising: a frame application region that connects the adjacent tensile regions and is attached to the frame.

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