JP6568339B2 - 強固に固定されたバルク弾性波共振器における境界リングモード抑制 - Google Patents

強固に固定されたバルク弾性波共振器における境界リングモード抑制 Download PDF

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JP6568339B2
JP6568339B2 JP2014044851A JP2014044851A JP6568339B2 JP 6568339 B2 JP6568339 B2 JP 6568339B2 JP 2014044851 A JP2014044851 A JP 2014044851A JP 2014044851 A JP2014044851 A JP 2014044851A JP 6568339 B2 JP6568339 B2 JP 6568339B2
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region
electrode
boundary
extension
piezoelectric layer
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JP2014176095A (ja
JP2014176095A5 (enExample
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アリレザ、タジク
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Qorvo US Inc
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Triquint Semiconductor Inc
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/703—Networks using bulk acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02118—Means for compensation or elimination of undesirable effects of lateral leakage between adjacent resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175—Acoustic mirrors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/58—Multiple crystal filters
    • H03H9/582—Multiple crystal filters implemented with thin-film techniques
    • H03H9/586—Means for mounting to a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/589—Acoustic mirrors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/703—Networks using bulk acoustic wave devices
    • H03H9/706—Duplexers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
JP2014044851A 2013-03-12 2014-03-07 強固に固定されたバルク弾性波共振器における境界リングモード抑制 Active JP6568339B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/796,824 US9450565B2 (en) 2013-03-12 2013-03-12 Border ring mode suppression in solidly-mounted bulk acoustic wave resonator
US13/796,824 2013-03-12

Publications (3)

Publication Number Publication Date
JP2014176095A JP2014176095A (ja) 2014-09-22
JP2014176095A5 JP2014176095A5 (enExample) 2017-04-13
JP6568339B2 true JP6568339B2 (ja) 2019-08-28

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JP2014044851A Active JP6568339B2 (ja) 2013-03-12 2014-03-07 強固に固定されたバルク弾性波共振器における境界リングモード抑制

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Country Link
US (1) US9450565B2 (enExample)
JP (1) JP6568339B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016147688A1 (ja) * 2015-03-16 2016-09-22 株式会社村田製作所 弾性波装置及びその製造方法
WO2016147986A1 (ja) * 2015-03-16 2016-09-22 株式会社村田製作所 弾性波装置及びその製造方法
US9985194B1 (en) 2015-05-13 2018-05-29 Qorvo Us, Inc. Spurious mode suppression in bulk acoustic wave resonator
US10686425B2 (en) 2017-06-30 2020-06-16 Texas Instruments Incorporated Bulk acoustic wave resonators having convex surfaces, and methods of forming the same
US10615772B2 (en) 2017-06-30 2020-04-07 Texas Instruments Incorporated Acoustic wave resonators having Fresnel surfaces
US10622966B2 (en) 2017-07-26 2020-04-14 Texas Instruments Incorporated Bulk acoustic wave resonators having a phononic crystal acoustic mirror
US10855251B2 (en) 2017-08-08 2020-12-01 Texas Instruments Incorporated Unreleased plane acoustic wave resonators
US10277194B2 (en) 2017-09-15 2019-04-30 Globalfoundries Singapore Pte. Ltd. Acoustic MEMs resonator and filter with fractal electrode and method for producing the same
US11233496B2 (en) 2018-02-21 2022-01-25 Vanguard International Semiconductor Singapore Pte. Ltd. Acoustic resonator and filter with electrode having zig-zag edge and method for producing the same
US11082023B2 (en) 2018-09-24 2021-08-03 Skyworks Global Pte. Ltd. Multi-layer raised frame in bulk acoustic wave device
JP7456734B2 (ja) * 2019-06-17 2024-03-27 太陽誘電株式会社 弾性波デバイス、フィルタおよびマルチプレクサ
US11469735B2 (en) * 2018-11-28 2022-10-11 Taiyo Yuden Co., Ltd. Acoustic wave device, filter, and multiplexer
WO2020134803A1 (zh) * 2018-12-27 2020-07-02 天津大学 电极厚度不对称的体声波谐振器、滤波器和电子设备
US10879872B2 (en) * 2019-04-19 2020-12-29 Akoustis, Inc. BAW resonators with antisymmetric thick electrodes
WO2021200677A1 (ja) 2020-03-31 2021-10-07 株式会社村田製作所 弾性波装置
DE102021209875A1 (de) 2020-09-18 2022-03-24 Skyworks Global Pte. Ltd. Akustische volumenwellenvorrichtung mit erhöhter rahmenstruktur
CN116235411B (zh) * 2020-09-23 2025-10-24 华为技术有限公司 谐振器及其制备方法、滤波器、电子设备
US11581869B2 (en) 2020-09-30 2023-02-14 Skyworks Global Pte. Ltd. Bulk acoustic wave resonator with mass loading layer

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FI107660B (fi) 1999-07-19 2001-09-14 Nokia Mobile Phones Ltd Resonaattorirakenne
WO2002093740A1 (en) * 2001-05-11 2002-11-21 Ube Electronics, Ltd. Film bulk acoustic resonator
US7466213B2 (en) * 2003-10-06 2008-12-16 Nxp B.V. Resonator structure and method of producing it
US8008993B2 (en) * 2005-09-30 2011-08-30 Nxp B.V. Thin-film bulk-acoustic wave (BAW) resonators
JP2008182543A (ja) * 2007-01-25 2008-08-07 Ube Ind Ltd 薄膜圧電共振器とそれを用いた薄膜圧電フィルタ
JPWO2009013938A1 (ja) * 2007-07-20 2010-09-30 株式会社村田製作所 圧電共振子及び圧電フィルタ装置
DE112008002181B4 (de) * 2007-08-14 2023-08-03 Avago Technologies International Sales Pte. Limited Bulkakustikwellenstruktur mit einer piezoelektrischen Aluminiumkupfernitrid-Schicht und darauf bezogenes Verfahren
WO2009023100A2 (en) * 2007-08-14 2009-02-19 Skyworks Solutions, Inc. Method for forming a multi-layer electrode underlying a piezoelectric layer and related structure
WO2009028027A1 (ja) * 2007-08-24 2009-03-05 Fujitsu Limited 圧電薄膜共振子、それを用いたフィルタ、そのフィルタを用いたデュプレクサおよびそのフィルタまたはそのデュプレクサを用いた通信機
JP5563739B2 (ja) * 2008-02-20 2014-07-30 太陽誘電株式会社 圧電薄膜共振器、フィルタ、デュープレクサ、通信モジュール、および通信装置
US8487719B2 (en) * 2008-04-29 2013-07-16 Triquint Semiconductor, Inc. Bulk acoustic wave resonator
JP5246454B2 (ja) * 2009-02-20 2013-07-24 宇部興産株式会社 薄膜圧電共振器およびそれを用いた薄膜圧電フィルタ
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JP2012244616A (ja) * 2011-05-24 2012-12-10 Taiyo Yuden Co Ltd 圧電薄膜共振子、フィルタおよびモジュール

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Publication number Publication date
US20140273881A1 (en) 2014-09-18
US9450565B2 (en) 2016-09-20
JP2014176095A (ja) 2014-09-22

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