JP6559905B2 - 成膜方法及び成膜装置 - Google Patents
成膜方法及び成膜装置 Download PDFInfo
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- JP6559905B2 JP6559905B2 JP2018542796A JP2018542796A JP6559905B2 JP 6559905 B2 JP6559905 B2 JP 6559905B2 JP 2018542796 A JP2018542796 A JP 2018542796A JP 2018542796 A JP2018542796 A JP 2018542796A JP 6559905 B2 JP6559905 B2 JP 6559905B2
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- 238000000034 method Methods 0.000 title claims description 42
- 239000000758 substrate Substances 0.000 claims description 72
- 239000010419 fine particle Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 17
- 125000006850 spacer group Chemical group 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 13
- 239000012212 insulator Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 description 67
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000007740 vapor deposition Methods 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 10
- 238000004070 electrodeposition Methods 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
- B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
- B05B5/0255—Discharge apparatus, e.g. electrostatic spray guns spraying and depositing by electrostatic forces only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrostatic Spraying Apparatus (AREA)
Description
10はマイナスの電位が帯電された微粒子3と逆極性であるプラス電位を基板7に与える基板用電位付加装置、11はマイナスの電位が帯電された微粒子3と同極性であるマイナス電位をマスク8に与えるマスク用電位付加装置である。これらの詳細は後述する。
噴霧装置5によって粒子直径が例えば3.3±0.2μmの均一な大きさとなった微粒子3を槽1の内部に噴射させる。
この噴射された微粒子3に、例えば、帯電装置6によってマイナスの電位を帯電させる。一方、基板7には帯電した微粒子3と逆極性のプラスの電位を基板用電位付加装置10によって与えるとともに、マスク8には、帯電した微粒子3と同極性のマイナスの電位をマスク用電位付加装置11によって与える。マスク8は、絶縁膜9で被覆されているため、マスク8と基板7との間は絶縁されている。
そして、マスク8を基板7から取り除くと成膜13が有機EL素子となる。
尚、粒子直径が例えば3.3±0.2μmの均一な大きさとなった微粒子3を槽1の内部に噴射させることにより、この粒子径でのパターンコート寸法は蒸着マスクを凌駕する微細さ10μm角を確保できることが確認できた。
また、本開示に係る成膜装置は窒素雰囲気のドライな大気圧環境で行うため装置の製造コストは低く抑えることができる。
また、基板7を透明体で形成して、染料、顔料インキなどを用いれば、液晶関連のディスプレイ関連のカラーフィルター製作に有効である。
なお、図5に示すように、絶縁体は、マスク8の底部全面を覆う絶縁スペーサ16であってもよい。
また、図6に示すように、絶縁スペーサ15を、絶縁膜9で被覆されたマスク8と、基板7との間に配置してもよい。
基板7が大型である場合には、マスク8が自重により撓んで絶縁膜9に亀裂が発生するおそれがあるため、マスク8を絶縁膜9で覆い、かつ該マスク8と基板7との間に絶縁スペーサ15を配置する構成(図6)が望ましく、極めて精度の高い成膜13を得ることができる。
最近は、2×1.5mのような大型ディスプレイの生産量が増加傾向にある。大型ディスプレイに対応する大型の基板やマスクに静電荷を付加するには、ある程度の時間を要する。したがって、量産スピードを改善するには、大型大容量の電気二重層キャパシタ(EDLC)を採用することが望ましい。本実施形態では、上記のような電気二重層キャパシタ23を用いることにより、大型の基板やマスクに対して、瞬時に静電荷をチャージしたり、ディスチャージしたりすることを可能にしている。
本明細書に記載されたすべての文献、特許出願、および技術規格は、個々の文献、特許出願、および技術規格が参照により取り込まれることが具体的かつ個々に記された場合と同程度に、本明細書中に参照により取り込まれる。
Claims (7)
- 槽の下部に基板を設けるとともにこの基板の上に絶縁体を介してマスクを設け、前記槽の空間内に成膜材料となる帯電した微粒子を噴霧装置で噴霧するとともに前記基板には前記帯電した微粒子と逆極性の電位を与え、前記マスクには前記帯電した微粒子と同極性の電位を与えることにより、前記基板の上に前記微粒子を堆積させて成膜する成膜方法であって、
前記噴霧装置として、微粒子を振動させる圧電素子とメッシュノズルを用いた微粒子生成装置を用いる成膜方法。 - 前記基板を透明体で形成した請求項1に記載の成膜方法。
- 前記絶縁体は、前記マスクを被覆する絶縁膜、前記マスクと前記基板との間に配置する絶縁スペーサのいずれか一方である請求項1又は請求項2に記載の成膜方法。
- 前記絶縁体は、前記マスクを被覆する絶縁膜であり、
前記マスクの底面周辺の前記絶縁膜に、下方へ突出し先が鋭角な突出縁を形成し、この突出縁を前記基板に密着させた請求項1又は請求項2に記載の成膜方法。 - 前記絶縁体は、前記マスクを被覆する絶縁膜と、前記マスクと前記基板との間に配置する絶縁スペーサである請求項1又は請求項2に記載の成膜方法。
- 前記成膜材料が有機EL材料である請求項1〜請求項5の何れか1項に記載の成膜方法。
- 請求項1〜6の何れか一つの成膜方法に用いられる成膜装置であって、
前記成膜材料となる前記微粒子を所定の粒子直径に形成して前記槽内に噴霧する噴霧装置と、
この槽内の前記微粒子に帯電させる帯電装置と、
帯電した前記微粒子と逆極性の電位を前記基板に与える基板用電位付加装置と、
帯電した前記微粒子と同極性の電位を前記マスクに与えるマスク用電位付加装置と、を備え、
前記噴霧装置は、微粒子を振動させる圧電素子とメッシュノズルを用いた微粒子生成装置である成膜装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017102068 | 2017-05-23 | ||
JP2017102068 | 2017-05-23 | ||
PCT/JP2018/019373 WO2018216631A1 (ja) | 2017-05-23 | 2018-05-18 | 成膜方法及び成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018216631A1 JPWO2018216631A1 (ja) | 2019-06-27 |
JP6559905B2 true JP6559905B2 (ja) | 2019-08-14 |
Family
ID=64395580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018542796A Active JP6559905B2 (ja) | 2017-05-23 | 2018-05-18 | 成膜方法及び成膜装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190381522A1 (ja) |
JP (1) | JP6559905B2 (ja) |
KR (1) | KR102088126B1 (ja) |
CN (1) | CN109287117A (ja) |
WO (1) | WO2018216631A1 (ja) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8403304D0 (en) * | 1984-02-08 | 1984-03-14 | Willett Int Ltd | Fluid application |
TW495809B (en) * | 2000-02-28 | 2002-07-21 | Semiconductor Energy Lab | Thin film forming device, thin film forming method, and self-light emitting device |
JP4401040B2 (ja) * | 2001-06-19 | 2010-01-20 | 株式会社オプトニクス精密 | 蒸着用マスク |
US20060198940A1 (en) * | 2005-03-04 | 2006-09-07 | Mcmorrow David | Method of producing particles utilizing a vibrating mesh nebulizer for coating a medical appliance, a system for producing particles, and a medical appliance |
JP5207334B2 (ja) * | 2006-02-28 | 2013-06-12 | 独立行政法人理化学研究所 | マイクロパターン形成装置、マイクロパターン構造体、および、その製造方法 |
GB0709517D0 (en) | 2007-05-17 | 2007-06-27 | Queen Mary & Westfield College | An electrostatic spraying device and a method of electrostatic spraying |
EP2110455A1 (en) * | 2008-04-18 | 2009-10-21 | Applied Materials, Inc. | Mask support, mask assembly, and assembly comprising a mask support and a mask |
KR101398237B1 (ko) * | 2009-07-02 | 2014-05-23 | 퓨엔스 가부시끼가이샤 | 유기 el 소자, 유기 el 소자의 제조방법, 및 유기 el 표시장치 |
KR101539874B1 (ko) * | 2011-01-18 | 2015-07-27 | 샤프 가부시키가이샤 | 피성막 기판, 유기 el 표시 장치 |
JP5686196B2 (ja) * | 2011-08-29 | 2015-03-18 | トヨタ自動車株式会社 | 微粒子センサ及び微粒子センサの製造方法 |
JP6054673B2 (ja) * | 2012-08-03 | 2016-12-27 | 株式会社オプトニクス精密 | 噴霧器用メッシュノズル及び噴霧器 |
JP5977684B2 (ja) * | 2013-02-01 | 2016-08-24 | 東レエンジニアリング株式会社 | 薄膜形成装置 |
JP6142393B2 (ja) * | 2013-09-09 | 2017-06-07 | 株式会社ブイ・テクノロジー | 成膜マスク、成膜装置及び成膜方法並びにタッチパネル基板 |
KR102479926B1 (ko) * | 2015-09-03 | 2022-12-20 | 삼성전자주식회사 | 박막 형성 장치, 이를 이용한 유기 발광 소자 및 이의 제조 방법 |
JP2017074568A (ja) * | 2015-10-16 | 2017-04-20 | アネスト岩田株式会社 | マスキング治具を用いた液体塗着方法、そのためのマスキング治具、及び、そのマスキング治具を用いた静電噴霧装置 |
-
2018
- 2018-05-18 US US16/304,698 patent/US20190381522A1/en not_active Abandoned
- 2018-05-18 WO PCT/JP2018/019373 patent/WO2018216631A1/ja active Application Filing
- 2018-05-18 KR KR1020187035408A patent/KR102088126B1/ko active IP Right Grant
- 2018-05-18 JP JP2018542796A patent/JP6559905B2/ja active Active
- 2018-05-18 CN CN201880002206.4A patent/CN109287117A/zh active Pending
Also Published As
Publication number | Publication date |
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KR20190005210A (ko) | 2019-01-15 |
US20190381522A1 (en) | 2019-12-19 |
KR102088126B1 (ko) | 2020-03-11 |
WO2018216631A1 (ja) | 2018-11-29 |
CN109287117A (zh) | 2019-01-29 |
JPWO2018216631A1 (ja) | 2019-06-27 |
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