JP6546041B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP6546041B2
JP6546041B2 JP2015165771A JP2015165771A JP6546041B2 JP 6546041 B2 JP6546041 B2 JP 6546041B2 JP 2015165771 A JP2015165771 A JP 2015165771A JP 2015165771 A JP2015165771 A JP 2015165771A JP 6546041 B2 JP6546041 B2 JP 6546041B2
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plasma
processing chamber
plasma processing
electromagnet
processing apparatus
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JP2017045790A5 (https=
JP2017045790A (ja
Inventor
田村　仁
仁 田村
浩平 佐藤
浩平 佐藤
崇 植村
崇 植村
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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JP2015165771A 2015-08-25 2015-08-25 プラズマ処理装置 Active JP6546041B2 (ja)

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JP2015165771A JP6546041B2 (ja) 2015-08-25 2015-08-25 プラズマ処理装置

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JP2015165771A JP6546041B2 (ja) 2015-08-25 2015-08-25 プラズマ処理装置

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JP2017045790A JP2017045790A (ja) 2017-03-02
JP2017045790A5 JP2017045790A5 (https=) 2018-09-06
JP6546041B2 true JP6546041B2 (ja) 2019-07-17

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JP2015165771A Active JP6546041B2 (ja) 2015-08-25 2015-08-25 プラズマ処理装置

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024089806A (ja) * 2022-12-22 2024-07-04 株式会社日立ハイテク プラズマ処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438680Y2 (https=) * 1976-06-11 1979-11-16
JPS56123738U (https=) * 1980-02-18 1981-09-21
JPH06216042A (ja) * 1993-01-18 1994-08-05 Hitachi Ltd プラズマプロセシング装置及びその運転方法
JP3432720B2 (ja) * 1997-09-12 2003-08-04 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP2000173986A (ja) * 1998-12-01 2000-06-23 Hitachi Ltd エッチング装置
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
JP5756974B2 (ja) * 2011-12-06 2015-07-29 株式会社デンソー 半導体装置の製造方法、半導体エッチングプロセスにおける計測方法
JP2015138931A (ja) * 2014-01-24 2015-07-30 株式会社日立ハイテクノロジーズ 真空処理装置および真空処理方法

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