JP6537234B2 - 発光ダイオードパッケージ及びその製造方法 - Google Patents
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- JP6537234B2 JP6537234B2 JP2014169386A JP2014169386A JP6537234B2 JP 6537234 B2 JP6537234 B2 JP 6537234B2 JP 2014169386 A JP2014169386 A JP 2014169386A JP 2014169386 A JP2014169386 A JP 2014169386A JP 6537234 B2 JP6537234 B2 JP 6537234B2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
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- 229910004611 CdZnTe Inorganic materials 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
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- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004262 HgTe Inorganic materials 0.000 description 1
- -1 InGaN Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- 241000764773 Inna Species 0.000 description 1
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- 229910007709 ZnTe Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
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- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 150000003949 imides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
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- 230000031700 light absorption Effects 0.000 description 1
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- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
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- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Description
1408678961555_0
−(filler)を含み得る。
1408678961555_1
)状態の電子が降りる際に発生する。この際、量子ドットはその粒子が小さいほど短い波長の光が発生して粒子が大きいほど長い波長の光を発生する性質がある。したがって、量子ドットのサイズを調節すると、所望する波長の可視光線領域の光をすべて発生させることができる。
103a 挿入ホール
200、201 発光ダイオードチップ
300、301、302 波長変換部
310、311、312 第1バリアー層
320、321 波長変換層
330、331、332 第2バリアー層
400、401、402 カバー部
410、411 透明ベース部材
420、421、422 光学コーティング層
500 熱遮断部材
Claims (10)
- パッケージモールドと、
前記パッケージモールドの一面上に位置する発光ダイオードチップと、
前記パッケージモールドの一面上に位置して前記発光ダイオードチップと離隔して位置する波長変換部と、
前記発光ダイオードチップ及び前記波長変換部との間に介在する熱遮断部材と、
を含み、
前記発光ダイオードチップは、平面的に見て前記熱遮断部材と重ならず、
前記波長変換部は、
前記パッケージモールドの一面上に位置する第1バリアー層と、
前記第1バリアー層上に位置する波長変換層と、
前記波長変換層上に位置する第2バリアー層を含み、
前記パッケージモールドの一面から前記熱遮断部材の上面までの距離は、前記パッケージモールドの一面から前記第2バリアー層の上面までの距離よりも小さい、又は同じである、発光ダイオードパッケージ。 - 前記波長変換層は量子ドットを含む、請求項1に記載の発光ダイオードパッケージ。
- 前記発光ダイオードチップ及び前記波長変換部が同一平面上に位置する、請求項1に記載の発光ダイオードパッケージ。
- 前記パッケージモールドの一面上に位置し、前記発光ダイオードチップ及び前記波長変換部をカバーするカバー部をさらに含み、
前記カバー部は、
透明ベース部材と、
前記透明ベース部材上に位置し、特定波長領域の大部分の光を反射する光学コーティング層を含む、
請求項1に記載の発光ダイオードパッケージ。 - 前記光学コーティング層は、前記特定波長領域を除いた残りの波長領域の大部分の光を通
過させる、請求項4に記載の発光ダイオードパッケージ。 - 前記第1バリアー層及び前記第2バリアー層のうち少なくとも一つが絶縁性物質を含む、請求項1に記載の発光ダイオードパッケージ。
- 前記発光ダイオードチップは青色光を放出し、
前記波長変換部は、前記青色光を黄色光に波長変換する、
請求項1に記載の発光ダイオードパッケージ。 - パッケージモールドと、
前記パッケージモールドの一面上に位置する発光ダイオードチップと、
前記パッケージモールドの一面上に位置し、前記発光ダイオードチップと離隔して位置する波長変換部と、
前記パッケージモールドの一面上に位置し、前記発光ダイオードチップ及び前記波長変換部をカバーするカバー部と、
前記発光ダイオードチップ及び前記波長変換部との間に介在する熱遮断部材と、
を含み、
前記発光ダイオードチップは、平面的に見て前記熱遮断部材と重ならず、
前記カバー部は、
透明ベース部材と、
前記透明ベース部材上に位置し、特定波長領域の大部分の光を反射する光学コーティング層を含み、
前記パッケージモールドの一面から前記熱遮断部材の上面までの距離は、前記パッケージモールドの一面から前記波長変換部の上面までの距離よりも小さい、又は同じである、発光ダイオードパッケージ。 - 前記波長変換部は、
前記パッケージモールドの一面上に位置する第1バリアー層と、
前記第1バリアー層上に位置する波長変換層と、
前記波長変換層上に位置する第2バリアー層を含む、
請求項8に記載の発光ダイオードパッケージ。 - 前記波長変換層は量子ドットを含む、請求項9に記載の発光ダイオードパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0013127 | 2014-02-05 | ||
KR1020140013127A KR20150092801A (ko) | 2014-02-05 | 2014-02-05 | 발광 다이오드 패키지 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015149468A JP2015149468A (ja) | 2015-08-20 |
JP6537234B2 true JP6537234B2 (ja) | 2019-07-03 |
Family
ID=53731602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014169386A Expired - Fee Related JP6537234B2 (ja) | 2014-02-05 | 2014-08-22 | 発光ダイオードパッケージ及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9447932B2 (ja) |
JP (1) | JP6537234B2 (ja) |
KR (1) | KR20150092801A (ja) |
CN (1) | CN104821364A (ja) |
Families Citing this family (9)
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KR20180071027A (ko) * | 2016-12-19 | 2018-06-27 | 삼성전자주식회사 | 디스플레이 장치 |
KR20180082041A (ko) | 2017-01-09 | 2018-07-18 | 삼성전자주식회사 | 발광 소자 패키지, 그 제조 방법, 발광 소자 패키지를 포함하는 백라이트 유닛, 및 표시 장치 |
CN106981562B (zh) * | 2017-03-30 | 2019-04-02 | 深圳市华星光电技术有限公司 | 量子点led封装结构 |
US20190198720A1 (en) | 2017-12-22 | 2019-06-27 | Lumileds Llc | Particle systems and patterning for monolithic led arrays |
JP6822452B2 (ja) * | 2018-08-23 | 2021-01-27 | セイコーエプソン株式会社 | 光源装置およびプロジェクター |
TWI735847B (zh) * | 2018-10-12 | 2021-08-11 | 財團法人工業技術研究院 | 光電元件封裝體 |
CN111048654B (zh) | 2018-10-12 | 2021-10-22 | 财团法人工业技术研究院 | 光电元件封装体 |
CN117497668B (zh) * | 2024-01-03 | 2024-03-19 | 江西省兆驰光电有限公司 | 一种led器件及其制备方法 |
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2014
- 2014-02-05 KR KR1020140013127A patent/KR20150092801A/ko not_active IP Right Cessation
- 2014-06-16 US US14/306,127 patent/US9447932B2/en active Active
- 2014-08-22 JP JP2014169386A patent/JP6537234B2/ja not_active Expired - Fee Related
- 2014-09-19 CN CN201410484312.4A patent/CN104821364A/zh active Pending
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KR20150092801A (ko) | 2015-08-17 |
CN104821364A (zh) | 2015-08-05 |
US20150219288A1 (en) | 2015-08-06 |
US9447932B2 (en) | 2016-09-20 |
JP2015149468A (ja) | 2015-08-20 |
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