JP6535202B2 - 真空断熱材及びこの真空断熱材を使用した断熱箱体 - Google Patents
真空断熱材及びこの真空断熱材を使用した断熱箱体 Download PDFInfo
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- JP6535202B2 JP6535202B2 JP2015085739A JP2015085739A JP6535202B2 JP 6535202 B2 JP6535202 B2 JP 6535202B2 JP 2015085739 A JP2015085739 A JP 2015085739A JP 2015085739 A JP2015085739 A JP 2015085739A JP 6535202 B2 JP6535202 B2 JP 6535202B2
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- adsorbent
- heat insulating
- sheets
- insulating material
- vacuum heat
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011162 core material Substances 0.000 claims description 42
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
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- 229920002125 Sokalan® Polymers 0.000 description 1
- 229920006328 Styrofoam Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
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- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- VCNTUJWBXWAWEJ-UHFFFAOYSA-J aluminum;sodium;dicarbonate Chemical compound [Na+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O VCNTUJWBXWAWEJ-UHFFFAOYSA-J 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
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- 239000000919 ceramic Substances 0.000 description 1
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- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 239000004794 expanded polystyrene Substances 0.000 description 1
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- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
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- 239000011496 polyurethane foam Substances 0.000 description 1
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- 238000003825 pressing Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
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- 238000009823 thermal lamination Methods 0.000 description 1
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- 238000009461 vacuum packaging Methods 0.000 description 1
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- 238000010792 warming Methods 0.000 description 1
- 238000009816 wet lamination Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
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Application Number | Priority Date | Filing Date | Title |
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JP2015085739A JP6535202B2 (ja) | 2015-04-20 | 2015-04-20 | 真空断熱材及びこの真空断熱材を使用した断熱箱体 |
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JP2015085739A JP6535202B2 (ja) | 2015-04-20 | 2015-04-20 | 真空断熱材及びこの真空断熱材を使用した断熱箱体 |
Publications (3)
Publication Number | Publication Date |
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JP2016205480A JP2016205480A (ja) | 2016-12-08 |
JP2016205480A5 JP2016205480A5 (ru) | 2018-03-08 |
JP6535202B2 true JP6535202B2 (ja) | 2019-06-26 |
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JP2015085739A Expired - Fee Related JP6535202B2 (ja) | 2015-04-20 | 2015-04-20 | 真空断熱材及びこの真空断熱材を使用した断熱箱体 |
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JP (1) | JP6535202B2 (ru) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110864193B (zh) * | 2018-08-27 | 2021-02-12 | 广州力及热管理科技有限公司 | 薄型真空隔热片的制作方法 |
CN111594703A (zh) * | 2019-02-21 | 2020-08-28 | 北京航天试验技术研究所 | 一种具有外置补偿板的真空绝热管小真空焊接连接结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006194559A (ja) * | 2005-01-17 | 2006-07-27 | Nisshinbo Ind Inc | 真空断熱材を用いた断熱箱体 |
JP6070269B2 (ja) * | 2013-02-27 | 2017-02-01 | 東芝ホームテクノ株式会社 | 断熱体 |
JP2014209011A (ja) * | 2013-04-16 | 2014-11-06 | 日立アプライアンス株式会社 | 真空断熱材 |
JP2015001290A (ja) * | 2013-06-17 | 2015-01-05 | 日立アプライアンス株式会社 | 真空断熱材及び冷蔵庫 |
JP5476615B2 (ja) * | 2013-08-07 | 2014-04-23 | パナソニック株式会社 | 真空断熱材、並びにこれを備えた冷蔵庫、ジャーポット及び住宅 |
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