JP6530498B2 - メカトロニクスコンポーネントおよびその製造方法 - Google Patents
メカトロニクスコンポーネントおよびその製造方法 Download PDFInfo
- Publication number
- JP6530498B2 JP6530498B2 JP2017541950A JP2017541950A JP6530498B2 JP 6530498 B2 JP6530498 B2 JP 6530498B2 JP 2017541950 A JP2017541950 A JP 2017541950A JP 2017541950 A JP2017541950 A JP 2017541950A JP 6530498 B2 JP6530498 B2 JP 6530498B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- encapsulation
- support
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 14
- 239000008393 encapsulating agent Substances 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000004033 plastic Substances 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000002787 reinforcement Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000003677 Sheet moulding compound Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000003923 scrap metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
前記平面側には、以下の複数のコンポーネント、すなわち、
−複数の電子部品と、
−前記支持体プリント回路基板上で少なくとも1つの電子部品を機械的に固定するための少なくとも1つの機械的挿入部品と、が配置されている。本発明によれば、一体的に構成されたカプセル封止部が設けられており、このカプセル封止部は、実装される平面側に配置される全てのコンポーネントを、形状結合的にかつ素材結合的に取り囲んでいる。
1.1 プリント回路基板要素
2 電気回路装置
2.1 電子アセンブリ
2.2 ボンディングワイヤ
3 第1のセンサ
4 第2のセンサ
4.1 第2の機械的挿入部品
5 接着剤
6 第1のカバー要素
6.1 プラスチック被包部
7 第1の封止要素
8 第1の機械的挿入部品
8.1 金属製支持体
8.2 プラスチック外被
9 第2のカバー要素
10 第3のカバー要素
11 第2の封止要素
12 カプセル封止部
13 金型
14 補強リブ
E メカトロニクスアセンブリ
G ベースプレート
M カプセル封止材料
Z 垂直軸
Claims (5)
- メカトロニクスアセンブリ(E)を製造するための方法であって、
前記メカトロニクスアセンブリ(E)は、
少なくとも1つの平面側に、複数の電子部品が実装されている支持体プリント回路基板(1)を備え、
前記複数の電子部品のうちの少なくとも1つは、少なくとも1つの機械的挿入部品(4.1,8)によって、前記支持体プリント回路基板(1)の前記平面側に機械的に固定されており、
前記少なくとも1つの機械的挿入部品(4.1,8)を含めて前記複数の電子部品が、硬化可能なカプセル封止材料(M)から形成されているカプセル封止部(12)によって形状結合的にかつ素材結合的に取り囲まれている、方法において、
前記硬化可能なカプセル封止材料(M)は、金型(13)内に充填され、前記支持体プリント回路基板(1)の前記実装される平面側が前記金型(13)内に浸漬されることを含み、
前記金型(13)は、前記支持体プリント回路基板(1)の実装される平面側の単純化された負の型と、前記支持体プリント回路基板(1)上に補強リブ(14)を成形するための空胴とを有していることを特徴とする方法。 - 前記硬化可能なカプセル封止材料(M)は、前記支持体プリント回路基板(1)の前記実装される平面側に射出される、請求項1記載の方法。
- 前記硬化可能なカプセル封止材料(M)は、熱硬化性樹脂を含んでいる、請求項1または2記載の方法。
- 前記硬化可能なカプセル封止材料(M)は、少なくとも1つの無機充填材を備えている、請求項1から3までのいずれか1項記載の方法。
- 前記カプセル封止部(12)は、付加的に、前記支持体プリント回路基板(1)の、前記実装される平面側とは反対側の平面側を、少なくとも部分的に取り囲んでいる、請求項1から4までのいずれか1項記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015202311 | 2015-02-10 | ||
DE102015202311.7 | 2015-02-10 | ||
DE102015209191.0 | 2015-05-20 | ||
DE102015209191.0A DE102015209191A1 (de) | 2015-02-10 | 2015-05-20 | Mechatronische Komponente und Verfahren zu deren Herstellung |
PCT/EP2016/052096 WO2016128245A1 (de) | 2015-02-10 | 2016-02-01 | Mechatronische komponente und verfahren zu deren herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018511932A JP2018511932A (ja) | 2018-04-26 |
JP6530498B2 true JP6530498B2 (ja) | 2019-06-12 |
Family
ID=56498576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017541950A Active JP6530498B2 (ja) | 2015-02-10 | 2016-02-01 | メカトロニクスコンポーネントおよびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10349540B2 (ja) |
EP (1) | EP3257339B1 (ja) |
JP (1) | JP6530498B2 (ja) |
CN (1) | CN107006132B (ja) |
DE (1) | DE102015209191A1 (ja) |
WO (1) | WO2016128245A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016224671B4 (de) | 2016-12-12 | 2021-07-29 | Vitesco Technologies Germany Gmbh | Getriebesteuergerät in einem Kraftfahrzeug |
DE102016224949B4 (de) * | 2016-12-14 | 2023-08-10 | Vitesco Technologies Germany Gmbh | Verfahren zur Herstellung von mechatronischen Baugruppen |
DE102016225174A1 (de) * | 2016-12-15 | 2018-06-21 | Conti Temic Microelectronic Gmbh | Selbsttragender Anschlussrahmen für einen Sensorturm |
DE102016015216A1 (de) * | 2016-12-21 | 2018-06-21 | Thomas Magnete Gmbh | Elektromechanischer Aktor |
DE102017209180A1 (de) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Elektronikanordnung |
DE102017209179A1 (de) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Elektronikanordnung |
DE102017211513A1 (de) * | 2017-07-06 | 2019-01-10 | Robert Bosch Gmbh | Elektronikmodul und Kombination eines Elektronikmoduls mit einer Hydraulikplatte |
DE102017211578A1 (de) * | 2017-07-06 | 2019-01-10 | Zf Friedrichshafen Ag | Elektronikmodul, Aktuatoreinrichtung und Verfahren zum Herstellen einer Aktuatoreinrichtung |
DE102018218434A1 (de) * | 2018-10-29 | 2020-04-30 | Bühler Motor GmbH | Elektronikmodul, Pumpenantrieb mit diesem Elektronikmodul |
DE102018220012A1 (de) | 2018-11-22 | 2020-05-28 | Zf Friedrichshafen Ag | Leiterplatte, Umspritzwerkzeug und Verfahren zum Umspritzen einer Leiterplatte |
KR20210158309A (ko) * | 2020-06-23 | 2021-12-30 | 주식회사 엘지에너지솔루션 | 회로 기판 어셈블리 제조 방법, 이에 의해 제조된 회로 기판 어셈블리 및 이를 구비하는 전기 자동차 |
DE102021200061A1 (de) | 2021-01-07 | 2022-07-07 | Zf Friedrichshafen Ag | Elektronikmodul, Verfahren zum Herstellen eines Elektronikmoduls und Kontrollvorrichtung |
DE102021203904B4 (de) | 2021-04-20 | 2024-02-01 | Vitesco Technologies Germany Gmbh | Verfahren zum Verkapseln einer elektronischen Baugruppe |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5313365A (en) * | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
JPH0722722A (ja) * | 1993-07-05 | 1995-01-24 | Mitsubishi Electric Corp | 樹脂成形タイプの電子回路装置 |
CN1123515A (zh) * | 1994-11-24 | 1996-05-29 | 三菱电机株式会社 | 树脂模压的电子电路装置 |
KR19980077546A (ko) | 1997-04-21 | 1998-11-16 | 한스 스트롬 | 쓰레기 배출 방법 및 장치 |
JP2000208905A (ja) * | 1999-01-14 | 2000-07-28 | Nec Corp | プリント基板 |
JP2002277482A (ja) * | 2001-03-21 | 2002-09-25 | Calsonic Kansei Corp | 回転センサ |
JP2003258476A (ja) * | 2002-03-06 | 2003-09-12 | Alps Electric Co Ltd | シールド構造 |
KR100472286B1 (ko) * | 2002-09-13 | 2005-03-10 | 삼성전자주식회사 | 접착 테이프가 본딩와이어에 부착된 반도체 칩 패키지 |
US7897234B2 (en) * | 2003-01-15 | 2011-03-01 | Osram Sylvania Inc. | Potting material for electronic components |
TWI235469B (en) * | 2003-02-07 | 2005-07-01 | Siliconware Precision Industries Co Ltd | Thermally enhanced semiconductor package with EMI shielding |
FR2869706B1 (fr) * | 2004-04-29 | 2006-07-28 | Oberthur Card Syst Sa | Entite electronique securisee, telle qu'un passeport. |
JP4478007B2 (ja) * | 2004-12-16 | 2010-06-09 | 日立オートモティブシステムズ株式会社 | 電子回路装置及びその製造方法 |
DE102004061818A1 (de) * | 2004-12-22 | 2006-07-06 | Robert Bosch Gmbh | Steuermodul |
DE102005063279A1 (de) * | 2005-12-30 | 2007-07-05 | Robert Bosch Gmbh | Einlegeteil sowie Spritzgussteil mit Einlegeteil |
US20090056446A1 (en) * | 2007-09-05 | 2009-03-05 | Cluff Charles A | Multiple-axis sensor package and method of assembly |
JP2009088351A (ja) * | 2007-10-01 | 2009-04-23 | Denso Corp | 電子回路装置の製造方法および電子回路装置 |
JP5324191B2 (ja) * | 2008-11-07 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2010206158A (ja) * | 2009-02-04 | 2010-09-16 | Panasonic Corp | デバイス |
US8130496B2 (en) * | 2009-04-01 | 2012-03-06 | Intel Corporation | Device and method for mitigating radio frequency interference |
US9674976B2 (en) * | 2009-06-16 | 2017-06-06 | Rosemount Inc. | Wireless process communication adapter with improved encapsulation |
JP2012028487A (ja) * | 2010-07-22 | 2012-02-09 | Panasonic Corp | 樹脂封止基板装置と、それらの製造方法 |
DE102010063151A1 (de) * | 2010-12-15 | 2012-06-21 | Robert Bosch Gmbh | Steuergerät und Verfahren zum Herstellen eines Steuergeräts |
US8293572B2 (en) * | 2011-01-20 | 2012-10-23 | ADL Engineering Inc. | Injection molding system and method of chip package |
DE102011006594A1 (de) | 2011-03-31 | 2012-10-04 | Robert Bosch Gmbh | Sensormodul und Verfahren zur Herstellung eines Sensormoduls |
DE102011006632A1 (de) * | 2011-04-01 | 2012-10-04 | Robert Bosch Gmbh | Elektronikmodul |
JP5807413B2 (ja) * | 2011-07-04 | 2015-11-10 | セイコーエプソン株式会社 | 電子デバイス用パッケージ、電子デバイスおよび電子機器 |
JP5939895B2 (ja) * | 2012-06-11 | 2016-06-22 | 日立オートモティブシステムズ株式会社 | 車載用電子制御装置 |
JP5892087B2 (ja) * | 2013-03-01 | 2016-03-23 | 株式会社デンソー | 車両用電子制御ユニット及びその製造方法 |
JP6141064B2 (ja) * | 2013-03-21 | 2017-06-07 | 日立オートモティブシステムズ株式会社 | 回路基板と筐体の接続方法 |
DE102014205386A1 (de) * | 2014-03-24 | 2015-09-24 | Robert Bosch Gmbh | Elektronikmodul, insbesondere für Getriebesteuergerät, mit integriertem elektronischem Sensorelement |
-
2015
- 2015-05-20 DE DE102015209191.0A patent/DE102015209191A1/de not_active Withdrawn
-
2016
- 2016-02-01 EP EP16702704.4A patent/EP3257339B1/de active Active
- 2016-02-01 CN CN201680003896.6A patent/CN107006132B/zh active Active
- 2016-02-01 JP JP2017541950A patent/JP6530498B2/ja active Active
- 2016-02-01 WO PCT/EP2016/052096 patent/WO2016128245A1/de active Application Filing
-
2017
- 2017-08-10 US US15/674,236 patent/US10349540B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3257339A1 (de) | 2017-12-20 |
WO2016128245A1 (de) | 2016-08-18 |
DE102015209191A1 (de) | 2016-08-11 |
US20170367200A1 (en) | 2017-12-21 |
US10349540B2 (en) | 2019-07-09 |
CN107006132A (zh) | 2017-08-01 |
CN107006132B (zh) | 2019-12-24 |
EP3257339B1 (de) | 2019-09-25 |
JP2018511932A (ja) | 2018-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6530498B2 (ja) | メカトロニクスコンポーネントおよびその製造方法 | |
US10829064B2 (en) | Electronic control device | |
EP3499560B1 (en) | Semiconductor module and method for producing the same | |
TWI334216B (en) | Power semiconductor apparatus | |
US9532460B2 (en) | Transmission control module | |
EP3358920B1 (en) | Electronic control device, and manufacturing method for vehicle-mounted electronic control device | |
US8995142B2 (en) | Power module and method for manufacturing the same | |
CN104425435A (zh) | 具有散热器的重叠模塑的基板-芯片布置 | |
JP5038271B2 (ja) | 電気電子制御装置及びその製造方法 | |
JP2009200416A (ja) | 半導体装置および半導体装置の製造方法 | |
CN103958280A (zh) | 电子组件 | |
KR20130118225A (ko) | 자동차를 위한 캡슐화된 제어 모듈 | |
US8422241B2 (en) | Sealed electronic control device and method of fabricating the same | |
CN107079583B (zh) | 用于在污染的介质中使用的变速器控制模块、用于在这种变速器控制模块中使用的tcu组件和用于制造这种变速器控制模块的方法 | |
JP3842010B2 (ja) | 複数基板を有する電子機器 | |
JP4886988B2 (ja) | 樹脂封止型エンジンコントロール装置並びにその製造方法 | |
CN107851620B (zh) | 功率半导体模块 | |
CN110476490A (zh) | 用于变速器控制单元的电子模块和变速器控制单元 | |
JP2003037241A (ja) | 電気回路基板パッケージ品および電気回路基板パッケージ品の製造方法 | |
CN101960180A (zh) | 电子油压控制模块 | |
EP4075484A1 (en) | Power semiconductor module comprising molded body and method for producing a power semiconductor module | |
CN219716867U (zh) | 功率半导体模块 | |
JP2009277959A (ja) | 半導体装置及びその製造方法 | |
CN111755390A (zh) | 功率模块 | |
CN113594103A (zh) | 半导体电路 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180726 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180806 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181102 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190417 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190516 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6530498 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |