JP6522306B2 - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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JP6522306B2
JP6522306B2 JP2014202300A JP2014202300A JP6522306B2 JP 6522306 B2 JP6522306 B2 JP 6522306B2 JP 2014202300 A JP2014202300 A JP 2014202300A JP 2014202300 A JP2014202300 A JP 2014202300A JP 6522306 B2 JP6522306 B2 JP 6522306B2
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particles
resin
target surface
particle
removal target
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JP2016072517A5 (enrdf_load_stackoverflow
JP2016072517A (ja
Inventor
松嶋　大輔
大輔 松嶋
出村　健介
健介 出村
中村　聡
中村　　聡
将文 鈴木
将文 鈴木
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2014202300A 2014-09-30 2014-09-30 基板処理装置及び基板処理方法 Active JP6522306B2 (ja)

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JP2014202300A JP6522306B2 (ja) 2014-09-30 2014-09-30 基板処理装置及び基板処理方法

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JP2014202300A JP6522306B2 (ja) 2014-09-30 2014-09-30 基板処理装置及び基板処理方法

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JP2016072517A JP2016072517A (ja) 2016-05-09
JP2016072517A5 JP2016072517A5 (enrdf_load_stackoverflow) 2017-11-09
JP6522306B2 true JP6522306B2 (ja) 2019-05-29

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10384238B2 (en) 2007-09-17 2019-08-20 Rave Llc Debris removal in high aspect structures
US10330581B2 (en) 2007-09-17 2019-06-25 Rave Llc Debris removal from high aspect structures
TWI764926B (zh) 2016-09-27 2022-05-21 美商伊路米納有限公司 產生壓印無殘餘基板表面之方法和流量槽
JP7175620B2 (ja) * 2018-03-30 2022-11-21 キヤノン株式会社 型を用いて基板上の組成物を成形する成形装置、成形方法、および物品の製造方法
DE102018206278A1 (de) 2018-04-24 2019-10-24 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Entfernen eines Partikels von einer photolithographischen Maske
JP7551694B2 (ja) * 2021-11-12 2024-09-17 キヤノン株式会社 異物除去方法、異物除去装置、及び物品の製造方法
TW202320130A (zh) * 2021-11-12 2023-05-16 日商佳能股份有限公司 粒子移除方法、粒子移除設備及製造物品的方法

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JPS6023024A (ja) * 1983-07-20 1985-02-05 Atake Ind:Kk 液体注出器等の使い捨てチツプの製造方法
JPS61242389A (ja) * 1985-04-19 1986-10-28 Hitachi Ltd 電磁記憶デバイスの異物除去方法
JPS61245536A (ja) * 1985-04-24 1986-10-31 Hitachi Ltd 電子素子の製造方法
JPS63124531A (ja) * 1986-11-14 1988-05-28 Hitachi Ltd 平滑面清掃方法
JP2000228439A (ja) * 1999-02-05 2000-08-15 Advantest Corp ステージ上のパーティクル除去方法及び清掃板
JP2005084582A (ja) * 2003-09-11 2005-03-31 Sii Nanotechnology Inc フォトマスクのパーティクル除去方法
JP2006326716A (ja) * 2005-05-24 2006-12-07 Sony Corp 挟持具および挟持装置ならびに挟持方法
JP2009265176A (ja) * 2008-04-22 2009-11-12 Toshiba Corp 異物除去方法、異物除去装置および半導体装置の作製方法
JP6045787B2 (ja) * 2011-12-05 2016-12-14 Ntn株式会社 異物除去装置および異物除去方法

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