JP6515569B2 - 温度センサ - Google Patents

温度センサ Download PDF

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Publication number
JP6515569B2
JP6515569B2 JP2015028277A JP2015028277A JP6515569B2 JP 6515569 B2 JP6515569 B2 JP 6515569B2 JP 2015028277 A JP2015028277 A JP 2015028277A JP 2015028277 A JP2015028277 A JP 2015028277A JP 6515569 B2 JP6515569 B2 JP 6515569B2
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Japan
Prior art keywords
insulating film
temperature sensor
case
thermistor
pair
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JP2015028277A
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English (en)
Japanese (ja)
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JP2016151450A5 (enrdf_load_stackoverflow
JP2016151450A (ja
Inventor
敬治 白田
敬治 白田
中村　賢蔵
賢蔵 中村
長友　憲昭
憲昭 長友
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Priority to JP2015028277A priority Critical patent/JP6515569B2/ja
Publication of JP2016151450A publication Critical patent/JP2016151450A/ja
Publication of JP2016151450A5 publication Critical patent/JP2016151450A5/ja
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Publication of JP6515569B2 publication Critical patent/JP6515569B2/ja
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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Thermistors And Varistors (AREA)
JP2015028277A 2015-02-17 2015-02-17 温度センサ Active JP6515569B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015028277A JP6515569B2 (ja) 2015-02-17 2015-02-17 温度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015028277A JP6515569B2 (ja) 2015-02-17 2015-02-17 温度センサ

Related Child Applications (1)

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JP2018194025A Division JP6791225B2 (ja) 2018-10-15 2018-10-15 温度センサ

Publications (3)

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JP2016151450A JP2016151450A (ja) 2016-08-22
JP2016151450A5 JP2016151450A5 (enrdf_load_stackoverflow) 2018-01-25
JP6515569B2 true JP6515569B2 (ja) 2019-05-22

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ID=56696419

Family Applications (1)

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JP2015028277A Active JP6515569B2 (ja) 2015-02-17 2015-02-17 温度センサ

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JP (1) JP6515569B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106556472A (zh) * 2016-11-23 2017-04-05 合肥舒实工贸有限公司 温度传感器
CN107271065B (zh) * 2017-06-07 2019-12-13 佛山市程显科技有限公司 一种电热容器传感封装结构
CN107167256B (zh) * 2017-06-07 2020-02-14 佛山市程显科技有限公司 一种温度传感器封装结构
CN107219018B (zh) * 2017-06-07 2019-12-17 佛山市程显科技有限公司 一种pcb封装温度传感器
CN107167260B (zh) * 2017-06-07 2020-02-14 佛山市程显科技有限公司 一种热敏传感器
JP6888439B2 (ja) 2017-06-28 2021-06-16 株式会社デンソー 温度センサ
JP6791225B2 (ja) * 2018-10-15 2020-11-25 三菱マテリアル株式会社 温度センサ
JP2022038819A (ja) * 2020-08-27 2022-03-10 ミネベアミツミ株式会社 モジュール及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553393Y1 (enrdf_load_stackoverflow) * 1970-06-17 1980-01-26
JPH07159248A (ja) * 1993-12-07 1995-06-23 Nireco Corp 接触型温度検出器
JP2011043486A (ja) * 2009-08-24 2011-03-03 Mitsubishi Materials Corp 温度センサ
JP5928829B2 (ja) * 2013-01-31 2016-06-01 三菱マテリアル株式会社 温度センサ

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JP2016151450A (ja) 2016-08-22

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