JP6498910B2 - Processing method of device including PCB - Google Patents
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- JP6498910B2 JP6498910B2 JP2014221346A JP2014221346A JP6498910B2 JP 6498910 B2 JP6498910 B2 JP 6498910B2 JP 2014221346 A JP2014221346 A JP 2014221346A JP 2014221346 A JP2014221346 A JP 2014221346A JP 6498910 B2 JP6498910 B2 JP 6498910B2
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- 238000003672 processing method Methods 0.000 title claims description 20
- 239000007788 liquid Substances 0.000 claims description 67
- 238000004140 cleaning Methods 0.000 claims description 62
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 53
- 239000000126 substance Substances 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 17
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 9
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 7
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 6
- 239000003350 kerosene Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 230000001804 emulsifying effect Effects 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 5
- 230000003204 osmotic effect Effects 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 3
- -1 alkyl naphthalene sulfonate Chemical compound 0.000 claims description 3
- 238000004062 sedimentation Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 230000001112 coagulating effect Effects 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 150000003071 polychlorinated biphenyls Polymers 0.000 description 7
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- 238000004519 manufacturing process Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010007269 Carcinogenicity Diseases 0.000 description 1
- 206010043275 Teratogenicity Diseases 0.000 description 1
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- 230000007670 carcinogenicity Effects 0.000 description 1
- 231100000260 carcinogenicity Toxicity 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000010735 electrical insulating oil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 238000001223 reverse osmosis Methods 0.000 description 1
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Description
本発明は、ＰＣＢを内包する機器の処理方法に関する。
更に詳しくは、安全かつ効率的に、ＰＣＢを内包する機器からＰＣＢを抜き出し、同機器を洗浄して清浄化できる処理方法に関する。
なお、本明細書および本特許請求の範囲において、用語「ＰＣＢ」はPoly Chlorinated Biphenylの略であり、また、一部記載を除き、「ＰＣＢ」は、ＰＣＢを含んだ液体も含む意味で使用している。
The present invention relates to a processing method for a device containing a PCB.
More specifically, the present invention relates to a processing method that can safely and efficiently extract a PCB from a device containing the PCB, and clean and clean the device.
In the present specification and claims, the term “PCB” is an abbreviation for Poly Chlorinated Biphenyl, and “PCB” is used to include liquids containing PCB, except for some descriptions. ing.
ＰＣＢは、１９６８年のカネミ油症事件が起こる前までは、熱安定性、電気絶縁性、耐薬品性等の化学的特性から、加熱用／冷却用熱媒体、コンデンサ等の電気機器の絶縁油、可塑剤、塗料、ノンカーボン紙の溶剤等、非常に幅広い分野に用いられていたが、発癌性、催奇性といった毒性が認められたため、１９７５年施行の「化学物質の審査及び製造等の規制に関する法律」によって製造および使用が禁止されている。しかしながら、禁止前に製造販売された電気機器については、その使用が規制されていなかった。 Before the 1968 Kanemi oil symptom incident occurred, PCBs were used for insulating oils and plastics for heating / cooling heating media, capacitors, and other electrical equipment because of their chemical properties such as thermal stability, electrical insulation, and chemical resistance. It was used in a very wide range of fields such as chemicals, paints, solvents for non-carbon paper, etc., but toxicities such as carcinogenicity and teratogenicity were observed. ”Is prohibited by the manufacture and use. However, the use of electrical equipment manufactured and sold before the prohibition was not regulated.
また、２００１年には「ポリ塩化ビフェニル廃棄物の適正な処理の推進に関する特別措置法（以下「ＰＣＢ特別措置法」という。）」が制定され、２０１６年までにＰＣＢを内包する機器等の処理を図ることとしていた。 In 2001, the “Special Measures Act on Promotion of Appropriate Treatment of Polychlorinated Biphenyl Waste” (hereinafter referred to as “PCB Special Measures Act”) was enacted, and the processing of equipment that contains PCBs by 2016. I was going to plan.
一方、ＰＣＢの使用等が禁止されてから４０年近い歳月が経過しており、ＰＣＢを包含する機器の老朽化、保管されたＰＣＢを含む廃棄物を収めた容器の腐食等が問題となっている。ＰＣＢの処理においては、ＰＣＢを包含した機器のみならず、最終的には、抜き出したＰＣＢを保管する容器についても洗浄等して清浄化する必要がある。 On the other hand, nearly 40 years have passed since the use of PCBs was banned, and aging of equipment including PCBs, corrosion of containers containing waste containing stored PCBs, etc. became a problem. ing. In the PCB processing, it is necessary to clean not only the equipment including the PCB but also the container for storing the extracted PCB by cleaning or the like.
このような処理方法として、下記非特許文献１に、高圧トランス等のＰＣＢを包含する電気機器の処理方法が開示されており、溶剤洗浄法や、真空加熱分離装置による分離法が記載されている。 As such a treatment method, the following Non-Patent Document 1 discloses a treatment method for electrical equipment including PCB such as a high-voltage transformer, and describes a solvent cleaning method and a separation method using a vacuum heating separation device. .
しかしながら、上記非特許文献１に開示されている現在の処理方法では、ＰＣＢを包含する機器を持ち込んで処理するまでに１４日程かかっており、全量処理を行うにあたって設定された目標時期の２０１６年には間に合わず、２０２７年まで先送りされるほど処理が遅れており、大きな社会問題となっている。このため、安全かつ効率的に行うことができる処理方法の確立が望まれている。 However, in the current processing method disclosed in Non-Patent Document 1, it takes about 14 days to bring in a device including PCB and process it, and in 2016, which is the target time set for performing the total amount processing. Is not in time, processing is delayed as it is postponed until 2027, which is a big social problem. For this reason, establishment of the processing method which can be performed safely and efficiently is desired.
本発明は、以上の点を鑑みて創案されたものであり、安全かつ効率的に、ＰＣＢを内包する機器からＰＣＢを抜き出し、同機器を洗浄して清浄化できる処理方法を提供することを目的とするものである。 The present invention was devised in view of the above points, and an object of the present invention is to provide a processing method that can safely and efficiently extract a PCB from a device containing the PCB, and clean and clean the device. It is what.
上記の目的を達成するためにＰＣＢを内包する機器の処理方法は、ＰＣＢまたはＰＣＢを含む液体を包含した被処理物の内部から、同液体を吸引して回収する第１のステップと、ファインバブル水を加熱および加圧して成された亜臨界水を第１の洗浄液として、前記被処理物の内部へ高圧で噴霧して同被処理物内を洗浄し、使用された同第１の洗浄液を回収する第２のステップと、ファインバブル水へ、洗浄作用、付着物除去作用、乳化分散作用、浸透作用、を付加する化学薬品を混合および撹拌して成る第１液に、ケロシンと界面活性剤を更に混合すると共に加熱および加圧して成された亜臨界水を第２の洗浄液として、前記被処理物の内部へ高圧で噴霧し、同第２の洗浄液を一定時間浸透させた後に超音波洗浄を行って同被処理物内を洗浄し、使用された同第２の洗浄液を回収する第３のステップとを備える。 In order to achieve the above object, a processing method of a device including PCB includes a first step of sucking and collecting the liquid from the inside of the workpiece including PCB or the liquid containing PCB, and fine bubbles. Subcritical water formed by heating and pressurizing water is used as a first cleaning liquid to spray the inside of the object to be processed at a high pressure to clean the inside of the object to be processed, and the used first cleaning liquid Kerosene and surfactant in the second step of collecting, and mixing and stirring chemicals that add cleaning action, deposit removal action, emulsifying dispersion action, and permeation action to fine bubble water Is further mixed, heated and pressurized as subcritical water as a second cleaning liquid, sprayed at a high pressure into the object to be treated, and infiltrated with the second cleaning liquid for a certain period of time, followed by ultrasonic cleaning. To clean the object to be treated And, and a third step of recovering the same second cleaning solution used.
前記発明は、回収した前記第１の洗浄液および前記第２の洗浄液を油水分離し、凝集沈降させる第４のステップを備えるものであってもよい。 The invention may include a fourth step in which the recovered first cleaning liquid and the second cleaning liquid are oil-water separated and agglomerated and settled.
前記発明は、前記第４のステップにおいて分離した水を濾過し、濾過した水を前記第１の洗浄液および前記第２の洗浄液の原料として再利用するものであってもよい。 The said invention may filter the water isolate | separated in the said 4th step, and reuse the filtered water as a raw material of a said 1st washing | cleaning liquid and a said 2nd washing | cleaning liquid.
前記発明は、前記第４のステップにおいて分離したＰＣＢ、油あるいは化学薬品を回収して容器に保管するものであってもよい。 In the invention, the PCB, oil, or chemical separated in the fourth step may be collected and stored in a container.
前記発明は、前記第２ステップおよび前記第３ステップ、または、前記第２ステップあるいは前記第３ステップのいずれか、における前記亜臨界水を得るための工程が、材料を加圧容器へ入れ、１４０〜２００℃での加熱および１５〜２０Ｍｐａでの加圧を３０分〜２時間行うものであってもよい。 In the invention, the step of obtaining the subcritical water in the second step and the third step, or the second step or the third step, puts the material into a pressurized container, 140 Heating at ˜200 ° C. and pressurization at 15 to 20 MPa may be performed for 30 minutes to 2 hours.
前記発明は、前記第２の洗浄液に係る洗浄作用を付加する化学薬品が、1,4-ジオキサンであってもよい。 In the present invention, the chemical that adds the cleaning action related to the second cleaning liquid may be 1,4-dioxane.
前記発明は、前記第２の洗浄液に係る付着物除去作用を付加する化学薬品が、1.3-ジメキル-2-イミダゾリジノンであってもよい。 In the present invention, the chemical agent for adding a deposit removing action according to the second cleaning liquid may be 1.3-dimethylol-2-imidazolidinone.
前記発明は、前記第２の洗浄液に係る乳化分散作用を付加する化学薬品が、アルキルナフタレンスルホン酸塩であってもよい。 In the present invention, the chemical agent for adding an emulsifying and dispersing action according to the second cleaning liquid may be an alkyl naphthalene sulfonate.
前記発明は、前記第２の洗浄液に係る浸透作用を付加する化学薬品が、アルキルスルホン酢酸塩であってもよい。 In the present invention, the chemical agent that adds the osmotic action related to the second cleaning liquid may be an alkylsulfone acetate.
前記発明は、前記第２の洗浄液に、特殊溶剤としてメチルヘキシルケトンを更に加えたものであってもよい。 In the present invention, methylhexyl ketone may be further added as a special solvent to the second cleaning liquid.
前記発明は、前記第２の洗浄液に係る界面活性剤がノニルフェノールエーテルであってもよい。 In the invention, the surfactant according to the second cleaning liquid may be nonylphenol ether.
前記発明は、前記第１液が、ファインバブル水８０％と、1,4-ジオキサン５％と、1.3-ジメキル-2-イミダゾリジノン５％と、アルキルナフタレンスルホン酸塩２．５％と、アルキルスルホン酢酸塩２．５％と、メチルヘキシルケトン５％の比率で混合されたものであってもよい。 In the invention, the first liquid is composed of 80% fine bubble water, 5% 1,4-dioxane, 5% 1.3-dimethyl-2-imidazolidinone, 2.5% alkylnaphthalene sulfonate, It may be a mixture of 2.5% alkylsulfone acetate and 5% methyl hexyl ketone.
前記発明は、前記第２の洗浄液が、第１液７４％と、ケロシン２５％と、ノニルフェノールエーテル１％の比率で混合されたものであってもよい。 In the present invention, the second cleaning liquid may be a mixture of 74% of the first liquid, 25% of kerosene, and 1% of nonylphenol ether.
本発明によれば、安全かつ効率的に、ＰＣＢを内包する機器からＰＣＢを抜き出し、同機器を洗浄して清浄化できる、ＰＣＢを内包する機器の処理方法を提供できる。 ADVANTAGE OF THE INVENTION According to this invention, the processing method of the apparatus which includes PCB which can extract PCB from the apparatus which includes PCB safely, and can wash | clean and clean the apparatus can be provided.
図１を参照して、本発明の実施の形態について更に詳細に説明する。 The embodiment of the present invention will be described in more detail with reference to FIG.
実施例１において使用する被処理物、洗浄液に使用する薬剤等は以下の通りである。
（被処理物）
実施例１において、被処理物はコンデンサであり、ＰＣＢと油を含む液体（電気絶縁油）を包含している。なお、これに限定するものではなく、例えばトランスその他の、ＰＣＢのみ、または、ＰＣＢを含む液体を包含した被処理物が処理対象物となりうる。
The processing object used in Example 1, the chemical | medical agent etc. which are used for a washing | cleaning liquid are as follows.
(Processed object)
In the first embodiment, the object to be processed is a capacitor and includes a liquid (electrical insulating oil) containing PCB and oil. However, the present invention is not limited to this. For example, an object to be processed including a transformer or other PCB alone or a liquid containing PCB can be a processing object.
（ファインバブル水）
実施例１において、ファインバブル水は、平均粒子径が１００ｎｍ程度の気泡が、
１ｍＬ中の数密度で約１億個／ｍＬが含まれる水であり、ファインバブル製造装置により生成される。なお、これに限定するものではなく、例えば、平均粒子径が１００〜３００ｎｍ程度であってもよいし、１ｍＬ中の数密度は５０００万個〜１億個／ｍＬであってもよい。
(Fine bubble water)
In Example 1, fine bubble water has bubbles with an average particle diameter of about 100 nm.
It is water containing about 100 million pieces / mL at a density of 1 mL, and is produced by a fine bubble manufacturing apparatus. In addition, it is not limited to this, For example, an average particle diameter may be about 100-300 nm, and the number density in 1 mL may be 50 million-100 million pieces / mL.
（第１の洗浄液） (First cleaning solution)
第１の洗浄液は、ファインバブル水を加圧容器へ入れ、２００℃での加熱および２０Ｍｐａでの加圧を２時間行うことによって亜臨界水としたものである。なお、これに限定するものではなく、例えば、加熱温度は１４０〜２００℃であってもよいし、加圧する圧力は１５〜２０Ｍｐａであってもよいし、時間は３０分〜２時間であってもよい。
（第２の洗浄液）
A 1st washing | cleaning liquid is made into subcritical water by putting fine bubble water into a pressurized container, and heating at 200 degreeC and pressurizing at 20 Mpa for 2 hours. In addition, it is not limited to this, For example, the heating temperature may be 140-200 degreeC, the pressure to pressurize may be 15-20 Mpa, and time is 30 minutes-2 hours, Also good.
(Second cleaning liquid)
第２の洗浄液に係る第１液は、「洗浄作用を付加する化学薬品」が1,4-ジオキサンであり、「付着物除去作用を付加する化学薬品」が1.3-ジメキル-2-イミダゾリジノンであり、「乳化分散作用を付加する化学薬品」がアルキルナフタレンスルホン酸塩であり、「浸透作用を付加する化学薬品」がアルキルスルホン酢酸塩である。加えて、特殊溶剤としてメチルヘキシルケトンを更に加えている。 The first liquid related to the second cleaning liquid has 1,4-dioxane as the “chemicals that add a cleaning action” and 1.3-dimethylol-2-imidazolidinone as the “chemicals that add a deposit removing action”. The “chemical agent that adds an emulsifying and dispersing action” is an alkylnaphthalene sulfonate, and the “chemical agent that adds an osmotic action” is an alkylsulfone acetate. In addition, methylhexyl ketone is further added as a special solvent.
なお、ここで、1.3-ジメキル-2-イミダゾリジノンは、表面洗浄作用を付加する化学薬品でもある。また、ここで、アルキルナフタレンスルホン酸塩は、浸透作用を付加する化学薬品でもある。更に、ここで、アルキルスルホン酢酸塩は、洗浄作用および乳化作用を付加する化学薬品でもある。 Here, 1.3-dimethylol-2-imidazolidinone is also a chemical that adds a surface cleaning action. Here, the alkyl naphthalene sulfonate is also a chemical that adds osmotic action. Furthermore, here, the alkylsulfone acetate is also a chemical that adds cleaning and emulsifying effects.
第１液は、ファインバブル水８０％と、1,4-ジオキサン５％と、1.3-ジメキル-2-イミダゾリジノン５％と、アルキルナフタレンスルホン酸塩２．５％と、アルキルスルホン酢酸塩２．５％と、メチルヘキシルケトン５％の比率で混合されたものである。 The first solution consists of 80% fine bubble water, 5% 1,4-dioxane, 5% 1.3-dimethyl-2-imidazolidinone, 2.5% alkylnaphthalene sulfonate, and alkylsulfone acetate 2 0.5% and 5% methyl hexyl ketone.
第２の洗浄液に係る第２液は、「界面活性剤」がノニルフェノールエーテルである。 In the second liquid according to the second cleaning liquid, the “surfactant” is nonylphenol ether.
第２の洗浄液は、第１液７４％と、ケロシン２５％と、ノニルフェノールエーテル１％の比率で混合されたものである。 The second cleaning liquid is a mixture of 74% of the first liquid, 25% of kerosene, and 1% of nonylphenol ether.
なお、第２の洗浄液に係る第１液の化学薬品名とその使用目的（作用）、ＣＡＳ Ｎｏ、各薬品の添加量（配合比率）、および、第１液とその他の薬品との配合比率について、表１にまとめている。 In addition, about the chemical name of the 1st liquid which concerns on a 2nd washing | cleaning liquid, its use purpose (action), CAS No, the addition amount (mixing ratio) of each chemical, and the mixing ratio of the 1st liquid and other chemicals These are summarized in Table 1.
第２の洗浄液は、上記表１に記載された各要素を加圧容器へ入れ、２００℃での加熱および２０Ｍｐａでの加圧を２時間行うことによって亜臨界水としたものである。なお、これに限定するものではなく、例えば、加熱温度は１４０〜２００℃であってもよいし、加圧する圧力は１５〜２０Ｍｐａであってもよいし、時間は３０分〜２時間であってもよい。 A 2nd washing | cleaning liquid is made into subcritical water by putting each element described in the said Table 1 into a pressure vessel, and heating at 200 degreeC and pressurizing at 20 Mpa for 2 hours. In addition, it is not limited to this, For example, the heating temperature may be 140-200 degreeC, the pressure to pressurize may be 15-20 Mpa, and time is 30 minutes-2 hours, Also good.
〔ＰＣＢを内包する機器の処理方法〕
図１を参照して、本実施例におけるＰＣＢを内包する機器（コンデンサ）の処理方法を説明する。
本実施例におけるＰＣＢを内包する機器の処理方法は、第１ステップと、第２ステップと、第３ステップと、第４ステップからなり、以下詳述する。
[Processing method for equipment containing PCB]
With reference to FIG. 1, the processing method of the apparatus (capacitor) which contains PCB in a present Example is demonstrated.
The processing method of the device including the PCB in this embodiment includes a first step, a second step, a third step, and a fourth step, which will be described in detail below.
（第１ステップ）
コンデンサの容器内部から、吸引ポンプによりＰＣＢを可能な限り吸引し、一時タンクに保管する。そして、一時タンクから、安定して保管できる保管容器に移し替えて、最終処分まで保管する。
この作業により、まずは粗方のＰＣＢを吸引回収されるので、コンデンサの容器内の表面や隙間に僅かなＰＣＢが残った状態となる。
(First step)
The PCB is sucked as much as possible from the inside of the condenser container by a suction pump and stored in a temporary tank. Then, the temporary tank is transferred to a storage container that can be stably stored, and stored until final disposal.
By this operation, the rough PCB is first sucked and collected, so that a slight amount of PCB remains on the surface or gap in the capacitor container.
（第２ステップ）
ファインバブル製造装置により、ファインバブル水を生成する。なお、このファインバブル製造装置は、第３ステップで使用するファインバブル水の製造にも利用される。
ファインバブル水を加圧容器へ入れて加熱加圧して亜臨界水とし、第１の洗浄液として精製する。
第１の洗浄液を、コンデンサの容器内へ高圧で噴霧して内部を洗浄する。そして、使用された第１の洗浄液は、回収され、洗浄水回収タンク内に一時保管される。
(Second step)
Fine bubble water is produced by a fine bubble production apparatus. This fine bubble production apparatus is also used for producing fine bubble water used in the third step.
Fine bubble water is put into a pressure vessel, heated and pressurized to make subcritical water, and purified as a first cleaning liquid.
The first cleaning liquid is sprayed at a high pressure into the container of the capacitor to clean the inside. Then, the used first cleaning liquid is recovered and temporarily stored in the cleaning water recovery tank.
ファインバブルの液体を洗浄に使用した場合、気泡表面の活性化が高く、汚れ成分を界面に吸着させることができる効果があることは、一般的に知られている。本実施例では、このファインバブルの効果を更に高めるべく、ファインバブル水を加熱加圧して亜臨界水としている。 When a fine bubble liquid is used for cleaning, it is generally known that the bubble surface has high activation and has an effect of adsorbing a dirt component to the interface. In this embodiment, in order to further enhance the effect of the fine bubbles, the fine bubble water is heated and pressurized to obtain subcritical water.
通常の水の誘電率の値が８０程度であるのに対し、亜臨界水は誘電率の値が２０〜３０程度であって、油を溶かすことに用いられるエタノールに近づくので、油を溶かす性質を有するようになる。つまり、第１の洗浄液は、ファインバブル水を亜臨界水とすることで、互いの相乗効果を得たものであり、単なる水に溶剤効果を持たせることができる。
この結果、ＰＣＢを内包する機器（コンデンサ）の洗浄作業における化学薬品の使用量を抑制することができる。
The value of dielectric constant of normal water is about 80, whereas subcritical water has a value of dielectric constant of about 20 to 30, which is close to ethanol used to dissolve oil, so that it dissolves oil. Will have. That is, the 1st washing | cleaning liquid obtained the mutual synergistic effect by making fine bubble water into subcritical water, and can give a solvent effect to mere water.
As a result, the amount of chemicals used in the cleaning operation of the device (capacitor) containing the PCB can be suppressed.
（第３ステップ）
第２ステップで生成したファインバブル水と、表１に記載した各化学薬品を混合し、６０分間撹拌して第１液を生成する。
第１液にケロシン、ノニルフェノールエーテルを混合したものを加圧容器へ入れて加熱加圧して亜臨界水とし、第２の洗浄液として精製する。なお、ノニルフェノールエーテルは、低気泡性のものを選定する。
(Third step)
The fine bubble water produced | generated at the 2nd step and each chemical agent described in Table 1 are mixed, and it stirs for 60 minutes, and produces | generates 1st liquid.
A mixture of kerosene and nonylphenol ether in the first liquid is put into a pressure vessel, heated and pressurized to obtain subcritical water, and purified as a second cleaning liquid. In addition, nonyl phenol ether selects a low-bubble thing.
第２の洗浄液を、コンデンサの容器内へ高圧で噴霧して、一定時間、内部に浸透させる。浸透させた後、超音波洗浄を行う。この超音波洗浄は、低い周波数によりキャビテーションを発生させることにより行われ、超音波の作用により真空の泡が発生し、汚れを直接分解して洗浄する。
そして、使用された第２の洗浄液は、回収され、洗浄水回収タンク内に一時保管される。
The second cleaning liquid is sprayed at a high pressure into the container of the condenser and allowed to penetrate inside for a certain time. After soaking, ultrasonic cleaning is performed. This ultrasonic cleaning is performed by generating cavitation at a low frequency, and vacuum bubbles are generated by the action of ultrasonic waves, and dirt is directly decomposed and cleaned.
Then, the used second cleaning liquid is recovered and temporarily stored in the cleaning water recovery tank.
なお、第２の洗浄液は、先に述べた亜臨界水としたファインバブル水の効果を有していると共に、混合された各化学薬品が表１に示す使用目的に記載された各々の作用を奏することで、より洗浄効果が高められており、先に述べた超音波洗浄の効果と相まって、コンデンサ内に残存するＰＣＢを洗浄除去することができる。 The second cleaning liquid has the effect of fine bubble water as the subcritical water described above, and each of the mixed chemicals has each action described in the purpose of use shown in Table 1. As a result, the cleaning effect is further enhanced, and the PCB remaining in the capacitor can be cleaned and removed in combination with the ultrasonic cleaning effect described above.
（第４ステップ）
洗浄水回収タンク内に保管された第１の洗浄液と第２の洗浄液をひとまとめにし、シックナー等の油水分離と凝集沈降が可能な装置を用いて、油水分離と、凝集沈降がなされる。
このとき、ＰＣＢは化合物の状態では水に溶けないので、水とＰＣＢは分離し、分離された水は逆浸透膜等のフィルターを通過させることで、化学薬品と分離される。
この結果、水は、清浄化されているので、還流させてファインバブル水の原料として再利用する。また、分離されたＰＣＢ、油あるいは化学薬品は、回収して容器に保管する。
(4th step)
The first cleaning liquid and the second cleaning liquid stored in the cleaning water recovery tank are collected together, and oil / water separation and coagulation / sedimentation are performed using an apparatus capable of oil / water separation and coagulation / sedimentation such as thickener.
At this time, since PCB does not dissolve in water in a compound state, water and PCB are separated, and the separated water is separated from chemicals by passing through a filter such as a reverse osmosis membrane.
As a result, since the water is purified, it is refluxed and reused as a raw material for fine bubble water. The separated PCB, oil or chemical is collected and stored in a container.
このように、本実施例の処理方法によれば、ＰＣＢを内包するコンデンサからＰＣＢを抜き出した後、僅かに残るコンデンサ内のＰＣＢについても、安全かつ効率的に、ほぼ完全に洗浄化することができる。 As described above, according to the processing method of this embodiment, the PCB in the capacitor remaining slightly after the PCB is extracted from the capacitor containing the PCB can be cleaned almost completely safely and efficiently. it can.
また、この処理方法によれば、作業液に使用する水に加える化学薬品の使用量を抑えることができ、更に、洗浄液の主原料たる水が再利用できることから大規模水処理施設が不要であるため、従来の処理方法と比較して、建設コストおよび運用コストを抑制することができる。 Further, according to this treatment method, the amount of chemicals added to the water used for the working liquid can be suppressed, and further, the water as the main raw material of the cleaning liquid can be reused, so that a large-scale water treatment facility is unnecessary. Therefore, compared with the conventional processing method, construction cost and operation cost can be suppressed.
本明細書および本特許請求の範囲で使用している用語と表現は、あくまでも説明上のものであって、なんら限定的なものではなく、本明細書および本特許請求の範囲に記述された特徴およびその一部と等価の用語や表現を除外する意図はない。また、本発明の技術思想の範囲内で、種々の変形態様が可能であるということは言うまでもない。 The terms and expressions used in the present specification and claims are for illustrative purposes only, and are not limiting at all. Features described in the present specification and claims. And there is no intention to exclude terms and expressions equivalent to those. It goes without saying that various modifications are possible within the scope of the technical idea of the present invention.
Claims (9)
ファインバブル水を加熱および加圧して成された亜臨界水を第１の洗浄液として、前記被処理物の内部へ高圧で噴霧して同被処理物内を洗浄し、使用された同第１の洗浄液を回収する第２のステップと、
ファインバブル水へ、洗浄作用を付加する1,4-ジオキサン、付着物除去作用を付加する1.3-ジメキル-2-イミダゾリジノン、乳化分散作用を付加するアルキルナフタレンスルホン酸塩、および、浸透作用を付加するアルキルスルホン酢酸塩を混合および撹拌して成る第１液に、ケロシンと界面活性剤を更に混合すると共に加熱および加圧して成された亜臨界水を第２の洗浄液として、前記被処理物の内部へ高圧で噴霧し、同第２の洗浄液を一定時間浸透させた後に超音波洗浄を行って同被処理物内を洗浄し、使用された同第２の洗浄液を回収する第３のステップとを備える
ＰＣＢを内包する機器の処理方法。 A first step of sucking and collecting the liquid from the inside of the object to be processed including PCB or the liquid containing PCB;
Subcritical water formed by heating and pressurizing fine bubble water is used as a first cleaning liquid to spray the inside of the object to be processed at a high pressure to clean the inside of the object to be processed. A second step of collecting the cleaning liquid;
1,4-dioxane for adding cleaning action to fine bubble water, 1.3-dimethylol-2-imidazolidinone for adding deposit removing action , alkyl naphthalene sulfonate for adding emulsifying and dispersing action, and osmotic action The above-mentioned object to be treated is obtained by using subcritical water formed by further mixing kerosene and a surfactant and heating and pressurizing the first liquid obtained by mixing and stirring the alkylsulfone acetate to be added as a second cleaning liquid. A third step of spraying the inside of the container with high pressure, infiltrating the second cleaning liquid for a certain period of time, and then performing ultrasonic cleaning to clean the inside of the object to be processed and recovering the used second cleaning liquid A processing method for a device including a PCB.
請求項１記載のＰＣＢを内包する機器の処理方法。 The processing method of the apparatus which contains PCB of Claim 1 provided with the 4th step which carries out oil-water separation of the collect | recovered said 1st washing | cleaning liquid and said 2nd washing | cleaning liquid, and coagulating sedimentation.
請求項２記載のＰＣＢを内包する機器の処理方法。 The method for processing a device containing a PCB according to claim 2, wherein the water separated in the fourth step is filtered, and the filtered water is reused as a raw material for the first cleaning liquid and the second cleaning liquid.
請求項２または請求項３記載のＰＣＢを内包する機器の処理方法。 The method for processing a device containing a PCB according to claim 2 or 3, wherein the PCB, oil, or chemical separated in the fourth step is collected and stored in a container.
請求項１、請求項２、請求項３または請求項４記載のＰＣＢを内包する機器の処理方法。 The step of obtaining the subcritical water in the second step and the third step, or the second step or the third step, puts the material into a pressurized container at 140 to 200 ° C. The method for processing a device containing PCB according to claim 1, claim 2, claim 3, or claim 4, wherein the heating and the pressurization at 15 to 20 MPa are performed for 30 minutes to 2 hours.
請求項１、請求項２、請求項３、請求項４または請求項５記載のＰＣＢを内包する機器の処理方法。The processing method of the apparatus which contains PCB of Claim 1, Claim 2, Claim 3, Claim 4 or Claim 5.
請求項１、請求項２、請求項３、請求項４、請求項５または請求項６記載のＰＣＢを内包する機器の処理方法。The processing method of the apparatus which contains PCB of Claim 1, Claim 2, Claim 3, Claim 4, Claim 5 or Claim 6.
請求項１、請求項２、請求項３、請求項４、請求項５、請求項６または請求項７記載のＰＣＢを内包する機器の処理方法。A processing method for a device containing a PCB according to claim 1, claim 2, claim 3, claim 4, claim 5, claim 6 or claim 7.
請求項１、請求項２、請求項３、請求項４、請求項５、請求項６、請求項７または請求項８記載のＰＣＢを内包する機器の処理方法。A processing method for a device containing a PCB according to claim 1, 2, 3, 4, 5, 6, 7, or 8.
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