JP6486215B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP6486215B2
JP6486215B2 JP2015121639A JP2015121639A JP6486215B2 JP 6486215 B2 JP6486215 B2 JP 6486215B2 JP 2015121639 A JP2015121639 A JP 2015121639A JP 2015121639 A JP2015121639 A JP 2015121639A JP 6486215 B2 JP6486215 B2 JP 6486215B2
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plasma
processing apparatus
processing chamber
etching
plasma processing
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JP2017010972A (ja
JP2017010972A5 (cg-RX-API-DMAC7.html
Inventor
侯然 廣田
侯然 廣田
義人 釜地
義人 釜地
茂 白米
茂 白米
角屋　誠浩
誠浩 角屋
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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JP2015121639A 2015-06-17 2015-06-17 プラズマ処理装置 Active JP6486215B2 (ja)

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JP2015121639A JP6486215B2 (ja) 2015-06-17 2015-06-17 プラズマ処理装置

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JP2015121639A JP6486215B2 (ja) 2015-06-17 2015-06-17 プラズマ処理装置

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JP2017010972A JP2017010972A (ja) 2017-01-12
JP2017010972A5 JP2017010972A5 (cg-RX-API-DMAC7.html) 2018-02-22
JP6486215B2 true JP6486215B2 (ja) 2019-03-20

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11355324B2 (en) 2017-03-27 2022-06-07 Hitachi High-Tech Corporation Plasma processing method
JP7190938B2 (ja) * 2019-02-27 2022-12-16 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN115023794A (zh) * 2020-02-10 2022-09-06 株式会社日立高新技术 等离子处理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359233A (ja) * 2001-06-01 2002-12-13 Hitachi Ltd プラズマ処理装置
JP2004079609A (ja) * 2002-08-12 2004-03-11 Renesas Technology Corp 半導体装置の製造方法
US7147749B2 (en) * 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
JP5450187B2 (ja) * 2010-03-16 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP2015088696A (ja) * 2013-11-01 2015-05-07 株式会社日立ハイテクノロジーズ プラズマ処理方法

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