JP6484745B1 - Method for manufacturing light emitting device package - Google Patents

Abstract

A light emitting device package and a method for manufacturing the same are disclosed.
A method of manufacturing a light emitting device package includes a step of mounting and arranging each light emitting device unit on a substrate, and attaching a wavelength conversion member to each of the light emitting device units mounted and arranged on the substrate. And a step of filling a reflective material between the light emitting element units to which the wavelength converting member is attached to form a reflecting member, and a step of filling each of the light emitting element units to which the wavelength converting member is attached. Vertical cutting to form each light emitting device package by vertically cutting so as to surround the reflective material.
[Selection] Figure 3

Description

The present invention relates to a light emitting device package and a method for manufacturing the light emitting device package. More specifically, the present invention relates to a chip scale that can be used in a lighting device requiring high luminance such as an automobile headlight and can improve light extraction efficiency. The present invention relates to a method for manufacturing a light emitting device package .

  Among various light-emitting elements, an LED (Light Emitting Diode) is a semiconductor element that can realize light of various colors using a PN junction, and has a long life, and can be reduced in size, weight, and driven at a low voltage. It has the advantages of

  In addition, the LED is resistant to shock and vibration, does not require complicated driving, and is mounted and packaged on a substrate or a lead frame in various forms. Has been applied for.

  The LED package is also embodied in a chip scale package (CSP), but the chip scale package is coated with a translucent material so as to surround a side surface and an upper surface of the LED. Manufactured in different forms. In general, in the chip scale package, the bottom surface of the LED is exposed, so that the electrode pad of the LED can be directly bonded to the substrate.

  However, in general, since the chip scale package itself does not include a reflector, the light emitted from the LED has a disadvantage that it is difficult to provide light in an intended direction while having an appropriate luminance. In order to solve this problem, there has been proposed a technique for generating a chip scale package by further including an open bottom reflector surrounding the light emitting element. However, in this case, light between the side surface of the light emitting element and the inner side surface of the reflector leaks from the bottom surface of the light emitting element, and the luminance is lowered.

  FIG. 1 shows an example of a conventional chip scale package. As shown in FIG. 1, an LED 11 is mounted on a substrate 12, a phosphor sheet 13 is attached to the LED 11, and then a chip scale package is manufactured by dispensing white silicone 14. In such a conventional chip scale package, as shown in the drawing, the side surface of the LED 11 is surrounded by the white silicone 14, and in particular, since the reflective surface of the white silicone 14 is formed vertically, the LED 11 comes out on the side surface of the LED 11. Since light (arrow in FIG. 1) cannot be emitted to the outside and is reflected and lost by the side 15 of the white silicone 14, the overall brightness of the chip scale package is reduced. Furthermore, in such a conventional chip scale package structure, light emitted in the side surface direction does not travel forward (upper side of the LED 11 in FIG. 1) and does not pass through the phosphor sheet, so that the brightness of the chip scale package is improved. There is also a need for a plan for propagating the light emitted in the lateral direction forward. In particular, in the case of a chip scale package for application to automotive headlights and other applications used for front lighting, it is required to increase the brightness of light traveling forward, There is a need to improve the chip scale package structure.

  Further, in order to prevent a decrease in luminance, a white resin reflective wall can be formed by injecting a white series reflective resin through the upper end opening of the reflector cavity. In this case, the upper end opening of the cavity is narrow. There is a problem that it becomes difficult or impossible to secure a space for resin injection. In addition, since the white resin may contaminate the upper surface of the light emitting element and cause a decrease in light efficiency, these problems need to be improved.

JP 2014-82453 A

The problem to be solved by the present invention is to provide a method for manufacturing a light emitting device package capable of significantly improving luminance by reducing light lost in the side surface direction of the light emitting device .

Another object of the present invention is to provide a method for manufacturing a light emitting device package that can add a transparent sealing material molding and effectively radiate light output from the side surface of the light emitting device .

  A method of manufacturing a light emitting device package according to an aspect of the present invention for solving the above problems includes a step of mounting and arranging each light emitting device unit on a substrate, and each light emitting mounted and arranged on the substrate. A step of attaching a wavelength conversion member to each of the element units, a step of filling a reflective material between the light emitting element units to which the wavelength conversion member is attached to form a reflection member, and the wavelength conversion member A vertical cutting step of forming each light emitting device package by vertically cutting each of the attached light emitting device units so as to surround the reflective material.

  In one embodiment, each light emitting element unit includes a step of arranging a plurality of light emitting elements on a sheet, and a light transmitting material between the light emitting elements arranged on the sheet to form a light transmitting member. And filling each of the light emitting element units with a light emitting element and a light transmitting member. And a slanted cutting step for cutting to be inclined.

In one embodiment, in the oblique cutting step, the cross section of the section of the translucent material that is cut to be inclined is cut to be a straight plane.
In one embodiment, in each of the light emitting element units, the distance between the section of the translucent material that is cut so as to be inclined and the side surface of the light emitting element becomes narrower as it goes downward.

  In one embodiment, in the oblique cutting step, the cross section of the section of the translucent material that is cut so as to be inclined is cut so as to form a downwardly convex curved surface.

  In one embodiment, in the oblique cutting step, the cutting is performed so as to be inclined in the entire section of the light transmitting material.

  In one embodiment, in each of the light emitting element units, the distance between the translucent material and the side surface of the light emitting element becomes narrower as it goes downward.

  In one embodiment, in the oblique cutting step, cutting is performed so that a curved surface convex downward is formed in the entire section of the translucent material.

  In one embodiment, in the oblique cutting step, the lower end of the translucent material is cut away from the side surface of the light emitting device.

  In one embodiment, in each of the light emitting device packages, the outer edge of the wavelength conversion member is formed wider than the outer edge of the light emitting device.

  In one embodiment, the reflective member is formed of a white silicone material.

  A light emitting device package according to one aspect of the present invention for solving the above problems includes a substrate, a light emitting device mounted on the substrate, a reflecting member having a reflecting surface that reflects side light of the light emitting device, A light-transmitting member having a light-transmitting surface that transmits side light of the light-emitting element between the side surface of the light-emitting element and the reflecting member to the reflecting surface side of the reflecting member and is in contact with the light reflecting surface of the reflecting member; And a wavelength converting member that converts the wavelength of light emitted from the light emitting element and light reflected by the reflecting surface of the reflecting member.

  In one embodiment, the translucent surface of the translucent member becomes narrower as the distance from the side surface of the light emitting element goes downward in at least a partial section.

  In one embodiment, the translucent surface of the translucent member is a curved surface that protrudes downward at least partially in the section.

  In one embodiment, the translucent surface of the translucent member becomes narrower as the distance from the side surface of the light emitting element goes downward in the entire section.

  In one embodiment, the translucent surface of the translucent member is a straight surface in the entire section.

  In one embodiment, the translucent surface of the translucent member is a curved surface convex downward in the entire section.

  In one embodiment, the lower end of the light transmitting surface of the light transmitting member is formed to be separated from the side surface of the light emitting device.

  In one embodiment, the outer edge of the wavelength conversion member is formed wider than the outer edge of the light emitting device.

  In one embodiment, the reflective member is formed of a white silicone material.

  The method of manufacturing a light emitting device package according to another aspect of the present invention includes a light emitting device transfer step of attaching one surface of a plurality of light emitting devices to one side of the light transmissive plate, one side of the light transmissive plate, and the light emission. A transparent encapsulant molding step of molding on the side surface of the element with a transparent encapsulant, and the translucent plate is cut into an oblique line so that a cross section of the translucent plate has a first inclined surface, and the translucent A diagonal cutting step of forming a plurality of unit assemblies comprising a plate, the light emitting element and the transparent sealing material, and the diagonal cutting step is performed as the distance from one side to the other side of the translucent plate increases. Cutting is performed in a direction away from the light emitting element attached to the translucent plate.

  In one embodiment, in the transparent sealing material molding step, the transparent sealing material in a liquid state is applied and then cured so as to have a second inclined surface between the light emitting device and the translucent plate.

  In one embodiment, the gradient of the first inclined surface of the translucent plate is equal to or greater than the gradient of the second inclined surface of the transparent sealing material.

  In one embodiment, the method further includes a unit combination transfer step of attaching the other side of the light transmitting plate of the plurality of unit assemblies to the sheet after the oblique cutting step.

  In one embodiment, the method further includes an opaque encapsulant molding step of molding the periphery of the unit assembly on the sheet with an opaque encapsulant after the unit conjugate transfer step.

  In one embodiment, after the opaque sealing material molding step, a cutting step of vertically cutting the opaque sealing material around the unit assembly is separated from the sheet attached to the light transmitting plate of the unit assembly. A sheet separation step.

  In one embodiment, in the oblique cutting step, the first inclined surface of the translucent plate is cut into an oblique line so that the first inclined surface has a gradient of 55 to 75 degrees, and the first inclined surface of the translucent plate is limited. Cut into diagonal lines to have a surface roughness value less than the surface roughness.

  In one embodiment, the other surface of the light emitting device includes an electrode pad, and in the opaque sealing material molding step, the opaque sealing material is molded such that a bottom surface of the electrode pad of the light emitting device is exposed to the outside. In the opaque sealing material molding step, the opaque sealing material is molded so that the bottom surface of the electrode pad of the light emitting element and the bottom surface of the opaque sealing material are positioned on the same plane.

  According to another aspect of the present invention, there is provided a light emitting device package comprising: a translucent plate that is cut obliquely so as to have a first inclined surface; a light emitting device attached to one side of the translucent plate; A transparent sealing material that is molded on one side of the light-transmitting plate and the side surface of the light-emitting element, and is formed to have a second inclined surface between the light-emitting element and the light-transmitting plate, The first inclined surface has a surface roughness value less than the limit surface roughness.

  In one embodiment, after the transparent sealing material is applied in a liquid state, the transparent sealing material is cured to have a second inclined surface between the light emitting device and the translucent plate. In addition, the gradient of the first inclined surface of the translucent plate is equal to or greater than the gradient of the second inclined surface of the transparent sealing material.

  In one embodiment, the light emitting device package further includes an opaque sealing material molded around a unit assembly including the light transmitting plate, the light emitting device, and a transparent sealing material. At this time, the opaque sealing material is molded around the unit assembly and then vertically cut, and the outside cut surface is ground.

  In one embodiment, in the translucent plate, the first inclined surface has a gradient of 55 to 75 degrees, and the first inclined surface has a surface roughness value less than a limit surface roughness.

  In one embodiment, the light emitting device includes an electrode pad on the other surface, and the bottom surface of the electrode pad is exposed to the outside. The bottom surface of the electrode pad and the bottom surface of the opaque sealing material are formed on the same plane.

  The present invention provides a light emitting device package having a translucent surface of a translucent member formed to be inclined and a reflecting surface structure of a reflecting member, and a method of manufacturing the light emitting device package. This has the effect of reducing the amount of light and improving the brightness.

  Further, the present invention has an effect that it can be widely applied to vehicle lighting devices by providing a chip scale package having high luminance.

  In addition, the present invention includes a transparent silicone applied between the light emitting element and the translucent plate, and can effectively radiate light output from the side surface of the light emitting element, and the side surface of the translucent plate is constant. Through the structure formed to have a gradient, the light extraction efficiency of light output from the light emitting element can be improved.

It is the figure which showed an example of the conventional chip scale package. 1 is a view showing a light emitting device package according to an embodiment of the present invention. FIG. 5 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. It is a figure for demonstrating the shape of the translucent member and reflective member in the light emitting element package which concerns on one Example of this invention. It is a figure for demonstrating the shape of the translucent member and reflective member in the light emitting element package which concerns on one Example of this invention. It is a figure for demonstrating the shape of the translucent member and reflective member in the light emitting element package which concerns on one Example of this invention. It is a figure for demonstrating the shape of the translucent member and reflective member in the light emitting element package which concerns on one Example of this invention. 6 is a flowchart illustrating a method of manufacturing a light emitting device package according to another embodiment of the present invention. It is the schematic which shows the manufacturing method of the light emitting element package which concerns on the other Example of this invention. FIG. 6 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention. FIG. 6 is a view illustrating a comparison between a light emitting device package according to another embodiment of the present invention and an existing light emitting device package. FIG. 6 is an exemplary view comparing a light emitting device package according to another embodiment of the present invention with an existing light emitting device package. FIG. 6 is a view illustrating a comparison between a light emitting device package according to another embodiment of the present invention and an existing light emitting device package.

  Various embodiments of the present invention will be described below with reference to the accompanying drawings. Here, the attached drawings and the embodiments described with reference to the drawings are simplified and illustrated so that those skilled in the art can easily understand the present invention. You have to be careful.

  Further, in the present specification, a light emitting element and a light emitting element unit are distinguished from each other, and a light-emitting element unit is defined as a resultant product after a light transmitting member is added to the light emitting element and cut obliquely.

  FIG. 2 is a view illustrating a light emitting device package according to an embodiment of the present invention, and FIG. 3 is a view for explaining a method of manufacturing a light emitting device package according to an embodiment of the present invention. 4 to 7 are views for explaining the shapes of the light transmitting member and the reflecting member in the light emitting device package according to the embodiment of the present invention.

  Referring to FIG. 2, the light emitting device package according to an embodiment of the present invention includes a light emitting device 110, a substrate 120, a wavelength converting member 130, a reflecting member 140 and a light transmitting member 150. In FIG. 2, the light emitting element 110 is in the form of an LED chip. Therefore, in the following description, the LED will be described with reference numeral 110.

  The LED 110 has a main surface, side surfaces, and a mounting surface, and is mounted on the substrate 120 so that the mounting surface faces. The main surface is a surface from which light generated in the active layer of the LED 110 mainly exits, and is a surface that is the upper surface of the LED 110 and is in contact with the wavelength conversion member 130 in FIG. The side surface is a surface in contact with the translucent member 150. An electrode pad (not shown) is formed on the mounting surface. Therefore, the LED 110 is a flip chip type or a lateral chip type in which a positive electrode pad and a negative electrode pad are formed on the mounting surface side.

  The substrate 120 is a lead frame type that provides a space in which the LED 110 is mounted on the top, is electrically connected to each electrode pad of the LED 110, and is formed with a lead frame for connection to the outside. It is preferable to form with good material.

  The wavelength conversion member 130 is for converting the wavelength of the light emitted from the LED 110 and adheres to the main surface of the LED 110 using a silicone adhesive. The wavelength conversion member 130 converts the wavelength of the light emitted from the side surface of the LED 110 and reflected by the light reflection surface 141 of the reflection member 140 in addition to the light emitted from the main surface of the LED 110. Since the light reflected by the light reflecting surface 141 may be emitted to a region other than the main surface of the LED 110, the wavelength of the light reflected by the light reflecting surface 141 can be converted as shown in the figure. In addition, the outer edge of the wavelength conversion member 130 is preferably formed wider than the outer edge of the LED 110. Here, the outer edge of the LED 110 means the outer edge of the main surface of the LED 110. When the outer edge of the wavelength conversion member 130 is smaller than the outer edge of the main surface of the LED 110, for example, after the light is transmitted through the secondary wide-angle lens, a poor color impression phenomenon occurs due to the wavelength conversion failure.

  Furthermore, it is most preferable that the outer edge of the wavelength conversion member 130 is formed so as to coincide with the outer edge of the translucent member 150 in consideration of the path of light reflected by the light reflecting surface 141. As the wavelength conversion member 130, for example, one of a general phosphor sheet, quantum dot material, PIG (Phosphor In Glass), PIS (Phosphor In Silicon), and PC (Phosphor Ceramic) can be used. However, it is not limited to such materials. PIG is formed after mixing glass powder with phosphor powder and then molded into a plate type. PIS is manufactured in the form of a film with a thickness of several micrometers by mixing phosphor powder with a sealing material. The PC is a ceramic plate phosphor manufactured by a powder sintering method.

  The reflection member 140 is formed such that at least a part of the reflection member 140 is inclined with respect to the side surface of the LED 110, and the light reflection that reflects the light emitted from the side surface of the LED 110 through the wavelength conversion member 130 of the LED 110 so as to be emitted after being converted. It has a surface 141. The reflecting member 140 can be formed of a white silicone material so as to be reflected by the light reflecting surface 141, but is not limited to such a material, and can be formed of various materials that reflect light.

  The light transmissive member 150 transmits light emitted from the side surface of the LED 110 between the side surface of the LED 110 and the reflective member 140 to the light reflective surface 141 side of the reflective member 140 and is in contact with the light reflective surface 141 of the reflective member 140. 151. That is, the light reflecting surface 141 of the reflecting member 140 and the light transmitting surface 151 of the light transmitting member 150 are in contact with each other.

  Specific examples of the translucent member 150 and the reflecting member 140 in contact with the translucent member 150 are shown in FIGS. 4 to 7, and will be described below with reference to these drawings.

  FIG. 4 shows an example in which the translucent member 150a has an upper and lower narrow structure, and the distance between the translucent surface 151a of the translucent member 150a and the side surface of the LED 110 becomes narrower as it goes downward. Referring to FIG. 4, the upper thickness of the translucent member 150a is thicker, and the thickness becomes thinner toward the lower side. The translucent member 150a is formed by a straight surface in the entire section. Here, the straight surface is a term meaning a single plane, and is a term used to distinguish from the curved surface illustrated in FIG. Since the light transmission surface 151a of the light transmission member 150a and the light reflection surface 141a of the reflection member 140a are in contact with each other, the light reflection surface 141a of the reflection member 140a is also a straight surface, and the distance from the side surface of the LED 110 is closer to the lower side. Get closer. Therefore, the light emitted from the side surface of the LED 110 passes through the translucent member 150a and is reflected by the light reflecting surface 141a of the reflecting member 140a, and then wavelength-converted by the wavelength converting material 130.

  FIG. 5 shows an example in which the translucent member 150b has an upper and lower narrow structure, and the translucent surface 151b of the translucent member 150b is a downwardly convex curved surface in the entire section. Referring to FIG. 5, the light transmitting surface 151b of the light transmitting member 150b and the light reflecting surface 141b of the reflecting member 140b are reflected so that the light emitted from the side surface of the LED 110 is reflected by the light reflecting surface 141b and travels toward the wavelength conversion member 130. Are formed in a curved surface convex downward in the entire section. On the surface of thickness, the thickness of the upper side of the translucent member 150b is thicker and the thickness is made thinner toward the lower side, similarly to the shape of the linear surface of FIG. Since the light reflecting surface 141b has a concave mirror shape, the light emitted from the side surface of the LED 110 passes through the light transmitting member 150b and is reflected by the light reflecting surface 141b of the reflecting member 140b, and then wavelength-converted by the wavelength converting material 130. .

  In the embodiment illustrated in FIGS. 4 and 5, the lower ends of the light transmitting surfaces 151 a and 151 b of the light transmitting members 150 a and 150 b are in contact with the side surfaces of the LEDs 110. As in the embodiment, the lower end of the translucent surface may be formed so as to be separated from the side surface of the LED 110.

  In FIG. 6, the light transmitting surface 151c of the light transmitting member 150c is formed such that the lower end of the light transmitting surface 151c is separated from the side surface of the LED 110, and the light transmitting member 150c has an upper and lower narrow structure. The example formed so that the space | interval of the surface 151c and the side surface of LED110 may become so narrow that it goes below. Thereafter, as in the method of manufacturing the light emitting device package described with reference to FIG. 3, the light transmitting surface 151 c is formed by cutting the light transmitting material so as to be inclined with respect to the side surface of the LED 110. When cutting so that the light transmitting surfaces 151a and 151b are in contact with the lower end of the side surface of the LED 110 as in the example shown in FIG. 5, there is a risk that the lower end of the side surface of the LED 110 may be damaged during cutting. As an example, the risk that the lower end of the side surface of the LED 110 is damaged can be eliminated by forming the lower end of the light transmitting surface 151c to be separated from the side surface of the LED 110. The thickness of the upper side of the translucent member 150c is thicker and thinner toward the lower side, and is formed on a straight surface in the entire section of the translucent member 150c. Since the translucent surface 151c of the translucent member 150c and the light reflecting surface 141c of the reflecting member 140c are in contact with each other, the light reflecting surface 141c of the reflecting member 140c is also a straight surface, and the distance from the side surface of the LED 110 decreases toward the bottom. Get closer. Furthermore, since the translucent surface 151c of the translucent member 150c is separated from the side surface of the LED 110, the light reflecting surface 141c of the reflective member 140c is also separated from the side surface of the LED 110. By forming in such a shape, the light emitted from the side surface of the LED 110 passes through the translucent member 150 c and is reflected by the light reflecting surface 141 c of the reflecting member 140 c, and then wavelength-converted by the wavelength converting material 130.

  FIG. 7 shows an example in which a part of the light transmitting surface 151 d of the light transmitting member 150 d is formed to be inclined with respect to the side surface of the LED 110. That is, unlike the examples of FIGS. 4, 5, and 6 in which the light transmitting surface of the light transmitting member and the light reflecting surface of the reflecting member in contact with the light transmitting member are inclined to a straight surface or a curved surface in the entire section. In the case of FIG. 7, a part of the light transmitting surface 151 d of the light transmitting member 150 d is formed to be inclined with respect to the side surface of the LED 110. Further, since the light reflection surface 141d of the reflection member 140d is in contact with the light transmission surface 151d of the light transmission member 150d, a part of the light reflection surface 141d of the reflection member 140d is also formed to be inclined with respect to the side surface of the LED 110. Is done. In the case where the light reflecting surface 141d and the light transmitting surface 151d are formed as shown in FIG. 7, there may be some light lost on the side surface of the LED 110, but the light reflected by the light reflecting surface 141d has a wavelength by the wavelength conversion member 130. Enable conversion.

  Next, a method for manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to FIG. Here, similarly, the LED 110 will be described as an example of the light emitting element.

  The method for manufacturing a light emitting device package according to an embodiment of the present invention starts with a step of arranging a plurality of LEDs 110 on a sheet 50 (FIG. 3A). A transparent sheet can be used as the sheet 50. The plurality of LEDs 110 are arranged on the sheet 50 at a predetermined interval, and one surface of each LED 110 is adhered to the sheet 50 and maintained. Thus, for example, when each LED 110 is a flip chip type or a lateral chip type, in order to prevent contamination of each electrode pad (not shown) of each LED 110, the electrode pads are directed upward, ie, electrodes Although it is preferable that the surfaces on which the pads are not formed are arranged so as to adhere, the surfaces on which the electrode pads are formed may be arranged so as to adhere.

  Then, in order to form a translucent member (150 in FIG. 2), a translucent material is filled between the LEDs 110 arranged on the sheet 50 ((b)). Eventually, the translucent material filled between the LEDs 110 becomes a translucent member (150 in FIG. 2) of the light emitting device package by cutting. Therefore, in FIG. 3, the translucent material is the same as the translucent member of FIG. Reference numeral 150 is shown. Dispensing or squeezing can be used as a method of filling the light-transmitting material 150 between the LEDs 110, but is not limited to these methods.

  Thereafter, after the light transmissive material 150 is cured, a step ((c)) of forming a plurality of primary LED units (FLU) is performed. Here, the primary LED unit (FLU) is also referred to as an LED unit. As shown in (c), the primary LED unit (FLU) was cut by cutting the translucent material 150 downward so as to surround each side surface of each LED 110 with each LED 110 as a reference. The translucent material (the surface to be cut becomes the translucent surface (see 151 in FIG. 2) in the final light emitting device package) is inclined at least partially with respect to each of the LEDs 110 located at the center. It is formed by cutting. Reference sign CL1 indicates an example of a line to be cut. Accordingly, each primary LED unit (FLU) has one LED 110 and a light-transmitting member 150, and the light-transmitting member 150 has a light-transmitting surface 151 (see FIG. 2). The inclination angle (d in FIG. 2) when cutting the light-transmitting material 150 (the inclination angle of the partial section when it is cut so that the partial section is inclined) is 0 ° <d <90 °. It is a range. For example, when the translucent surface 151 is a straight surface (see FIG. 4, FIG. 6 or FIG. 7), the translucent surface 151 is inclined at an arbitrary angle within a range of 0 ° <d <90 °. Are cut and formed. When the translucent surface 151 is a curved surface (see FIG. 5), the inclination angle d is defined as an angle formed by a tangent at an arbitrary point on the translucent surface that is a curved surface and the side surface of the LED 110, and the translucent surface 151 is It is formed by cutting so that it is within the range of 0 ° <d <90 °. Further, although not shown in the drawings, the light transmitting surface 151 may be formed by cutting so that a large number of linear surfaces are continuous. In each primary LED unit (FLU), the interval between the section of the light transmitting material 150 that is cut so as to be inclined (in the case of the entire section, the entire light transmitting surface) and the side surface of the LED 110 is closer to the lower side. It is formed to be narrow.

  Thereafter, the primary LED units (FLU) formed by being inclined so as to be inclined in the step (c) are mounted on the substrate 120 and rearranged ((d)). In the process of mounting the primary LED unit (FLU) on the substrate 120, the electrode pads (not shown) formed on the LEDs in the primary LED unit (FLU) are in corresponding areas on the substrate 120 (each of the LEDs). The process proceeds by die-bonding to the area where the wafer is mounted. The substrate 120 may be, for example, a ceramic substrate that is a material having high thermal conductivity. Further, when each of the primary LED units (FLU) is separated from the sheet 50 and individually mounted on the substrate 120, as shown in (d), the portion bonded to the sheet 50 is directed upward. In this way, it is mounted on the substrate 120. That is, in (a), when the surface on which each electrode pad of each LED 110 is not formed adheres to the sheet 50 side, when the primary LED unit (FLU) is formed by cutting and then mounted on the substrate 120 Will be turned over and implemented. Unlike this, when the surface on which the electrode pad is formed adheres to the sheet 50, after the primary LED unit (FLU) is separated in (c), it may be mounted on the substrate 120 as it is without being turned over. Good.

  In FIG. 3D, only one primary LED unit (FLU) is shown enlarged. The substrate 120 is electrically connected to each electrode pad (not shown) of the LED 110 and is a lead frame type in which a lead frame (not shown) for connection to the outside is formed, and has good thermal conductivity. It is preferable to form with a material.

  Thereafter, the wavelength conversion member 130 is attached to each of the primary LED units (FLU) that are mounted on the substrate 120 and rearranged ((e)). For example, the wavelength conversion member 130 is bonded to the main surface of the LED 110 using a silicone adhesive. As the wavelength conversion member 130, for example, one of a general phosphor sheet, quantum dot material, PIG (Phosphor In Glass), PIS (Phosphor In Silicon) and PC (Phosphor Ceramic) can be used. It is not necessarily limited to the example. In each of the primary LED units (FLU), not only the light emitted from the main surface of the LED 110 but also the light reflected by the light reflecting surface after exiting the side surface of the LED 110 must be wavelength-converted. The outer edge of the wavelength conversion member 130 is preferably formed wider than the outer edge of the LED 110. Furthermore, it is most preferable that the outer edge of the wavelength conversion member 130 is formed so as to coincide with the outer edge of the translucent member 150 in consideration of the path of light reflected by the light reflecting surface 141.

  Thereafter, in order to form a reflective member (140 in FIG. 2), a reflective material is filled between the primary LED units (FLU) to which the wavelength conversion member 130 is attached ((f)). Since the reflective material to be filled is cut to an appropriate size around each of the primary LED units (FLU) and finally becomes the reflective member 140, the reflective material is also shown in FIG. Reference numeral 140 is shown. Dispensing and squeezing methods can be used as a method for filling the reflective material 140 between the primary LED units (FLU), but the method is not limited to these methods. Moreover, although white silicone can be used as a reflective member, it is not necessarily limited to such a material.

  Thereafter, as shown in FIG. 3F, the primary LED unit (FLU) to which the wavelength conversion member 130 is attached is cut along the cutting line CL2 so that the reflective material 140 further surrounds the plurality of primary LED units (FLU). A secondary LED unit (SLU) is formed. The secondary LED unit (SLU) is a light emitting device package that is a product manufactured by the method for manufacturing a light emitting device package according to the present invention. As a result, the secondary LED unit (SLU), that is, each of the light emitting device packages, is formed to have one LED 110, a translucent member 150, a wavelength converting member 130, and a reflecting member 140.

  FIG. 8 is a flowchart illustrating a method for manufacturing a light emitting device package according to another embodiment of the present invention, and FIG. 9 is a schematic view illustrating a method for manufacturing a light emitting device package according to another embodiment of the present invention. . The light emitting device package manufactured here is a chip scale package (CSP: Chip Scale Package).

  Hereinafter, a method for manufacturing a light emitting device package according to another embodiment of the present invention will be described with reference to FIGS.

  In the light emitting element transfer step (S10), one surface of the plurality of light emitting elements 220 is attached to one side of the translucent plate 210. As shown in FIG. 9A, a plurality of light emitting device packages 220 can be simultaneously manufactured by positioning a plurality of light emitting devices 220 on one translucent plate 210. At this time, the light emitting elements 220 are arranged in a matrix and transferred onto the translucent plate 210. Here, as shown in FIG. 9A, the light emitting device 220 can be implemented in a flip chip configuration including an electrode pad protruding on the other surface of the light emitting device 220.

  The translucent plate 210 diffuses the light output from the light emitting element 220 to the outside. The polycarbonate series, the polysulfone series, the polyacrylate series, the polystyrene series, the polyvinyl chloride series, the polyvinyl alcohol series, the polynorbornene series, It can be manufactured with materials such as polyester, and in addition, it can be manufactured with materials of various translucent resin series.

  In the transparent sealing material molding step (S20), one side of the translucent plate 210 and the side surface of the light emitting element 220 are molded with the transparent sealing material. As shown in FIG. 9B, the liquid transparent sealing material 230 is supplied onto the translucent plate 210, and the liquid transparent sealing material 230 is raised to at least the height of the light emitting element 220. Supplied in quantity. Thereafter, as shown in FIG. 9C, the liquid state transparent sealing material 230 can be cured, and at this time, the cured transparent sealing material 230 forms a second inclined surface while forming a light emitting element. Surrounds 220.

  In the oblique cutting step (S30), the translucent plate 210 is cut into oblique lines so that the cross section of the translucent plate 210 has the first inclined surface. At this time, after placing the light emitting element 220 at the center, the translucent plate 210 having a certain area around the light emitting element 220 is cut. Through this, a unit combination including the light emitting element 220, the transparent sealing material 230, and the translucent plate 210 can be generated. Here, the transparent sealing material 230 may not be cut, and the gradient of the first inclined surface of the translucent plate 210 may be different from the gradient of the second inclined surface of the transparent sealing material 230. That is, the gradient of the first inclined surface can be formed to be equal to or greater than the gradient of the second inclined surface. Meanwhile, burrs may occur in the cutting step (S30). In this case, a burr removing step for removing the burr is further performed.

  Further, as shown in FIG. 9D, in the oblique cutting step (S30), the direction away from the light emitting element 220 attached to the light transmissive plate 210 from one side of the light transmissive plate 210 to the other side. Cut to. In some embodiments, the first inclined surface of the translucent plate 210 is cut to have a gradient of 55 degrees to 75 degrees. In this case, the first inclined surface of the cut translucent plate 210 is the limit surface. It has a surface roughness value less than roughness.

  The surface roughness value of the first inclined surface appears in a different value depending on the gradient of the cross section. At this time, the light efficiency of the light emitting element 220 improves as the surface roughness value decreases. That is, when the surface roughness of the first inclined surface of the translucent plate 210 is rough, the amount of light scattered from the first inclined surface increases and the amount of light diffused to the outside decreases. A loss may occur in the light efficiency of the element 220. The surface roughness value of the cross section obtained by cutting the translucent plate 210 may have a rough surface roughness when cut vertically, but may improve the surface roughness when cut obliquely so as to have a constant gradient. Here, the gradient having the optimum surface roughness can be obtained experimentally, and in some embodiments, the gradient has the optimum surface roughness when the first inclined surface has a gradient of 55 to 75 degrees. The gradient of the first inclined surface can be set in various ways, but is set so that at least the surface roughness of the first inclined surface has a value smaller than the limit surface roughness. Here, the limit surface roughness is the surface roughness when cut vertically.

  Therefore, in the oblique cutting step (S30), the translucent plate 210 is cut so as to have a gradient, and the surface roughness value on the first inclined surface is reduced.

  In the unit combination transfer step (S40), as shown in FIG. 9E, a plurality of unit combinations generated through the oblique cutting step (S30) are rearranged on a separate sheet S. At this time, the transfer is performed so that the other side of the translucent plate 210 included in the unit combination adheres to the sheet.

  Thereafter, in the opaque sealing material molding step (S50), the periphery of the unit combination is molded with the opaque sealing material 240. As shown in FIG. 9 (f), the liquid state opaque sealing material 240 is supplied onto the sheet S, and the liquid state opaque sealing material 240 has a height that does not cover the electrode pads of the light emitting element 220. Supplied. Thereafter, in the opaque sealing material molding step (S50), the liquid opaque sealing material 240 is cured, and the periphery of each unit combination is molded with the opaque sealing material 240. At this time, the opaque sealing material 240 is molded so that the bottom surface of the electrode pad of the light emitting element 220 is exposed to the outside. In some embodiments, the bottom surface of the electrode pad and the bottom surface of the opaque sealing material are positioned on the same plane. It is also possible to perform molding. That is, when the opaque sealing material is molded to protect the unit combination, the electrode pad is exposed to facilitate electrical connection of the light emitting device package produced thereafter to another substrate. In particular, when molding is performed so that the bottom surface of the electrode pad and the bottom surface of the opaque sealing material are located on the same plane, stable connection is possible while minimizing exposure.

  On the other hand, after the opaque encapsulant 240 is cured, the opaque encapsulant 240 around each unit assembly is cut vertically through the cutting step (S60), and the unit assembly is translucent through the sheet separation step (S70). The sheet S attached to the plate 210 is separated. In some embodiments, burrs generated in the vertical cutting process are further removed. Through this, the light emitting device package 200 shown in FIG. 10 can be generated. The light emitting device package 200 is protected from an external impact by the opaque sealing material 240, and the light output from the light emitting device 220 is reflected by the opaque sealing material 240 and diffused to the outside. That is, most of the light output from the light emitting element 220 is directly diverged through the translucent plate 210, but part of the light is output to the side surface. In this case, the light is reflected by the opaque sealing material 240 and diverged outside. The

  FIG. 10 is a cross-sectional view illustrating a light emitting device package according to another embodiment of the present invention.

  Referring to FIG. 10, a light emitting device package 200 according to an embodiment of the present invention includes a light transmissive plate 210, a light emitting device 220, a transparent sealing material 230 and an opaque sealing material 240.

  Hereinafter, a light emitting device package according to an embodiment of the present invention will be described with reference to FIG.

  The translucent plate 210 protects the light emitting element 220 from external impact and diverges the light output from the light emitting element 220 to the outside. The translucent plate 210 can be manufactured from materials such as polycarbonate series, polysulfone series, polyacrylate series, polystyrene series, polyvinyl chloride series, polyvinyl alcohol series, polynorbornene series, polyester, etc. It can be manufactured from resin series materials. In some embodiments, the translucent plate 210 may include a fine pattern, a fine protrusion, a diffusion film, or the like on the surface, and may be manufactured by various methods such as a method of forming fine bubbles inside.

  As shown in FIG. 10, the translucent plate 210 may be formed so that the area on the other side 212 is wider than the one side 211. At this time, the side surface 213 may be cut in a diagonal line so that the cross section has the first inclined surface a. The gradient of the first inclined surface a can be variously set, but according to one embodiment, the first inclined surface a is formed to have a gradient of 55 degrees to 57 degrees.

  Moreover, the 1st inclined surface a of the side surface of the translucent plate 210 is formed so that it may have surface roughness less than a limit surface roughness. The light output from the light emitting element 220 is transmitted to the outside through the translucent plate 210, and part of the light output from the light emitting element 220 is diverged through the first inclined surface a of the translucent plate 210. Is done. Here, when the surface roughness of the first inclined surface a is large, light is scattered and the amount of light reflected to the outside is reduced, so that a loss occurs in the light efficiency of the light emitting element. Therefore, the surface roughness of the first inclined surface a is embodied so as to be at least less than the limit surface roughness. In particular, in one embodiment of the present invention, the surface roughness of the first inclined surface a can be improved by cutting the side surface 213 of the translucent plate 210 in a diagonal line. In general, the surface roughness value of a cross section obtained by vertically cutting the translucent plate 210 is larger than the surface roughness value of the cross section cut along the oblique line, and the surface roughness value varies depending on the gradient cut along the oblique line. Therefore, the gradient having the optimum surface roughness can be obtained experimentally. In some embodiments, the optimum surface roughness is obtained when the first inclined surface a is cut so as to have a gradient of 55 to 75 degrees. Is obtained. Although the gradient of the first inclined surface a can be variously set according to the embodiment, the gradient of the first inclined surface a having a surface roughness that is at least smaller than the limit surface roughness is selected. Here, the limit surface roughness is the surface roughness when cut vertically.

  In the light emitting element 220, one surface 221 of the light emitting element 220 is attached to one side 211 of the translucent plate 210. The light emitting element 220 outputs light through one surface 221 corresponding to the light emitting surface. Here, as shown in FIG. 10, the light emitting device 220 may be implemented in a flip chip configuration including an electrode pad (not shown) protruding from the other surface 222 of the light emitting device 220.

  On the other hand, the light emitting device 220 is implemented by a semiconductor. For example, a blue, green, red, yellow light emitting LED (Light Emitting Diode) made of a nitride semiconductor or an ultraviolet light emitting LED corresponds to the light emitting device 220. To do. The nitride semiconductor is represented by a general formula of AlxGayInzN (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ z ≦ 1, x + y + z = 1). The light-emitting element 220 is configured by epitaxially growing a nitride semiconductor such as InN, AIN, InGaN, AlGaN, or InGaAIN on a growth sapphire substrate or silicon carbide substrate by a vapor phase growth method such as MOCVD. In addition, the light emitting element 220 can be formed using a semiconductor such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP. Here, the light-emitting element 220 can be implemented using a stacked body in which these semiconductors are formed in the order of an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer, and the light-emitting layer (active layer) has a multiple quantum well structure or a single structure. It can be implemented using a stacked semiconductor including a quantum well structure or a stacked semiconductor having a double hetero structure.

  The transparent sealing material 230 is molded on one side 211 of the translucent plate 210 and the side surface 223 of the light emitting element. The transparent sealing material 230 is applied in a liquid state, and is cured and fixed so as to have the second inclined surface b between the light emitting element 220 and the translucent plate 210.

  Since the transparent sealing material 230 is formed so as to surround the side surface 223 of the light emitting element 220, the light output from the side surface 223 of the light emitting element 220 can secure a path for diverging through the transparent sealing material 230. . That is, the light efficiency of the light emitting element 220 can be improved by the structure of the transparent sealing material 230. On the other hand, the gradient of the second inclined surface b of the transparent sealing material 230 is the same as or smaller than the first inclined surface a of the translucent plate, as shown in FIG.

  The opaque encapsulant 240 is molded around the unit assembly including the translucent plate 210, the light emitting element 220, and the transparent encapsulant 230. The opaque sealing material 240 protects the unit combination from external impacts, reflects light output from the light emitting element 220, and diverges the light to the outside. Most of the light output from the light emitting element 220 is directly diverged through the translucent plate 210, but part of the light is output to the side surface. In this case, the light is reflected through the opaque sealing material 240 and diverged outside. The

  Here, the opaque sealing material 240 is an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, a polyimide resin composition, and a modification. It can be implemented by various materials such as polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin. The opaque sealing material 240 includes, among these resins, titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, white series and metal series. Light reflective reflective materials such as components can be included.

  The opaque encapsulant 240 is molded around the unit combination and then cut vertically. In some embodiments, grinding is added to the vertically cut outer surface c. That is, the outer surface c is ground to increase the completeness of the produced light emitting device package 200, and the surface roughness of the outer surface c is reduced.

  11 to 13 are exemplary views for comparing a light emitting device package according to another embodiment of the present invention and an existing light emitting device package.

  First, as illustrated in FIG. 11A, a light emitting device package that does not include the transparent sealing material 230 is implemented. In this case, most of the light is emitted to the outside through the light emitting surface of the light emitting element 220, but the light output from the side surface of the light emitting element 220 is blocked by the opaque sealing material 240 and may not be emitted to the outside. is there.

  On the other hand, as shown in FIG. 11B, when the transparent sealing material 230 is included, the light output from the side surface of the light emitting element 220 is transmitted through the transparent sealing material 230 and the opaque sealing material 240. It is irradiated by. Here, since the transparent sealing material 230 has the second inclined surface, the light reflected by the opaque sealing material 240 is easily emitted to the outside. Therefore, the light emitting device package including the transparent sealing material 230 as shown in FIG. 11B can obtain an effect of improving the light extraction efficiency by about 5% compared to the case of FIG.

  On the other hand, the light emitting device package of FIG. 12A includes the transparent sealing material 230, which corresponds to an embodiment in which the translucent plate 210 is cut vertically. On the other hand, FIG. 12B shows a light emitting device package according to an embodiment of the present invention, which is characterized in that the translucent plate 210 is cut in diagonal lines so as to have a first inclined surface.

  Here, when the translucent plate 210 is cut vertically, a cut surface as shown in FIG. 13A appears. Further, when the translucent plate 210 is cut obliquely, a cut surface as shown in FIG. 13B appears. That is, as shown in FIGS. 13A and 13B, it can be confirmed that the surface roughness when cutting so as to have a certain gradient is better than when cutting vertically. .

  In general, light output from the light emitting element 220 is transmitted to the outside through the translucent plate 210, and part of the light is emitted through the side surface of the translucent plate 210. Here, when the surface roughness of the side surface of the translucent plate 210 is rough, the light is scattered and the amount of light reflected to the outside is reduced, thereby causing a loss in light extraction efficiency. Therefore, the light emitting device package having the structure shown in FIG. 12B having a good surface roughness is relatively advantageous in terms of light extraction efficiency. That is, as shown in FIG. 12B, when the translucent plate 210 is cut and formed in a slanted line so as to have the first inclined surface, it is about 1.5% compared to the case of FIG. The effect of improving the light extraction efficiency can be obtained.

  The present invention is not limited to the embodiments described above and the accompanying drawings. It will be apparent to those skilled in the art to which the present invention pertains that the components according to the present invention can be replaced, modified and changed without departing from the technical idea of the present invention.

11 LED
12, 120 Substrate 13 Phosphor sheet 14 White silicone 15 Side surface 50 Sheet 110 Light emitting element, LED
130 Wavelength converting member, wavelength converting material 140 Reflecting member, reflecting material 140a, 140b, 140c, 140d Reflecting member 141, 141a, 141b, 141c, 141d Light reflecting surface 150 Light transmitting member, Light transmitting material 150a, 150b, 150c, 150d Translucent member 151, 151a, 151b, 151c, 151d Translucent surface 200 Light emitting element package 210 Translucent plate 211 One side 212 Other side 213, 223 Side surface 220 Light emitting element 221 One side 222 Other side 230 Transparent sealing material 240 Opaque sealing Stop material S10 Light emitting element transfer step S20 Transparent sealing material molding step S30 Diagonal line cutting step S40 Unit combination transfer step S50 Opaque sealing material molding step S60 Cutting step S70 Sheet separation step

Claims (9)

Mounting and arranging each light emitting element unit on a substrate;
Attaching a wavelength conversion member to each of the light emitting element units mounted and arranged on the substrate; and
Filling a reflective material between the light emitting element units to which the wavelength conversion member is attached to form a reflective member;
A vertical cutting step of forming each light emitting device package by vertically cutting each of the light emitting device units to which the wavelength conversion member is attached so as to surround the reflective material;
Each light emitting element unit is
Arranging a plurality of light emitting elements on a sheet;
Filling a light-transmitting material between the light-emitting elements arranged on the sheet to form a light-transmitting member;
After each of the light emitting elements is cured, the light transmitting material is cut so as to be inclined with respect to each of the light emitting elements so that each of the light emitting element units has one light emitting element and a light transmitting member. Formed by a diagonal cutting stage,
Wherein the hatched cutting step, the distance between the sloping so cut has been section of translucent material and a side surface of the light emitting device tends to close as it goes downward, SEQ implement the respective light emitting unit on a substrate in the step of the method of manufacturing the light emitting device package the interval, each characterized that you mounted on a substrate to be narrower toward the lower portion of each light-emitting element units.
Wherein the hatched cutting step, the translucent material production method of the light emitting device package according to the claim 1 you cross cutting has been interval, characterized in that the cutting to be a straight line surface so that inclination of. In the shaded cutting step, the light emitting device package according to claim 1 you characterized in that the cross section of the cutting has been section to be inclined in the translucent material is cut so as to convexly curved downward Production method. Wherein the hatched cutting step, the method of manufacturing the light emitting device package according to claim 1 you, characterized in that the cutting to be inclined across the section of the light-transmitting material. In each of the respective light emitting unit, the light transmission material and the method of manufacturing the light emitting device package according to claim 4 you wherein said distance between the side surface of the light-emitting element to become narrower toward downward. Wherein the hatched cutting step, the method of manufacturing the light emitting device package according to claim 1 you, characterized in that the cutting as a whole becomes a convex curved surface downward section of the translucent material. In the shaded cutting step, the method of manufacturing the light emitting device package according to claim 5 you, characterized in that the lower end of the translucent material is cut into so that spaced apart from the side surface of the light emitting element. In the each of the light emitting device package, the outer edge of the wavelength conversion member, method of manufacturing the light emitting device package according to claim 1 you characterized by being wider than the outer edge of the light emitting element. The reflecting member, method of manufacturing the light emitting device package according to claim 1 you being formed white silicone material.

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