JP6482883B2 - RESISTANCE BOARD INTEGRATED SUPPORT, ROTARY VARIABLE RESISTOR USING THE RESISTANCE BOARD INTEGRATED SUPPORT, AND METHOD FOR PRODUCING THE RESISTANCE BOARD INTEGRATED SUPPORT - Google Patents

Description

  The present invention relates to a resistance substrate integrated support, a rotary variable resistor using the resistance substrate integrated support, and a method of manufacturing the resistance substrate integrated support, and in particular, a resistance substrate integrated type excellent in linearity characteristics. The present invention relates to a support, a rotary variable resistor using the resistance substrate integrated support, and a method of manufacturing the resistance substrate integrated support.

  A variable resistor of a type in which a movable slider is slidably contacted with a resistor pattern is used for volumes and position sensors of various electronic devices. In particular, a rotary variable resistor of a type in which a slider rotates has come to be widely used because its structure can be easily configured.

  As such a general rotary variable resistor, Patent Document 1 (Conventional Example 1) discloses a rotary variable resistor 800. FIG. 22 is an exploded perspective view showing the rotary variable resistor 800 of the first conventional example.

  A rotary variable resistor 800 of Conventional Example 1 shown in FIG. 22 includes a resistance substrate 801 provided with a printed resistor pattern 802 and the like, a rotating body 803 having an engagement portion 803a, and a rotational body 803 that is driven to rotate. A receiving member 805 to which the slider 804 is attached, a spring washer 806 that presses a part of the receiving member 805 to the rotating body 803, a mounting plate 807 disposed on the bottom side of the resistance substrate 801, and a receiving member A cover member 808 disposed so as to cover 805 and press-fitting the mounting plate 807 to the resistance substrate 801, and an annular frame 809 placed on the resistance substrate 801 and surrounding the slider 804 and the receiving member 805 And is mainly configured. Then, using these components, the initial position of the slider 804 relative to the resistor pattern 802 is adjusted to a desired position, and assembly is performed sequentially. The receiving member 805 and the rotating body 803 are integrated via a spring washer 806.

  Further, a rotary variable resistor of a slightly different type from the rotary variable resistor 800 of Conventional Example 1 is disclosed as Patent Document 2 (Conventional Example 2) as a variable resistor 900. FIG. 23 is an exploded perspective view showing the variable resistor 900 of the second conventional example.

  A variable resistor 900 of Conventional Example 2 shown in FIG. 23 is formed by insert-molding a resistance substrate 911 having a resistance element portion 912 and a conductive portion 913 formed by screen printing or the like, and an insulating resin. An insulating case 915, a slider 907 that slides on the resistance element portion 912 and the conductive portion 913, and a rotating body 918 having a disc-shaped flange portion 918B and a shaft portion 918D having a small-diameter tip. It is mainly composed. Then, after the slider 907 is fixed to the lower surface of the flange portion 918B and the shaft portion 918D is inserted into the fitting hole 915A of the insulating case 915, the thin end portion thereof is formed into a trumpet shape on the lower surface side of the insulating case 915. It is caulked and attached to the insulating case 915 so as to be rotatable.

JP 2008-135558 A JP 2007-103775 A

  However, in both of the conventional example 1 and the conventional example 2, the resistor pattern 802 and the resistor element portion 912 are formed by printing such as screen printing, and the film thickness is not uniform in printing such an independent pattern. There was a problem that it was easy to become. One of the causes of the problem of non-uniform film thickness of the independent pattern in this screen printing is considered to be a difference in frictional resistance (friction coefficient) between the squeegee and the printing mask at the printing location. For example, it is assumed that the frictional resistance of the print mask is low at a position where the pattern does not exist (a part of the outer peripheral portion of the independent pattern), whereas the position where the pattern exists is higher than the position where there is no frictional resistance. . When the frictional resistance fluctuates in this way, the squeegee that contacts the print mask moves while changing the contact angle. For this reason, when the frictional resistance is low, the contact angle becomes relatively large. On the other hand, when the frictional resistance is high, it is estimated that the contact angle becomes relatively small. With these changes in contact angle, it is considered that the amount of material supplied changes at the printing start position and end position of the independent pattern, and the film thickness becomes non-uniform.

  Thus, when the film thickness of the pattern (resistor pattern 802 and resistance element portion 912) becomes non-uniform, there is a problem that the linearity characteristic of the output signal obtained from this pattern is deteriorated. This problem has become more apparent when the rotary variable resistor is used as a rotary position sensor.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and includes a resistance substrate integrated support that can improve the linearity characteristics (accuracy) of an output signal, a rotary variable resistor using the resistance substrate integrated support, and the resistance. It is an object of the present invention to provide a method for manufacturing a substrate-integrated support.

  In order to solve this problem, a resistance substrate integrated support according to the present invention includes a resistor substrate having a resistor pattern printed and formed on an insulating substrate by screen printing, and the resistor pattern is exposed. A resin member holding a resistance substrate, and the resistor substrate includes a current collector pattern, a first electrode pattern electrically connected to one end of the resistor pattern having an arc shape, and the resistor pattern. A resistance substrate integrated support for a rotary variable resistor having a second electrode pattern conductive to an end, wherein the resistance substrate has the same resistance film as the resistor pattern around the resistor pattern. The resistor pattern is formed at the same time, and a separation pattern formed by removing the resistance film is formed between the resistor pattern and the resistor layer, and the resistor pattern is formed. Wherein a resistor layer is characterized by being insulated from the.

  According to this, the resistance substrate integrated support according to the present invention is formed in a circular arc shape by screen-printing a resistor pattern and a resistor film to be a resistor layer on an insulating substrate at the same time in a solid film form, and separating both. It is possible to form an independent resistor pattern having For this reason, compared with the conventional pattern formed by printing independently, the film thickness of a resistor pattern can be formed substantially uniformly. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern can be improved.

  The resistance substrate integrated support according to the present invention is characterized in that the separation pattern is formed by removing the resistance film by laser irradiation.

  According to this, as compared with the case where the resistance film is removed (for example, scraped off) by another physical method, the edge of the separated resistor pattern can be smoothly formed with less unevenness. Thereby, the pattern accuracy of the resistor pattern is improved, and the linearity characteristic of the output signal obtained from the resistor pattern can be further improved.

  In the resistance substrate integrated support according to the present invention, the insulating substrate is made of a glass epoxy substrate, an insulating layer is formed on the glass epoxy substrate, and the resistor pattern is formed on the insulating layer. And the resistor layer is laminated, and the insulating layer is exposed from the separation pattern.

  According to this, even when this resistance substrate integrated support is applied to a sensor or the like used in a high-temperature environment for vehicles, it has sufficient heat resistance performance and has excellent linearity characteristics of an output signal. Can be obtained. On the other hand, even if a glass epoxy substrate that is adversely affected by laser processing is used, the resistive film can be removed by laser processing because an insulating layer is formed between the resistor pattern and the resistor layer and the insulating substrate. The shape of the resistor pattern having an arc shape can be obtained. Thus, even when a glass epoxy substrate is used as the insulating substrate, it is possible to reliably obtain a resistance substrate integrated support body with improved output signal linearity characteristics.

  In the resistance substrate integrated support according to the present invention, the current collector pattern is formed on an inner peripheral side of the resistor pattern, and the current collector pattern is made of the same material as the resistor pattern. An overcoat layer is formed so as to cover the current collector pattern, and the overcoat layer constitutes a part of the resistor layer.

  According to this, the resistor pattern and the current collector pattern can be provided close to each other. As a result, it is possible to suppress an increase in the resistance substrate accompanying the provision of the resistor layer.

  Further, the resistance substrate integrated support according to the present invention is a shaft portion of a rotating member provided with a housing portion in which the resin member can accommodate the resistance substrate and a slider that slides on the resistor pattern. The resistance substrate is provided with a through-hole through which the shaft portion is inserted, and is press-fitted into the resin member and held in the housing portion. It is a feature.

  According to this, it becomes possible to ensure relative positional accuracy between the resistor pattern of the resistance substrate and the slider on the rotating member side. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern can be further improved.

  In order to solve the above-described problem, a rotary variable resistor according to the present invention includes a resistance substrate integrated support according to any one of the aspects described above, a slider that slides in a circular arc shape on the resistor pattern, It is characterized by comprising.

  According to this, since the resistance substrate integrated support body according to any one of the aspects described above is provided, it is possible to provide a rotary variable resistor in which the linearity characteristic of the output signal obtained from the resistor pattern is improved.

  In order to solve the above-described problems, a method of manufacturing a resistance substrate integrated support according to the present invention includes a resistor substrate having a resistor pattern printed on an insulating substrate by screen printing, and the resistor pattern is exposed. A resin member holding the resistor substrate, and the resistor substrate includes a current collector pattern, a first electrode pattern electrically connected to one end of the resistor pattern having an arc shape, and the resistor In the method of manufacturing a resistance substrate integrated support for a rotary variable resistor formed with a second electrode pattern that is electrically connected to the other end of the body pattern, the first electrode pattern and the first electrode pattern on the one surface side of the mother substrate An electrode forming step for forming the second electrode pattern apart, a resistance printing step for printing and forming the first electrode pattern and the resistive film laminated on the second electrode pattern in a solid film shape, and the mother An outer shape process for obtaining an individual substrate constituting the resistance substrate by performing an outer shape process on the plate, an integration step for holding the individual substrate on the resin member, and irradiating the resistance film with a laser for the resistance A separation step of removing a part of the film and obtaining the resistor pattern having at least the outer peripheral side and the inner peripheral side sandwiched by the separation pattern formed by removing the resistive film.

  According to this, since an independent resistor pattern having an arc shape can be obtained from a resistance film printed and formed in a solid film shape, the resistor pattern is compared with a conventional pattern formed by printing alone. Can be formed substantially uniformly. As a result, it is possible to produce a resistance substrate integrated support body in which the linearity characteristic of the output signal obtained from the resistor pattern is improved.

  Further, in the method of manufacturing a resistance substrate integrated support according to the present invention, the resin member rotatably supports a shaft portion of a rotating member provided with a slider that slides on the resistor pattern. And in the outer shape processing step, the step of forming a through-hole through which the shaft portion is inserted in the individual substrate, and the laser irradiation on the resistance film in the separation step is performed after the integration step. The method is performed based on a part of the resin member.

  According to this, it becomes possible to irradiate the resistance film with a laser on the basis of a part of the resin member, and it is possible to ensure relative positional accuracy between the resin member and the resistor pattern. For this reason, the relative positional accuracy of the resistor pattern and the slider can be ensured only by assembling the rotating member to the resistor substrate integrated support. As a result, it is possible to easily produce a resistance substrate integrated support body in which the linearity characteristic of the output signal obtained from the resistor pattern is improved.

  In addition, the method for manufacturing a resistance substrate integrated support according to the present invention is characterized in that, in the separation step, the separation pattern is formed with reference to the bearing portion.

  According to this, since the separation pattern is formed on the basis of the bearing portion that rotatably supports the rotating member provided with the slider, it is defined by the separation pattern (the outer peripheral side and the inner peripheral side are defined). It is possible to further improve the accuracy with respect to the bearing portion of the resistor pattern. For this reason, since the bearing portion supports the shaft portion of the rotating member provided with the slider, the relative positional accuracy between the resistor pattern and the slider can be further improved. As a result, it is possible to easily produce a resistance substrate integrated support body in which the linearity characteristic of the output signal obtained from the resistor pattern is improved.

  Further, in the method for manufacturing a resistance substrate integrated support according to the present invention, the resin member is formed with an accommodating portion capable of accommodating the individual substrate, and in the integration step, the individual substrate is It press-fits in the accommodating part, The said individual board | substrate is integrated and hold | maintained at the said resin member, It is characterized by the above-mentioned.

  According to this, in the integration step, the individual substrate can be integrated with the resin member and held by simply press-fitting the individual substrate into the housing portion. Since this is a simple process, the resistance substrate integrated support can be easily manufactured.

  Further, in the method of manufacturing a resistance substrate integrated support according to the present invention, in the integration step, the individual substrate is embedded in the resin member by insert molding the individual substrate, and the bearing portion is provided. It is characterized by forming.

  According to this, since the insert molding of the individual substrate and the formation of the bearing portion are performed in the integration step, the resistance substrate can be reliably held on the resin member and the bearing portion can be easily attached to the resin member. It can also be formed.

  In addition, in the method for manufacturing a resistance substrate integrated support according to the present invention, the insulating substrate is a glass epoxy substrate, and an insulating layer forming step of forming an insulating layer on the glass epoxy substrate before the electrode forming step is performed. In the electrode forming step, the first electrode pattern and the second electrode pattern are formed on the insulating layer, and in the resistance printing step, the resistive film is formed by the first electrode pattern and the second electrode. It is formed by printing on the insulating layer so as to cover a pattern, and the insulating layer is exposed from the separation pattern in the separation step.

  According to this, even if a glass epoxy substrate that is adversely affected by laser processing is used, the resistance film can be removed by laser processing, and a resistor pattern having an arc shape can be produced. Thus, even when a glass epoxy substrate is used as the insulating substrate, it is possible to reliably produce a resistance substrate integrated support body with improved linearity characteristics of output signals.

  The resistance substrate integrated support of the present invention is an independent resistor having an arc shape by simultaneously printing a resistor pattern and a resistance film to be a resistor layer on an insulating substrate by screen printing in a solid film shape and separating them. A body pattern can be formed. For this reason, compared with the conventional pattern formed by printing independently, the film thickness of a resistor pattern can be formed substantially uniformly. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern can be improved.

  In addition, since the rotary variable resistor according to the present invention includes the resistance substrate integrated support body according to any one of the aspects described above, the linearity characteristic of the output signal obtained from the resistor pattern is improved.

  Also, the method for manufacturing a resistance substrate integrated support according to the present invention can obtain an independent resistor pattern having an arc shape from a resistance film printed and formed in a solid film shape. Compared with the conventional pattern, the film thickness of the resistor pattern can be formed almost uniformly. As a result, it is possible to produce a resistance substrate integrated support body in which the linearity characteristic of the output signal obtained from the resistor pattern is improved.

1 is a perspective view of a rotary variable resistor according to a first embodiment of the present invention. 2A and 2B are diagrams for explaining a rotary variable resistor according to a first embodiment of the present invention, in which FIG. 2A is a top view seen from the Z1 side shown in FIG. 1, and FIG. 2 is a side view seen from the X1 side shown in FIG. It is a disassembled perspective view of the rotation type variable resistor using the resistance board integrated support body of 1st Embodiment of this invention. It is a disassembled side view of the rotation type variable resistor using the resistance board integrated support body of 1st Embodiment of this invention. It is a figure explaining the rotary variable resistor of 1st Embodiment of this invention, Comprising: It is a perspective view of the slider and rotary member seen from the Z2 side shown in FIG. It is a top view of the resistance board integrated support body of 1st Embodiment of this invention. It is a figure explaining the resistance board integrated support body of 1st Embodiment of this invention, Comprising: It is a top view of a resistance board. It is a figure explaining the resistance board integrated support body of 1st Embodiment of this invention, Comprising: Fig.8 (a) is sectional drawing in the VIII-VIII line | wire shown in FIG. 7, FIG.8 (b) It is sectional drawing in the IX-IX line shown in FIG. It is a figure explaining the resistance board integrated support body of 1st Embodiment of this invention, Comprising: It is a top view of a resin member. It is explanatory drawing explaining process A1 in the manufacturing method of the resistance board | substrate integrated support body concerning 1st Embodiment of this invention. It is a figure explaining the manufacturing method of the resistance substrate integrated support concerning 1st Embodiment of this invention, Comprising: It is explanatory drawing of process A2 following process A1 of FIG. It is a figure explaining the separation process of the resistance substrate integrated support concerning a 1st embodiment of the present invention, and Drawing 12 (a) is a microscope picture after laser processing in a portion corresponding to Z section shown in FIG. FIG. 12B is a schematic diagram thereof. It is a figure explaining the rotary type variable resistor of 2nd Embodiment of this invention, Comprising: Fig.13 (a) is a top view, FIG.13 (b) is a side view. It is a disassembled perspective view of the rotation type variable resistor using the resistance board integrated support body of 2nd Embodiment of this invention. It is a decomposition | disassembly side view of the rotation type variable resistor using the resistance board integrated support body of 2nd Embodiment of this invention. It is a top view of the resistance board integrated support body of 2nd Embodiment of this invention. It is a figure explaining the resistance board integrated support body of 2nd Embodiment of this invention, Comprising: It is a top view of a resistance board. It is a figure explaining the resistance board integrated support body of 2nd Embodiment of this invention, Comprising: Fig.18 (a) is sectional drawing in the XV-XV line | wire shown in FIG. 17, FIG.18 (b) It is sectional drawing in the XX-XX line shown in FIG. It is explanatory drawing explaining process B1 in the manufacturing method of the resistance board | substrate integrated support body concerning 2nd Embodiment of this invention. It is a figure explaining the manufacturing method of the resistance substrate integrated support concerning 2nd Embodiment of this invention, Comprising: It is explanatory drawing of process B2 following process B1 of FIG. It is a figure explaining the comparative example compared with the manufacturing method of the resistance board integrated support concerning a 1st embodiment of the present invention, and Drawing 21 (a) is a microscope picture compared with Drawing 12 (a). FIG. 21 (b) is a schematic diagram compared with FIG. 12 (b). It is a disassembled perspective view which shows the rotary variable resistor of the prior art example 1. FIG. It is a disassembled perspective view which shows the variable resistor of the prior art example 2.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view of a rotary variable resistor KT01 according to a first embodiment of the present invention. 2 is a diagram for explaining the rotary variable resistor KT01 according to the first embodiment of the present invention. FIG. 2 (a) is a top view seen from the Z1 side shown in FIG. b) is a side view seen from the X1 side shown in FIG. FIG. 3 is an exploded perspective view of the rotary variable resistor KT01 using the resistance substrate integrated support 110 according to the first embodiment of the present invention. FIG. 4 is an exploded side view of the rotary variable resistor KT01 using the resistance substrate integrated support 110 according to the first embodiment of the present invention. FIG. 5 is a perspective view of the slider 150 and the rotating member 160 viewed from the Z2 side shown in FIG. In FIGS. 4 and 5, for convenience of explanation, the distal end side of the shaft portion 63 is shown in a deformed state.

  The rotary variable resistor KT01 of the first embodiment of the present invention has a columnar appearance as shown in FIGS. 1 and 2, and as shown in FIGS. The slider 150 includes a slider 150 that slides in an arc shape on a resistor pattern RP2 (see FIG. 7 described later) of the resistor substrate 11, and a rotating member 160 provided with the slider 150. In response to the rotation operation of the operator, the rotation member 160 rotates in conjunction with an operation shaft (not shown), and the slider 150 rotates as the rotation member 160 rotates.

  First, the slider 150 of the rotary variable resistor KT01 is formed into a ring shape by punching and bending an elastic metal plate. As shown in FIGS. 3 and 5, the slider 150 has a semi-annular shape. Two first sliding arm portions 51, two semi-annular second sliding arm portions 52, and two connecting portions that connect the first sliding arm portion 51 and the second sliding arm portion 52 54. When the rotary variable resistor KT01 is assembled, as shown in FIG. 5, the slider 150 includes two through holes 54h provided in the connecting portion 54 and two fixed portions of the rotating member 160. 64 is engaged with and held by the rotating member 160. As a result, the slider 150 rotates as the rotating member 160 rotates.

  The first sliding arm portion 51 of the slider 150 is provided with a sliding portion 51a protruding downward (Z2 side shown in FIG. 4) and the second sliding of the slider 150. The arm portion 52 is provided with a sliding portion 52b protruding downward. The sliding portion 51 a and the sliding portion 52 b are disposed to face the resistance substrate 11 of the resistance substrate integrated support body 110 and are configured to contact the surface of the resistance substrate 11.

  Next, the rotary member 160 of the rotary variable resistor KT01 is manufactured by injection molding synthetic resin such as ABS (acrylonitrile butadiene styrene) resin. As shown in FIGS. A portion 62, a cylindrical shaft portion 63 provided at the center of the lower surface of the base portion 62, and two fixing portions 64 provided so as to protrude from the lower surface of the base portion 62 are configured.

  Further, as shown in FIGS. 1 and 3, a non-circular (half-notch circular) hole 62h is provided at the center of the base 62, and the operation shaft (described above) is provided in the hole 62h. (Not shown) is inserted and engaged, and the rotation member 160 is rotatable in conjunction with the rotation operation by the operator. At this time, the rotation center axis of the operation shaft and the rotation center axis of the rotation member 160 (the circle center axis of the hole 62h) are configured to coincide with each other. Further, the rotation center axis of the rotation member 160 and the outer periphery center axis of the shaft portion 63 are configured to coincide with each other.

  Further, as described above, the two fixing portions 64 of the rotating member 160 are press-fitted into the two through holes 54 h of the slider 150 so that the slider 150 is held by the rotating member 160. When the rotary variable resistor KT01 is assembled, the sliding portion 51a and the sliding portion 52b of the slider 150 abut against the surface of the resistance substrate 11, and the first sliding arm of the slider 150 is assembled. Due to the elasticity of the portion 51 and the second sliding arm portion 52, the resistance substrate 11 is urged in a state where the sliding portion 51a and the sliding portion 52b are slightly lifted upward (Z1 side shown in FIG. 4). The rotation member 160 is rotatably attached to the resistance substrate integrated support body 110. In addition, the sliding part 51a and the sliding part 52b are comprised so that it may be arrange | positioned on a concentric circle with respect to a rotation center axis | shaft (it is also an outer periphery central axis of the axial part 63).

  Next, the resistance substrate integrated support body 110 according to the first embodiment of the present invention will be described. FIG. 6 is a top view of the resistance substrate integrated support 110 according to the first embodiment of the present invention. FIG. 7 is a top view of the resistance substrate 11. 6 and 7, the current collector pattern SP3, the first electrode pattern E14, and the second electrode pattern E24 are indicated by broken lines for easy understanding. 8A is a cross-sectional view taken along line VIII-VIII shown in FIG. 7, and FIG. 8B is a cross-sectional view taken along line IX-IX shown in FIG.

  As shown in FIG. 6, the resistance substrate integrated support 110 used for the rotary variable resistor KT01 includes a resistance substrate 11 having an arc-shaped resistor pattern RP2 and a resistance substrate so that the resistor pattern RP2 is exposed. 11 and the resin member 17 holding 11. The resistance substrate 11 is press-fitted and held in the resin member 17. In addition, the resistance substrate integrated support 110 further includes three terminals 18 (18A, 18B, 18C) for taking out an output signal from the resistor pattern RP2.

  First, as shown in FIG. 7, the resistance substrate 11 of the resistance substrate integrated support body 110 has a circular base portion 11s and a base portion in plan view as shown in FIG. 7, using the insulating substrate 19 (see FIG. 8) as a base material. And a rectangular terminal portion 11t formed on the lower side of 11s (Y2 side shown in FIG. 7).

  As shown in FIG. 7, two rectangular notches 11 k are formed on the base portion 11 s of the resistance substrate 11 on both sides of the circular side (X direction side shown in FIG. 7) in plan view. In addition, a circular through hole 11h into which the shaft portion 63 of the rotating member 160 is inserted is provided. Further, as shown in FIG. 7, the terminal portion 11t of the resistance substrate 11 is also provided with three through holes (11a, 11b, 11c). The outer peripheral central axis of the base portion 11s and the hole central axis of the through hole 11h are configured to coincide with each other.

  Also, as shown in FIG. 8, a plurality of layers are formed on the insulating substrate 19 on one surface side of the resistance substrate 11, and as shown in FIG. The resistor pattern RP2 in which the sliding portion 51a) slides in an arc shape, the resistor layer RS2 formed on the outer periphery and the inner periphery of the resistor pattern RP2, and the inner periphery of the resistor pattern RP2 Current collector pattern SP3 formed on the side, first electrode pattern E14 that conducts to one end RP2a of resistor pattern RP2, and second electrode pattern E24 that conducts to the other end RP2z of resistor pattern RP2. I have. All of these layers are printed by screen printing.

  First, the resistor pattern RP2 and the resistor layer RS2 formed on the resistor substrate 11 have the same resistance film configuration and a solid film shape, and are printed at the same time. The resistor pattern RP2 is separated and formed into an arc-shaped pattern as will be described later, and the sliding portion 51a of the slider 150 slides in an arc shape on the resistor pattern RP2. . For this reason, compared with the conventional pattern (resistor pattern 802 and resistance element part 912) formed by independently printing the arc-shaped independent pattern, the film thickness of the resistor pattern RP2 is formed almost uniformly. Can do. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be improved. Note that the resistance film that is the basis of the resistor pattern RP2 and the resistor layer RS2 is a film in which carbon powder is dispersed in a binder such as a phenol resin.

  Further, as shown in FIGS. 7 and 8, a separation pattern DP5 including a space is formed between the resistor pattern RP2 and the resistor layer RS2, and the resistor pattern is formed by the separation pattern DP5. RP2 and resistor layer RS2 are insulated. This separation pattern DP5 is formed by preparing a resistance film to be the resistor pattern RP2 and the resistor layer RS2 in advance and irradiating the resistance film with a laser to remove a part of the resistance film. It is. This makes it possible to smoothly form the edges of the separated resistor pattern RP <b> 2 with less unevenness as compared with the case of removing (for example, scraping) by other physical methods. As will be described later, laser irradiation to the resistance substrate 11 is performed in a state where the resistance substrate 11 is integrated with the resin member 17. That is, the laser irradiation is performed by using the bearing portion J17 (specifically, the center of the through hole J17h) which is a part of the resin member 17 holding the resistance substrate 11 as an irradiation position reference, and is formed separately. The resistor pattern RP2 is formed with reference to the hole center axis of the through hole J17h.

  Moreover, in 1st Embodiment of this invention, as shown in FIG. 8, the insulating layer R16 which consists of synthetic resins is first printed and formed on the surface on the insulating substrate 19 by screen printing. On the solid insulating layer R16, the resistor pattern RP2, resistor layer RS2, current collector pattern SP3, first electrode pattern E14 (not shown in FIG. 8), and second electrode pattern E24 described above. Are stacked.

  In addition, the insulating layer R16 formed on the resistance substrate 11 is preferably composed of an epoxy resin film which is a thermosetting resin. For example, when a phenol resin is used as the thermosetting resin, moisture may be generated when curing is performed according to the heat treatment after printing. Such generation of moisture causes generation of minute irregularities on the surface of the film, and may adversely affect each layer formed on the insulating layer R16. On the other hand, in the first embodiment of the present invention, since an epoxy resin is used as the thermosetting resin, it is possible to prevent the generation of such moisture and to obtain a surface film with less unevenness. This can have a positive effect on the output characteristics of the rotary variable resistor KT01 using the resistance substrate 11.

  Further, as shown in FIG. 8, a part of the insulating layer R16 located under the separation pattern DP5 (insulating substrate 19 side) formed by irradiating the resistance film with laser is shaved, as shown in FIG. Thus, it is exposed from the separation pattern DP5 in plan view. This is because the insulating layer R16, which is a thermosetting resin, does not soften even if the insulating layer R16 is irradiated with the laser and heated, so that the laser can be prevented from reaching the insulating substrate 19. It is a result.

  Next, as shown in FIG. 6, the current collector pattern SP3 formed on the resistor substrate 11 is provided on the inner peripheral side of the resistor pattern RP2, and an annular ring portion and a lower portion of the ring portion are provided. A pattern shape is formed by a rectangular strip portion extending from (Y2 direction shown in FIG. 6). Then, the sliding portion 52b of the slider 150 slides in an arc shape on the annular portion of the current collector pattern SP3. Further, since the cylindrical portion 18s (see FIG. 3) of the terminal 18B is inserted into the through hole 11b of the resistance substrate 11 and fixed by means such as caulking, the current collector pattern SP3 is electrically connected to the terminal 18B at a strip-shaped portion. doing.

  On the current collector pattern SP3, as shown in FIGS. 7 and 8, an overcoat layer CR2 made of the same material as the resistor pattern RP2 is formed so as to cover the current collector pattern SP3. The overcoat layer CR2 is made of a resistance film that becomes the resistor pattern RP2 and the resistor layer RS2, and constitutes a part of the resistor layer RS2. Thereby, the resistor pattern RP2 and the current collector pattern SP3 can be provided close to each other. Thereby, it can suppress that the resistance board | substrate 11 becomes large with provision of resistor layer RS2. Since the overcoat layer CR2 is provided on the current collector pattern SP3 in this way, the sliding portion 52b of the slider 150 is positioned over the current collector pattern SP3. It slides in contact with.

  Next, as shown in FIGS. 6 and 7, the first electrode pattern E14 and the second electrode pattern E24 formed on the resistor substrate 11 are provided on the outer peripheral side of the current collector pattern SP3, and the resistor pattern A pattern shape is formed by an arc portion provided on the same circumference as RP2 and a rectangular strip-like portion extending downward from one end of the arc portion (Y2 direction shown in FIG. 6).

  The first electrode pattern E14 is electrically connected to one end RP2a of the resistor pattern RP2, and is electrically connected to a terminal 18A inserted and fixed in the through hole 11a of the resistor substrate 11. The second electrode pattern E24 is electrically connected to the other end RP2z of the resistor pattern RP2, and is electrically connected to a terminal 18C inserted and fixed in the through hole 11c of the resistor substrate 11. The current collector pattern SP3, the first electrode pattern E14, and the second electrode pattern E24 are films in which silver powder is dispersed in a binder such as phenol resin, and are simultaneously formed by screen printing.

  Further, as shown in FIGS. 7 and 8B, the first electrode pattern E14 and the second electrode pattern E24 have an overcoat made of the same material as the resistor layer RS2, as in the current collector pattern SP3. The layer CR2 is formed so as to cover the first electrode pattern E14 and the second electrode pattern E24. Thus, since the overcoat layer CR2 is provided on the current collector pattern SP3, the first electrode pattern E14, and the second electrode pattern E24, it is possible to prevent silver sulfidation, silver migration (silver migration), and the like. it can.

  Finally, the insulating substrate 19 of the resistance substrate 11 is a glass epoxy substrate. Thereby, even when this resistance substrate integrated support body 110 is applied to a sensor or the like used in a high-temperature environment for in-vehicle use, it has sufficient heat resistance and obtains a good linearity characteristic of an output signal. be able to. Note that a paper phenol substrate can also be used as the insulating substrate 19.

  Further, as described above, since the insulating layer R16 is formed between the resistor pattern RP2 and the resistor layer RS2 and the insulating substrate 19, the insulating substrate 19 is adversely affected by laser processing, as will be described in detail later. Even if a glass epoxy substrate is used, the resistance film can be removed by laser processing, and the shape of the resistor pattern RP2 having an arc shape can be obtained.

  Next, the resin member 17 of the resistance substrate integrated support 110 will be briefly described. FIG. 9 is a top view of the resin member 17. The resin member 17 is produced by injection molding a synthetic resin such as ABS resin into a circular box shape. As shown in FIGS. 3 and 9, the disc-shaped bottom B17 and the outer periphery of the bottom B17 The ring-shaped wall part W17 extended in the (Z1 direction shown in FIG. 3) and the cylindrical bearing part J17 formed through the center part of the bottom part B17 are comprised. And as shown in FIG. 9, the accommodating part 17s which is the space comprised by the upper surface B17p of the bottom part B17, the inner peripheral surface W17p of wall part W17, and the outer peripheral surface J17p of the bearing part J17 is formed, and this accommodating part The resistance substrate 11 is accommodated in 17s. Further, the hole central axis of the cylindrical through hole J17h penetrating the center of the bearing portion J17 coincides with the inner peripheral central axis of the inner peripheral surface W17p and the outer peripheral central axis of the outer peripheral surface J17p.

  Also, as shown in FIG. 3, the bottom B17 of the resin member 17 is provided with three convex portions B17t extending upward, and when the resistance substrate integrated support 110 is assembled. Each of the convex portions B17t is inserted into the cylindrical cavity of the cylindrical portion 18s of the terminal 18 (18A, 18B, 18C), and the convex portion B17t and the terminal 18 are engaged.

  Further, the wall portion W17 of the resin member 17 is provided with two protruding portions W17t extending toward the inside of the accommodating portion 17s. Then, when the resistance substrate integrated support 110 is assembled, the resistance substrate 11 is press-fitted into the housing portion 17s, and the protruding portion W17t of the wall portion W17 and the resistance substrate 11 are cut as shown in FIG. The notch portion 11k is strongly fitted. Thereby, positioning of the resistance board 11 in the rotation direction is performed. Further, the press-fitting of the resistance substrate 11 into the resin member 17 is performed by strongly fitting the outer periphery of the base portion 11s of the resistance substrate 11 and the inner peripheral surface W17p of the wall portion W17 of the resin member 17. As a result, the outer peripheral center axis of the base portion 11s (also the hole central axis of the through hole 11h of the resistance substrate 11) and the inner peripheral center axis of the inner peripheral surface W17p of the resin member 17 (the hole central axis of the through hole J17h of the resin member 17). Can be matched). The resistor pattern RP2 of the resistor substrate 11 is formed with the hole central axis of the through hole J17h of the resin member 17 as a reference. When the resistance substrate integrated support body 110 is assembled, the bearing portion J17 of the resin member 17 is inserted into the through hole 11h of the resistance substrate 11.

  When the rotary variable resistor KT01 is assembled, the shaft portion 63 of the rotating member 160 is inserted into the through hole J17h of the bearing portion J17 of the resin member 17, and the bearing portion J17 rotates the shaft portion 63. I support it as possible. At this time, the center axis of the through hole J17h of the bearing portion J17 and the center axis of the outer periphery of the shaft portion 63 of the rotating member 160 coincide with each other. As a result, the resistor pattern RP2 formed with reference to the hole central axis of the through hole J17h, the sliding portion 51a of the slider 150 disposed with reference to the outer peripheral central axis of the shaft portion 63, and the sliding The relative positional accuracy with the part 52b is ensured. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be further improved.

  The effects of the resistance substrate integrated support 110 and the rotary variable resistor KT01 using the resistance substrate integrated support 110 according to the first embodiment of the present invention configured as described above will be collectively described below. .

  The resistance substrate integrated support body 110 according to the first embodiment of the present invention screen-prints the resistance film to be the resistor pattern RP2 and the resistor layer RS2 on the insulating substrate 19 in the form of a solid film at the same time, and separates the two. Thus, an independent resistor pattern RP2 having an arc shape can be formed. For this reason, compared with the conventional pattern (resistor pattern 802 and resistor element part 912) formed by printing independently, the film thickness of resistor pattern RP2 can be formed almost uniformly. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be improved.

  Further, since the separation pattern DP5 is formed by removing the resistance film by laser irradiation, the separated resistor pattern RP2 is compared with the case where the separation pattern DP5 is removed (for example, scraped off) by another physical method. The edge can be smoothly formed with less unevenness. Thereby, the pattern accuracy of the resistor pattern RP2 is improved, and the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be further improved.

  In addition, since the insulating substrate 19 is a glass epoxy substrate, the resistance substrate integrated support 110 has sufficient heat resistance even when applied to a sensor or the like used in a high-temperature environment for vehicles, and is good. A linearity characteristic of an output signal can be obtained. On the other hand, even if a glass epoxy substrate that is adversely affected by laser processing is used, since the insulating layer R16 is formed between the resistor pattern RP2 and the resistor layer RS2 and the insulating substrate 19, the resistance film of the resistance film is formed by laser processing. Removal is possible, and the shape of the resistor pattern RP2 having an arc shape can be obtained. Thus, even when a glass epoxy substrate is used as the insulating substrate 19, the resistance substrate integrated support body 110 with improved linearity characteristics of the output signal can be obtained with certainty.

  Further, since the overcoat layer CR2 covering the current collector pattern SP3 constitutes a part of the resistor layer RS2, the resistor pattern RP2 and the current collector pattern SP3 can be provided close to each other. Thereby, it can suppress that the resistance board | substrate 11 becomes large with provision of resistor layer RS2.

  Further, since the resistance substrate 11 is press-fitted into the housing portion 17s of the resin member 17, and the shaft portion 63 of the rotating member 160 provided with the slider 150 is rotatably inserted into the bearing portion J17 of the resin member 17, It is possible to ensure relative positional accuracy between the resistor pattern RP2 of the resistance substrate 11 and the slider 150 on the rotating member 160 side. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be further improved.

  Since the rotary variable resistor KT01 according to the first embodiment of the present invention includes the resistance substrate integrated support 110 of any of the above-described aspects, the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved. ing.

  Next, a method for manufacturing the resistance substrate integrated support 110 will be described. FIG. 10 is an explanatory diagram for explaining the process A1 in the method of manufacturing the resistance substrate integrated support 110 according to the first embodiment of the present invention. FIG. 10 (a) shows the state after the completion of the insulating layer forming process P11. 10B shows a state after the electrode forming process P12 is finished, FIG. 10C shows a state after the resistance printing process P13 is finished, and FIG. 10D shows an outer shape machining process P14. The state after the end is shown. In addition, in FIG. 10, although demonstrated using the example which acquires the resistance board | substrate 11 which concerns on 1st Embodiment of this invention, the acquisition number is not restricted to this, It can change suitably. . FIG. 11 is an explanatory diagram of the process A2 following the process A1 of FIG. 10, FIG. 11 (a) shows a state after the terminal mounting process PA4 is completed, and FIG. 11 (b) is after the integration process P15 is completed. FIG. 11 (c) shows a state after the separation step P16 is completed.

  The manufacturing method of the resistance substrate integrated support 110 includes a preparation process PA1 for preparing the mother board MB, an insulating layer forming process P11 for printing and forming the insulating layer R16 in a solid film shape, the first electrode pattern E14, and the second electrode. Electrode forming step P12 for forming pattern E24, resistance printing step P13 for printing and forming a resistive film in a solid film shape, outer shape processing step P14 for obtaining a single substrate, and terminal mounting step for mounting terminals 18 on the single substrate It has PA4, the integration process P15 which hold | maintains an individual board | substrate to the resin member 17, and the isolation | separation process P16 which forms isolation | separation pattern DP5.

  First, although not shown, a preparation process PA1 for preparing the mother board MB is performed. In the preparation step PA1, a rectangular mother substrate MB is prepared by cutting out from a large glass epoxy substrate. This mother substrate MB becomes the insulating substrate 19 of the resistance substrate 11.

  Next, an insulating layer forming step P11 for forming the insulating layer R16 is performed. In the insulating layer forming step P11, first, an insulating ink in which an epoxy resin and a curing agent are dissolved in a solvent such as butyl carbitol is prepared, and the base substrate MB has a solid film-like rectangular shape as shown in FIG. Screen print on top. Then, the cured insulating layer R16 is formed on one surface side of the mother board MB by performing a heat treatment on the printed insulating ink. In addition, the heat processing in each process including the insulating layer forming process P11 is performed, for example, by placing the mother substrate MB in a baking furnace.

  Next, an electrode forming process P12 for forming the first electrode pattern E14 and the second electrode pattern E24 is performed. In the electrode forming step P12, first, a conductive ink in which silver powder is dispersed in a binder such as a phenol resin dissolved in a solvent such as carbitol is prepared, and a pattern as shown in FIG. 10B is formed on the insulating layer R16. Print. Then, by performing heat treatment on the conductive ink after printing, the cured first electrode pattern E14 and second electrode pattern E24 are formed on the insulating layer R16 in a state of being separated from each other. Moreover, in the manufacturing method of 1st Embodiment of this invention, as shown in FIG.10 (b), the collector pattern SP3 is also printed and formed simultaneously by using the same electroconductive ink.

  Next, a resistance printing process P13 for printing the resistance film in a solid film shape is performed. In the resistance printing step P13, first, a resistance ink in which carbon powder is dispersed in a binder such as phenol resin dissolved in a solvent such as carbitol is prepared, and a solid film-like rectangular shape as shown in FIG. Screen printing is performed on the insulating layer R16 so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3. Then, the cured resistive film (RF in FIG. 10C) is formed by being laminated on the first electrode pattern E14 and the second electrode pattern E24 by performing a heat treatment on the printed resistance ink. . Thereby, since it is solid film-like printing, the film thickness of the resistance film can be formed almost uniformly. In FIG. 10C, FIG. 10D, and FIG. 11, the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3 are indicated by broken lines for easy understanding.

  In the resistance printing step P13, the resistance film is formed in a solid film shape so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3. A certain overcoat layer CR2 is also produced at the same time. Thereby, a process can be simplified.

  Next, an outer shape processing step P14 for obtaining an individual substrate is performed. In the outer shape processing step P14, the outer shape is processed by performing die cutting on the mother board MB using a mold having an outer shape as shown in FIG. 10 (d). Thereby, an individual substrate constituting the resistance substrate 11 can be obtained. And since it is die-cutting by a metal mold, a circular shape (including the notch portion 11k) that is the outer shape of the base portion 11s of the resistance substrate 11, a rectangular shape that is the outer shape of the terminal portion 11t, and a central portion of the base portion 11s. The circular shape of the provided through hole 11h and the through holes (11a, 11b, 11c) provided in the terminal portion 11t can be simultaneously produced. In addition, a large number of individual substrates can be manufactured by one processing. In the outer shape processing step P14, the step of obtaining the outer shape of the resistance substrate 11 and the step of providing the through hole 11h may be performed separately.

  Next, a terminal mounting process PA4 for mounting the terminals 18 on the individual substrates is performed. In the terminal mounting process PA4, first, the cylindrical portion 18s (see FIG. 3) of the three terminals 18 (18A, 18B, 18C) is passed through the through holes (11a, 11b, 11c) of the resistance substrate 11 (individual piece substrate) (FIG. 3)). Then, the tip of the cylindrical portion 18s is caulked on the other surface side of the resistance substrate 11, and the terminal 18 is fixed to the resistance substrate 11 as shown in FIG. Thereby, the terminal 18A is electrically connected to the first electrode pattern E14 via the resistance film. Similarly, the terminal 18B and the current collector pattern SP3 are electrically connected, and the terminal 18C and the second electrode pattern E24 are electrically connected. Note that the three terminals 18 shown in FIGS. 3 and 4 are exploded views after assembly, and thus show a state in which the tip is crimped and deformed.

  Next, an integration process P15 for holding the individual substrates on the resin member 17 is performed. In the integration step P15, the resistance substrate 11 which is an individual substrate is press-fitted into the accommodating portion 17s, and the resistance substrate 11 is integrated and held on the resin member 17 as shown in FIG. At this time, as described above, the outer periphery of the base portion 11s of the resistance substrate 11 and the inner peripheral surface W17p of the wall portion W17 of the resin member 17 are strongly fitted, and the notch portion 11k and the wall portion W17 of the resistance substrate 11 are fitted. The projecting portion W17t is strongly fitted. Thereby, the relative positioning of the resistance substrate 11 and the resin member 17 is performed, and the positioning of the resistance substrate 11 in the rotation direction is also performed. Since the process is simple as described above, the resistance substrate integrated support body 110 in which the resistance substrate 11 is integrated can be easily manufactured. In the integration step P15, the bearing portion J17 of the resin member 17 is inserted into the through hole 11h of the resistance substrate 11.

  Finally, a separation process P16 for forming the separation pattern DP5 is performed. In the separation step P16, the resistance film (RF in FIG. 11B) of the resistance substrate 11 is irradiated with a laser to remove a part of the resistance film as shown in FIG. 11C. As a result, a separation pattern DP5 is formed by removing the resistance film, and a resistor pattern RP2 is obtained in which at least the outer peripheral side and the inner peripheral side are sandwiched by the separation pattern DP5. The resistor pattern RP2 is formed in an independent arc shape. The first electrode pattern E14 is electrically connected to one end RP2a of the resistor pattern RP2, and the second end RP2z of the resistor pattern RP2 is connected to the second end RP2z. The two-electrode pattern E24 is conducted. Thereby, compared with the conventional pattern (resistor pattern 802 and resistor element part 912) formed by printing independently, the film thickness of resistor pattern RP2 can be formed almost uniformly. In addition, the edge of the resistor pattern RP2 separated by the laser is smoothly formed with less unevenness as compared with the case of removing (scraping) by another physical method. By these things, the resistance board integrated support body 110 which the linearity characteristic of the output signal obtained from resistor body pattern RP2 improved can be produced.

  Further, when a plurality of resistor patterns RP2 are produced with a large mother board, the resistor films to be the plurality of resistor patterns RP2 are simultaneously screen-printed in a solid film form, so that the resistor patterns RP2 on each individual substrate Can be formed substantially uniformly. As a result, the characteristics of the output signals obtained from the resistor pattern RP2 of each resistor substrate integrated support 110 can be made uniform, and a plurality of resistor substrate integrated supports 110 with less characteristic variation can be manufactured.

  Furthermore, since the resistance film can be easily removed by laser processing as compared with the case where the resistance film is removed by other chemical methods or physical methods, when the resistance substrate integrated support 110 is manufactured. The productivity is very good. In this separation step P16, the overcoat layer CR2 formed so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3, and the resistor formed around the resistor pattern RP2. Layer RS2 is formed simultaneously.

  In addition, the laser irradiation of the resistance film in the separation step P16 of the first embodiment of the present invention is performed after the integration step P15, and a part of the resin member 17, specifically, the through hole J17h of the bearing portion J17. The separation pattern DP5 is formed on the basis of the hole center axis. Thereby, the relative positional accuracy of the resin member 17 and the resistor pattern RP2 can be ensured. In addition, irradiating the resistance film with a laser on the basis of a part of the resin member 17 (hole central axis of the through hole J17h) can be easily performed using an image processing technique.

  Further, since the separation pattern DP5 is formed with reference to the bearing portion J17 that rotatably supports the rotating member 160 provided with the slider 150, it is defined by the separation pattern DP5 (the outer periphery side and the inner periphery). The accuracy with respect to the bearing portion J17 of the resistor pattern RP2 is further improved. For this reason, since the bearing portion J17 supports the shaft portion 63 of the rotating member 160 provided with the slider 150, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be further improved. Can do. That is, the resistor pattern RP2 formed on the basis of the hole central axis of the through hole J17h and the sliding portion 51a of the slider 150 disposed on the basis of the outer peripheral central axis of the shaft portion 63 of the rotating member 160. And the relative positional accuracy with the sliding part 52b will be ensured. As described above, it is possible to easily manufacture the resistance substrate integrated support body 110 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved.

  Here, the role of the insulating layer R16 formed in the insulating layer forming step P11 will be described with reference to the drawings. FIG. 12 is a diagram for explaining laser processing in the separation step P16, and FIG. 12A is a micrograph after laser processing in a portion corresponding to the Z portion shown in FIG. ) Is a schematic diagram thereof. In FIG. 12, since the resistance film is irradiated with laser in the state of the mother substrate before the outer shape processing for obtaining the resistance substrate 11 (individual piece substrate), the through hole 11h and the like are not formed. FIG. 21 is a diagram for explaining a comparative example compared with laser processing in the separation step P16 according to the first embodiment of the present invention. FIG. 21 (a) is a microscope compared with FIG. 12 (a). It is a photograph and FIG.21 (b) is a schematic diagram compared with FIG.12 (b). In the comparative example shown in FIG. 21, the insulating layer forming step P11 is not performed, and the insulating layer R16 is not formed on the insulating substrate 19 of the glass epoxy substrate.

  In the separation step P16, the resistance film is irradiated with laser, and as shown in FIG. 12, when the separation pattern DP5 is formed, the insulating layer R16 formed in the lower layer is exposed from the separation pattern DP5. At that time, as described above, the insulating layer R16, which is a thermosetting resin, is only partially scraped (see FIG. 8) to prevent the laser from reaching the insulating substrate 19. Thereby, the resistance film can be removed so that the unevenness of the edge portion of the separation pattern DP5 is smooth and less.

  On the other hand, in the comparative example in which the insulating layer R16 is not formed, the laser reaches the insulating substrate 19 when forming the separation pattern DP5, and as shown in FIG. 21, the surface of the insulating substrate 19 made of a glass epoxy substrate. Carbonized (CC portion shown in FIG. 21 (b)). For this reason, the removal of the resistance film is adversely affected, and it is difficult to form the separation pattern DP5. Therefore, even if a glass epoxy substrate is used as the insulating substrate 19, if the insulating layer R16 is formed between the resistance film (resistor pattern RP2 and resistor layer RS2) and the glass epoxy substrate, the resistance film is formed by laser processing. Removal is possible. Note that this phenomenon did not occur when a phenol substrate was used as the insulating substrate 19.

  The effect in the manufacturing method of the resistance board integrated support body 110 of 1st Embodiment of this invention comprised as mentioned above is demonstrated collectively below.

  In the manufacturing method of the resistance substrate integrated support 110 in the first embodiment of the present invention, the resistance film to be the resistor pattern RP2 is screen-printed as a solid film (resistance printing step P13), and one of the resistance films is formed by laser. And removing the portion to obtain a resistor pattern RP2 having at least the outer peripheral side and the inner peripheral side sandwiched by the separation pattern DP5 (separation step P16). As a result, an independent resistor pattern RP2 having an arc shape can be obtained from the resistance film printed and formed in a solid film shape, so that the conventional pattern (resistor pattern 802 and the resistor element portion) formed by printing independently can be obtained. Compared with 912), the film thickness of the resistor pattern RP2 can be formed substantially uniformly. As a result, it is possible to manufacture the resistance substrate integrated support body 110 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved.

  Further, since the separation step P16 for obtaining the resistor pattern RP2 is performed by laser irradiation after the individual substrate (resistive substrate 11) is integrated with the resin member 17, the laser is based on a part of the resin member 17. Can be irradiated to the resistance film, and the relative positional accuracy between the resin member 17 and the resistor pattern RP2 can be ensured. Therefore, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be ensured only by assembling the rotating member 160 to the resistor board integrated support body 110. As a result, it is possible to easily manufacture the resistance substrate integrated support body 110 with improved linearity characteristics of the output signal obtained from the resistor pattern RP2.

  Further, since the separation pattern DP5 is formed with reference to the bearing portion J17 that rotatably supports the rotating member 160 provided with the slider 150, it is defined by the separation pattern DP5 (the outer periphery side and the inner periphery). The accuracy with respect to the bearing portion J17 of the resistor pattern RP2 is further improved. For this reason, since the bearing portion J17 supports the shaft portion 63 of the rotating member 160 provided with the slider 150, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be further improved. Can do. As a result, it is possible to easily manufacture the resistance substrate integrated support body 110 with improved linearity characteristics of the output signal obtained from the resistor pattern RP2.

  Further, in the integration step P15, the individual substrate (resistive substrate 11) can be integrated and held on the resin member 17 simply by press-fitting the individual substrate into the housing portion 17s. As a result, the process becomes a simple process, and the resistance substrate integrated support 110 can be easily manufactured.

  In addition, since the insulating layer R16 is formed between the resistance film (resistor pattern RP2 and resistor layer RS2) and the glass epoxy substrate in the insulating layer formation step P11, a glass epoxy substrate that is adversely affected by laser processing is formed. Even if it is used, the resistance film can be removed by laser processing, and the shape of the resistor pattern RP2 having an arc shape can be produced. Thereby, even when a glass epoxy substrate is used as the insulating substrate 19, the resistance substrate integrated support body 110 with improved linearity characteristics of the output signal can be reliably manufactured.

[Second Embodiment]
FIG. 13 is a diagram for explaining a rotary variable resistor KT02 according to a second embodiment of the present invention. FIG. 13 (a) is a top view of the rotary variable resistor KT02, and FIG. These are side views of rotary type variable resistor KT02. FIG. 14 is an exploded perspective view of the rotary variable resistor KT02 using the resistance substrate integrated support body 210 of the second embodiment of the present invention. FIG. 15 is an exploded side view of the rotary variable resistor KT02 using the resistance substrate integrated support 210 of the second embodiment of the present invention. The resistance substrate integrated support 210 of the second embodiment is different from the first embodiment in the configuration of the resistance substrate integrated support 210. In addition, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  The rotary variable resistor KT02 of the second embodiment of the present invention has a cylindrical appearance as shown in FIG. 13, and as shown in FIGS. 14 and 15, a resistance substrate integrated support body 210 and a resistance substrate. 21 includes a slider 150 that slides in an arc shape on a resistor pattern RP2 (see FIG. 17 described later), and a rotating member 160 provided with the slider 150. In response to the rotation operation of the operator, the rotation member 160 rotates in conjunction with an operation shaft (not shown), and the slider 150 rotates as the rotation member 160 rotates.

  First, as in the first embodiment, the slider 150 of the rotary variable resistor KT02 is formed into a ring shape by punching and bending a metal plate having elasticity, as shown in FIG. Two semi-annular first sliding arm portions 51, two semi-annular two second sliding arm portions 52, and the first sliding arm portion 51 and the second sliding arm portion 52 are connected to each other. And two connecting portions 54. When the rotary variable resistor KT02 is assembled, as shown in FIG. 14, the slider 150 has two through holes 54h provided in the connecting portion 54 and two fixed portions of the rotating member 160. 64 (see FIG. 15) is engaged and held by the rotating member 160. As a result, the slider 150 rotates as the rotating member 160 rotates.

  Next, the rotating member 160 of the rotary variable resistor KT02 is manufactured by injection molding a synthetic resin such as a polybutylene terephthalate (PBT) resin, and the disk-shaped base portion 62 (see FIG. 14). ), A cylindrical shaft portion 63 provided at the center of the lower surface of the base portion 62 (see FIG. 15), and two fixing portions 64 provided on the lower surface of the base portion 62 (one side in FIG. 15). , And is configured. As described above, when the two fixing portions 64 are press-fitted into the two through holes 54 h of the slider 150, the slider 150 is held by the rotating member 160. In that case, the sliding part 51a and the sliding part 52b of the slider 150 are disposed concentrically with respect to the rotation center axis of the rotating member 160 (also the outer periphery center axis of the shaft part 63). It is configured as follows.

  Next, the resistance substrate integrated support 210 according to the second embodiment of the present invention will be described. FIG. 16 is a top view of the resistance substrate integrated support 210 according to the second embodiment of the present invention. FIG. 17 is a top view of the resistance substrate 21. 16 and 17, the current collector pattern SP3, the first electrode pattern E14, and the second electrode pattern E24 are indicated by broken lines for easy understanding. In FIG. 16, the outer shape of the resistance substrate 21 is also indicated by a broken line. 18A is a cross-sectional view taken along line XV-XV shown in FIG. 17, and FIG. 18B is a cross-sectional view taken along line XX-XX shown in FIG.

  As shown in FIG. 16, a resistance substrate integrated support 210 used for the rotary variable resistor KT02 includes a resistance substrate 21 having an arc-shaped resistor pattern RP2 and a resistance substrate so that the resistor pattern RP2 is exposed. And a resin member 27 holding 21. The resistance substrate 21 is embedded and held in the resin member 27. In addition, the resistance substrate integrated support 210 includes three terminals 28 (28A, 28B, 28C) for taking out an output signal from the resistor pattern RP2.

  First, as shown in FIG. 17, the resistance substrate 21 of the resistance substrate integrated support 210 has a circular base portion 21s and a base portion as viewed in plan, using an insulating substrate 29 (see FIG. 18) as a base material. And a rectangular terminal portion 21t formed on the lower side of 21s (Y2 side shown in FIG. 17). The base portion 21s of the resistance substrate 21 is provided with a circular through hole 21h through which the shaft portion 63 of the rotating member 160 is inserted in the center portion. Through holes (21a, 21b, 21c) are also provided. A cylindrical portion of the terminal 28 (not shown) is inserted through the through holes (21a, 21b, 21c).

  Further, as shown in FIG. 18, a plurality of layers are formed on the insulating substrate 29 on one surface side of the resistance substrate 21. As shown in FIG. The resistor pattern RP2 in which the sliding portion 51a) slides in an arc shape, the resistor layer RS2 formed on the outer periphery and the inner periphery of the resistor pattern RP2, and the inner periphery of the resistor pattern RP2 Current collector pattern SP3 formed on the side, first electrode pattern E14 that conducts to one end RP2a of resistor pattern RP2, and second electrode pattern E24 that conducts to the other end RP2z of resistor pattern RP2. I have. All of these layers are printed by screen printing.

  First, similarly to the first embodiment, the resistor pattern RP2 and the resistor layer RS2 formed on the resistor substrate 21 have the same resistance film configuration and a solid film shape, and are printed at the same time. The resistor pattern RP2 is separated and formed into an arc-shaped pattern as will be described later, and the sliding portion 51a of the slider 150 slides in an arc shape on the resistor pattern RP2. . For this reason, compared with the conventional pattern (resistor pattern 802 and resistance element part 912) formed by independently printing the arc-shaped independent pattern, the film thickness of the resistor pattern RP2 is formed almost uniformly. Can do. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be improved. Note that the resistance film that is the basis of the resistor pattern RP2 and the resistor layer RS2 is a film in which carbon powder is dispersed in a binder such as a phenol resin.

  Further, a resistor layer RS2 which is a resistance film is provided on the outer edge portion of the resistance substrate 21, and this outer edge portion is embedded in the resin member 27 as shown in FIG. Thereby, the pattern of the solid film resistance film can be made wider. For this reason, it is possible to embed an outer peripheral portion of a pattern in which the film thickness is likely to be non-uniform, and to arrange the resistor pattern RP2 in the center where the film thickness is highly uniform. Thereby, the film thickness of the resistor pattern RP2 can be made more uniform, and the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be further improved.

  Further, as shown in FIGS. 17 and 18, a separation pattern DP5 composed of a space is formed between the resistor pattern RP2 and the resistor layer RS2, and the resistor pattern is formed by the separation pattern DP5. RP2 and resistor layer RS2 are insulated. This separation pattern DP5 is formed by preparing a resistance film to be the resistor pattern RP2 and the resistor layer RS2 in advance and irradiating the resistance film with a laser to remove a part of the resistance film. It is. This makes it possible to smoothly form the edges of the separated resistor pattern RP <b> 2 with less unevenness as compared with the case of removing (for example, scraping) by other physical methods.

  In the second embodiment of the present invention, as in the first embodiment, an insulating layer R26 made of an epoxy resin, which is a thermosetting resin, is first printed on the surface of the insulating substrate 29, as shown in FIG. A resistor pattern RP2 and a resistor layer RS2 made of a resistance film, a current collector pattern SP3, and a first electrode pattern E14 (shown in FIG. 18) are formed on the solid insulating layer R26. And the second electrode pattern E24 are laminated. The insulating layer R26 prevents the laser from reaching the insulating substrate 29 because the insulating layer R26, which is a thermosetting resin, does not soften even if the insulating layer R26 is irradiated with the laser to reach the insulating layer R26 and is heated. doing. The laser irradiation is performed using the central axis of a cylindrical through hole J27h penetrating the center of a bearing portion J27 of the resin member 27 described later as an irradiation position reference. The resistor pattern RP2 formed separately is , Formed with reference to the hole central axis of the through hole J27h.

  Next, as in the first embodiment, the current collector pattern SP3 formed on the resistor substrate 21 is provided on the inner peripheral side of the resistor pattern RP2, as shown in FIG. A pattern shape is formed by a ring-shaped portion and a rectangular strip-shaped portion extending from below the annular portion (Y2 direction shown in FIG. 16). Then, the sliding portion 52b of the slider 150 slides in an arc shape on the annular portion of the current collector pattern SP3. Further, the current collector pattern SP3 is electrically connected to the terminal 28B at a strip-shaped portion.

  On the current collector pattern SP3, as shown in FIGS. 17 and 18, an overcoat layer CR2 made of the same material as the resistor pattern RP2 is formed so as to cover the current collector pattern SP3. The overcoat layer CR2 is made of a resistance film that becomes the resistor pattern RP2 and the resistor layer RS2, and constitutes a part of the resistor layer RS2. Thereby, the resistor pattern RP2 and the current collector pattern SP3 can be provided close to each other. Thereby, it can suppress that the resistance board | substrate 21 becomes large in connection with providing resistor layer RS2.

  Next, as shown in FIGS. 16 and 17, the first electrode pattern E14 and the second electrode pattern E24 formed on the resistance substrate 21 are provided on the outer peripheral side of the current collector pattern SP3. A pattern shape is formed by an arc portion provided on the same circumference as RP2 and a rectangular strip-like portion extending downward from one end of the arc portion (Y2 direction shown in FIG. 16). The first electrode pattern E14 is electrically connected to one end RP2a of the resistor pattern RP2 and the terminal 28A, and the second electrode pattern E24 is electrically connected to the other end RP2z of the resistor pattern RP2 and the terminal 28C. . As in the first embodiment, the current collector pattern SP3, the first electrode pattern E14, and the second electrode pattern E24 are a film in which silver powder is dispersed in a binder such as a phenol resin. Is formed.

  Finally, a glass epoxy substrate is used for the insulating substrate 29 of the resistance substrate 21 as in the first embodiment. As a result, even when this resistance substrate integrated support 210 is applied to a sensor or the like used in a high-temperature environment for vehicles, it has sufficient heat resistance and obtains a good linearity characteristic of an output signal. be able to. Note that a paper phenol substrate can also be used as the insulating substrate 29.

  Next, the resin member 27 of the resistance substrate integrated support 210 will be briefly described. The resin member 27 is produced by injection molding synthetic resin such as PBT resin into a circular box shape. As shown in FIG. 14, the ring-shaped wall portion W27 forming the outer peripheral portion and the central portion are formed. And a cylindrical bearing portion J27 formed therethrough. The resistance substrate 21 and the terminal 28 are embedded and held in the resin member 27. In that case, as shown in FIG. 16, the outer edge portion of the resistance substrate 21 is embedded in the wall portion W27, and the inner peripheral edge portion of the resistance substrate 21 facing the through hole 21h is embedded in the bearing portion J27. . Although not shown, the tip of the cylindrical portion of the terminal 28 is embedded in the bottom B27 of the resin member 27 (see FIG. 15). The embedding of the resistance substrate 21 and the terminal 28 in the resin member 27 can be easily achieved by insert molding the resistance substrate 21 and the terminal 28.

  Further, when the rotary variable resistor KT02 is assembled, the shaft portion 63 of the rotating member 160 is inserted into the through hole J27h of the bearing portion J27 of the resin member 27, and the bearing portion J27 rotates the shaft portion 63. I support it as possible. At this time, the hole central axis of the through hole J27h of the bearing portion J27 and the outer peripheral central axis of the shaft portion 63 of the rotating member 160 coincide with each other. As a result, the resistor pattern RP2 formed with reference to the hole central axis of the through hole J27h, the sliding portion 51a of the slider 150 arranged with reference to the outer peripheral central axis of the shaft portion 63, and the sliding The relative positional accuracy with the part 52b is ensured. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be improved.

  The effects of the resistance substrate integrated support 210 and the rotary variable resistor KT02 using the resistance substrate integrated support 210 of the second embodiment of the present invention configured as described above will be described below. .

  The resistance substrate integrated support body 210 according to the second embodiment of the present invention screen-prints the resistance film to be the resistor pattern RP2 and the resistor layer RS2 on the insulating substrate 29 in the form of a solid film at the same time, and separates them. Thus, an independent resistor pattern RP2 having an arc shape can be formed. For this reason, compared with the conventional pattern (resistor pattern 802 and resistor element part 912) formed by printing independently, the film thickness of resistor pattern RP2 can be formed almost uniformly. Thereby, the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be improved.

  Further, since the separation pattern DP5 is formed by removing the resistance film by laser irradiation, the separated resistor pattern RP2 is compared with the case where the separation pattern DP5 is removed (for example, scraped off) by another physical method. The edge can be smoothly formed with less unevenness. Thereby, the pattern accuracy of the resistor pattern RP2 is improved, and the linearity characteristic of the output signal obtained from the resistor pattern RP2 can be further improved.

  In addition, since the insulating substrate 29 is a glass epoxy substrate, the resistance substrate integrated support 210 has sufficient heat resistance even when applied to a sensor or the like used in a high-temperature environment for vehicles. A linearity characteristic of an output signal can be obtained.

  Further, since the overcoat layer CR2 covering the current collector pattern SP3 constitutes a part of the resistor layer RS2, the resistor pattern RP2 and the current collector pattern SP3 can be provided close to each other. Thereby, it can suppress that the resistance board | substrate 21 becomes large in connection with providing resistor layer RS2.

  Since the rotary variable resistor KT02 according to the second embodiment of the present invention includes the resistance substrate integrated support 210 in any of the above-described aspects, the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved. ing.

  Next, a method for manufacturing the resistance substrate integrated support 210 will be described. FIG. 19 is an explanatory diagram for explaining the process B1 in the manufacturing process of the resistance substrate integrated support 210 according to the second embodiment of the present invention, and FIG. 19A shows the state after the end of the insulating layer forming process P21. FIG. 19B shows a state after the electrode forming step P22, FIG. 19C shows a state after the resistance printing step P23, and FIG. 19D shows an outer shape processing step P24. The state after the end is shown. In addition, in FIG. 19, although demonstrated using the example which acquires the three resistance boards 21 which concern on 2nd Embodiment of this invention, the acquisition number is not restricted to this, It can change suitably. . FIG. 20 is an explanatory diagram of the process B2 following the process B1 of FIG. 19, FIG. 20 (a) shows a state after the integration process P25 ends, and FIG. 20 (b) shows a state after the separation process P26 ends. Indicates the state.

  The manufacturing method of the resistance substrate integrated support 210 includes a preparation step PB1 for preparing the mother board MB, an insulating layer forming step P21 for forming the insulating layer R26, and the first electrode pattern E14 and the second electrode pattern E24. Electrode forming step P22, resistance printing step P23 for printing and forming a resistance film in a solid film shape, outer shape processing step P24 for obtaining a piece substrate, integration step P25 for holding the piece substrate on the resin member 27, and separation And a separation step P26 for forming the pattern DP5.

  First, although not shown, a preparation process PB1 for preparing the mother board MB is performed. In the preparation step PB1, a rectangular mother substrate MB is prepared by cutting out from a large glass epoxy substrate. This mother board MB becomes the insulating board 29 of the resistance board 21.

  Next, an insulating layer forming step P21 for forming the insulating layer R26 is performed. In the insulating layer forming step P21, first, an insulating ink in which an epoxy resin and a curing agent are dissolved in a solvent such as butyl carbitol is prepared, and the base substrate MB has a solid film-like rectangular shape as shown in FIG. Screen print on top. Then, the cured insulating layer R26 is formed on one surface side of the mother board MB by performing a heat treatment on the printed insulating ink. In addition, the heat processing in each process including the insulating layer forming process P21 is performed, for example, by placing the mother substrate MB in a baking furnace.

  Next, an electrode forming process P22 for forming the first electrode pattern E14 and the second electrode pattern E24 is performed. In the electrode forming step P22, first, conductive ink in which silver powder is dispersed in a binder such as phenol resin dissolved in a solvent such as carbitol is prepared, and a pattern as shown in FIG. 19B is formed on the insulating layer R26. Print. Then, by performing a heat treatment on the printed conductive ink, the cured first electrode pattern E14 and second electrode pattern E24 are formed on the insulating layer R26 in a separated state. Moreover, in the manufacturing method of 2nd Embodiment of this invention, as shown in FIG.19 (b), the collector pattern SP3 is also printed and formed simultaneously by using the same electroconductive ink.

  Next, a resistance printing process P23 for printing the resistance film in a solid film shape is performed. In the resistance printing step P23, first, a resistance ink in which carbon powder is dispersed in a binder such as phenol resin dissolved in a solvent such as carbitol is prepared, and a solid film-like rectangular shape as shown in FIG. Screen printing is performed on the insulating layer R26 so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3. Then, the cured resistive film (RF in FIG. 19C) is laminated on the first electrode pattern E14 and the second electrode pattern E24 by performing a heat treatment on the printed resistance ink. . Thereby, since it is solid film-like printing, the film thickness of the resistance film can be formed almost uniformly. In FIG. 19C, FIG. 19D, and FIG. 20, the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3 are indicated by broken lines for easy understanding. In FIG. 20, the outer shape of the resistance substrate 21 is also indicated by a broken line.

  Further, in the resistance printing step P23, the resistance film is formed in a solid film shape so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3. A certain overcoat layer CR2 is also produced at the same time. Thereby, a process can be simplified.

  Next, an outer shape processing step P24 for obtaining an individual substrate is performed. In the outer shape processing step P24, the outer shape is formed by performing die cutting on the mother board MB using a mold having an outer shape as shown in FIG. As a result, an individual substrate constituting the resistance substrate 21 can be obtained. And since it is die-cutting by a metal mold, the circular shape that is the outer shape of the base portion 21s of the resistance substrate 21, the rectangular shape that is the outer shape of the terminal portion 21t, and the circular shape of the through-hole 21h provided in the central portion of the base portion 21s. The shape and the through holes (21a, 21b, 21c) provided in the terminal portion 21t can be produced at the same time. In addition, a large number of individual substrates can be manufactured by one processing.

  Next, an integration process P25 for holding the individual substrates on the resin member 27 is performed. In the integration step P25, the resistance substrate 21 which is an individual substrate and the three terminals 28 (28A, 28B, 28C) are set in a mold, and a synthetic resin such as PBT resin is injection-molded. By this insert molding, the resistance substrate 21 and the terminal 28 can be embedded in the resin member 27 and the bearing portion J27 of the resin member 27 can be formed. As a result, the resistance substrate 21 can be held on the resin member 27 easily and reliably.

  Finally, a separation process P26 for forming the separation pattern DP5 is performed. In the separation process P26, the resistance film (RF in FIG. 20A) of the resistance substrate 21 is irradiated with a laser to remove a part of the resistance film as shown in FIG. 20B. As a result, a separation pattern DP5 is formed by removing the resistance film, and a resistor pattern RP2 is obtained in which at least the outer peripheral side and the inner peripheral side are sandwiched by the separation pattern DP5. The resistor pattern RP2 is formed in an independent arc shape. The first electrode pattern E14 is electrically connected to one end RP2a of the resistor pattern RP2, and the second end RP2z of the resistor pattern RP2 is connected to the second end RP2z. The two-electrode pattern E24 is conducted. Thereby, compared with the conventional pattern (resistor pattern 802 and resistor element part 912) formed by printing independently, the film thickness of resistor pattern RP2 can be formed almost uniformly. In addition, the edge of the resistor pattern RP2 separated by the laser is smoothly formed with less unevenness as compared with the case of removing (scraping) by another physical method. Thus, it is possible to manufacture the resistance substrate integrated support body 210 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved.

  Further, when a plurality of resistor patterns RP2 are produced on a large mother board MB, the resistor films to be the plurality of resistor patterns RP2 are simultaneously screen-printed in the form of a solid film. The film thickness of RP2 can be formed almost uniformly. As a result, the characteristics of the output signals obtained from the resistor pattern RP2 of each resistor substrate integrated support 210 can be made uniform, and a plurality of resistor substrate integrated supports 210 with little variation in characteristics can be produced.

  Furthermore, since the resistance film can be easily removed by laser processing as compared with the case where the resistance film is removed by other chemical methods or physical methods, the resistance substrate integrated support 210 is manufactured. The productivity is very good. In this separation step P26, the overcoat layer CR2 formed so as to cover the first electrode pattern E14, the second electrode pattern E24, and the current collector pattern SP3, and the resistor formed around the resistor pattern RP2. Layer RS2 is formed simultaneously.

  In addition, the laser irradiation of the resistance film in the separation step P26 of the second embodiment of the present invention is performed after the integration step P25, and a part of the resin member 27, specifically, the through hole J27h of the bearing portion J27. The separation pattern DP5 is formed on the basis of the hole center axis. Thereby, the relative positional accuracy of the resin member 27 and the resistor pattern RP2 can be ensured.

  Further, since the separation pattern DP5 is formed with reference to the bearing portion J27 that rotatably supports the rotating member 160 provided with the slider 150, it is defined by the separation pattern DP5 (the outer periphery side and the inner periphery). The accuracy of the resistor pattern RP2 with respect to the bearing portion J27 is further improved. For this reason, since the bearing portion J27 supports the shaft portion 63 of the rotating member 160 provided with the slider 150, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be further improved. Can do. That is, the resistor pattern RP2 formed on the basis of the hole central axis of the through hole J27h, and the sliding portion 51a of the slider 150 disposed on the basis of the outer peripheral central axis of the shaft portion 63 of the rotating member 160. And the relative positional accuracy with the sliding part 52b will be ensured. As described above, it is possible to easily manufacture the resistance substrate integrated support body 210 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved.

  Similarly to the first embodiment, in the insulating layer forming step P21, the insulating layer R26 is formed between the resistance film (resistor pattern RP2 and resistor layer RS2) and the glass epoxy substrate (insulating substrate 29). Therefore, as described in detail in the first embodiment, even if a glass epoxy substrate that is adversely affected by laser processing is used, the resistance film can be removed by laser processing, and the resistor pattern RP2 having an arc shape can be removed. Shapes can be made. This makes it possible to reliably manufacture the resistance substrate integrated support body 210 with improved linearity characteristics of the output signal.

  The effects of the method for manufacturing the resistance substrate integrated support 210 of the second embodiment of the present invention configured as described above will be described below.

  In the manufacturing method of the resistance substrate integrated support 210 in the second embodiment of the present invention, the resistance film to be the resistor pattern RP2 is screen-printed as a solid film (resistance printing step P23), and one of the resistance films is formed by laser. And removing a portion to obtain a resistor pattern RP2 having at least the outer peripheral side and the inner peripheral side sandwiched by the separation pattern DP5 (separation step P26). As a result, an independent resistor pattern RP2 having an arc shape can be obtained from the resistance film printed and formed in a solid film shape, so that the conventional pattern (resistor pattern 802 and the resistor element portion) formed by printing independently can be obtained. Compared with 912), the film thickness of the resistor pattern RP2 can be formed substantially uniformly. As a result, it is possible to manufacture the resistance substrate integrated support body 210 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved.

  Further, since the separation step P26 for obtaining the resistor pattern RP2 is performed by laser irradiation after the individual substrate (resistive substrate 21) is integrated with the resin member 27, the laser is based on a part of the resin member 27. Can be irradiated to the resistance film, and the relative positional accuracy between the resin member 27 and the resistor pattern RP2 can be ensured. Therefore, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be ensured only by assembling the rotating member 160 to the resistor board integrated support 210. Thereby, the resistance substrate integrated support body 210 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved can be easily manufactured.

  Further, since the separation pattern DP5 is formed with reference to the bearing portion J27 that rotatably supports the rotating member 160 provided with the slider 150, it is defined by the separation pattern DP5 (the outer periphery side and the inner periphery). The accuracy of the resistor pattern RP2 with respect to the bearing portion J27 is further improved. For this reason, since the bearing portion J27 supports the shaft portion 63 of the rotating member 160 provided with the slider 150, the relative positional accuracy between the resistor pattern RP2 and the slider 150 can be further improved. Can do. Thereby, the resistance substrate integrated support body 210 in which the linearity characteristic of the output signal obtained from the resistor pattern RP2 is improved can be easily manufactured.

  Further, in the integration step P25, since the insert molding of the individual substrate (resistive substrate 21) and the formation of the bearing portion J27 are performed, the resistive substrate 21 can be reliably held on the resin member 27 and the resin member The bearing portion J27 can also be easily formed on 27.

  In addition, since the insulating layer R26 is formed between the resistance film (resistor pattern RP2 and resistor layer RS2) and the glass epoxy substrate (insulating substrate 29) in the insulating layer forming step P21, the adverse effect of laser processing is reduced. Even if the glass epoxy substrate to be received is used, the resistance film can be removed by laser processing, and the shape of the resistor pattern RP2 having an arc shape can be produced. Thus, even when a glass epoxy substrate is used as the insulating substrate 29, the resistance substrate integrated support 210 with improved output signal linearity characteristics can be reliably produced.

  In addition, this invention is not limited to the said embodiment, For example, it can deform | transform and implement as follows, These embodiments also belong to the technical scope of this invention.

<Modification 1>
In the said 1st Embodiment, although comprised suitably so that the isolation | separation process P16 might be performed after the integration process P15, it is not restricted to this, For example, after the external shape process P14, an individual board | substrate (resistance board | substrate 11) Alternatively, the separation process P16 may be performed based on a part of the process, and then the integration process P15 may be performed. In this case, it is preferable to use the outer peripheral central axis of the base portion 11s of the resistance substrate 11 (which is also the hole central axis of the through hole 11h) as a reference.

<Modification 2>
In the said 2nd Embodiment, although comprised suitably so that the isolation | separation process P26 might be performed after the integration process P25, it is not restricted to this, For example, after the external shape process P24, a piece board (resistive substrate 21) Alternatively, the separation step P26 may be performed with reference to a part thereof, and then the integration step P25 may be performed. At that time, in the integration step P25, the outer peripheral center axis of the base 21s of the resistance substrate 21 (also the hole central axis of the through hole 21h) and the hole central axis of the through hole J27h of the resin member 27 coincide with each other. It is preferable that the resistance substrate 21 is set in a mold.

<Modification 3>
In the first embodiment and the second embodiment, the separation pattern DP5 is preferably formed on the basis of the bearing portions (J17, J27) in the separation step (P16, P26). However, the present invention is not limited to this. For example, you may comprise so that it may be performed on the basis of some resin members (17, 27), such as a wall part (W17, W27).

<Modification 4>
In the said 1st Embodiment and 2nd Embodiment, although the glass epoxy board | substrate was used suitably as an insulating board | substrate (19, 29), it does not restrict to this, For example, you may use a phenol board | substrate. In that case, the structure which does not perform an insulating layer formation process (P11, P21) and does not provide an insulating layer (R16, R26) may be sufficient.

  The present invention is not limited to the above-described embodiment, and can be modified as appropriate without departing from the scope of the object of the present invention.

11, 21 Resistance substrate 11h, 21h Through hole 63 Shaft portion 17, 27 Resin member 17s Housing portion J17, J27 Bearing portion J17h, J27h Through hole 19, 29 Insulating substrate MB Mother substrate DP5 Separation pattern E14 First electrode pattern E24 Second Electrode pattern SP3 Current collector pattern RP2 Resistor pattern RP2a One end RP2z The other end CR2 Overcoat layer R16, R26 Insulating layer RS2 Resistor layer 110, 210 Resistor substrate integrated support 150 Slider 160 Rotating member KT01, KT02 Rotary variable resistor P11, P21 Insulating layer forming process P12, P22 Electrode forming process P13, P23 Resistance printing process P14, P24 Outline machining process P15, P25 Integration process P16, P26 Separation process

Claims (5)

A resistor substrate having a resistor pattern printed on an insulating substrate by screen printing;
A resin member holding the resistance substrate so that the resistor pattern is exposed,
The resistor substrate includes a current collector pattern, a first electrode pattern that conducts to one end of the resistor pattern having an arc shape, and a second electrode pattern that conducts to the other end of the resistor pattern. In the manufacturing method of the resistance substrate integrated support for the formed rotary variable resistor,
An electrode forming step of forming the first electrode pattern and the second electrode pattern separately on one side of the mother substrate;
A resistance printing step of printing and forming a resistance film laminated on the first electrode pattern and the second electrode pattern in a solid film shape;
Performing outline processing on the mother substrate, and obtaining an individual substrate constituting the resistance substrate;
An integration step of holding the individual substrate on the resin member;
A separation step of irradiating the resistance film with a laser to remove a part of the resistance film and obtaining the resistor pattern sandwiched at least between the outer peripheral side and the inner peripheral side by a separation pattern formed by removing the resistive film and, the possess,
The resin member has a bearing portion that rotatably supports a shaft portion of a rotating member provided with a slider that slides on the resistor pattern;
In the outer shape processing step, including a step of forming a through hole through which the shaft portion is inserted into the individual substrate,
The method of manufacturing a resistance substrate integrated support body , wherein the laser irradiation on the resistance film in the separation step is performed after the integration step with reference to a part of the resin member . 2. The method of manufacturing a resistance substrate integrated support according to claim 1 , wherein in the separation step, the separation pattern is formed with reference to the bearing portion. The resin member is formed with an accommodating portion capable of accommodating the individual substrate.
In the integration step, by press-fitting the substrate pieces on the housing part, the resistance substrate according to claim 1 or claim 2 wherein the individual substrate, characterized in that retaining integrally said resin member A method for manufacturing an integrated support. In the integration step, by said individual substrate to insert molding, resistance according with embedding the individual substrate to the resin member, to claim 1 or 2, characterized by forming the bearing portion A method for manufacturing a substrate-integrated support. The insulating substrate is made of a glass epoxy substrate,
Before the electrode formation step, it has an insulation layer formation step of forming an insulation layer on the glass epoxy substrate,
In the electrode formation step, the first electrode pattern and the second electrode pattern are formed on the insulating layer,
In the resistance printing step, the resistance film is printed on the insulating layer so as to cover the first electrode pattern and the second electrode pattern,
In the above separation process, the manufacturing method of the resistor board integrated support according to any one of claims 1 to 4, wherein the insulating layer from the separation pattern is exposed.