JP6481833B2 - 変換器素子 - Google Patents
変換器素子 Download PDFInfo
- Publication number
- JP6481833B2 JP6481833B2 JP2016575538A JP2016575538A JP6481833B2 JP 6481833 B2 JP6481833 B2 JP 6481833B2 JP 2016575538 A JP2016575538 A JP 2016575538A JP 2016575538 A JP2016575538 A JP 2016575538A JP 6481833 B2 JP6481833 B2 JP 6481833B2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing member
- frame
- membrane
- transducer element
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 110
- 239000012528 membrane Substances 0.000 claims description 94
- 239000000463 material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
- H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/204—Material aspects of the outer suspension of loudspeaker diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/207—Shape aspects of the outer suspension of loudspeaker diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/03—Reduction of intrinsic noise in microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Description
2,2a,2b : メンブレン
3 : バックプレート
4 : メンブレンの縁部
5 : フレーム
6 : メンブレンの内側領域
7 : 第1の部分
8 : 第2の部分
9 : フレームの下端
10,10a : 補強部材
11 : 主軸
12 : 副軸
13 : 第3の部分
14 : 第4の部分
15 : 上限位置
16 : 最小距離
17 : フレームの上端
Claims (10)
- 変換器素子(1)であって、
1つの縁部(4)を有する、1つの可動なメンブレン(2,2a,2b)と、
前記メンブレン(2,2a,2b)の前記縁部(4)が固定されている1つのフレーム(5)と、
前記フレーム(5)の1つの第1の部分(7)と、当該第1の部分(7)の反対側にある、前記フレーム(5)の1つの第2の部分(8)とを互いに結合している、1つの補強部材(10)と、
を備え、
前記補強部材(10)は切り株状の頂部を有する楔形状かまたは前記メンブレン(2,2a,2b)に向かって尖状になっていることを特徴とする変換器素子。 - 前記補強部材(10)は、前記フレーム(5)の高さより小さな高さを備えることを特徴とする、請求項1に記載の変換器素子。
- 前記補強部材(10)および前記フレーム(5)は、同じ材料から成っていることを特徴とする、請求項1または2に記載の変換器素子。
- 前記補強部材(10)は、前記フレーム(5)の1つの第3の部分(13)と、前記フレーム(5)の1つの第4の部分(14)とを互いに結合し、当該第4の部分は、当該第3の部分(13)の反対側にあることを特徴とする、請求項1乃至3のいずれか1項に記載の変換器素子。
- 前記補強部材(10)は帯形状であることを特徴とする、請求項1乃至4のいずれか1項に記載の変換器素子。
- 前記補強部材(10)は十字形状であることを特徴とする、請求項1乃至4のいずれか1項に記載の変換器素子。
- 前記補強部材(10)は星形状であることを特徴とする、請求項1乃至4のいずれか1項に記載の変換器素子。
- 前記メンブレンは(2,2b)は、楕円形状または矩形状であることを特徴とする、請求項1乃至7のいずれか1項に記載の変換器素子。
- 前記補強部材(10)は、150〜700μmの高さを備えることを特徴とする、請求項1乃至8のいずれか1項に記載の変換器素子。
- 請求項1乃至9のいずれか1項に記載の変換器素子(1)を備えるMEMSマイクロフォン。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014108984.7 | 2014-06-26 | ||
DE102014108984.7A DE102014108984B4 (de) | 2014-06-26 | 2014-06-26 | Wandlerelement |
PCT/EP2015/063206 WO2015197382A1 (de) | 2014-06-26 | 2015-06-12 | Wandlerelement und mems-mikrofon |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017525263A JP2017525263A (ja) | 2017-08-31 |
JP6481833B2 true JP6481833B2 (ja) | 2019-03-13 |
Family
ID=53398087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016575538A Expired - Fee Related JP6481833B2 (ja) | 2014-06-26 | 2015-06-12 | 変換器素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10587961B2 (ja) |
JP (1) | JP6481833B2 (ja) |
DE (1) | DE102014108984B4 (ja) |
WO (1) | WO2015197382A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108346566B (zh) | 2017-01-22 | 2021-02-09 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
CN108569672B (zh) * | 2017-03-13 | 2020-08-25 | 中芯国际集成电路制造(上海)有限公司 | 麦克风及其制造方法 |
JP2019106616A (ja) * | 2017-12-12 | 2019-06-27 | 新日本無線株式会社 | Mems素子 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6031359Y2 (ja) * | 1979-03-09 | 1985-09-19 | ソニー株式会社 | 電気音響変換器 |
JPS55130500A (en) | 1979-03-27 | 1980-10-09 | Naka Tech Lab | Lifting gear used for service car at height |
JPS599517Y2 (ja) | 1979-12-15 | 1984-03-26 | 株式会社東芝 | 静電型音響−電気変換装置 |
US4418246A (en) | 1980-10-29 | 1983-11-29 | Tibbetts Industries, Inc. | Cell assembly for electret transducer |
JPS6234899A (ja) | 1985-08-09 | 1987-02-14 | Nippon Kokan Kk <Nkk> | 船体の係留力低減装置 |
JPS6234899U (ja) * | 1985-08-19 | 1987-02-28 | ||
DE69325732T2 (de) * | 1992-03-18 | 2000-04-27 | Knowles Electronics, Inc. | Festkörper-Kondensatormikrofon |
US5490220A (en) | 1992-03-18 | 1996-02-06 | Knowles Electronics, Inc. | Solid state condenser and microphone devices |
US5870482A (en) * | 1997-02-25 | 1999-02-09 | Knowles Electronics, Inc. | Miniature silicon condenser microphone |
DE10030352A1 (de) * | 2000-06-21 | 2002-01-10 | Bosch Gmbh Robert | Mikromechanisches Bauelement, insbesondere Sensorelement, mit einer stabilisierten Membran und Verfahren zur Herstellung eines derartigen Bauelements |
US7825484B2 (en) | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
US7885423B2 (en) | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
JP4256367B2 (ja) | 2005-07-06 | 2009-04-22 | 東京エレクトロン株式会社 | 振動波検出装置 |
DE102005042664A1 (de) * | 2005-09-08 | 2007-03-15 | Robert Bosch Gmbh | Mikromechanisches Sensorelement und Verfahren zu dessen Herstellung |
DE102007020847B4 (de) * | 2007-05-02 | 2009-11-26 | Mundorf Eb Gmbh | Membran-Anordnung für einen elektrodynamischen Schallwandler und Lautsprecher mit einer derartigen Membran-Anordnung |
US8467559B2 (en) * | 2008-02-20 | 2013-06-18 | Shandong Gettop Acoustic Co., Ltd. | Silicon microphone without dedicated backplate |
DE102008001185A1 (de) * | 2008-04-15 | 2009-10-29 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Membranstruktur mit feststehendem Gegenelement |
CN101883306B (zh) * | 2010-04-27 | 2012-12-12 | 瑞声声学科技(深圳)有限公司 | 振膜及包括该振膜的电容麦克风 |
ITTO20130441A1 (it) * | 2013-05-30 | 2014-12-01 | St Microelectronics Srl | Struttura di rilevamento per un trasduttore acustico mems con migliorata resistenza alle deformazioni |
US9510103B2 (en) * | 2013-09-09 | 2016-11-29 | Audio Pixels Ltd. | Microelectromechanical apparatus for generating a physical effect |
US8921957B1 (en) | 2013-10-11 | 2014-12-30 | Robert Bosch Gmbh | Method of improving MEMS microphone mechanical stability |
JP6311375B2 (ja) * | 2014-03-14 | 2018-04-18 | オムロン株式会社 | 静電容量型トランスデューサ |
-
2014
- 2014-06-26 DE DE102014108984.7A patent/DE102014108984B4/de active Active
-
2015
- 2015-06-12 US US15/319,890 patent/US10587961B2/en active Active
- 2015-06-12 WO PCT/EP2015/063206 patent/WO2015197382A1/de active Application Filing
- 2015-06-12 JP JP2016575538A patent/JP6481833B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102014108984B4 (de) | 2017-04-06 |
US20170127188A1 (en) | 2017-05-04 |
DE102014108984A1 (de) | 2015-12-31 |
US10587961B2 (en) | 2020-03-10 |
WO2015197382A1 (de) | 2015-12-30 |
JP2017525263A (ja) | 2017-08-31 |
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