JP6481695B2 - Lamp, wavelength discrimination cover for lamp, lighting device, and method of manufacturing lamp - Google Patents

Description

  The present invention relates to a lamp, a wavelength discrimination cover for the lamp, a lighting device, and a method for manufacturing the lamp.

  The use of light emitting diode (hereinafter also referred to as “LED”) elements as light source elements instead of incandescent lamps or fluorescent lamps is being promoted for the purpose of reducing the burden on the environment. . As an LED element used as a light source element, for example, a package in which a blue LED chip using gallium nitride (GaN) and a YAG yellow phosphor are combined is known. In this LED element, blue light is emitted from the blue LED chip, and yellow light is emitted from the yellow phosphor excited by the blue light. By mixing blue light and yellow light, pseudo white light can be obtained.

  In general, an illuminating device is expected to make an object that has been exposed to light look natural, that is, to have high color rendering properties. For example, Patent Document 1 describes a technique for improving the color rendering properties of a lighting device. In the illuminating device described in Patent Literature 1, the evaluation value of color rendering properties is improved by adding a filter containing neodymium oxide to the LED light source.

Japanese Unexamined Patent Application Publication No. 2004-193581

  On the other hand, the lighting device is often required to have optical characteristics according to the application. For example, an illumination device for a semiconductor factory is required to have a light color (spectrum) in which a wavelength band of 500 nm or less is attenuated (removed or reduced). The lighting device for plant cultivation facilities is required to have a light color in which the spectral emission intensity in the red band or blue band is relatively increased. An illumination device for food display equipment such as fresh fish or meat requires a light color in which the spectral radiant intensity in the red band is relatively increased.

  In the case of a lighting device using phosphors, various light colors can be reproduced by appropriately combining a plurality of phosphors.

However, in the case of an illuminating device that employs an LED element as a light source element, various light colors cannot be easily reproduced as in an illuminating device using a phosphor. As a method of reproducing a desired light color using an LED element, for example, the following method is known.
(1) A method using an LED element having a special light color (2) A method of combining multi-chip LED elements (3) A combination of a pseudo white LED and a filter function for reducing the spectral radiation intensity in some wavelength bands Method

  There are few kinds of LED elements having a special light color. Since the LED element having a special light color is expensive, there is a problem that the cost becomes high when the method (1) is adopted. In addition, since the multi-chip type LED element is also expensive, the method (2) is also expensive. For this reason, in order to reproduce a wide variety of light colors, the method (3) is preferable in terms of cost. However, the method (3) has a problem that it is not suitable for controlling the spectral radiation intensity in a narrow wavelength band.

  The present invention has been made to solve the above-described problems. An object of the present invention is to provide a lamp capable of reproducing a desired light color (spectrum) at low cost and a method for manufacturing such a lamp. Another object of the present invention is to provide a wavelength discrimination cover used for a lamp having the above-described effects and an illumination device including the lamp having the above-described effects.

A lamp according to the present invention has a light source unit having a light source element, a cylindrical shape having an opening at an end, the light source unit is disposed in a space formed inside, a cover that covers the light source element, and a cover that is provided on the cover. A wavelength discrimination layer. The wavelength discrimination layer is made of a heat-shrinkable film provided on the outer peripheral surface of the cover , and includes a first wavelength discrimination layer having a first wavelength discrimination characteristic that is a spectral radiation intensity characteristic, and a cover that is inside the first wavelength discrimination layer . A second wavelength discrimination layer provided on the inner peripheral surface or the outer peripheral surface and having a second wavelength discrimination characteristic that is a spectral radiation intensity characteristic different from the first wavelength discrimination characteristic. The spectral radiant intensity of the light that has passed through the wavelength discrimination layer with respect to the light emitted from the light source element has a maximum value that is 0.8 or more in the wavelength region longer than 500 nm, and is substantially 0 in the wavelength region shorter than 500 nm. is there.
A lamp according to the present invention has a light source unit having a light source element, a cylindrical shape having an opening at an end, the light source unit is disposed in a space formed inside, a cover that covers the light source element, and a cover that is provided on the cover. A wavelength discrimination layer. The wavelength discrimination layer is made of a heat-shrinkable film provided on the outer peripheral surface of the cover , and includes a first wavelength discrimination layer having a first wavelength discrimination characteristic that is a spectral radiation intensity characteristic, and a cover that is inside the first wavelength discrimination layer . A second wavelength discrimination layer provided on the inner peripheral surface or the outer peripheral surface and having a second wavelength discrimination characteristic that is a spectral radiation intensity characteristic different from the first wavelength discrimination characteristic. The spectral radiant intensity of light that has passed through the wavelength discrimination layer with respect to light emitted from the light source element has a first peak that is 0.7 or more in a wavelength region shorter than 500 nm, and in a wavelength region longer than 500 nm, It has a second peak that is greater than or equal to 0.6 and smaller than the first peak.

A wavelength discrimination cover for a lamp according to the present invention has a cylindrical shape having an opening at an end, and is provided with a cover for arranging a light source unit having a light source element in a space formed inside, and the cover. A wavelength discrimination layer. The wavelength discrimination layer is made of a heat-shrinkable film provided on the outer peripheral surface of the cover , and includes a first wavelength discrimination layer having a first wavelength discrimination characteristic that is a spectral radiation intensity characteristic, and a cover that is inside the first wavelength discrimination layer . A second wavelength discrimination layer provided on the inner peripheral surface or the outer peripheral surface and having a second wavelength discrimination characteristic that is a spectral radiation intensity characteristic different from the first wavelength discrimination characteristic.

  An illumination device according to the present invention includes the lamp, a power supply socket electrically connected to a power supply base of the lamp, and a power supply device that supplies lighting power to the lamp via the power supply socket.

The method for manufacturing a lamp according to the present invention includes a step of preparing a cylindrical cover having an opening at an end, and a first wavelength discrimination layer having a first wavelength discrimination characteristic which is a spectral radiation intensity characteristic on an outer peripheral surface of the cover. a step of providing a, on the inner peripheral surface of the cover, the steps of the first wavelength discrimination characteristic providing the second wavelength discrimination layer having a second wavelength discrimination characteristic is different spectral radiation strength characteristics, the light source unit to the inside of the cover And a step of covering the opening with a power supply base having a power supply terminal. The step of providing the first wavelength discrimination layer on the outer peripheral surface of the cover includes the step of covering the cover with a heat-shrinkable film, the step of shrinking the heat-shrinkable film by heating, and bringing the heat-shrinkable film into close contact with the outer peripheral surface of the cover, Is provided.

  According to the present invention, a desired light color (spectrum) can be reproduced at a low cost in a lamp.

It is a perspective view which shows an example of the illuminating device in Embodiment 1 of this invention. It is a perspective view which shows an example of the lamp | ramp in Embodiment 1 of this invention. It is a figure which shows the AA cross section of FIG. It is a figure which shows the BB cross section of FIG. It is a figure for demonstrating the structure and characteristic of a heat shrink film. It is a figure for demonstrating the structure and characteristic of a heat shrink film. It is a figure explaining the effect of Embodiment 1 of this invention. It is a figure explaining the effect of Embodiment 1 of this invention. It is a figure explaining the effect of Embodiment 1 of this invention. It is a flowchart which shows an example of the manufacturing method of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a flowchart which shows the other example of the manufacturing method of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is a figure for demonstrating the assembly procedure of a lamp | ramp. It is sectional drawing which shows an example of the lamp | ramp in Embodiment 2 of this invention. It is sectional drawing which shows an example of the lamp | ramp in Embodiment 3 of this invention. It is a side view which shows an example of the lamp | ramp in Embodiment 4 of this invention. It is a side view which shows an example of the lamp | ramp in Embodiment 5 of this invention. It is a figure for demonstrating the effect of Embodiment 6 of this invention.

  The present invention will be described with reference to the accompanying drawings. The overlapping description will be simplified or omitted as appropriate. In each figure, the same reference numerals indicate the same or corresponding parts. In addition, this invention is not necessarily limited only to the form shown in drawing. Further, the arrangement and orientation of devices, instruments, components, etc. are not limited to the arrangement and orientation shown in the drawings. The materials, shapes, and sizes of devices, instruments, and components can be changed as appropriate within the scope of the present invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an example of an illumination device 100 according to Embodiment 1 of the present invention.
The lighting device 100 includes a power supply tool 101 and a lamp 106. FIG. 1 shows an example in which the lighting device 100 includes one lamp 106. The lighting device 100 may include a plurality of lamps 106. The lamp 106 is held by the power supply device 101. The lamp 106 can be attached to and detached from the power supply device 101 by a simple operation. The power supply apparatus 101 has a mechanism for supplying power to the lamp 106. The lamp 106 is turned on when power is supplied while properly attached to the power supply apparatus 101.

  The illuminating device 100 is attached to an attachment surface such as a ceiling or a wall using, for example, a fixing tool (not shown) such as a screw. The lamp 106 is lit to illuminate the floor surface or the indoor space. The installation method, installation position, and application of the lighting device 100 are not limited to the above. For example, the lighting device 100 may be of a ceiling embedded type. The lighting device 100 may be of the type used on a table.

  The power supply device 101 includes, for example, a device main body 102, a holding socket 103, a power supply socket 104, and a power supply device 105.

  The holding socket 103 is a member for holding the lamp 106. When the lamp 106 is a straight tube lamp as shown in FIG. 1, the holding socket 103 holds one end of the lamp 106. The holding socket 103 physically contacts the lamp 106 and mechanically holds the lamp 106. The holding socket 103 may not be electrically connected to the lamp 106. That is, the holding socket 103 may be a non-powered socket. Further, the holding socket 103 may include a terminal for grounding the lamp 106. The holding socket 103 is provided on the instrument main body 102.

  The power supply socket 104 is a member for holding the lamp 106. When the lamp 106 is a straight tube lamp as shown in FIG. 1, the power supply socket 104 holds the other end of the lamp 106. The power supply socket 104 physically contacts the lamp 106 and mechanically holds the lamp 106. When the lamp 106 is properly held in the power supply socket 104, the power supply socket 104 is electrically connected to the lamp 106. That is, the power supply socket 104 forms part of the power supply path to the lamp 106. The power supply socket 104 is provided in the instrument main body 102.

  The power supply device 105 supplies power to the lamp 106 via the power supply socket 104. The power supply device 105 is housed in a dedicated housing, for example. The power supply device 105 is provided inside the instrument main body 102. In FIG. 1, the power supply device 105 housed inside the instrument main body 102 is indicated by a broken line.

  The power supply device 105 includes a power conversion device, for example. The power supply device 105 supplies power for lighting the lamp 106 (hereinafter also referred to as “lighting power”) when a switch (not shown) provided on the wall of the room is turned on. When the switch is turned off, the power supply device 105 stops supplying the lighting power. For example, a power receiving wiring (not shown) and a power feeding wiring (not shown) are connected to the power supply device 105. The power receiving wiring is a wiring for receiving power supply from an external commercial power source or the like. The power supply wiring is a wiring for supplying lighting power to the lamp 106. The power supply wiring is connected to the power supply socket 104.

  The lamp 106 includes a light emitting diode (hereinafter also referred to as “LED”) as a light source element. Hereinafter, a specific description will be given by taking as an example the case where the lamp 106 is a straight tube LED lamp. The shape of the lamp 106 is not limited to the shape of a straight tube lamp.

  FIG. 2 is a perspective view showing an example of the lamp 106 according to Embodiment 1 of the present invention. In FIG. 2, in order to make the internal configuration of the lamp 106 easier to see, a part of the internal configuration of the lamp 106 is indicated by a solid line. FIG. 3 is a view showing a cross section taken along the line AA of FIG. FIG. 4 is a view showing a BB cross section of FIG. 3.

  The lamp 106 includes, for example, a cover 1, a wavelength discrimination layer 6, a holding base 3, a power supply base 4, and a light source unit 2.

  The cover 1 is made of a hollow member having an opening. For example, the cover 1 has a long cylindrical shape as shown in FIGS. 3 and 4, and the outer shape of the cross section has a substantially circular shape (including a circular shape). In each end portion 14 (first end portion 140 and second end portion 141) of the cover 1, an opening leading to the internal space is formed. The cover 1 has a rigidity that can support the entire lamp 106 when the lamp 106 is held by the power supply apparatus 101. For the cover 1, for example, a material having both desired translucency and heat resistance is used. The translucency is a function necessary for transmitting the light emitted from the light source unit 2. The heat resistance is a function necessary for fixing the wavelength discrimination layer 6 to the cover 1.

  As a material for the cover 1, glass is suitable. The cover 1 is made of, for example, a glass tube. For example, as the material of the cover 1, soda lime glass composed of 70% to 72% of silica (SiO 2) is used. As the cover 1, a straight pipe having the same dimensional standard as that of the straight pipe before sealing at both ends used for manufacturing a fluorescent lamp specified in Japanese Industrial Standard (JIS) may be used. The material of the cover 1 is not limited to the above material. For example, a heat resistant resin material may be used as the material of the cover 1. However, it is preferable that the linear expansion coefficient of the cover 1 is small.

  The cover 1 includes, for example, a straight pipe portion 12 and a neck portion 13. The straight pipe portion 12 has a straight cylindrical shape with an outer diameter D1. The straight pipe portion 12 occupies most of the cover 1. The straight pipe portion 12 is disposed between the neck portions 13. That is, the end portions 14 on both sides of the cover 1 are formed by the neck portions 13.

  The neck portion 13 includes a convex ring portion 130, a concave ring portion 131, and a straight ring portion 132 in order from the side closer to the straight pipe portion 12. The convex ring portion 130 is an annular portion that swells outward. The concave ring portion 131 is an annular portion recessed inward. The diameter of the convex ring portion 130 and the concave ring portion 131 gradually decreases as the distance from the straight pipe portion 12 increases. The straight ring portion 132 is an annular portion having a certain diameter. The outer diameter D2 of the straight ring portion 132 is smaller than the outer diameter D1 of the straight pipe portion 12. The convex ring portion 130, the concave ring portion 131, and the straight ring portion 132 are continuously connected to form the neck portion 13. The shape of the neck portion 13 is called a neck form.

  The shape of the cover 1 is not limited to the above shape. For example, the outer shape of the cross section of the cover 1 may be oval. The outer shape of the cross section of the cover 1 may be a polygon or a star.

  The light source unit 2 is a unit that emits light when supplied with lighting power. The light source unit 2 includes an LED 200 as a light source element. The light source unit 2 is disposed in a space formed inside the cover 1. That is, the LED 200 is covered by the cover 1. When the lighting power is supplied to the light source unit 2, the light emitted from the LED 200 passes through the cover 1 and the wavelength discrimination layer 6 and is emitted to an indoor space or the like. A specific configuration of the light source unit 2 will be described later.

  The wavelength discrimination layer 6 has a function of attenuating the spectral radiation intensity in a specific wavelength band with respect to the transmitted light. The light emitted from the LED 200 passes through the wavelength discrimination layer 6 to adjust its light color (spectrum). Light whose light color has been adjusted by the wavelength discrimination layer 6 is emitted into an indoor space or the like. The wavelength discrimination layer 6 is provided on the cover 1. In the present invention, the wavelength discrimination layer 6 includes a plurality of layers. Each layer constituting the wavelength discrimination layer 6 has different wavelength discrimination characteristics. That is, each layer constituting the wavelength discrimination layer 6 attenuates the spectral radiation intensity in a specific wavelength band.

  In the present embodiment, as the simplest example, a case will be described in which the wavelength discrimination layer 6 includes two layers of a first wavelength discrimination layer 6A and a second wavelength discrimination layer 6B. The first wavelength discrimination layer 6A has a first wavelength discrimination characteristic. The second wavelength discrimination layer 6B has a second wavelength discrimination characteristic that is different from the first wavelength discrimination characteristic. For example, the second wavelength discrimination characteristic is different from the first wavelength discrimination characteristic in the spectral radiation intensity characteristic. As another example, the second wavelength discrimination characteristic has a maximum attenuation wavelength different from the first wavelength discrimination characteristic. As another example, the second wavelength discrimination characteristic is different from the first wavelength discrimination characteristic in the half-value width with respect to the maximum attenuation wavelength. These characteristics may be combined.

  Hereinafter, an example in which the heat shrink film 60 is provided as the first wavelength discrimination layer 6A and the light color adjustment film 64 is provided as the second wavelength discrimination layer 6B will be described in detail.

  The light color adjusting film 64 is provided on the inner peripheral surface 11 of the cover 1. The inner peripheral surface 11 is a surface (first surface) on which light from the LED 200 is incident. The light emitted from the LED 200 first passes through the light color adjusting film 64 and its light color is adjusted. The light whose light color is adjusted by the light color adjusting film 64 enters the cover 1 from the inner peripheral surface 11.

  The film thickness of the light color adjusting film 64 is set so that a desired attenuation characteristic can be obtained with respect to the spectral radiation intensity in a specific wavelength band. In the example shown in the present embodiment, the film thickness of the light color adjusting film 64 is set so as to obtain a desired attenuation characteristic according to the specification of the lamp 106 in combination with the attenuation characteristic of the heat shrink film 60. . The film thickness of the light color adjusting film 64 is set to a value of 30 μm or less, for example.

  The light color adjusting film 64 includes, for example, a light color adjusting material for discriminating and attenuating light having a specific wavelength. The light color adjusting film 64 includes, for example, a resin, an organic pigment, or a dye as a light color adjusting material. The light color adjustment film 64 may include a plurality of the light color adjustment materials exemplified above. When a light color adjusting material such as a resin is included in the light color adjusting film 64, for example, a mixed liquid containing the light color adjusting material is applied to the inner peripheral surface 11 of the cover 1. Then, the mixed liquid applied to the inner peripheral surface 11 of the cover 1 is dried, and a light color adjusting film 64 including a light color adjusting material is formed on the inner peripheral surface 11.

  An inorganic pigment may be employed as the light color adjusting material, but in such a case, the luminous flux value (brightness) of the lamp 106 may be significantly reduced. On the other hand, when a resin, an organic pigment, or a dye is used as the light color adjusting material, the luminous flux value (brightness) of the lamp 106 does not significantly decrease. For this reason, the organic pigment is suitable as a light color adjusting material included in the light color adjusting film 64. When an organic pigment is employed as the light color adjusting material in the example shown in the present embodiment, the volume content of the organic pigment in the light color adjusting film 64 is, for example, 3.0% to The value is set to about 10.0%.

  Some dyes are not excellent in heat resistance, light resistance and weather resistance. When such a dye-dissolved liquid is applied to the inner peripheral surface 11 of the cover 1 and dried, the light color adjusting film 64 may change color with time. That is, a desired light color cannot be obtained. For this reason, when a dye is included in the light color adjusting film 64 as a light color adjusting material, it is preferable that the mixed liquid contained in a state where the dye is not dissolved is applied to the inner peripheral surface 11 of the cover 1 and dried. By forming the light color adjusting film 64 by such a method, discoloration of the light color adjusting film 64 can be suppressed over a long period of time. In addition, an inexpensive dye can be employed as the light color adjusting material. In the case of using another light color adjusting material, the light color adjusting film 64 may be formed by the same procedure.

  By adjusting the film thickness of the light color adjusting film 64 and the content of the light color adjusting material, the light color adjusting film 64 can have a desired second wavelength discrimination characteristic. Thereby, it is possible to provide the lamp 106 and the illumination device 100 having various light colors.

  In the present embodiment, the case where the light color adjustment film 64 is provided on the inner peripheral surface 11 of the cover 1 has been described. This is an example. The light color adjustment film 64 may be provided on the outer peripheral surface 10 of the cover 1. The outer peripheral surface 10 is a surface (second surface) from which light from the LED 200 is emitted.

  In addition, the process according to the specification requested | required of the lamp | ramp 106 may be performed to the outer peripheral surface 10 and the inner peripheral surface 11 of the cover 1. FIG. Examples of processing that can be performed on the outer peripheral surface 10 and the inner peripheral surface 11 include light diffusion processing and partial light shielding processing. These processes may be performed only on the outer peripheral surface 10 or only on the inner peripheral surface 11.

  For example, as a light diffusing treatment, there is a method in which a light diffusing member having light diffusing particles is applied in a film shape so that the film thickness becomes 5.0 μm to 20.0 μm. As the light diffusing particles, for example, a metal oxide, phosphoric acid compound, fluoride, organic pigment, dye or barium sulfate having an average particle diameter of 0.01 μm to 20.0 μm is included in the light diffusing member. preferable. A plurality of the above examples may be included in the light diffusing member as light diffusing particles. When the light diffusing member contains a metal oxide as the light diffusing particle, it is selected from the group consisting of titanium, silicon, aluminum, zinc, yttrium, lanthanum, magnesium, cerium, bismuth, copper, nickel, gadolinium, zirconium, and barium. It is preferable that the light diffusing member contains at least one oxide. When the light diffusing member contains a phosphoric acid compound as the light diffusing particles, the light diffusing member preferably contains at least one compound selected from calcium pyrophosphate and strontium pyrophosphate. When the light diffusing member contains fluoride as the light diffusing particles, the light diffusing member contains at least one compound selected from magnesium fluoride, cerium fluoride, barium fluoride, strontium fluoride, and aluminum fluoride. It is preferable.

  The heat shrink film 60 is provided on the outer peripheral surface 10 of the cover 1. As described above, the light emitted from the LED 200 first passes through the light color adjustment film 64 and its light color is adjusted. The light whose light color is adjusted by the light color adjusting film 64 passes through the cover 1. And the light radiate | emitted from the outer peripheral surface 10 of the cover 1 permeate | transmits the heat contraction film 60, and the light color is adjusted again. The light transmitted through the heat shrink film 60 is emitted to an indoor space or the like. Since the light color can be adjusted in multiple stages (two stages in this embodiment), the lamp 106 and the lighting device 100 having various light colors can be provided.

  The film thickness or material of the heat shrink film 60 is selected so that a desired attenuation characteristic can be obtained with respect to the spectral radiation intensity in a specific wavelength band. In the example shown in the present embodiment, an appropriate heat shrink film 60 is selected so that a desired attenuation characteristic according to the specifications of the lamp 106 can be obtained in combination with the attenuation characteristic of the light color adjustment film 64. The

  The heat shrink film 60 is made of a member that shrinks by heat. The heat shrink film 60 covers the cover 1 from the outside of the cover 1. The heat-shrinkable film 60 shown in FIGS. 1 to 4 is in a state after being shrunk by heat. The heat shrink film 60 is provided so as to be in close contact with the cover 1 by being shrunk by heat. FIG. 3 shows an example in which the entire outer peripheral surface 10 of the cover 1 is covered with the heat shrink film 60. That is, the straight pipe portion 12 and the neck portion 13 of the cover 1 are covered with the heat shrink film 60.

  5 and 6 are diagrams for explaining the configuration and characteristics of the heat-shrinkable film 60. FIG. FIG. 5 shows a state of the heat-shrink film 60 before being shrunk by heat. The heat shrink film 60 is manufactured using, for example, two sheets 61 and 62 having heat shrinkability. The sheets 61 and 62 have, for example, a long rectangular shape. The dimensions of the sheets 61 and 62 are substantially the same. By joining the edges of the long sides with the sheets 61 and 62 having the above-described shapes overlapped, a tubular heat-shrink film 60 is formed. A joint portion 63 (first joint portion 630 and second joint portion 631) formed by joining the sheets 61 and 62 is formed in a straight line in the longitudinal direction of the heat shrink film 60. The method of joining the edges of the sheets 61 and 62 may be adhesion or welding. The edges of the sheets 61 and 62 may be joined by other methods.

  The heat-shrink film 60 has a tube shape and opens at the end 65 (the first end 650 and the second end 651). By pulling the sheet 61 in the direction of arrow S1 shown in FIG. 5 and the sheet 62 in the direction of arrow S2, the end portion 65 of the heat shrink film 60 can be expanded. When the heat-shrinkable film 60 is heat-shrinked in a state where a columnar or cylindrical member (not shown) is passed through the heat-shrinkable film 60, a cylindrical shape as shown in FIG. 6 is obtained. The heat shrink film 60 is shrunk by heat and is in close contact with the member. The heat-shrinkable film 60 after heat-shrinking has a shape that matches the outer shape of the member that is in close contact.

  The holding base 3 is a member that is held by the holding socket 103 when the lamp 106 is attached to the power supply device 101. The holding base 3 physically contacts the holding socket 103. FIG. 3 shows an example of a configuration in which the holding base 3 is not electrically connected to the light source unit 2. The holding base 3 may be configured to be electrically connected to the light source unit 2. In this case, for example, when the lamp 106 is appropriately attached to the power supply device 101, an electrical path for grounding the lamp 106 is formed between the holding base 3 and the holding socket 103.

  The holding base 3 includes, for example, a housing part 30 and a holding terminal 31. The housing part 30 is composed of, for example, a peripheral wall part 300 and a bottom wall part 301. The holding base 3 is fixed to the light source unit 2 using screws 5. A through hole 302 through which the flange of the screw 5 passes is formed in the bottom wall portion 301.

  The bottom wall portion 301 includes the first end portion 140 and the first end portion so as to close an opening (hereinafter also referred to as “first opening”) formed in one end portion 14 (first end portion 140) of the cover 1. Opposite the opening. The peripheral wall portion 300 has a cylindrical shape and is provided on the bottom wall portion 301. The peripheral wall 300 is formed so as to extend from the edge of the bottom wall 301 to the cover 1 side. The peripheral wall portion 300 is disposed around the neck portion 13 so as to surround one neck portion 13 of the cover 1. For example, the peripheral portion of the peripheral wall portion 300 that is farthest from the bottom wall portion 301 is disposed outside the concave ring portion 131 of the neck portion 13. In such a case, the peripheral wall portion 300 completely covers the straight ring portion 132 of the neck portion 13.

  In the heat shrink film 60, for example, the first end portion 650 extends to the straight ring portion 132 of the neck portion 13, and completely covers the convex ring portion 130 and the concave ring portion 131. Therefore, the first end portion 650 of the heat shrink film 60 is disposed between the cover 1 and the peripheral wall portion 300 of the holding base 3. That is, the first end portion 650 of the heat shrink film 60 is disposed inside the holding base 3. The first end 650 of the heat shrink film 60 cannot be seen from the outside of the lamp 106.

  The holding terminal 31 is provided on the bottom wall portion 301. The holding terminal 31 protrudes from the surface of the bottom wall portion 301. In the holding base 3, for example, a conductive holding terminal 31 and an electrically insulating casing 30 are integrally formed by insert molding. In this case, the holding base 3 has a structure in which the base portion of the holding terminal 31 is embedded in the housing part 30. For the housing part 30, an electrically insulating resin material or ceramic material is used. Each figure shows an example in which the holding base 3 is a GX16 type base. However, this is an example. The type of the holding cap 3 is not limited to this. As the holding base 3, another type of base such as G13 type or T5 type may be used.

  The power supply cap 4 is a member that is held by the power supply socket 104 when the lamp 106 is attached to the power supply apparatus 101. The power supply cap 4 physically contacts the power supply socket 104. The power supply base 4 is a base for supplying lighting power to the light source unit 2. For this reason, the power supply cap 4 is electrically connected to the light source unit 2. When the lamp 106 is appropriately attached to the power supply device 101, an electrical path for supplying lighting power to the light source unit 2 is formed in the power supply base 4 and the power supply socket 104.

  The power supply cap 4 includes, for example, a housing part 40 and a power supply terminal 41. The housing part 40 includes, for example, a peripheral wall part 400 and a bottom wall part 401. The power supply cap 4 is fixed to the light source unit 2 using screws 5. A through hole 402 through which the flange of the screw 5 passes is formed in the bottom wall portion 401.

  The bottom wall 401 has a second end 141 and a second end so as to block an opening (hereinafter also referred to as a “second opening”) formed in the other end 14 (second end 141) of the cover 1. Opposite the opening. The peripheral wall 400 has a cylindrical shape and is provided on the bottom wall 401. The peripheral wall 400 is formed so as to extend from the edge of the bottom wall 401 to the cover 1 side. The peripheral wall portion 400 is arranged around the neck portion 13 so as to surround the other neck portion 13 of the cover 1. The peripheral wall portion 400 is arranged, for example, at the edge farthest from the bottom wall portion 401 outside the concave ring portion 131 of the neck portion 13. In such a case, the peripheral wall portion 400 completely covers the straight ring portion 132 of the neck portion 13.

  In the heat shrink film 60, for example, the second end portion 651 extends to the straight ring portion 132 of the neck portion 13, and completely covers the convex ring portion 130 and the concave ring portion 131. For this reason, the second end portion 651 of the heat shrink film 60 is disposed between the cover 1 and the peripheral wall portion 400 of the power supply cap 4. That is, the second end 651 of the heat shrink film 60 is disposed inside the power supply cap 4. The second end 651 of the heat shrink film 60 cannot be seen from the outside of the lamp 106.

  A pair of power supply terminals 41 is provided on the bottom wall 401. 2 and 3 show an example in which the power supply terminal 41 is an L-shaped terminal having an upright portion 410 and a bent portion 411. The power supply terminal 41 protrudes from the surface of the bottom wall portion 401. The power supply terminal 41 is electrically connected to the light source unit 2. In the power supply cap 4, for example, a pair of conductive power supply terminals 41 and a casing 40 having electrical insulation are integrally formed by insert molding. In such a case, the power supply cap 4 has a structure in which the base portion of the power supply terminal 41 is embedded in the housing portion 40. The casing 40 is made of an electrically insulating resin material or ceramic material. Each figure shows an example in which the power supply base 4 is a GX16 type base. However, this is an example. The type of the power supply cap 4 is not limited to this. As the power supply base 4, another type of base such as G13 type or T5 type may be used. When the lamp 106 is properly attached to the power supply apparatus 101, the power supply terminal 41 is electrically connected to the power supply socket 104.

  The light source unit 2 includes, for example, an LED 200, a substrate 201, and a heat sink 21.

  The LED 200 is mounted on the mounting surface (front surface) of the substrate 201, for example. 2 and 3 show an example in which a plurality of LEDs 200 are mounted on the mounting surface of the substrate 201. FIG. The LEDs 200 are arranged in a line at regular intervals on the mounting surface of the substrate 201. A light source circuit is formed by electrically connecting the LED 200 and a wiring pattern provided on the surface of the substrate 201. The connection between the LED 200 and the wiring pattern provided on the surface of the substrate 201 is performed by, for example, soldering.

  For example, a pseudo white LED is used as the LED 200. The pseudo white LED can be realized, for example, by packaging a blue LED chip using gallium nitride (GaN) in combination with a YAG yellow phosphor. A blue LED chip having a main light emission peak in a wavelength range of 440 nm to 460 nm is suitable, for example. In such a pseudo white LED, blue light is emitted from a blue LED chip, and yellow light is emitted from a yellow phosphor excited by the blue light. By mixing blue light and yellow light, pseudo white light can be obtained. The configuration of the LED 200 is not limited to the above configuration. For example, a LED on which an LED chip is directly mounted on the substrate 201 such as a chip on board (COB) may be used as the LED 200. The number, arrangement, and type of the LEDs 200 are appropriately determined according to specifications required for the lamp 106.

  The substrate 201 is formed in a long shape according to the shape of the internal space of the cover 1. A wiring pattern is formed on the mounting surface of the substrate 201. A plurality of LEDs 200 are mounted on the mounting surface of the substrate 201 along the longitudinal direction. The LED 200 is electrically connected by a wiring pattern to form a light source circuit. A circuit component 202 for lighting the LED 200 is mounted on the mounting surface of the substrate 201. The circuit component 202 includes, for example, a rectifier diode, a fuse, and a resistor. The light source substrate 20 is configured by the LED 200, the substrate 201, and the circuit component 202. These circuit components 202 are electrically connected by a wiring pattern to form a power feeding circuit. Connection between the circuit component 202 and the wiring pattern provided on the surface of the substrate 201 is performed by, for example, soldering. The substrate 201 is electrically connected to the power supply terminal 41 of the power supply base 4. Lighting power is supplied to the substrate 201 from an external power source via the power supply terminal 41 of the power supply base 4. When the lighting power is supplied to the substrate 201, the LED 200 is turned on.

  For the base material of the substrate 201, a glass epoxy material, a paper phenol material, a composite material, a metal material such as aluminum (Al), or the like is used. In selecting the base material of the substrate 201, for example, arrangement of components, heat dissipation, material cost, and the like are taken into consideration. The thickness of the substrate 201 is, for example, about 1 mm. The thickness of the substrate 201 is not limited to this. In order to improve the utilization efficiency of light emitted from the LED 200, a reflective member may be provided on the surface of the substrate 201. For example, it is preferable to provide a reflective member on the surface of the substrate 201 on which the LED 200 is mounted. Examples of a method for providing the reflecting member on the surface of the substrate 201 include bonding, coating, printing, and vapor deposition.

  The heat sink 21 is formed in a long shape according to the shape of the internal space of the cover 1. A material having high thermal conductivity is used for the heat sink 21. A substrate 201 on which the LED 200 is mounted is attached to the heat sink 21. Heat generated during operation of the LED 200 is transferred from the substrate 201 to the heat sink 21. The heat received by the heat sink 21 is transmitted to the cover 1 and radiated from the cover 1 to the outside.

  The heat sink 21 has rigidity for supporting the substrate 201 and the like inside the cover 1. The heat sink 21 is formed of a metal material that can be extruded, for example. As a material of the heat sink 21, for example, a metal material such as aluminum (Al), iron, titanium, or magnesium is preferable. A material other than a metal material may be used as the material of the heat sink 21. For example, a highly heat conductive resin or ceramic may be used as the material of the heat sink 21. The material of the heat sink 21 is not limited to these. However, the linear expansion coefficient of the heat sink 21 is preferably small.

  The heat sink 21 includes, for example, a light source mounting part 210, a side wall part 213, and a facing part 225.

  The light source attachment part 210 is a part for attaching the substrate 201 on which the LED 200 and the circuit component 202 are mounted. The light source attachment part 210 is formed in a long shape according to the shape of the internal space of the cover 1. The substrate 201 is fixed to the light source arrangement surface 211 of the light source mounting part 210. The substrate 201 is attached to the light source arrangement surface 211 using, for example, an adhesive member such as an adhesive silicon resin (adhesive) or a double-sided tape. The method for fixing the substrate 201 is not limited to this. For example, the substrate 201 may be fixed to the light source arrangement surface 211 by other methods such as screwing. Further, the substrate 201 and the light source mounting part 210 may be integrally formed. In such a case, for example, a wiring pattern formed on the substrate 201 is formed on the light source arrangement surface 211. The LED 200 and the circuit component 202 are mounted on the light source arrangement surface 211.

  The light source mounting part 210 includes a screw fixing part 230 at one end and the other end. A screw hole 231 for screwing the screw 5 is formed in the screw fixing portion 230. The screw hole 231 has an axial direction in the longitudinal direction of the light source mounting portion 210. The screw fixing portion 230 is provided on the inner surface 212 of the light source attachment portion 210, for example. The inner surface 212 is a surface that faces in a direction opposite to the direction in which the light source arrangement surface 211 faces. When the heat sink 21 is manufactured by extrusion molding, it is preferable to open a portion of the screw fixing portion 230 farthest from the inner surface 212 as shown in FIG.

  When the screw 5 penetrating the through hole 302 of the holding base 3 is screwed into the screw hole 231, the holding base 3 is fixed to one end of the light source mounting portion 210. When the screw 5 penetrating the through hole 402 of the power supply base 4 is screwed into the screw hole 231, the power supply base 4 is fixed to the other end of the light source attachment part 210. The method of fixing the holding base 3 and the power supply base 4 to the heat sink 21 (light source unit 2) is not limited to this. Screw holes 231 may be formed at other positions. The holding base 3 and the power supply base 4 may be fixed to the heat sink 21 by a method other than screwing.

  The side wall part 213 is a part having a positioning function of the substrate 201. The side wall part 213 is provided on the light source arrangement surface 211 of the light source attachment part 210 along the longitudinal direction of the light source attachment part 210. The side wall part 213 protrudes from the light source arrangement surface 211. The pair of side wall portions 213 are provided on the light source arrangement surface 211 with a space slightly larger than the width of the substrate 201. The substrate 201 is disposed between the side wall portions 213. The side wall part 213 serves to shield part of circuit components (for example, connection connectors) mounted on the substrate 201 from being visible from the outside of the cover 1.

  The facing portion 225 is a portion facing the inner peripheral surface 11 of the cover 1 with the light color adjusting film 64 interposed therebetween. The facing portion 225 has an arc shape. The outer surface 226 of the facing portion 225 is curved with, for example, substantially the same curvature as that of the inner peripheral surface 11 of the cover 1. The facing portion 225 is supported by the support portion 221. The support part 221 protrudes from the inner surface 212 of the light source attachment part 210, for example, and extends perpendicularly to the substrate 201 attached to the light source attachment part 210. By providing the support part 221, the thickness of the heat sink 21 can be made uniform. The moldability of the heat sink 21 formed by extrusion molding can be improved.

  As shown in FIG. 4, for example, the heat sink 21 is provided with a pair of facing portions 225. The facing portion 225 is disposed along the inner peripheral surface 11 of the cover 1. An adhesive member 235 such as an adhesive silicon resin (adhesive) or a double-sided tape is provided between the outer surface 226 of the facing portion 225 and the inner peripheral surface 11 (light color adjusting film 64) of the cover 1. As a result, the light source unit 2 is affixed and fixed to the light color adjustment film 64 on the inner peripheral surface 11 of the cover 1.

  The facing portion 225 is a portion that transfers heat generated by the LED 200 or the like to the cover 1 via the light color adjusting film 64. For this reason, the adhesive member 235 may include a material containing a heat conductive grease. Further, a heat conductive member such as a heat conductive sheet may be used as the adhesive member 235. The heat conduction performance of the adhesive member 235 is appropriately determined based on the heat resistant temperature, life, strength, and the like of the LED 200 and the circuit component 202.

  The light source mounting part 210, the pair of side wall parts 213, the pair of support parts 221 and the pair of opposing parts 225 are integrally formed, for example. The heat generated in the LED 200 and the circuit component 202 is transmitted from the light source mounting part 210 to the support part 221 and from the support part 221 to the facing part 225. The heat transferred to the facing portion 225 is transmitted from the facing portion 225 to the cover 1 via the light color adjustment film 64 and is radiated from the cover 1 to the outside.

  The cross-sectional shape of the heat sink 21 shown in FIG. 4 shows an example. The cross-sectional shape of the heat sink 21 may be other shapes. For example, in order to increase rigidity, the cross-sectional shape of the heat sink 21 may be cylindrical. For the purpose of promoting the transfer of heat to the internal space of the cover 1, fins or the like may be provided on the heat sink 21. The surface area of the heat sink 21 can be increased by providing the fins.

  Next, the effect of this Embodiment is demonstrated using FIGS. 7-9. 7 to 9 are diagrams for explaining the operational effects of the first embodiment of the present invention. FIG. 7 is a graph comparing the spectral radiant intensity of light emitted from the LED 200 and the spectral radiant intensity of light transmitted through the light color adjusting film 64 using an organic pigment. This represents the relative value when the maximum amount is 1. As shown in FIG. 7, the spectral radiant intensity (relative intensity) of the light that has passed through the light color adjusting film 64 using the organic pigment is substantially 0 in the wavelength region shorter than 500 nm. The average value of the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is about 4.0%, and the average value of the film thickness of the light color adjusting film 64 is about 7 μm.

  FIG. 8 is a graph comparing the spectral radiant intensity of light that has passed through the light color adjusting film 64 using an organic pigment by changing the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64. The characteristics are shown in detail by expanding the range of the spectral radiation intensity. As shown in FIG. 8, according to an experiment, when an organic pigment is used as the light color adjusting material, the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is 3.0% to 4. The best results are obtained when adjusted to about 0%.

  In addition, regarding the relationship between the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 and the film thickness of the light color adjusting film 64, the film thickness is adjusted when the volume content is adjusted to 3.0%. The average value is about 6 μm, the average film thickness when the volume content is adjusted to 4.0% is about 7 μm, the average thickness is about 10 μm when the volume content is adjusted to 5.0%, When the volume content is adjusted to 6.0%, the average film thickness is about 15 μm, and when the volume content is adjusted to 7.0%, the average film thickness is about 20 μm and the volume content is 8. When adjusted to 0%, the average film thickness is about 25 μm, and when the volume content is adjusted to 10.0%, the average film thickness is about 30 μm.

  FIG. 9 shows a light color adjusting film using an organic pigment by providing a heat shrink film 60 on the outer peripheral surface 10 of the cover 1 and changing the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64. 64 is a graph comparing the spectral radiant intensity of light that has passed through 64, and shows the characteristics in detail by expanding the range of the spectral radiant intensity. As shown in FIG. 9, in an experiment in which the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is adjusted to 3.0% to 7.0%, The spectral radiant intensity (relative intensity) of the light that passed through the light color adjusting film 64 using the pigment could be substantially zero. The thickness of the heat shrink film 60 used in this experiment is about 120 μm. As described above, by combining the light color adjusting film 64 using an organic pigment as the wavelength discriminating means with the heat shrink film 60, it is possible to obtain suitable characteristics in a wavelength region shorter than 500 nm.

  For example, the lamp 106 capable of reducing the spectral radiant intensity (relative intensity) to approximately 0 in a wavelength region shorter than 500 nm is for semiconductor factories that require a light color with a relatively large spectral radiant intensity in the yellow band. It is suitable for the lighting device 100.

  Next, a method for manufacturing the lamp 106 having the above configuration will be specifically described with reference to FIGS. FIG. 10 is a flowchart showing an example of a method for manufacturing the lamp 106. 11 to 18 are diagrams for explaining an assembly procedure of the lamp 106. In FIGS. 11 to 18, a portion surrounded by a broken line indicates a cross section.

First, the cover 1 shown in FIG. 11 is prepared. The cover 1 is, for example, a hollow glass tube. As described above, the cover 1 includes the straight pipe portion 12 and the neck portion 13. A first opening is formed in the first end 140 of the cover 1. A second opening is formed at the second end 141. Each dimension in the radial direction shown in FIG. 11 and the like is as follows.
D1: Outer diameter of straight pipe portion 12 D2: Outer diameter of straight ring portion 132

Next, the light color adjusting film 64 is formed on the inner peripheral surface 11 of the prepared cover 1 (W12). The light color adjustment film 64 is formed by, for example, applying a mixed liquid containing a light color adjustment material to the inner peripheral surface 11 of the cover 1 and drying it. The method for forming the light color adjusting film 64 is not limited to this. FIG. 12 shows a state in which the light color adjusting film 64 is formed on the inner peripheral surface 11 of the cover 1. The light color adjusting film 64 is formed over the entire inner peripheral surface 11, for example. Each dimension of the longitudinal direction shown in FIG. 12 etc. is as follows.
L1: Overall length of the cover 1 L2: Length of the exposed portion 15 of the cover 1 L3: Length of the concealing portion 16 of the cover 1 L4: Minimum length of a portion covered by the heat shrink film 60

  The concealing portion 16 is a portion of the cover 1 that is concealed by the holding base 3 or the power supply base 4 when the lamp 106 is completed. The concealing portion 16 is disposed inside the holding base 3 or inside the power supply base 4 when the lamp 106 is completed. The concealing part 16 is set to the concave ring part 131 and the straight ring part 132, for example. The range of the concealment part 16 is not limited to this. For example, a part of the concave ring part 131 may not be included in the concealing part 16. A part of the convex ring portion 130 may be included in the concealing portion 16.

  The exposed portion 15 is a portion of the cover 1 that is not concealed by the holding base 3 and the power supply base 4 when the lamp 106 is completed. The exposed portion 15 is disposed between the concealing portion 16. For example, the exposed portion 15 is set to the straight tube portion 12 and the convex ring portion 130. The range of the exposed portion 15 is not limited to this. For example, a part of the convex ring portion 130 may not be included in the exposed portion 15. A part of the concave ring portion 131 may be included in the exposed portion 15.

  The length L4 is a length in a range that needs to be covered by the heat shrink film 60. That is, when the lamp 106 is completed, at least a range indicated by the length L4 is covered with the heat shrink film 60. The length L4 is set to a length longer than the length L2 of the exposed portion 15. For example, the length L4 is set to the length of the straight pipe portion 12, the convex ring portions 130 on both sides of the straight pipe portion 12, and the concave ring portions 131 on both sides of the convex ring portion 130. The length L4 matches the length required for the heat shrink film 60 after heat shrink.

Moreover, the tube-shaped heat shrink film 60 shown in FIG. 13 is prepared. Each dimension shown in FIG. 13 is as follows.
<Dimensions in the longitudinal direction>
L5: Length of heat-shrink film 60 before heat shrinking <diameter dimension>
D3: Outer diameter of heat-shrinkable film 60 before heat shrinking D4: Inner diameter of heat-shrinkable film 60 before heat shrinking T1: Thickness of heat-shrinkable film 60 before heat shrinking

  The length L5 is set to such a length that the entire range indicated by the length L4 of the cover 1 can be covered with the heat shrink film 60 when the lamp 106 is completed. For example, the length L5 is set to be longer than the entire length L1 of the cover 1. When the long heat shrink film 60 is prepared, the heat shrink film 60 is cut into a length L5 (W11).

  Either the process of W11 or the process of W12 may be performed first.

  Next, the cover 1 is inserted into the heat shrink film 60, and the cover 1 is disposed at a predetermined position with respect to the heat shrink film 60 (W13). FIG. 14 shows a state in which the cover 1 is disposed inside the heat shrink film 60. For example, the cover 1 is disposed in the center of the heat shrink film 60, and the entire cover 1 is covered with the heat shrink film 60.

  A radial dimension A1 shown in FIG. 14 is a theoretical average value of a gap formed between the straight pipe portion 12 of the cover 1 and the heat-shrinkable film 60 before heat-shrinking. The dimension A1 is equal to a value obtained by dividing the difference between the inner diameter D4 of the heat shrink film 60 before heat shrinkage and the outer diameter D1 of the straight pipe portion 12 by two. As the heat shrink film 60, a film in which the dimension A1 is about 5 to 20 times the thickness T1 is preferable. For example, consider a case in which a heat shrink film 60 having a thickness T1 before heat shrinkage of 0.1 mm is used for the cover 1 having an outer diameter D1 of the straight pipe portion 12 of 25.5 mm. In such a case, the heat shrinkable film 60 having a theoretical average value of the distance between the outer peripheral surface 10 of the straight pipe portion 12 and the inner surface 67 of the heat shrinkable film 60 of 0.5 mm to 2.0 mm may be used.

  Next, the cover 1 and the heat shrink film 60 are heated in a state where they are arranged at the positions shown in FIG. Thereby, the heat shrink film 60 adheres to the outer peripheral surface 10 of the cover 1 (W14). FIG. 15 shows a state in which the heat-shrinkable film 60 that is heat-shrinked is in close contact with the cover 1. As shown in FIG. 15, the entire cover 1 is covered with a heat shrink film 60.

  In the process of W14, for example, the heating temperature, the heating time, and the heating distribution are adjusted, and the heat shrink film 60 is gradually brought into close contact with the cover 1 from one end portion 14 of the cover 1 toward the other end portion 14. This is to prevent bubbles from remaining between the cover 1 and the heat shrink film 60. In particular, it is not preferable that bubbles remain in the exposed portion 15 of the cover 1. The heat shrink film 60 may be gradually adhered to the cover 1 from the center portion of the cover 1 toward both end portions 14.

  The dimension L6 in the longitudinal direction shown in FIG. 15 indicates the finished length of the heat shrink film 60 after heat shrinkage. The length L6 is longer than the overall length L1 of the cover 1. The length L5 of the heat shrink film 60 before heat shrinking is set in advance so that the length L6 is longer than the length L1.

  Next, the extra length portion of the heat shrink film 60 is cut (W15). FIG. 16 shows a state after the extra length portion of the heat shrink film 60 is cut. A longitudinal dimension L7 shown in FIG. 16 indicates the length of the heat-shrinkable film 60 after cutting. FIG. 16 shows an example in which the heat-shrink film 60 is cut along the edge of the cover 1 that forms the first opening and the second opening. That is, the heat shrink film 60 is cut to the length of the cover 1. The length L7 matches the length L1.

  Next, the light source unit 2 is attached inside the cover 1 (W16). First, the light source unit 2 is inserted into the cover 1, and the light source unit 2 is arranged inside the cover 1. The entire light source unit 2 is disposed inside the cover 1. When the light source unit 2 is appropriately disposed inside the cover 1, the facing portion 225 is fixed to the inner peripheral surface 11 of the cover 1.

  Next, the holding base 3 and the power supply base 4 are attached to the cover 1 (W17). For example, the power supply cap 4 is put on the second end portion 141 of the cover 1, and the screw 5 is screwed into the screw hole 231 in this state. Thereby, the power supply cap 4 is fixed to the light source unit 2. Note that the facing portion 225 may be fixed to the inner peripheral surface 11 of the cover 1 after the power supply base 4 (or the holding base 3) is fixed to the light source unit 2.

  FIG. 17 shows a state where the power supply cap 4 is attached to the light source unit 2. A radial dimension H1 shown in FIG. 17 indicates the width of the convex portion 403 of the power supply cap 4. The dimension R <b> 1 indicates a relative displacement range between the joint portion 63 of the heat shrink film 60 and the power supply base 4 (or the holding base 3).

  When the feeding base 4 is appropriately fixed to the light source unit 2, the feeding terminal 41 of the feeding base 4 is electrically connected to the light source unit 2. When the power supply base 4 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 that covers the straight ring portion 132 and the concave ring portion 131 is disposed between the cover 1 and the power supply base 4. Further, the edge along the second opening of the heat shrink film 60 is disposed inside the power supply cap 4. The second opening and the edge along the second opening of the heat shrink film 60 are covered with the power supply cap 4. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  Next, the holding base 3 is put on the first end 140 of the cover 1, and the screw 5 is screwed into the screw hole 231 in this state. Thereby, the holding base 3 is fixed to the light source unit 2. FIG. 18 shows a state where both the power supply cap 4 and the holding cap 3 are attached to the light source unit 2. When the holding base 3 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 that covers the straight ring portion 132 and the concave ring portion 131 is disposed between the cover 1 and the holding base 3. Further, an edge along the first opening of the heat shrink film 60 is disposed inside the holding base 3. The first opening and the edge along the first opening of the heat shrink film 60 are covered with the holding base 3. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  In the above description, the feeding base 4 is attached before the holding base 3. This is an example. The holding base 3 may be attached first, and the feeding base 4 may be attached later.

  The lamp 106 having the configuration shown in FIGS. 2 to 4 is manufactured by the above procedure.

  In the lamp 106 having the above-described configuration, the wavelength discrimination layer 6 including a plurality of layers is provided on the cover 1. By appropriately setting the wavelength discrimination characteristics of each layer, light having a desired light color (spectrum) can be obtained. In particular, when a pseudo white LED is mounted on the light source unit 2, it is necessary to attenuate the spectral radiation intensity in a narrow wavelength band. In the case of the lamp 106 having the above-described configuration, the entire wavelength discrimination characteristics can be set by combining the wavelength discrimination characteristics of the layers constituting the wavelength discrimination layer 6, so that such a case can be easily handled. In addition, the lamp 106 having the above configuration can emit special light having a light color not defined in JIS Z 9112.

  In the lamp 106 having the above configuration, the first end portion 650 of the heat shrink film 60 is disposed inside the holding base 3. The second end 651 of the heat shrink film 60 is disposed inside the power supply cap 4. The end portion 65 of the heat shrink film 60 is not exposed on the surface of the lamp 106. For this reason, the designability of the lamp 106 can be improved.

  In the lamp 106 having the above-described configuration, a portion covering the straight ring portion 132 and the concave ring portion 131 of the heat shrink film 60 is sandwiched between the cover 1 and the holding base 3 or the power supply base 4. The heat shrink film 60 is not disposed outside the holding base 3 and outside the power supply base 4. For this reason, the heat shrink film 60 can be prevented from being rolled or peeled off from the first end 650 or the second end 651. For example, it is possible to prevent the heat-shrinkable film 60 from being peeled off in processes after assembling the lamp 106 such as an inspection process and a packaging process. Further, it is possible to prevent the heat shrink film 60 from being peeled off in the construction process for attaching the lamp 106 to the power supply apparatus 101.

  In the lamp 106 having the above-described configuration, by attaching the holding base 3 and the power supply base 4, it is possible to obtain a structure for preventing the heat shrink film 60 from being twisted and peeled off. A member necessary only for fixing the end portion 65 of the heat shrink film 60 is not required. Further, an operation necessary only for fixing the end portion 65 of the heat shrink film 60 does not occur. For this reason, a number of parts can be reduced and assemblability can be improved.

  In the present embodiment, an example in which the cover 1 is a hollow member having a first opening and a second opening has been described. This is an example. For example, if the holding base 3 is not electrically connected to the light source unit 2, the cover 1 may not have the first opening. When the lighting device 100 is used on a table, only the base corresponding to the power supply base 4 may be provided. In such a case, only one opening is necessarily formed in the cover 1.

  In the present embodiment, the lamp 106 has been described in detail, but the form distributed in the market is not limited to the form of the lamp 106. For example, you may distribute the illuminating device 100 provided with the power supply device 105 grade | etc., To a market. Further, the lamp 106 excluding the light source unit 2 may be distributed in the market as a lamp case. The cover 1 provided with the wavelength discrimination layer 6 may be distributed in the market as a lamp case. Even in such a form, the same effect as described above can be expected.

  Next, another method for manufacturing the lamp 106 having the above-described configuration will be specifically described with reference to FIGS. FIG. 19 is a flowchart showing another example of a method for manufacturing the lamp 106. 20 to 26 are diagrams for explaining the procedure for assembling the lamp 106. 20 to 26, a portion surrounded by a broken line indicates a cross section.

  First, the cover 1 shown in FIG. 20 is prepared. The cover 1 is, for example, a hollow glass tube. As described above, the cover 1 includes the straight pipe portion 12 and the neck portion 13. A first opening is formed in the first end 140 of the cover 1. A second opening is formed at the second end 141.

  Next, the light color adjusting film 64 is formed on the inner peripheral surface 11 of the prepared cover 1 (W22). The light color adjustment film 64 is formed by, for example, applying a mixed liquid containing a light color adjustment material to the inner peripheral surface 11 of the cover 1 and drying it. The method for forming the light color adjusting film 64 is not limited to this. FIG. 21 shows a state in which the light color adjusting film 64 is formed on the inner peripheral surface 11 of the cover 1. The light color adjusting film 64 is formed over the entire inner peripheral surface 11, for example.

  Moreover, the tube-shaped heat shrink film 60 shown in FIG. 22 is prepared. A dimension L8 in the longitudinal direction shown in FIG. 22 indicates the length of the heat shrink film 60 before heat shrinking. The length L8 is set to such a length that the entire range indicated by the length L4 of the cover 1 can be covered with the heat shrink film 60 when the lamp 106 is completed. For example, the length L8 is set to a length longer than L4 and shorter than the length L1. When the long heat shrink film 60 is prepared, the heat shrink film 60 is cut into a length L8 (W21).

  Next, the cover 1 is inserted into the heat shrink film 60, and the cover 1 is disposed at a predetermined position with respect to the heat shrink film 60 (W23). FIG. 23 shows a state in which the cover 1 is appropriately disposed inside the heat shrink film 60. For example, the cover 1 is arranged so that the center of the cover 1 and the center of the heat shrink film 60 are aligned. The length L8 is shorter than the length L1. For this reason, the cover 1 protrudes from both end portions 65 of the heat shrink film 60. The cover 1 is covered with the heat shrink film 60 except for the protruding portion.

  Next, the cover 1 and the heat shrink film 60 are heated in a state where they are arranged at the positions shown in FIG. Thereby, the heat shrink film 60 adheres to the cover 1 (W24). FIG. 24 illustrates a state in which the heat-shrinkable film 60 that has been heat-shrinked is in close contact with the cover 1. As shown in FIG. 24, in the cover 1, the edge forming the first opening and the edge forming the second opening are not covered by the heat shrink film 60. The other part of the cover 1 is entirely covered by the heat shrink film 60. Each end portion 65 of the heat shrink film 60 is disposed, for example, outside the straight ring portion 132 of the cover 1.

  The dimension L9 in the longitudinal direction shown in FIG. 24 indicates the finished length of the heat shrink film 60 after heat shrink. The length L9 is longer than the length L4 and shorter than the length L1, for example. The length L8 of the heat shrink film 60 before heat shrinking is set in advance such that the length L9 is longer than the length L4 and shorter than the length L1.

  Next, the light source unit 2 is attached to the inside of the cover 1 (W26). First, the light source unit 2 is inserted into the cover 1, and the light source unit 2 is arranged inside the cover 1. The entire light source unit 2 is disposed inside the cover 1. When the light source unit 2 is appropriately disposed inside the cover 1, the facing portion 225 is fixed to the inner peripheral surface 11 of the cover 1.

  Next, the holding base 3 and the power supply base 4 are attached to the cover 1 (W27). For example, the power supply cap 4 is put on the second end portion 141 of the cover 1, and the screw 5 is screwed into the screw hole 231 in this state. Thereby, the power supply cap 4 is fixed to the light source unit 2. Note that the facing portion 225 may be fixed to the cover 1 after the power supply base 4 (or the holding base 3) is fixed to the light source unit 2.

  FIG. 25 shows a state in which the power supply cap 4 is attached to the light source unit 2. A longitudinal dimension L10 (right side) shown in FIG. 25 indicates the length of a portion of the heat shrink film 60 that is in close contact with the cover 1 that is concealed by the power supply cap 4.

  When the feeding base 4 is appropriately fixed to the light source unit 2, the feeding terminal 41 of the feeding base 4 is electrically connected to the light source unit 2. When the power supply base 4 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 that covers the straight ring portion 132 and the concave ring portion 131 is disposed between the cover 1 and the power supply base 4. Further, an edge along the second opening of the heat shrink film 60 is also disposed between the cover 1 and the power supply base 4. That is, the edge along the second opening of the heat shrink film 60 is disposed inside the power supply cap 4. The second opening and the edge along the second opening of the heat shrink film 60 are covered with the power supply cap 4. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  Next, the holding base 3 is put on the first end 140 of the cover 1, and the screw 5 is screwed into the screw hole 231 in this state. Thereby, the holding base 3 is fixed to the light source unit 2. FIG. 26 shows a state where both the power supply cap 4 and the holding cap 3 are attached to the light source unit 2. A longitudinal dimension L10 (left side) shown in FIG. 26 indicates the length of a portion of the heat shrink film 60 that is in close contact with the cover 1 that is concealed by the holding base 3.

  When the holding base 3 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 that covers the straight ring portion 132 and the concave ring portion 131 is disposed between the cover 1 and the holding base 3. Further, an edge along the first opening of the heat shrink film 60 is also disposed between the cover 1 and the holding base 3. That is, the edge along the first opening of the heat shrink film 60 is disposed inside the holding base 3. The first opening and the edge along the first opening of the heat shrink film 60 are covered with the holding base 3. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  In the above description, the feeding base 4 is attached before the holding base 3. This is an example. The holding base 3 may be attached first, and the feeding base 4 may be attached later.

  In the assembly procedure shown in FIG. 19, there is no step of cutting the extra length portion of the heat shrink film 60. The above procedure can be realized by appropriately managing the length L8 of the heat shrink film 60 before heat shrinking. The assembly procedure shown in FIG. 19 can further improve the assemblability. Moreover, since the usage-amount of the heat shrink film 60 can be reduced, while being excellent in economical efficiency, it leads also to environmental conservation.

  Next, another configuration that can employ the lamp 106 will be described. Even if the configuration described below is employed, the same effect as described above can be expected.

  As an example, a light color adjustment film similar to the light color adjustment film 64 may be provided as the first wavelength discrimination layer 6A. That is, a light color adjusting film may be provided on the outer peripheral surface 10 of the cover 1 as the first wavelength discrimination layer 6A. In such a case, the film thickness of the light color adjusting film provided on the outer peripheral surface 10 of the cover 1 is set so as to obtain a desired attenuation characteristic according to the specification of the lamp 106 in combination with the attenuation characteristic of the light color adjusting film 64. Is done. If the film thickness of the light color adjustment film 64 is less than 40 μm, the film thickness of the light color adjustment film provided on the outer peripheral surface 10 of the cover 1 is set to a value of 40 μm or more. For example, the film thickness of the light color adjustment film 64 can be 10 μm, and the film thickness of the light color adjustment film provided on the outer peripheral surface 10 of the cover 1 can be 120 μm. That is, the light color adjusting films having different thicknesses are provided on the outer peripheral surface 10 and the inner peripheral surface 11 of the cover 1.

  Further, when the light color adjusting film provided on the outer peripheral surface 10 of the cover 1 includes an organic pigment as the light color adjusting material like the light color adjusting film 64, the volume content of the light color adjusting material is set to the light color adjusting film. The wavelength discrimination characteristic can also be changed by setting the value different from the volume content of 64. If the volume content of the light color adjusting material of the light color adjusting film 64 is less than about 10.0%, the volume content of the light color adjusting material of the light color adjusting film provided on the outer peripheral surface 10 of the cover 1 is 10. It is set to about 0% or more. For example, the volume content of the light color adjusting material of the light color adjusting film 64 is about 5.0%, and the volume content of the light color adjusting material of the light color adjusting film provided on the outer peripheral surface 10 of the cover 1 is 15.0. %.

  As another example, the first wavelength discrimination layer 6 </ b> A and the second wavelength discrimination layer 6 </ b> B may be provided on the same surface of the cover 1. For example, the first wavelength discrimination layer 6A and the second wavelength discrimination layer 6B may be provided on the outer peripheral surface 10 of the cover 1 so as to overlap each other. In this case, after providing the first wavelength discrimination layer 6A on the outer peripheral surface 10 of the cover 1, the second wavelength discrimination layer 6B may be provided on the surface of the first wavelength discrimination layer 6A. Further, the first wavelength discrimination layer 6A and the second wavelength discrimination layer 6B may be provided on the inner peripheral surface 11 of the cover 1 in an overlapping manner. In this case, after providing the first wavelength discrimination layer 6A on the inner peripheral surface 11 of the cover 1, the second wavelength discrimination layer 6B may be provided on the surface of the first wavelength discrimination layer 6A.

  As another example, the wavelength discrimination layer 6 may include three or more layers. In this case, the wavelength discrimination layer 6 may be provided only on the outer peripheral surface 10 of the cover 1, or the wavelength discrimination layer 6 may be provided only on the inner peripheral surface 11. A part of the wavelength discrimination layer 6 may be provided on the outer peripheral surface 10 of the cover 1, and another layer of the wavelength discrimination layer 6 may be provided on the inner peripheral surface 11 of the cover 1.

  In the present embodiment, the lamp 106 in which the spectral radiation intensity (relative intensity) is substantially zero in the wavelength region shorter than 500 nm is shown as an example. By adjusting the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64, the band where the spectral radiant intensity (relative intensity) of the light that has passed through the light color adjusting film 64 becomes substantially zero is shifted. May be. For example, the spectral radiant intensity (relative intensity) of the light that has passed through the light color adjusting film 64 is made substantially zero in a region having a wavelength shorter than 480 nm. That is, by adjusting the volume content of the organic pigment (light color adjusting material), the band where the spectral radiation intensity (relative intensity) is substantially 0 is shifted to the short wavelength side. In addition, the spectral radiant intensity (relative intensity) in the wavelength region longer than 500 nm is relatively increased. Thereby, the lamp | ramp 106 excellent in the low insect attractant can be obtained.

  Further, the wavelength band of light to be attenuated or increased may be shifted by mixing a yellow phosphor with the light color adjusting film 64. Even with such a configuration, light having a desired light color (spectrum) can be obtained. Note that by mixing a yellow phosphor with the light color adjusting film 64, light in the blue band having a wavelength shorter than 500 nm can be converted into light in the yellow band. The energy of light emitted from the LED 200 can be utilized without waste, and the decrease in the luminous flux of the lamp 106 can be prevented. The above function may be realized by providing a yellow phosphor inside the package of the LED 200. The above function may be realized by providing a yellow phosphor near the LED 200, for example, between the package of the LED 200 and the cover 1.

Embodiment 2. FIG.
FIG. 27 is a cross-sectional view showing an example of a lamp 106a according to Embodiment 2 of the present invention. The cross section shown in FIG. 27 is a cross section corresponding to the AA cross section of FIG. A lamp 106 a illustrated in FIG. 27 is held by the power supply tool 101. The lamp 106a includes, for example, a cover 1a, a wavelength discrimination layer 6, a holding base 3, a power supply base 4, and a light source unit 2.

  The cover 1a is made of a hollow member having an opening. In each end portion 14 of the cover 1a, an opening leading to the internal space is formed. The cover 1 a has the same diameter from the first end 140 to the second end 141. That is, the cover 1 a does not include the neck portion 13.

  The heat shrink film 60 covers the cover 1a from the outside of the cover 1a. The procedure for bringing the heat shrink film 60 into close contact with the cover 1a may be the procedure shown in FIG. 10 or the procedure shown in FIG. FIG. 27 shows an example in which the entire outer peripheral surface 10 of the cover 1 a is covered with the heat shrink film 60.

  In the holding base 3, for example, a step for abutting the end surface of the cover 1 a is formed on the cylindrical peripheral wall portion 300. In order to prevent the heat shrink film 60 from being peeled off when the holding base 3 is placed on the first end 140 of the cover 1a, a taper is formed at the edge of the peripheral wall 300 that is farthest from the bottom wall 301.

  When the holding base 3 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 close to the first end 650 is disposed between the cover 1 a and the holding base 3. Further, an edge along the first opening of the heat shrink film 60 is disposed inside the holding base 3. The first opening and the edge along the first opening of the heat shrink film 60 are covered with the holding base 3. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  In the power supply cap 4, for example, a step for abutting the end surface of the cover 1 a is formed on a cylindrical peripheral wall portion 400. In order to prevent the heat shrink film 60 from being peeled off when the power supply cap 4 is put on the second end portion of the cover 1a, a taper is formed at an edge portion farthest from the bottom wall portion 401 of the peripheral wall portion 400.

  When the feeding base 4 is appropriately fixed to the light source unit 2, the feeding terminal 41 of the feeding base 4 is electrically connected to the light source unit 2. When the power supply base 4 is appropriately fixed to the light source unit 2, a portion of the heat shrink film 60 close to the second end 651 is disposed between the cover 1 a and the power supply base 4. Further, the edge along the second opening of the heat shrink film 60 is disposed inside the power supply cap 4. The second opening and the edge along the second opening of the heat shrink film 60 are covered with the power supply cap 4. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  If it is the lamp | ramp 106a which has the said structure, the adhesiveness with respect to the cover 1a of the heat-shrink film 60 can be improved. It is possible to prevent the heat shrink film 60 from curling and peeling over a long period of time.

Embodiment 3 FIG.
FIG. 28 is a cross-sectional view showing an example of a lamp 106b according to Embodiment 3 of the present invention. The cross section shown in FIG. 28 is a cross section corresponding to the BB cross section of FIG. In the lamp 106b shown in FIG. 28, the light source unit 2b is not housed in the cover 1b.

  The lamp 106b illustrated in FIG. 28 is held by the power supply device 101. The lamp 106b includes, for example, a cover 1b, a wavelength discrimination layer 6, a holding base 3, a power supply base 4, and a light source unit 2b.

  In the light source unit 2 b, the facing portion 225 b of the heat sink 21 b is integrally provided across the pair of support portions 221. The other configuration of the light source unit 2b is the same as the configuration of the light source unit 2 disclosed in the first embodiment. The facing portion 225b has an arc shape in cross section, for example.

  The cover 1b has, for example, a shape obtained by cutting a cylindrical member along an axis. The cover 1b does not cover the entire light source unit 2b but covers only a part of the light source unit 2b. The cover 1b is provided on the light source unit 2b. For example, the cover 1b is provided with projections 17 and 18 for holding the light source unit 2b. The cover 1b can be attached to the light source unit 2b by sliding the light source unit 2b so that the edge of the light source attachment part 210 is sandwiched between the protrusions 17 and 18. When the cover 1b is appropriately attached to the light source unit 2b, the facing portion 225b is disposed so as to close the opening formed in the longitudinal direction of the cover 1b. Thereby, the board | substrate 201 with which LED200 etc. were mounted is covered with the cover 1b.

  In the lamp 106b in the present embodiment, a cylindrical member is formed by the cover 1b and the light source unit 2b. For this reason, unless the cover 1b is appropriately attached to the light source unit 2b, the opening corresponding to the first opening and the opening corresponding to the second opening are not formed. These openings are formed by both the cover 1b and the light source unit 2b.

  When manufacturing the lamp 106b in the present embodiment, after forming the light color adjusting film 64 on the inner peripheral surface 11 of the cover 1b, first, the cover 1b is attached to the light source unit 2b to form a cylindrical member. Then, the cylindrical member is inserted into the heat shrink film 60, and the heat shrink film 60 is heat shrunk. That is, the heat shrink film 60 covers both the cover 1b and the light source unit 2b. After the heat-shrinkable film 60 is brought into close contact with the tubular member, the extra length portion of the heat-shrinkable film 60 is cut as necessary, and the holding base 3 and the power supply base 4 are attached to the tubular member.

  When the power supply base 4 is appropriately fixed to the light source unit 2b, the power supply terminal 41 of the power supply base 4 is electrically connected to the light source unit 2b. When the power supply base 4 is appropriately fixed to the light source unit 2 b, a part of the heat shrink film 60 near the second end 651 is disposed between the cover 1 b and the power supply base 4. The part other than the above part near the second end 651 is disposed between the light source unit 2 b and the power supply cap 4. Further, the edge along the second opening of the heat shrink film 60 is disposed inside the power supply cap 4. The second opening and the edge along the second opening of the heat shrink film 60 are covered with the power supply cap 4. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  When the holding base 3 is appropriately fixed to the light source unit 2 b, a part of the heat shrink film 60 close to the first end 650 is disposed between the cover 1 b and the holding base 3. A portion other than the above portion near the first end 650 is disposed between the light source unit 2 b and the holding base 3. Further, an edge along the first opening of the heat shrink film 60 is disposed inside the holding base 3. The first opening and the edge along the first opening of the heat shrink film 60 are covered with the holding base 3. For this reason, the said edge of the heat shrink film 60 cannot be seen from the outside.

  Also in the lamp 106b having the above-described configuration, the same effect as that obtained by the lamp 106 disclosed in Embodiment 1 can be expected. Furthermore, the area of the light color adjusting film 64 formed on the inner peripheral surface 11 of the cover 1b can be reduced compared to the lamp 106 disclosed in the first embodiment. That is, the amount of use of the light color adjustment film 64 can be reduced, which is excellent in economic efficiency and leads to environmental conservation. In the present embodiment, the case where the cover 1b is attached to the light source unit 2b and the outer diameter of the cross section is circular has been described. This is an example. The outer shape of the cross section is not limited to a circle. The outer shape of the cross section may be an ellipse, a triangle, a quadrangle, a polygon, or the like. Only the cross-sectional shape of the cover 1b may be changed to another shape.

Embodiment 4 FIG.
FIG. 29 is a side view showing an example of a lamp 106c according to the fourth embodiment of the present invention. The lamp 106c illustrated in FIG. 29 is held by the power supply device 101. The lamp 106c includes, for example, a cover 1, a wavelength discrimination layer 6, a holding base 3c, a power supply base 4c, and a light source unit 2.

  The holding base 3 c includes, for example, a housing part 30 c and a holding terminal 31. The housing part 30c is composed of a peripheral wall part 300 and a bottom wall part 301, for example. In the holding base 3 c, a guide groove 304 is formed at an edge portion farthest from the bottom wall portion 301 of the peripheral wall portion 300. The holding base 3 c is disposed so that the guide groove 304 faces the joint portion 63 of the heat shrink film 60. Thereby, the direction of the holding cap 3c with respect to the heat shrink film 60 can be kept constant.

  The power supply cap 4 c includes, for example, a housing part 40 c and a power supply terminal 41. The housing part 40c is composed of a peripheral wall part 400 and a bottom wall part 401, for example. In the power supply cap 4 c, a guide groove 404 is formed at an edge portion farthest from the bottom wall portion 401 of the peripheral wall portion 400. The power supply cap 4 c is disposed so that the guide groove 404 faces the joint portion 63 of the heat shrink film 60. Thereby, the direction of the power supply cap 4c with respect to the heat shrink film 60 can be kept constant.

Embodiment 5. FIG.
FIG. 30 is a side view showing an example of the lamp 106d according to the fifth embodiment of the present invention. The lamp 106d shown in FIG. The lamp 106d includes, for example, a cover 1, a wavelength discrimination layer 6, a holding base 3d, a power supply base 4d, and a light source unit 2.

  The holding base 3d includes, for example, a housing part 30d and a holding terminal 31. The housing part 30d is composed of a peripheral wall part 300 and a bottom wall part 301, for example. The holding base 3 d is provided with a display unit 305 on the outer surface of the peripheral wall unit 300. The display unit 305 displays important information such as the model number, specifications, manufacturer, and production location of the lamp 106d. The holding base 3 d is not covered with the heat shrink film 60. For this reason, the outer surface of the surrounding wall part 300 can be utilized as a place which displays required information. The holding cap 3d can be manufactured in the same process as that used for a lamp that does not require the heat shrink film 60.

  The power supply cap 4d includes a housing part 40d and a power supply terminal 41, for example. The housing part 40d is composed of a peripheral wall part 400 and a bottom wall part 401, for example. The power supply base 4 d is provided with a display unit 405 on the outer surface of the peripheral wall 400. The display unit 405 displays important information such as the model number, specifications, manufacturer, and production location of the lamp 106d. The power supply cap 4 d is not covered with the heat shrink film 60. For this reason, the outer surface of the surrounding wall part 400 can be utilized as a place which displays required information. The power supply cap 4d can be manufactured in the same process as that used for a lamp that does not require the heat shrink film 60.

  In the first to fifth embodiments, the straight tube lamp whose base shape is JEL801 has been specifically described. The shape of the base is not limited to this. For example, it goes without saying that the present invention can also be applied to a straight tube lamp having a base shape of JEL802.

  The configurations described in the first to fifth embodiments may be implemented in combination within the possible range. One of the configurations described in the first to fifth embodiments may be partially implemented. A plurality of the configurations described in the first to fifth embodiments may be partially combined. The present invention is not limited to the configuration described in the first to fifth embodiments, and various modifications can be made as necessary.

Embodiment 6 FIG.
In this embodiment, an example of obtaining light having a light color (spectrum) that is not disclosed in the first to fifth embodiments will be described. The configuration itself of the lamp 106 may adopt any configuration disclosed in the first to fifth embodiments. For example, the lamp 106 includes an LED 200 as a light source element. The lamp 106 includes a wavelength discrimination layer 6. For example, the heat shrink film 60 is provided as the first wavelength discrimination layer 6A. A light color adjustment film 64 is provided as the second wavelength discrimination layer 6B.

  FIG. 31 is a diagram for explaining the function and effect of the sixth embodiment of the present invention. FIG. 31 is a graph comparing the spectral radiant intensity of light emitted from the LED 200 and the spectral radiant intensity of light that has passed through the light color adjusting film 64 using an organic pigment. FIG. 31 shows a relative value when the maximum amount of light emitted from the LED 200 is 1.

  As shown in FIG. 31, the LED 200 has a characteristic in which emitted light relatively increases around 450 nm, 520 nm, and 640 nm. The amount of light emitted from the LED 200 is maximum around 450 nm.

  As shown in FIG. 31, according to experiments, when an organic pigment is used as the light color adjusting material, the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is 0.5% to 1. The best results were obtained when adjusted to about 0%. That is, when the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is adjusted to about 0.5% to 1.0%, light is hardly attenuated in the band near 640 nm. On the other hand, in the band near 450 nm and the band near 520 nm, the light is greatly attenuated.

  When the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is adjusted to about 1.0%, the spectral emission intensity of light in the band near 450 nm and the spectral emission of light in the band near 640 nm. The strength is almost equal. The spectral radiant intensity of light in the band near 520 nm is about 40% of the spectral radiant intensity of light in the band near 450 nm.

  For example, the amount of light attenuation in each band can be finely adjusted by the heat shrink film 60 provided on the outer peripheral surface 10 of the cover 1. By appropriately setting the wavelength discrimination characteristics of the layers constituting the wavelength discrimination layer 6, light having a desired light color (spectrum) can be obtained. With the lamp 106 shown in this embodiment, light having a light color (spectrum) in which the spectral radiant intensity in the red band is relatively increased can be obtained. For this reason, the lamp 106 of Embodiment 6 is suitable for the lighting device 100 for food display equipment such as fresh fish or meat.

  The wavelength band of light to be attenuated or increased may be shifted by mixing a red phosphor in the light color adjusting film 64. Even with such a configuration, light having a desired light color (spectrum) can be obtained. Note that by mixing a red phosphor in the light color adjusting film 64, light in the blue band having a wavelength shorter than 500 nm can be converted into light in the red band. The energy of light emitted from the LED 200 can be utilized without waste, and the decrease in the luminous flux of the lamp 106 can be prevented. The above function may be realized by providing a red phosphor inside the package of the LED 200. The above function may be realized by providing a red phosphor in the vicinity of the LED 200, for example, between the LED 200 package and the cover 1.

Embodiment 7 FIG.
In this embodiment, an example in which light having a light color (spectrum) that is not disclosed in Embodiments 1 to 6 is obtained will be described. The configuration itself of the lamp 106 may adopt any configuration disclosed in the first to fifth embodiments. For example, the lamp 106 includes an LED 200 as a light source element. The LED 200 disclosed in Embodiment 6 may be adopted. The lamp 106 includes a wavelength discrimination layer 6. For example, the heat shrink film 60 is provided as the first wavelength discrimination layer 6A. A light color adjustment film 64 is provided as the second wavelength discrimination layer 6B.

  For example, an organic pigment is used as the light color adjusting material, and the volume content of the organic pigment (light color adjusting material) in the light color adjusting film 64 is adjusted. As a result, a light color adjusting film 64 is obtained that hardly attenuates light in the band near 520 nm and significantly attenuates light in the band near 450 nm and the band near 640 nm.

  For example, the amount of light attenuation in each band can be finely adjusted by the heat shrink film 60 provided on the outer peripheral surface 10 of the cover 1. By appropriately setting the wavelength discrimination characteristics of the layers constituting the wavelength discrimination layer 6, light having a desired light color (spectrum) can be obtained. With the lamp 106 shown in this embodiment, light having a light color (spectrum) in which the spectral radiant intensity in the green band is relatively increased can be obtained. For this reason, the lamp 106 of Embodiment 7 is suitable for the lighting device 100 for food display equipment such as vegetables.

  The wavelength band of light to be attenuated or increased may be shifted by mixing a green phosphor with the light color adjusting film 64. Even with such a configuration, light having a desired light color (spectrum) can be obtained. Note that by mixing a green phosphor with the light color adjusting film 64, light in the blue band having a wavelength shorter than 500 nm can be converted into light in the green band. The energy of light emitted from the LED 200 can be utilized without waste, and the decrease in the luminous flux of the lamp 106 can be prevented. The above function may be realized by providing a green phosphor inside the package of the LED 200. The above function may be realized by providing a green phosphor in the vicinity of the LED 200, for example, between the LED 200 package and the cover 1.

  The lamp according to the present invention can be applied to a lighting device suitable for various uses.

1 cover, 1a cover, 1b cover, 10 outer peripheral surface, 11 inner peripheral surface, 12 straight pipe portion, 13 neck portion, 130 convex ring portion, 131 concave ring portion, 132 straight ring portion, 14 end portion, 140 first end , 141 second end, 15 exposed part, 15a exposed part, 16 concealed part, 16a concealed part, 17 projecting part, 18 projecting part 2 light source unit, 2b light source unit, 20 light source board, 200 light emitting diode, 201 substrate, 202 circuit components, 21 heat sink, 21b heat sink, 210 light source mounting portion, 211 light source arrangement surface, 212 inner surface, 213 side wall portion, 214 inner surface, 215 outer surface, 216 upper surface, 221 support portion, 225
Opposing part, 225b Opposing part, 226 outer surface, 227 inner surface, 228 end part, 229 upper surface, 230 screw fixing part, 231 screw hole, 235 adhesive member 3 holding base, 3c holding base, 3d holding base, 30 housing part, 30c Case part, 30d Case part, 300 peripheral wall part, 301 bottom wall part, 302 through hole, 304 guide groove, 305 display part, 31 holding terminal, 310 shaft part, 311 plate part 4 power supply base, 4c power supply base, 4d Power supply base, 40 housing part, 40c housing part, 40d housing part, 400 peripheral wall part, 401 bottom wall part, 402 through hole, 403 convex part, 404 guide groove, 405 display part, 41 power feeding terminal, 410 standing part 411 bent portion 5 screw 6 wavelength discrimination layer, 6A first wavelength discrimination layer, 6B second wavelength discrimination layer, 60 heat shrink film, 61 sheet, 62 63 joint, 630 first joint,
631 2nd joint part, 64 light color adjusting film, 65 end part, 650 1st end part, 651 2nd end part, 66 outer surface, 67 inner surface 100 lighting device, 101 power supply instrument, 102 instrument body, 103 holding socket, 104 Power supply socket, 105 power supply, 106 lamp, 106a lamp, 106b lamp, 106c lamp, 106d lamp

Claims (22)

A light source unit having a light source element;
A cover having an opening at an end, the light source unit is disposed in a space formed inside, and a cover that covers the light source element;
A wavelength discrimination layer provided on the cover;
With
The wavelength discrimination layer is:
A first wavelength discrimination layer comprising a heat shrink film provided on the outer peripheral surface of the cover and having a first wavelength discrimination characteristic which is a spectral radiation intensity characteristic ;
Provided on the inner or outer peripheral surface of the cover which is inside the first wavelength discrimination layer, the second wavelength discrimination layer having a second wavelength discrimination characteristic from said first wavelength discrimination characteristic is different spectral radiation strength properties When,
With
The spectral radiant intensity of the light that has passed through the wavelength discrimination layer with respect to the light emitted from the light source element has a maximum value of 0.8 or more in a wavelength region longer than 500 nm, and is substantially in a wavelength region shorter than 500 nm. A lamp that is zero.   The spectral radiant intensity of the light that has passed through the wavelength discrimination layer with respect to the light emitted from the light source element has a maximum value that is 0.8 or more in a wavelength region of 550 nm to 650 nm, and its half-value width is 100 nm or more. The lamp according to claim 1. A light source unit having a light source element;
A cover having an opening at an end, the light source unit is disposed in a space formed inside, and a cover that covers the light source element;
A wavelength discrimination layer provided on the cover;
With
The wavelength discrimination layer is:
A first wavelength discrimination layer comprising a heat shrink film provided on the outer peripheral surface of the cover and having a first wavelength discrimination characteristic which is a spectral radiation intensity characteristic ;
Provided on the inner or outer peripheral surface of the cover which is inside the first wavelength discrimination layer, the second wavelength discrimination layer having a second wavelength discrimination characteristic from said first wavelength discrimination characteristic is different spectral radiation strength properties When,
With
Spectral radiation intensity of light that has passed through the wavelength discrimination layer with respect to light emitted from the light source element has a first peak that is 0.7 or more in a wavelength region shorter than 500 nm, and a wavelength region longer than 500 nm. The lamp has a second peak that is greater than or equal to 0.6 and less than the first peak.   The lamp according to any one of claims 1 to 3, wherein the second wavelength discrimination characteristic has a maximum attenuation wavelength different from the first wavelength discrimination characteristic.   The lamp according to any one of claims 1 to 3, wherein the second wavelength discrimination characteristic has a half-value width with respect to a maximum attenuation wavelength different from the first wavelength discrimination characteristic.   The lamp according to any one of claims 1 to 3, wherein a thickness of the first wavelength discrimination layer is different from a thickness of the second wavelength discrimination layer. The first wavelength discrimination layer and the second wavelength discrimination layer have a light color adjusting material for attenuating light of a specific wavelength,
4. The lamp according to claim 1, wherein the content of the light color adjusting material in the first wavelength discrimination layer is different from the content of the light color adjusting material in the second wavelength discrimination layer. 5.   The said 1st wavelength discrimination layer or the said 2nd wavelength discrimination layer contains any one of resin, an organic pigment, or dye as a light color adjusting material for attenuating the light of a specific wavelength. A lamp according to claim 1.   The lamp according to any one of claims 1 to 8, wherein the first wavelength discrimination layer and the second wavelength discrimination layer are provided so as to overlap with an outer peripheral surface of the cover. The layer provided on the outer peripheral surface of the cover of the wavelength discrimination layer Lamp according to any one of claims 1 to 9 which covers the entire outer peripheral surface of the cover. The cover is
A first neck forming one end of the cover;
A second neck portion forming the other end of the cover;
A straight pipe portion disposed between the first neck portion and the second neck portion;
With
The layer provided on the outer peripheral surface of the cover of the wavelength discrimination layer, the lamp according to claims 1 to cover the entire outer peripheral surface of the straight pipe section to any one of claims 9. A power supply base having a power supply terminal electrically connected to the light source unit;
The power supply cap closes the opening,
The layer provided on the outer peripheral surface of the cover among the wavelength discrimination layers is partially disposed between the cover and the power supply base, and an edge along the opening is disposed inside the power supply base. lamp according to any one of claims 11 to claim 1. The light source unit is
A substrate on which a plurality of the light source elements are mounted;
A circuit component mounted on the substrate for lighting the light source element;
Moreover lamp according to any one of claims 1 to 12 comprising a. A cover having an opening at the end, and a light source unit having a light source element disposed in a space formed inside;
A wavelength discrimination layer provided on the cover;
With
The wavelength discrimination layer is:
A first wavelength discrimination layer comprising a heat shrink film provided on the outer peripheral surface of the cover and having a first wavelength discrimination characteristic which is a spectral radiation intensity characteristic ;
Provided on the inner or outer peripheral surface of the cover which is inside the first wavelength discrimination layer, the second wavelength discrimination layer having a second wavelength discrimination characteristic from said first wavelength discrimination characteristic is different spectral radiation strength properties When,
Wavelength discrimination cover for lamps equipped with. The wavelength discrimination cover for a lamp according to claim 14 , wherein the first wavelength discrimination layer and the second wavelength discrimination layer are provided so as to overlap the outer peripheral surface of the cover. The wavelength discrimination cover for a lamp according to claim 14 or 15 , wherein a layer provided on an outer peripheral surface of the cover among the wavelength discrimination layers covers the entire outer peripheral surface of the cover. The cover is
A first neck forming one end of the cover;
A second neck portion forming the other end of the cover;
A straight pipe portion disposed between the first neck portion and the second neck portion;
With
The wavelength discrimination cover for a lamp according to claim 14 or 15 , wherein a layer provided on an outer peripheral surface of the cover among the wavelength discrimination layers covers an entire outer peripheral surface of the straight pipe portion. A lamp according to any one of claims 1 to 13 ,
A power supply socket electrically connected to the power supply base of the lamp;
A power supply for supplying lighting power to the lamp via the power supply socket;
A lighting device comprising: Preparing a cylindrical cover having an opening at the end;
Providing a first wavelength discrimination layer having a first wavelength discrimination characteristic which is a spectral radiation intensity characteristic on the outer peripheral surface of the cover;
Providing a second wavelength discrimination layer having a second wavelength discrimination characteristic, which is a spectral radiation intensity characteristic different from the first wavelength discrimination characteristic , on an inner peripheral surface of the cover;
Disposing a light source unit inside the cover;
Covering the opening with a power base having a power terminal;
Equipped with a,
The step of providing the first wavelength discrimination layer on the outer peripheral surface of the cover,
Covering the cover with a heat shrink film;
Shrinking the heat-shrinkable film by heating, and closely contacting the heat-shrinkable film to the outer peripheral surface of the cover;
A method of manufacturing a lamp comprising: The lamp manufacturing method according to claim 19 , wherein an edge along the opening of the first wavelength discrimination layer is covered with the opening together with the opening. The lamp manufacturing method according to claim 19 or 20 , wherein the first wavelength discrimination layer is provided on the cover so as to cover the entire outer peripheral surface of the cover. The cover is
A first neck forming one end of the cover;
A second neck portion forming the other end of the cover;
A straight pipe portion disposed between the first neck portion and the second neck portion;
With
The lamp manufacturing method according to claim 19 or 20 , wherein the first wavelength discrimination layer is provided on the cover so as to cover an entire outer peripheral surface of the straight pipe portion.

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