CN107110434A - The manufacture method of lamp, lamp wavelength discrimination cover, lighting device and lamp - Google Patents
The manufacture method of lamp, lamp wavelength discrimination cover, lighting device and lamp Download PDFInfo
- Publication number
- CN107110434A CN107110434A CN201580068693.0A CN201580068693A CN107110434A CN 107110434 A CN107110434 A CN 107110434A CN 201580068693 A CN201580068693 A CN 201580068693A CN 107110434 A CN107110434 A CN 107110434A
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- Prior art keywords
- cover
- wavelength discrimination
- lamp
- wavelength
- characteristic
- Prior art date
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- Granted
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000003595 spectral effect Effects 0.000 claims abstract description 47
- 229920006300 shrink film Polymers 0.000 claims description 172
- 239000000463 material Substances 0.000 claims description 72
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- 238000001228 spectrum Methods 0.000 claims description 18
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- 229920005989 resin Polymers 0.000 claims description 8
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- 238000002156 mixing Methods 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims 1
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
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- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- JUNWLZAGQLJVLR-UHFFFAOYSA-J calcium diphosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])(=O)OP([O-])([O-])=O JUNWLZAGQLJVLR-UHFFFAOYSA-J 0.000 description 1
- 229940043256 calcium pyrophosphate Drugs 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- 235000019821 dicalcium diphosphate Nutrition 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- QGKBPWOLFJRLKE-UHFFFAOYSA-J distrontium;phosphonato phosphate Chemical compound [Sr+2].[Sr+2].[O-]P([O-])(=O)OP([O-])([O-])=O QGKBPWOLFJRLKE-UHFFFAOYSA-J 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 238000001704 evaporation Methods 0.000 description 1
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- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- FVRNDBHWWSPNOM-UHFFFAOYSA-L strontium fluoride Chemical compound [F-].[F-].[Sr+2] FVRNDBHWWSPNOM-UHFFFAOYSA-L 0.000 description 1
- 229910001637 strontium fluoride Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
It is an object of the invention to provide the manufacture method that can inexpensively reproduce desired photochromic lamp and such lamp.The lamp (106) of the present invention possesses light source cell (2), cover (1) and wavelength discrimination layer (6).Light source cell (2) has LED (200).LED (200) quilt cover (1) is covered.Wavelength discrimination layer (6) is arranged at cover (1).Wavelength discrimination layer (6) possesses the 1st wavelength discrimination layer (6A) and the 2nd wavelength discrimination layer (6B).1st wavelength discrimination layer (6A) has the 1st wavelength discrimination characteristic.2nd wavelength discrimination layer (6B) has the spectral radiance characteristic 2nd wavelength discrimination characteristic different from the 1st wavelength discrimination characteristic.
Description
Technical field
The present invention relates to the manufacture method of a kind of lamp, lamp wavelength discrimination cover, lighting device and lamp.
Background technology
For the purpose of mitigating the load to environment, using light emitting diode (Light Emitting Diode：Also claim below
For " LED ") element as the lighting device of light source component accelerate popularization, with replace incandescent lamp or fluorescent lamp.It is used as quilt
LED element as light source component, such as known one kind will use the blue LED die that gallium nitride (GaN) is produced and YAG systems
Yellow fluorophor combination, encapsulation obtained from element.In the LED element, from blue LED die project blue light, from by
The yellow fluorophor that the blue light is excited projects sodium yellow.By the way that blue light is mixed with sodium yellow, obtain with can simulating
White light.
Generally, for lighting device, expect that the object that light is irradiated to looks like natural color, that is, expect high
Color rendering.For example, patent document 1 records the technology of the color rendering for improving lighting device.Described in patent document 1
Lighting device in, improve the evaluation of estimate of color rendering by the way that the optical filter comprising neodymia is additional into LED/light source.
Prior art literature
Patent document 1：Japanese Unexamined Patent Publication 2004-193581 publications
The content of the invention
On the other hand, lighting device requires that the situation of optical characteristics corresponding with purposes is also more.For example, with semiconductor work
Factory makes photochromic (spectrum) that below 500nm wave band is decayed and (removes or reduce) for the lighting device requirement of object.With plant
Cultivating facility makes what the spectral radiance of red band or blue bands relatively increased for the lighting device requirement of object
It is photochromic.Make the spectral radiance of red band using the display equipment of the food such as fresh fish or first-class meat as the requirement of the lighting device of object
It is photochromic that intensity relatively increases.
In the case of using the lighting device of fluorophor, it can reproduce a variety of many by being combined as multiple fluorophor
Sample it is photochromic.
But, in the case of the lighting device using LED element as light source component, it is impossible to such as the photograph using fluorophor
Bright device simply reproduces various photochromic like that.It is as desired photochromic method is reproduced using LED element, such as known
Following methods.
(1) using the method with special photochromic LED element
(2) method of the LED element of combination multicore sheet mode
(3) White LED will be simulated and makes the optical filter function combination that the spectral radiance of a part of wave band is reduced one
The method risen
The species of circulation with special photochromic LED element is few.Due to the price with special photochromic LED element
Height, so the problem of there is cost rise during using method (1).Further, since the price of the LED element of multicore sheet mode
Height, so cost is also raised in the case of using method (2).Therefore, it is diversified photochromic in order to reproduce, the side in terms of cost
Method (3) is appropriate.But, there is the problem of being not particularly suitable for controlling the spectral radiance of narrow-band in method (3).
The present invention completes to solve above-mentioned problem.It is an object of the invention to provide can be with cheap cost
Reproduce the lamp of desired photochromic (spectrum) and the manufacture method of such lamp.In addition, another object of the present invention is to carry
For wavelength discrimination cover used in a kind of lamp for obtaining the effect above and the lighting device for the lamp for possessing acquirement the effect above.
The light fixture of the present invention is standby：Light source cell, with light source component；Cover, covers light source component；And wavelength discrimination layer,
It is arranged at cover.Wavelength discrimination layer possesses：1st wavelength discrimination layer, with the 1st wavelength discrimination characteristic；And the 2nd wavelength discrimination layer,
With the 2nd wavelength discrimination characteristic, the spectral radiance characteristic of the 2nd wavelength discrimination characteristic and the light of the 1st wavelength discrimination characteristic
Spectrum intensity characteristic is different.
The lamp wavelength discrimination cover of the present invention possesses：Cover, for covering light source component；And wavelength discrimination layer, it is arranged at
Cover.Wavelength discrimination layer possesses：1st wavelength discrimination layer, with the 1st wavelength discrimination characteristic；And the 2nd wavelength discrimination layer, with the 2nd
Wavelength discrimination characteristic, the spectral radiance of the spectral radiance characteristic and the 1st wavelength discrimination characteristic of the 2nd wavelength discrimination characteristic is strong
Spend characteristic different.
The lighting device of the present invention possesses：Above-mentioned lamp；Power supply base, is electrically connected with the power supply socket of lamp；And power supply dress
Put, electric power is lighted to lamp supply via power supply base.
The manufacture method of the lamp of the present invention possesses：Prepare the process of the hollow cover with opening；Cover inner surface or
The process that person outer surface sets the 1st wavelength discrimination layer with the 1st wavelength discrimination characteristic；It is being arranged at the 1st wavelength discrimination of cover
The process that the surface of layer sets the 2nd wavelength discrimination layer, the 2nd wavelength discrimination layer has spectral radiance characteristic and the 1st wavelength
The 2nd different wavelength discrimination characteristic of the spectral radiance characteristic of distinctive feature；Light source cell is configured to the work of the inside of cover
Sequence；And pass through the process of the power supply socket covering opening with power supply terminal.
In addition, the manufacture method of the lamp of the present invention possesses：Prepare the process of the hollow cover with opening；In the appearance of cover
The process that face sets the 1st wavelength discrimination layer with the 1st wavelength discrimination characteristic；In the wavelength discrimination of inner surface setting the 2nd layer of cover
Process, the 2nd wavelength discrimination layer has the spectral radiance characteristic of spectral radiance characteristic and the 1st wavelength discrimination characteristic
The 2nd different wavelength discrimination characteristics；Light source cell is configured to the process of the inside of cover；And pass through the confession with power supply terminal
The process of electric light mouthful covering opening.
According to the present invention, lamp can reproduce desired photochromic (spectrum) with cheap cost.
Brief description of the drawings
Fig. 1 is the stereogram of an example of the lighting device for showing embodiments of the present invention 1.
Fig. 2 is the stereogram of an example of the lamp for showing embodiments of the present invention 1.
Fig. 3 is the figure for the A-A sections for showing Fig. 2.
Fig. 4 is the figure for the B-B sections for showing Fig. 3.
Fig. 5 is for illustrating the structure of heat shrink films and the figure of characteristic.
Fig. 6 is for illustrating the structure of heat shrink films and the figure of characteristic.
Fig. 7 is the figure for the action effect for illustrating embodiments of the present invention 1.
Fig. 8 is the figure for the action effect for illustrating embodiments of the present invention 1.
Fig. 9 is the figure for the action effect for illustrating embodiments of the present invention 1.
Figure 10 is the flow chart of an example of the manufacture method for showing lamp.
Figure 11 is the figure for illustrating the number of assembling steps of lamp.
Figure 12 is the figure for illustrating the number of assembling steps of lamp.
Figure 13 is the figure for illustrating the number of assembling steps of lamp.
Figure 14 is the figure for illustrating the number of assembling steps of lamp.
Figure 15 is the figure for illustrating the number of assembling steps of lamp.
Figure 16 is the figure for illustrating the number of assembling steps of lamp.
Figure 17 is the figure for illustrating the number of assembling steps of lamp.
Figure 18 is the figure for illustrating the number of assembling steps of lamp.
Figure 19 is the flow chart of another example for the manufacture method for showing lamp.
Figure 20 is the figure for illustrating the number of assembling steps of lamp.
Figure 21 is the figure for illustrating the number of assembling steps of lamp.
Figure 22 is the figure for illustrating the number of assembling steps of lamp.
Figure 23 is the figure for illustrating the number of assembling steps of lamp.
Figure 24 is the figure for illustrating the number of assembling steps of lamp.
Figure 25 is the figure for illustrating the number of assembling steps of lamp.
Figure 26 is the figure for illustrating the number of assembling steps of lamp.
Figure 27 is the sectional view of an example of the lamp for showing embodiments of the present invention 2.
Figure 28 is the sectional view of an example of the lamp for showing embodiments of the present invention 3.
Figure 29 is the side view of an example of the lamp for showing embodiments of the present invention 4.
Figure 30 is the side view of an example of the lamp for showing embodiments of the present invention 5.
Figure 31 is the figure for illustrating the action effect of embodiments of the present invention 6.
(symbol description)
1：Cover；1a：Cover；1b：Cover；10：Outer peripheral face；11：Inner peripheral surface；12：Straight sections；13：Neck；130：Projecting ring section；
131：Concave ring part；132：Straight ring portion；14：End；140：1st end；141：2nd end；15：Exposed division；15a：Exposed division；
16：The portion of hiding；16a：The portion of hiding；17：Jut；18：Jut；2：Light source cell；2b：Light source cell；20：Light source substrate；
200：Light emitting diode；201：Substrate；202：Circuit member；21：Radiator；21b：Radiator；210：Light resource installing section；211：
Light source configures face；212：Inner surface；213：Side of sidewall portion；214：Inner surface；215：Outer surface；216：Upper surface；221：Support；
225：Opposed portion；225b：Opposed portion；226：Outer surface；227：Inner surface；228：End；229：Upper surface；230：Screw is fixed
Portion；231：Screwed hole；235：Adhering part；3：Keep socket；3c keeps socket；3d：Keep socket；30：Frame；30c：Frame
Body portion；30d：Frame；300：Surrounding wall portion；301：Bottom wall part；302：Through hole；304：Guiding groove；305：Display part；31：Protect
Hold terminal；310：Axle portion；311：Plate portion；4：Power supply socket；4c：Power supply socket；4d：Power supply socket；40：Frame；40c：Frame
Body portion；40d：Frame；400：Surrounding wall portion；401：Bottom wall part；402：Through hole；403：Convex portion；404：Guiding groove；405：Display
Portion；41：Power supply terminal；410：Rising portion；411：Bending section；5：Screw；6：Wavelength discrimination layer；6A：1st wavelength discrimination layer；6B：
2nd wavelength discrimination layer；60：Heat shrink films；61：Piece；62：Piece；63：Junction surface；630：1st junction surface；631：2nd junction surface；
64：Photochromic adjustment film；65：End；650：1st end；651：2nd end；66：Outer surface；67：Inner surface；100：Illumination dress
Put；101：Powered appliance；102：Apparatus main body；103：Keep socket；104：Power supply base；105：Supply unit；106：Lamp；
106a：Lamp；106b：Lamp；106c：Lamp；106d：Lamp.
Embodiment
It is described with reference to the present invention.Suitably simplify or the repetitive description thereof will be omitted.In the various figures, same symbol represents same
A part of or suitable part.In addition, the present invention is not limited in mode shown in the drawings.In addition, device, apparatus and structure
The configuration of part etc. and direction are also not necessarily limited to configuration shown in the drawings and direction.Material, the shape of device, apparatus and component etc.
Shape and size also can be changed suitably within the scope of the invention.
Embodiment 1.
Fig. 1 is the stereogram of an example of the lighting device 100 for showing embodiments of the present invention 1.
Lighting device 100 possesses powered appliance 101 and lamp 106.Fig. 1 shows that lighting device 100 possesses the example of 1 lamp 106
Son.Lighting device 100 can also possess many lamps 106.Lamp 106 is kept by powered appliance 101.It can be incited somebody to action by shirtsleeve operation
Lamp 106 is installed to powered appliance 101 or disassembled from powered appliance 101.Powered appliance 101, which has, to be used to power to lamp 106
Mechanism.Lamp 106 is powered and lighted in the state of powered appliance 101 is appropriately mounted at.
Lighting device 100 is installed to the mounting surfaces such as ceiling or wall using the fixture such as screw (not shown).
Floor or the interior space are illuminated by a bright light 106.Method to set up, set location and the purposes of lighting device 100 are not
It is limited to above-mentioned situation.For example, lighting device 100 can also be the lighting device of ceiling flush type.Lighting device 100 can also
It is the lighting device of the type used on the table.
Powered appliance 101 possesses such as apparatus main body 102, keeps socket 103, power supply base 104 and supply unit
105。
It is the part for keeping lamp 106 to keep socket 103.In the case where lamp 106 is the straight lamp shown in Fig. 1, protect
Hold the end that socket 103 keeps lamp 106.Keep socket 103 to be physically contacted with lamp 106, mechanically keep lamp 106.Keep
Socket 103 can not also be electrically connected with lamp 106.That is, keeping socket 103 to be non-power supply base.In addition, keeping
Socket 103 can also possess the terminal for lamp 106 to be grounded.Socket 103 is kept to be arranged at apparatus main body 102.
Power supply base 104 is the part for keeping lamp 106.In the case where lamp 106 is the straight lamp shown in Fig. 1, supply
Electrical socket 104 keeps another end of lamp 106.Power supply base 104 is physically contacted with lamp 106, mechanically keeps lamp 106.When
When lamp 106 suitably is held in into power supply base 104, power supply base 104 is electrically connected with lamp 106.That is, power supply base
104 form the part to the supply path of lamp 106.Power supply base 104 is arranged at apparatus main body 102.
Supply unit 105 is via power supply base 104 to the supply electric power of lamp 106.Supply unit 105 is for example accommodated in special
Framework.Supply unit 105 is arranged at the inside of apparatus main body 102.It is shown in broken lines in Fig. 1 and is accommodated in the interior of apparatus main body 102
The supply unit 105 in portion.
Supply unit 105 possesses such as power-converting device.When the switch (not shown) of the wall for being arranged at room etc. is
During (ON) state of connection, supply unit 105 supplies the electric power (below also known as " lighting electric power ") for lighting lamp 106.When
When above-mentioned switch turns into (OFF) state of disconnection, supply unit 105 stops supply and lights electric power.Example is connected with to supply unit 105
Such as by electrical wiring (not shown) and power supply wiring (not shown).It is for receiving electric power from outside source power supply etc. by electrical wiring
The wiring of supply.Power supply wiring is for will light wiring of the power supply to lamp 106.Power supply wiring is connected to power supply base
104。
Lamp 106 possesses light emitting diode (Light Emitting Diode as light source component：It is also known as below
“LED”).Hereinafter, it is specifically described in case of lamp 106 is straight tube LED.In addition, the shape of lamp 106 is not limited to directly
The shape of spot.
Fig. 2 is the stereogram of an example of the lamp 106 for showing embodiments of the present invention 1.In fig. 2, for the ease of
The internal structure of observation lamp 106, it is indicated by the solid line go out lamp 106 internal structure a part.Fig. 3 is that the A-A for showing Fig. 2 is cutd open
The figure in face.Fig. 4 is the figure for the B-B sections for showing Fig. 3.
Lamp 106 possesses such as cover 1, wavelength discrimination layer 6, keeps socket 3, power supply socket 4 and light source cell 2.
Cover 1 includes the hollow part with opening.For example, as shown in Figure 3 and 4, cover 1 is in elongated tubular, is cutd open
The profile in face is in circular (including circle).Form logical in each end 14 (the 1st end 140 and the 2nd end 141) of cover 1
To the opening of inner space.Cover 1 has can support the overall rigidity of lamp 106 when lamp 106 is held in into powered appliance 101.
As cover 1, for example, it can use the material for having desired translucency and heat resistance concurrently.Translucency is in order that light source cell 2
The function that the light sent is passed through and needed.Heat resistance is the function in order to be fixed to wavelength discrimination layer 6 required for cover 1.
Glass is suitable as the material of cover 1.Cover 1 includes such as glass tube.For example, as cover 1 material, using comprising
The soda-lime glass of 70%~72% silica (SiO2).As cover 1, it can also use and Japanese Industrial Standards (JIS) institute
The straight tube of straight tube identical dimensional standard during defined manufacture fluorescent lamp before used two ends sealing.The material of cover 1 is not limited
In above-mentioned material.For example, the resin material of heat resistance can also be used as the material of cover 1.Wherein, preferably cover 1 line exapnsion
Coefficient is small.
Cover 1 possesses such as straight sections 12 and neck 13.Straight sections 12 are in the straight tubular that external diameter is D1.Straight sections 12 are accounted for
The major part of cover 1.Straight sections 12 are configured between neck 13.That is, the end 14 of the both sides of cover 1 is formed by neck 13.
Neck 13 possesses projecting ring section 130, concave ring part 131 and straight ring portion successively from the side close with straight sections 12
132.Projecting ring section 130 is the part for the ring-type heaved laterally.Concave ring part 131 is the part for the ring-type being recessed to inner side.Bulge loop
Portion 130 and concave ring part 131 are with leaving straight sections 12 and diameter is tapered into.Straight ring portion 132 is the ring with fixed diameter
The part of shape.The outer diameter D 2 of straight ring portion 132 is smaller than the outer diameter D 1 of straight sections 12.Projecting ring section 130, concave ring part 131 and straight ring portion
132 are connected as a single entity and form neck 13.The shape of the neck 13 is referred to as neck type.
The shape of cover 1 is not limited to above-mentioned shape.For example, the profile of the section of cover 1 can also be ellipse.The section of cover 1
Profile can also be polygon or star.
Light source cell 2 is by being supplied to the unit lighted electric power and send light.Light source cell 2 possesses light source component
LED200.Light source cell 2 is configured at the space to form the inner side in cover 1.That is, LED200 quilt covers 1 are covered.When light source list
Member 2 is supplied to when lighting electric power, and the light irradiated from LED200 is released to interior through cover 1 and wavelength discrimination layer 6
Space etc..On the concrete structure of light source cell 2, it is described below.
Wavelength discrimination layer 6 possesses the function of the spectral radiance decay for the specific band for making transmitted light.Shone from LED200
The light penetrated through wavelength discrimination layer 6 and by wavelength discrimination layer 6 by adjusting photochromic (spectrum).Light have adjusted by wavelength discrimination layer 6
The light of color is released to space of interior etc..Wavelength discrimination layer 6 is arranged at cover 1.In the present invention, wavelength discrimination layer 6 possesses many
Individual layer.Constituting each layer of wavelength discrimination layer 6 has each different wavelength discrimination characteristics.That is, constituting wavelength discrimination layer 6
Each layer the spectral radiance of specific band is decayed respectively.
In the present embodiment, as simplest example, illustrate wavelength discrimination layer 6 possess the 1st wavelength discrimination layer 6A and
The situation of this 2 layers of 2nd wavelength discrimination layer 6B.1st wavelength discrimination layer 6A has the 1st wavelength discrimination characteristic.2nd wavelength discrimination layer
6B has the 2nd wavelength discrimination characteristic, and the characteristic of the 2nd wavelength discrimination characteristic is different from the characteristic of the 1st wavelength discrimination characteristic.Example
Such as, the spectral radiance characteristic of the 2nd wavelength discrimination characteristic is different from the spectral radiance characteristic of the 1st wavelength discrimination characteristic.
As other examples, the maximum attenuation wavelength of the 2nd wavelength discrimination characteristic and the maximum attenuation wavelength of the 1st wavelength discrimination characteristic are not
Together.As other examples, the 2nd wavelength discrimination characteristic it is special relative to the half-amplitude duration of maximum attenuation wavelength and the 1st wavelength discrimination
Property the half-amplitude duration relative to maximum attenuation wavelength it is different.These characteristics can also be combined.
Hereinafter, describe in detail and possess heat shrink films 60, as the 2nd wavelength discrimination layer 6B as the 1st wavelength discrimination layer 6A
And possess the example of photochromic adjustment film 64.
Photochromic adjustment film 64 is arranged at the inner peripheral surface 11 of cover 1.Inner peripheral surface 11 is the incident face of the light from LED200 (
1 surface).Photochromic adjustment film 64 is first passed through from the LED200 light irradiated, its is photochromic to be adjusted.It has adjusted by photochromic adjustment film 64
Photochromic light incides cover 1 from inner peripheral surface 11.
The thickness of photochromic adjustment film 64 is set to obtain desired for the spectral radiance in specific band
Attenuation characteristic.If the example shown in present embodiment, then the thickness of photochromic adjustment film 64 is set to and heat shrink films
60 attenuation characteristic combination can obtain desired attenuation characteristic corresponding with the standard of lamp 106.The film of photochromic adjustment film 64
Thick quilt is set as such as less than 30 μm of value.
Photochromic adjustment film 64 has for example for the light for distinguishing specific wavelength and the photochromic adjustment material for making it decay.It is photochromic
Film 64 is adjusted as photochromic adjustment material and includes such as resin, organic pigment or dyestuff.Photochromic adjustment film 64 is adjusted as photochromic
Whole timber material can also include the above-mentioned multiple material exemplified.The feelings of the photochromic adjustment material such as resin are included in photochromic adjustment film 64
Under condition, for example, the mixing liquid comprising photochromic adjustment material is coated on to the inner peripheral surface 11 of cover 1.Then, make to be coated on the interior of cover 1
The mixing liquid of side face 11 is dried, and the photochromic adjustment film 64 of photochromic adjustment material is included in the formation of inner peripheral surface 11.
Inorganic pigment can also be used as photochromic adjustment material, but the light flux values of lamp 106 (become clear in this case
Degree) it is possible to be greatly reduced.By contrast, in the case where photochromic adjustment material uses resin, organic pigment or dyestuff, lamp
106 light flux values (lightness) will not be greatly reduced.Therefore, organic pigment is suitable as the light that photochromic adjustment film 64 is included
Color adjustment material.In the example shown in present embodiment, in the case where organic pigment to be used as to photochromic adjustment material, also examine
Consider the attenuation characteristic of heat shrink films 60, the volume containing ratio of the organic pigment of photochromic adjustment film 64 is set as such as 3.0%~
10.0% or so value.
In addition, there is heat resistance, light resistance and the bad dyestuff of ageing resistance in dyestuff.Such dye will be dissolved with
In the case that the liquid of material is coated on the inner peripheral surface 11 of cover 1 and makes its drying, photochromic adjustment film 64 is possible to time process
Discoloration.That is, it is impossible to obtain desired photochromic.Therefore, wrapped when in photochromic adjustment film 64 as photochromic adjustment material
In the case of containing dyestuff, the mixing liquid for containing dyestuff with undissolved state is preferably coated on the inner peripheral surface 11 of cover 1 and made
It is dried.Photochromic adjustment film 64 is formed by such method, so as to suppress the discoloration of photochromic adjustment film 64 for a long time.Separately
Outside, quality-high and inexpensive dyestuff can be used as photochromic adjustment material.In the case where using other photochromic adjustment materials, also may be used
To form photochromic adjustment film 64 by identical step.
By adjusting the thickness of photochromic adjustment film 64 and the containing ratio of photochromic adjustment material, photochromic adjustment film 64 can have
Standby desired 2nd wavelength discrimination characteristic.Thereby, it is possible to provide the photochromic lamp 106 and lighting device with multicolour
100。
In the present embodiment, the situation that photochromic adjustment film 64 is arranged to the inner peripheral surface 11 of cover 1 is illustrated.This is an example
Son.Photochromic adjustment film 64 can also be arranged at the outer peripheral face 10 of cover 1.Outer peripheral face 10 is the face the (the 2nd that the light from LED200 is projected
Surface).
In addition it is also possible to which the outer peripheral face 10 and inner peripheral surface 11 to cover 1 implement what is matched with the standard required by lamp 106
Processing.The processing that can implement to outer peripheral face 10 and inner peripheral surface 11 is such as having light DIFFUSION TREATMENT and shadowed layer processing.
These processing can also be implemented only to outer peripheral face 10 or only to inner peripheral surface 11.
For example, as light DIFFUSION TREATMENT have by the light diffusing member with light diffusion particle be applied as thickness for 5.0 μm~
20.0 μm of membranaceous method.As light diffusion particle, preferably in light diffusing member comprising such as average grain diameter be 0.01 μm~
Any materials in 20.0 μm of metal oxide, phosphate cpd, fluoride, organic pigment, dyestuff or barium sulfate.Light expands
Separate component can also include the multiple material in the above-mentioned material exemplified as light diffusion particle.Light is used as in light diffusing member
In the case that diffusion particle contains metal oxide, preferably light diffusing member contain from including titanium, silicon, aluminium, zinc, yttrium, lanthanum, magnesium,
At least one oxide selected in cerium, bismuth, copper, nickel, gadolinium, the group of zirconium and barium.In addition, expanding in light diffusing member as light
In the case that shot contains phosphate cpd, preferably light diffusing member contains selects from calcium pyrophosphate and strontium pyrophosphate
At least one compound.In the case where light diffusing member contains fluoride as light diffusion particle, preferred light diffusing member
Contain at least one compound selected from magnesium fluoride, cerium fluoride, barium fluoride, strontium fluoride and aluminum fluoride.
Heat shrink films 60 are arranged at the outer peripheral face 10 of cover 1.As described above, first passing through photochromic tune from the LED200 light irradiated
Whole film 64, its is photochromic to be adjusted.Photochromic light have adjusted by photochromic adjustment film 64 and pass through cover 1.Then, from the outer peripheral face 10 of cover 1
The light of injection passes through heat shrink films 60, and its is photochromic to be adjusted again.The light for having passed through heat shrink films 60 is released to the sky of interior
Between etc..Because (in the present embodiment, 2 stages) can be divided to carry out photochromic adjustment multiple stages, so tool can be provided
There is the photochromic lamp 106 and lighting device 100 of multicolour.
Thickness or raw material by heat shrink films 60 etc. are chosen to be and the spectral radiance in specific band can be obtained
Desired attenuation characteristic.If the example shown in present embodiment, then the thickness of heat shrink films 60 or raw material etc. are chosen to be
Desired attenuation characteristic corresponding with the standard of lamp 106 can be obtained by being combined with the attenuation characteristic of photochromic adjustment film 64.
Heat shrink films 60 include the part shunk due to heat.Outer side covers cover 1 of the heat shrink films 60 from cover 1.Fig. 1 extremely schemes
Heat shrink films 60 shown in 4 are due to hot and after contraction state.Heat shrink films 60 are shunk due to heat, so as to be configured to
It is close to cover 1.Fig. 3 shows the example that the entirety of the outer peripheral face 10 of cover 1 is covered by heat shrink films 60.That is, the straight tube of cover 1
Portion 12 and neck 13 are covered by heat shrink films 60.
Fig. 5 and Fig. 6 are for illustrating the structure of heat shrink films 60 and the figure of characteristic.Fig. 5 shows to shrink due to heat
The state of heat shrink films 60 before.Heat shrink films 60 are for example manufactured using 2 plates 61 and plate 62 with heat-shrinkable.Plate
61 and plate 62 for example in elongated rectangular shape.The size of plate 61 and plate 62 is roughly the same.By making above-mentioned shape
Plate 61 and plate 62 it is overlapping in the state of the edge part of long side is engaged with each other, formed tubulose heat shrink films 60.Pass through
The junction surface 63 (the 1st junction surface 630 and the 2nd junction surface 631) of joint plate 61 and the formation of plate 62 is in the length of heat shrink films 60
It is formed straight line shape on edge direction.The method that the edge part of plate 61 and plate 62 is engaged with each other both can be bonded or
It can be welding.The edge part of plate 61 and plate 62 can also be engaged with each other by other methods.
Heat shrink films 60 are tubulose, in end 65 (the 1st end 650 and the 2nd end 651) opening.By by plate 61 to
The direction stretching of arrow S1 shown in Fig. 5, plate 62 is stretched to arrow S2 direction, can become the end 65 of heat shrink films 60
It is wide.When making the heat of heat shrink films 60 in the state of cylindric or cylindric part (not shown) is run through heat shrink films 60
During contraction, as the tubular shown in Fig. 6.Heat shrink films 60 are shunk due to heat, are close to above-mentioned part.Heat after thermal contraction
Shrink film 60 turns into the shape of the form fit of the part with being close to.
It is that the part for keeping socket 103 is held in when lamp 106 is installed into powered appliance 101 to keep socket 3.Keep
Socket 3 is with keeping socket 103 to be physically contacted.Fig. 3 shows the example for the structure for keeping socket 3 not electrically connected with light source cell 2.Protect
It can also be the structure electrically connected with light source cell 2 to hold socket 3.In this case, for example when lamp 106 is appropriately mounted at into confession
During electric appliance 101, the power path for being grounded lamp 106 is formed between keeping socket 3 and keeping socket 103.
Keep socket 3 to possess such as frame 30 and keep terminal 31.Frame 30 includes such as surrounding wall portion 300 and bottom wall
Portion 301.Keep socket 3 using screw 5 fixed to light source cell 2.The bar portion institute insertion of screw 5 is formed in bottom wall part 301
Through hole 302.
The end 140 of bottom wall part 301 and the 1st and be formed at cover 1 an end 14 (the 1st end 140) opening it is (following
It is also known as " the 1st opening ") opposed, to block the 1st opening.Surrounding wall portion 300 is cylindrical, is arranged at bottom wall part 301.Surrounding wall portion
300 are formed as extending from the edge part of bottom wall part 301 to the side of cover 1.Surrounding wall portion 300 is in the way of a neck 13 around cover 1
It is configured at around the neck 13.The edge part farthest from bottom wall part 301 is for example configured at the scrobicular ring of neck 13 by surrounding wall portion 300
The outside in portion 131.In this case, the straight ring portion 132 of neck 13 is completely covered in surrounding wall portion 300.
Such as the 1st end 650 of heat shrink films 60 extends to the straight ring portion 132 of neck 13, be completely covered projecting ring section 130 with
And concave ring part 131.Therefore, the 1st end 650 of heat shrink films 60 is configured between cover 1 and the surrounding wall portion 300 for keeping socket 3.
That is, the 1st end 650 of heat shrink films 60 to be configured to the inner side for keeping socket 3.Can not be from the outside of lamp 106
1st end 650 of heat shrink films 60.
Terminal 31 is kept to be arranged at bottom wall part 301.Terminal 31 is kept to be protruded from the surface of bottom wall part 301.Keep socket 3
Such as it is integrally formed by insert molding and conductive keeps terminal 31 and the frame 30 with electrical insulating property.At this
In the case of, keep socket 3 that there is the foundation for keeping terminal 31 to be partly embedded into the construction of frame 30.As frame 30, make
Resin material or ceramic material with electrical insulating property etc..In the various figures, show to keep the example that socket 3 is the socket of GX16 types
Son.But this is an example.Keep the type not limited to this of socket 3.As socket 3 is kept, G13 types or T5 can also be used
The socket of these other species of type.
Socket 4 of powering is the part that power supply base 104 is held in when lamp 106 is installed on into powered appliance 101.Power supply
Socket 4 is physically contacted with power supply base 104.Power supply socket 4 is the socket that electric power is lighted for being supplied to light source cell 2.Therefore,
Power supply socket 4 is electrically connected with light source cell 2.When lamp 106 is appropriately mounted at into powered appliance 101, in power supply socket 4 with supplying
Formed between electrical socket 104 for power path of the power supply to light source cell 2 will to be lighted.
Power supply socket 4 possesses such as frame 40 and power supply terminal 41.Frame 40 includes such as surrounding wall portion 400 and bottom wall
Portion 401.Socket 4 of powering is fixed to light source cell 2 with screw 5.The bar portion institute insertion of screw 5 is formed in bottom wall part 401
Through hole 402.
The end 141 of bottom wall part 401 and the 2nd and be formed at cover 1 another end 14 (the 2nd end 141) opening (with
Lower also known as " the 2nd opening ") it is opposed, to block the 2nd opening.Surrounding wall portion 400 is cylindrical, is arranged at bottom wall part 401.Surrounding wall portion
400 are formed as extending from the edge part of bottom wall part 401 to the side of cover 1.Surrounding wall portion 400 is with around the side of another neck 13 of cover 1
Formula is configured at around the neck 13.The edge part farthest from bottom wall part 401 is for example configured at the recessed of neck 13 by surrounding wall portion 400
The outside of ring portion 131.In this case, the straight ring portion 132 of neck 13 is completely covered in surrounding wall portion 400.
Such as the 2nd end 651 of heat shrink films 60 extends to the straight ring portion 132 of neck 13, be completely covered projecting ring section 130 with
And concave ring part 131.Therefore, the 2nd end 651 of heat shrink films 60 is configured between the surrounding wall portion 400 of cover 1 and socket 4 of powering.
That is, the 2nd end 651 of heat shrink films 60 to be configured to the inner side of power supply socket 4.Can not be from the outside of lamp 106
2nd end 651 of heat shrink films 60.
A pair of power supply terminals 41 are arranged at bottom wall part 401.Fig. 2 and Fig. 3 show that power supply terminal 41 is with rising portion
410 and bending section 411 L-shaped terminals example.Power supply terminal 41 is protruded from the surface of bottom wall part 401.Power supply terminal 41 with
Light source cell 2 is electrically connected.Power supply socket 4 is for example integrally formed by insert molding with a pair of conductive power supplies
Terminal 41 and the frame 40 with electrical insulating property.In this case, bury the foundation part that power supply socket 4 has power supply terminal 41
Enter the construction of frame 40.As frame 40, resin material or ceramic material of electrical insulating property etc. are used.In each figure
In, it is the example of the socket of GX16 types to show power supply socket 4.But this is an example.The type not limited to this of power supply socket 4.
As power supply socket 4, the socket of these other species of G13 types or T5 types can also be used.It is appropriately mounted at when by lamp 106
During powered appliance 101, power supply terminal 41 is electrically connected with power supply base 104.
Light source cell 2 for example possesses LED200, substrate 201 and radiator 21.
LED200 such as faces are installed on the mounting surface (surface) of substrate 201.Fig. 2 and Fig. 3 show to pacify multiple LED200
The example of mounting surface loaded on substrate 201.LED200 is configured to a row at certain intervals in the mounting surface of substrate 201.Pass through
The wiring pattern on LED200 and the surface for being arranged at substrate 201 is electrically connected to form circuit of light sources.LED200 is with being arranged at base
The connection of the wiring pattern on the surface of plate 201 is carried out such as by welding.
As LED200, such as using virtual White LED.Virtual White LED for example can be by that will use gallium nitride
(GaN) blue LED die combines with the yellow fluorophor of YAG systems, encapsulates to realize.As blue LED die, for example, exist
There is 440nm~460nm wave band the chip of main luminescence peak to be suitable.In such virtual White LED, from indigo plant
Color LED chip projects blue light, and sodium yellow is projected from the yellow fluorophor by the blue light stimulus.By by blue light with it is yellow
Colored light mixing can obtain virtual white light.LED200 structure is not limited to said structure.For example, it is also possible to by chip on board
Etc. (COB) part is used as LED200 obtained from LED chip to be mounted directly to substrate 201.Can be according to the mark required by lamp 106
Accurate number, configuration and the species for suitably determining LED200.
Substrate 201 is formed as elongate according to the shape of the inner space of cover 1.It is formed with the mounting surface of substrate 201
Wiring pattern.In the mounting surface of substrate 201, multiple LED200 are installed along long side direction.LED200 is by wiring pattern
It is electrically connected, forms circuit of light sources.In addition, the mounting surface in substrate 201 is provided with circuit member for lighting LED200
202.Circuit member 202 is included such as commutation diode, fuse and resistance.Pass through LED200, substrate 201 and circuit
Component 202 constitutes light source substrate 20.These circuit members 202 are electrically connected by wiring pattern, form power supply circuit.Circuit structure
The connection of the wiring pattern on surface of the part 202 with being arranged at substrate 201 is carried out such as by welding.Substrate 201 and power supply lamp
The power supply terminal 41 of mouth 4 is electrically connected.Via the power supply terminal 41 of power supply socket 4, the supply of substrate 201 is lighted from outside power supply
Electric power.Power supply will lighted to after substrate 201, LED200 is lighted.
The metals such as glass epoxy material, paper phenolic material, composite or aluminium (Al) are used as the base material of substrate 201
Material etc..In the base material of selected substrate 201, such as the configuration of component to be considered, thermal diffusivity and material cost.Substrate
201 thickness is, for example, 1mm or so.The thickness not limited to this of substrate 201.Effect is utilized in order to improve from the LED200 light sent
Rate, can also set reflection part on the surface of substrate 201.For example, it is preferable to be set in the face for being provided with LED200 of AI substrates 201
Put reflection part.As the method for setting reflection part on the surface of substrate 201, for example, it can enumerate laminating, coating, printing
Or evaporation etc..
Radiator 21 is formed as elongate according to the shape of the inner space of cover 1.Thermal conductivity is used as radiator 21
High material.The substrate 201 for being provided with LED200 is installed to radiator 21.It is hot from substrate 201 that LED200 is produced when working
It is delivered to radiator 21.The heat transfer that radiator 21 is received is radiated outside to cover 1 from cover 1.
Radiator 21, which has, is used for the rigidity in the grade of interior support substrate 201 of cover 1.Radiator 21 is for example by that can carry out
The metal material of extrusion molding is formed.The metal material such as aluminium (Al), iron, titanium or magnesium is suitable as the material of radiator 21
Material.The material beyond metal material can also be used as the material of radiator 21.For example, also may be used as the material of radiator 21
To use the resin or ceramics of high-termal conductivity.The material of radiator 21 is not limited to these.Wherein, the line of preferably radiator 21 is swollen
Open coefficient small.
Radiator 21 possesses such as light resource installing section 210, side of sidewall portion 213 and opposed portion 225.
Light resource installing section 210 is to install the part for the substrate 201 for being equipped with LED200 and circuit member 202.Light source is pacified
Dress portion 210 is formed as elongate according to the shape of the inner space of cover 1.Substrate 201 is fixed to the light of light resource installing section 210
Source configures face 211.The adhering part such as using silicones (bonding agent) or two-sided tape with cementability is by substrate 201
Adhere to light source configuration face 211.The fixing means not limited to this of substrate 201.For example, it is also possible to pass through other sides such as trip bolt
Substrate 201 is fixed to light source and configures face 211 by method.Alternatively, it is also possible to which substrate 201 and light resource installing section 210 are formed as one.
In this case, the wiring pattern formation that for example will be formed in substrate 201 configures face 211 to light source.LED200 and circuit structure
Part 202 is installed on light source configuration face 211.
One end of light resource installing section 210 and another end possess screw fixed part 230.In screw fixed part
230 form the screwed hole 231 for screwing in screw 5.Screwed hole 231 has axially on the long side direction of light resource installing section 210.
Screw fixed part 230 is for example arranged at the inner surface 212 of light resource installing section 210.Inner surface 212 is directed towards configuring face with light source
The face in the direction in opposite direction of 211 directions.In the case of manufacture radiator 21 molding by extrusion, as shown in figure 4, excellent
Choosing makes the outs open farthest from inner surface 212 in screw fixed part 230.
Screwed hole 231 is screwed into by the screw 5 for the through hole 302 that insertion is kept to socket 3, socket 3 will be kept to fix
To an end of light resource installing section 210.By the way that the power screw 5 of through hole 402 of socket 4 of insertion is screwed into screwed hole
231, socket 4 of powering is fixed to another end of light resource installing section 210.Socket 3 and power supply socket 4 will be kept to be fixed to
The method not limited to this of radiator 21 (light source cell 2).Can also be in other positions formation screwed hole 231.Can also be by tight
Gu the method beyond screw will keep socket 3 and power supply socket 4 to be fixed to radiator 21.
Side of sidewall portion 213 is the part with the function of being positioned to substrate 201.Side of sidewall portion 213 is along light resource installing section
210 long side direction is arranged at the light source configuration face 211 of light resource installing section 210.Side of sidewall portion 213 is protruded from light source configuration face 211.
Vacate the interval more slightly larger than the width of substrate 201 and be arranged at light source configuration face 211 in a pair of sidewalls portion 213.Substrate 201 is configured at
Between side of sidewall portion 213.Side of sidewall portion 213 plays a part of masking, in order to avoid be installed on substrate 201 one is seen from the outside of cover 1
Parallel circuit component (for example, connector etc.).
Opposed portion 225 is across photochromic adjustment film 64 part opposed with the inner peripheral surface 11 of cover 1.Opposed portion 225 is in circular arc
Shape.The outer surface 226 of opposed portion 225 is for example with the curvature bending roughly the same with the curvature of the inner peripheral surface 11 of cover 1.Opposed portion
225 are supported in support 221.Support 221 is for example protruded from the inner surface 212 of light resource installing section 210, with being installed on light source
The substrate 201 of installation portion 210 vertically extends.Due to possessing support 221, so as to make the uniform wall thickness of radiator 21.
Can improve it is molding by extrusion formed by radiator 21 formability.
As shown in figure 4, such as radiator 21 possesses a pair of opposed portion 225.Opposed portion 225 is configured to the inner circumferential along cover 1
Face 11.For example it is provided with viscous between the outer surface 226 of opposed portion 225 and the inner peripheral surface 11 (photochromic adjustment film 64) for covering 1
The adhering parts 235 such as the silicones (bonding agent) or two-sided tape of connecing property.Thus, light source cell 2 is attached and fixed to cover 1
Inner peripheral surface 11 on photochromic adjustment film 64.
Opposed portion 225 is that the heat that will be produced in LED200 etc. is delivered to the part of cover 1 via photochromic adjustment film 64.Cause
This, can also be used as adhering part 235 includes the part of thermally conductive grease.In addition, can also be used as adhering part 235
The conducting-heat elements such as heat-conducting plate.Can be appropriate really according to the heat resisting temperature of LED200 and circuit member 202, life-span and intensity etc.
Determine the heat conductivility of adhering part 235.
Light resource installing section 210, a pair of sidewalls portion 213, a pair of support parts 221 and a pair of opposed portion 225 for example formed as
One.The heat produced in LED200 and the grade of circuit member 202 is delivered to support 221 from light resource installing section 210, from supporting
Portion 221 is delivered to opposed portion 225.The heat for being moved to opposed portion 225 is delivered to cover 1 from opposed portion 225 via photochromic adjustment film 64,
It is radiated outside from cover 1.
The section shape of radiator 21 shown in Fig. 4 shows an example.The section shape of radiator 21 can also be it
Its shape.For example, in order to improve rigidity, the section shape of radiator 21 can also be set into tubular.For promotion into cover 1
The purpose of portion space transmission heat, can also set blade etc. in radiator 21.By setting blade to increase radiator 21
Surface area.
Next, illustrating the action effect of present embodiment using Fig. 7 to Fig. 9.Fig. 7 to Fig. 9 is to illustrate the present invention
The figure of the action effect of embodiment 1.Fig. 7 is with having passed through using organic to the spectral radiance from the LED200 light sent
The chart that the spectral radiance of the light of the photochromic adjustment film 64 of pigment is compared, shows the light that will be sent from LED200 most
A large amount of relative value when being set to 1.As shown in fig. 7, being shorter than 500nm region in wavelength, pass through using the photochromic of organic pigment
Adjust the spectral radiance (relative intensity) substantially 0 of the light of film 64.Organic pigment (photochromic adjustment in photochromic adjustment film 64
Material) the average value of volume containing ratio be about 4.0%, the average value of the thickness of photochromic adjustment film 64 is about 7 μm.
Fig. 8 is to make the volume containing ratio change of the organic pigment (photochromic adjustment material) in photochromic adjustment film 64 carry out comparison to lead to
The chart of the spectral radiance of the light for the photochromic adjustment film 64 for using organic pigment has been crossed, has amplified the scope of spectral radiance
And it is shown specifically characteristic.As shown in figure 8, according to experiment, in the case of photochromic adjustment materials'use organic pigment, will be photochromic
The volume containing ratio of organic pigment (photochromic adjustment material) in adjustment film 64 is adjusted to obtain when 3.0%~4.0% or so
Optimal result.
In addition, volume containing ratio and photochromic adjustment on the organic pigment (photochromic adjustment material) in photochromic adjustment film 64
The relation of the thickness of film 64 has obtained following result：When volume containing ratio is adjusted into 3.0%, the average value of thickness is about 6 μ
m；The average value of thickness when volume containing ratio is adjusted into 4.0% is about 7 μm；Volume containing ratio is being adjusted to 5.0%
When thickness average value be about 10 μm；When volume containing ratio is adjusted into 6.0%, the average value of thickness is about 15 μm；By body
The average value of thickness is about 20 μm when product containing ratio is adjusted to 7.0%；When volume containing ratio is adjusted into 8.0%, thickness is flat
Average is about 25 μm；In addition, the average value of thickness is about 30 μm when volume containing ratio is adjusted into 10.0%.
Fig. 9 is that heat shrink films 60 are arranged at into the outer peripheral face 10 of cover 1 and make the organic pigment (light in photochromic adjustment film 64
Color adjustment material) volume containing ratio change compare passed through using organic pigment photochromic adjustment film 64 light spectrum spoke
The chart of intensity is penetrated, amplifies the scope of spectral radiance and is shown specifically characteristic.As shown in figure 9, adjusting film 64 by photochromic
In the volume containing ratio of organic pigment (photochromic adjustment material) be adjusted in 3.0%~7.0% experiment, be shorter than in wavelength
500nm region, the spectral radiance for the light that can will have passed through the photochromic adjustment film 64 for using organic pigment is (relatively strong
Degree) substantially it is set to 0.The thickness of the heat shrink films 60 used in the experiment is about 120 μm.So, by the way that organic pigment will be used
Combined as the photochromic adjustment film 64 of wavelength discrimination unit with heat shrink films 60, the region for being shorter than 500nm in wavelength can be obtained
Appropriate characteristic.
For example, spectral radiance (relative intensity) is substantially set to 0 lamp by the region that can be shorter than 500nm in wavelength
106 are suitable for the lighting device 100 using semiconductor factory as object, and lighting device 100 that should be using semiconductor factory as object will
Ask the frequency band for relatively increasing yellow spectral radiance it is photochromic.
Next, illustrating the manufacture method of the lamp 106 with said structure referring also to Figure 10 to Figure 18.Figure 10 is to show
Go out the flow chart of an example of the manufacture method of lamp 106.Figure 11 to Figure 18 is the figure for illustrating the number of assembling steps of lamp 106.
In Figure 11 section is represented into Figure 18 with the part of dotted line.
First, the cover 1 shown in Figure 11 is prepared.Cover 1 is, for example, hollow glass tube.As described above, cover 1 possesses straight sections 12
With neck 13.The 1st is formed in the 1st end 140 of cover 1 to be open.The 2nd is formed in the 2nd end 141 to be open.Footpath shown in Figure 11 etc.
To each size it is as described below.
D1：The external diameter of straight sections 12
D2：The external diameter of straight ring portion 132
Next, the inner peripheral surface 11 in the cover 1 prepared forms photochromic adjustment film 64 (W12).For example by the way that light will be included
The mixing liquid of color adjustment material is coated on the inner peripheral surface 11 of cover 1 and dries it to form photochromic adjustment film 64.Photochromic adjustment
The forming method not limited to this of film 64.Figure 12 shows that the inner peripheral surface 11 in cover 1 is formed with the state of photochromic adjustment film 64.For example exist
Whole inner peripheral surface 11 forms photochromic adjustment film 64.Each size of long side direction shown in Figure 12 etc. is as described below.
L1：The overall length of cover 1
L2：The length of the exposed division 15 of cover 1
L3：The length in the hiding portion 16 of cover 1
L4：The minimum length of the part covered by heat shrink films 60
It is that the part that socket 3 or power supply socket 4 are hidden is kept when lamp 106 is completed in cover 1 to hide portion 16.Hide
Portion 16 is configured in the inner side of the inner side for keeping socket 3 or socket 4 of powering when lamp 106 is completed.Portion 16 is hidden for example to set
In concave ring part 131 and straight ring portion 132.Hide the scope not limited to this in portion 16.For example, a part for concave ring part 131 can not also
It is contained in hiding portion 16.A part for projecting ring section 130 can also be contained in hiding portion 16.
Exposed division 15 is that socket 3 and the hiding part of power supply socket 4 are not kept when lamp 106 is completed in cover 1.Dew
Go out portion 15 to be configured between hiding portion 16.For example, exposed division 15 is set in straight sections 12 and projecting ring section 130.The model of exposed division 15
Enclose not limited to this.For example, a part for projecting ring section 130 can also be not included in exposed division 15.A part for concave ring part 131 also may be used
To be contained in exposed division 15.
Length L4 is the length for the scope that needs are covered by heat shrink films 60.That is, when lamp 106 is completed, at least
The scope represented by length L4 is covered by heat shrink films 60.Length L4 is set to the length longer than the length L2 of exposed division 15.
For example, length L4 is set to the concave ring part of straight sections 12, the projecting ring section 130 of the both sides of straight sections 12 and the both sides of projecting ring section 130
The length of 131 part altogether.Length L4 is consistent with the length needed for the heat shrink films 60 after thermal contraction.
In addition, preparing the heat shrink films 60 of the tubulose shown in Figure 13.Each size shown in Figure 13 is as described below.
The size ＞ of ＜ long side directions
L5：The length of heat shrink films 60 before thermal contraction
The size ＞ of ＜ radial directions
D3：The external diameter of heat shrink films 60 before thermal contraction
D4：The internal diameter of heat shrink films 60 before thermal contraction
T1：The thickness of heat shrink films 60 before thermal contraction
Length L5 is set as when lamp 106 is completed to use the model represented by length L4 of the cover 1 of heat shrink films 60
The overall length enclosed.For example, length L5 to be set as to the length longer than the overall length L1 of cover 1.It is elongated being prepared with
In the case of heat shrink films 60, heat shrink films 60 are cut into length L5 (W11).
The process of process and W12 as W11, it is all right no matter which line implements.
Next, cover 1 is inserted into heat shrink films 60, cover 1 is configured to the predetermined position of heat shrink films 60
(W13).Figure 14 shows to be configured to cover 1 into the state of the inside of heat shrink films 60.For example, cover 1 is configured into heat shrink films 60
Center, with the entirety of the cover 1 of heat shrink films 60.
The size A1 of radial direction shown in Figure 14 is formed between heat shrink films 60 before the straight sections 12 of cover 1 and thermal contraction
Gap theoretical mean.Size A1 is equal to the outer diameter D 1 by the internal diameter D4 of the heat shrink films 60 before thermal contraction and straight sections 12
Difference divided by 2 obtained from be worth.As heat shrink films 60, it is appropriate that size A1, which is 5 times to 20 times or so of thickness T1,.Example
Such as, it is considered to which the cover 1 that the outer diameter D 1 to straight sections 12 is 25.5mm is 0.1mm heat shrink films 60 using the thickness T1 before thermal contraction
Situation.In this case, put down using the outer peripheral face 10 of straight sections 12 with the theory at the interval of the inner surface 67 of heat shrink films 60
Average is the heat shrink films 60 of 0.5mm to 2.0mm value.
Next, being heated in the state of the position that cover 1 and heat shrink films 60 are configured to shown in Figure 14, make hot receipts
Contracting film 60 shrinks.Thus, heat shrink films 60 are close to the outer peripheral face 10 (W14) of cover 1.Figure 15 shows the heat shrink films of thermal contraction
60 are close to the state of cover 1.As shown in figure 15, cover 1 is overall is covered by heat shrink films 60.
In W14 process, for example, heating-up temperature, heat time and heating distribution are adjusted, makes heat shrink films 60 from cover 1
An end 14 gradually cling to cover 1 to another end 14.This is in order to avoid being left between cover 1 and heat shrink films 60
Bubble.Particularly, bubble had better not be left in the exposed division 15 of cover 1.Can also make heat shrink films 60 from the central portion of cover 1 to
Both ends 14 gradually cling to cover 1.
The size L6 of long side direction shown in Figure 15 represents the finished product length after the thermal contraction of heat shrink films 60.Length L6 is than cover
1 overall length L1 length.The length L5 of the heat shrink films 60 before thermal contraction is set as that length L6 is longer than length L1 in advance.
Next, the part (W15) of the additional length of cut-out heat shrink films 60.Figure 16 shows to cut off many of heat shrink films 60
State after the part of remaining length.The size L7 of long side direction shown in Figure 16 represents the length after the cutting of heat shrink films 60
Degree.The edge that Figure 16 is showing along being formed the cover 1 of the 1st opening and the 2nd opening has cut off the examples of heat shrink films 60.Namely
Say, heat shrink films 60 is alignd with the length of cover 1 and has been cut off heat shrink films 60.Length L7 is consistent with length L1.
Next, light source cell 2 to be installed to the inside (W16) of cover 1.First, light source cell 2 is inserted into cover 1, by light
Source unit 2 is configured to the inside of cover 1.The configured in one piece of light source cell 2 is in the inside of cover 1.Properly configured when by light source cell 2
In behind the inside of cover 1, opposed portion 225 is fixed to the inner peripheral surface 11 of cover 1.
Socket 3 and power supply socket 4 (W17) are kept next, being installed to cover 1.For example, the socket 4 that will power coats the of cover 1
2 ends 141, are screwed into screwed hole 231 by screw 5 in this condition.Thus, power supply socket 4 is fixed to light source cell 2.This
Outside, opposed portion 225 can also be fixed to cover 1 after the socket 4 (or keeping socket 3) that will power is fixed to light source cell 2
Inner peripheral surface 11.
Figure 17 shows to be installed on socket 4 of powering into the state of light source cell 2.The size H1 of radial direction shown in Figure 17 represents to supply
The width of the convex portion 403 of electric light mouthful 4.Size R1 represents that the junction surfaces 63 of heat shrink films 60 and power supply socket 4 (or keep socket
3) scope is deviateed in relative position.
After power supply socket 4 is appropriately secured into light source cell 2, by the power supply terminal 41 and light source list of socket 4 of powering
Member 2 is electrically connected.After power supply socket 4 is appropriately secured into light source cell 2, by the straight ring portion 132 of covering in heat shrink films 60
And the part of concave ring part 131 is configured between cover 1 and power supply socket 4.In addition, by heat shrink films 60 along the 2nd opening
Edge is configured to the inner side of power supply socket 4.The edge along the 2nd opening of 2nd opening and heat shrink films 60 is powered socket 4 and covered
Lid.Therefore, it is impossible to from outside heat shrink films 60 above-mentioned edge.
Next, by the 1st end 140 for keeping socket 3 to be coated on cover 1, screw 5 is screwed into screwed hole in this condition
231.Thus, socket 3 will be kept to be fixed to light source cell 2.Figure 18 shows power supply socket 4 and keeps both sockets 3 to install
To the state of light source cell 2.It is after socket 3 will be kept to be appropriately secured to light source cell 2, the covering in heat shrink films 60 is straight
The part of ring portion 132 and concave ring part 131 is configured between cover 1 and holding socket 3.Further, by the edge of heat shrink films 60
The edge for the 1st opening is configured to the inner side for keeping socket 3.The edge quilt along the 1st opening of 1st opening and heat shrink films 60
Socket 3 is kept to cover.Therefore, it is impossible to from outside heat shrink films 60 above-mentioned edge.
In the above description, prior to keeping socket 3 to be mounted with socket 4 of powering.This is an example.Guarantor can also be first installed
Hold and power supply socket 4 is installed after socket 3.
The step of by the above, produce the lamp 106 of the structure shown in Fig. 2 to Fig. 4.
Wavelength discrimination layer 6 including multiple layers is arranged at cover 1 by the lamp 106 with said structure.By suitably setting
The wavelength discrimination characteristic of each layer, can obtain the light with desired photochromic (spectrum).Particularly, by virtual White LED
, it is necessary to make spectral radiance decay in narrow wave band in the case of being equipped on light source cell 2.If with said structure
Lamp 106, then because the wavelength discrimination characteristic that can combine each layer for constituting wavelength discrimination layer 6 sets overall wavelength discrimination
Characteristic, so also can easily tackle in this case.In addition, if being the lamp 106 with said structure, then can also
Enough release has the unspecified photochromic special light of JIS Z 9112.
In the lamp 106 with said structure, the 1st end 650 of heat shrink films 60 is configured in holding socket 3
Side.2nd end 651 of heat shrink films 60 is configured to the inner side of power supply socket 4.The end 65 of heat shrink films 60 is not exposed to lamp
106 surface.Therefore, it is possible to improve the appearance design of lamp 106.
In the lamp 106 with said structure, by the straight ring portion 132 of covering of heat shrink films 60 and the portion of concave ring part 131
Divide and be clamped into cover 1 and keep between socket 3 or cover 1 and power supply socket 4.Heat shrink films 60, which are not configured at, keeps the outer of socket 3
Side and the outside for socket 4 of powering.Therefore, it is possible to preventing heat shrink films 60 from being rolled from the 1st end 650 or the 2nd end 651 or
Person is peeled off.For example, the heat shrink films in the process after lamp 106 is assembled as inspection operation and packaging process can be prevented
60 peel off.In addition, can prevent from peeling off lamp 106 is installed into heat shrink films 60 in the working procedure of powered appliance 101.
In the lamp 106 with said structure, socket 3 and power supply socket 4 are kept by installing, can obtain being used to prevent
The only construction rolled and peeled off of heat shrink films 60.It need not be only the portion required for the end 65 of fixed heat shrink films 60
Part.In addition, not producing the operation required for only fixing the end 65 of heat shrink films 60.Therefore, it is possible to reduce component number of packages, energy
Enough improve assembleability.
In the present embodiment, it is the example of the hollow part with the 1st opening and the 2nd opening to illustrate cover 1.This
It is an example.If for example, keeping socket 3 not electrically connected with light source cell 2, cover 1 can also be without the 1st opening.Separately
Outside, in the case of using lighting device 100 on the table, can also only possess the socket equivalent to above-mentioned power supply socket 4.In the feelings
Under condition, cover 1 is inevitable only to form 1 opening.
Lamp 106 is described in detail in the present embodiment, but the mode circulated in the market is not limited to the side of above-mentioned lamp 106
Formula.For example, it is also possible to which circulation possesses the lighting device 100 of the grade of supply unit 105 in the market.Alternatively, it is also possible to will be from lamp 106
Part is as lamp housing obtained from removing light source cell 2, and it is circulated in the market.Can also by wavelength discrimination layer
6 are arranged at the part of cover 1 as lamp housing, and it is circulated in the market.Even such mode, can also expect with
Above-mentioned identical effect.
Next, illustrating other manufacture methods of the lamp 106 with said structure referring also to Figure 19 to Figure 26.Figure 19
It is the flow chart of another example for the manufacture method for showing lamp 106.Figure 20 to Figure 26 is the number of assembling steps for illustrating lamp 106
Figure.In Figure 20 into Figure 26, section is represented with the part of dotted line.
First, the cover 1 shown in Figure 20 is prepared.Cover 1 is, for example, hollow glass tube.As described above, cover 1 possesses straight sections 12
With neck 13.The 1st is formed in the 1st end 140 of cover 1 to be open.The 2nd is formed in the 2nd end 141 to be open.
Next, the inner peripheral surface 11 in the cover 1 prepared forms photochromic adjustment film 64 (W22).The shape of photochromic adjustment film 64
Into for example by the way that the mixing liquid comprising photochromic adjustment material is coated on into the inner peripheral surface 11 of cover 1 and its drying is carried out.Light
The forming method not limited to this of color adjustment film 64.Figure 21 shows that the inner peripheral surface 11 in cover 1 is formed with the state of photochromic adjustment film 64.
Photochromic adjustment film 64 is for example formed in whole inner peripheral surface 11.
In addition, preparing the heat shrink films 60 of the tubulose shown in Figure 22.The size L8 of long side direction shown in Figure 22 represents heat
The length of heat shrink films 60 before contraction.Length L8 is set as to use the cover 1 of heat shrink films 60 when lamp 106 is completed
The overall length by the length L4 scopes represented.For example, length L8 is set as longer than L4 and shorter than length L1 long
Degree.In the case where getting out elongated heat shrink films 60, heat shrink films 60 are cut into length L8 (W21).
Next, cover 1 is inserted into heat shrink films 60, cover 1 is configured to the predetermined position of heat shrink films 60
(W23).Figure 23 shows to be suitably configured into cover 1 into the state of the inside of heat shrink films 60.For example, cover 1 is configured in cover 1
Centre is consistent with the center of heat shrink films 60.Length L8 is shorter than length L1.Therefore, cover 1 is dashed forward from two ends 65 of heat shrink films 60
Go out.Part beyond the part of the protrusion in cover 1 is covered by heat shrink films 60.
Next, being heated in the state of the position that cover 1 and heat shrink films 60 are configured at shown in Figure 23, make hot receipts
Contracting film 60 shrinks.Thus, heat shrink films 60 are close to cover 1 (W24).Figure 24 shows that the heat shrink films 60 of thermal contraction are close to cover
1 state.As shown in figure 24, the edge and the edge of the opening of formation the 2nd that the formation the 1st of cover 1 is open are not covered by heat shrink films 60
Lid.The other parts of cover 1 are integrally covered by heat shrink films 60.Each end 65 of heat shrink films 60 is for example configured at the straight ring of cover 1
The outside in portion 132.
The size L9 of long side direction shown in Figure 24 represents the finished product length after the thermal contraction of heat shrink films 60.Length L9 is for example
It is longer than length L4 and shorter than length L1.The length L8 of heat shrink films 60 before thermal contraction is redefined for length L9 to be made
It is longer than length L4 and shorter than length L1.
Next, light source cell 2 to be installed to the inside (W26) of cover 1.First, light source cell 2 is inserted into cover 1, by light
Source unit 2 is configured to the inside of cover 1.The entirety of light source cell 2 is configured in the inside of cover 1.Suitably match somebody with somebody when by light source cell 2
Behind the inside for being placed in cover 1, opposed portion 225 is fixed to the inner peripheral surface 11 of cover 1.
Socket 3 and power supply socket 4 (W27) are kept next, being installed to cover 1.For example, the socket 4 that will power coats the of cover 1
2 ends 141, are screwed into screwed hole 231 by screw 5 in this condition.Thus, power supply socket 4 is fixed to light source cell 2.This
Outside, opposed portion 225 can also be fixed to after the socket 4 (or keeping socket 3) that will power is fixed to light source cell 2 and covers 1.
Figure 25 shows to be installed on socket 4 of powering into the state of light source cell 2.The size L10 of long side direction shown in Figure 25
(right side) represents to be close to the length of the part hidden by power supply socket 4 in the heat shrink films 60 of cover 1.
After power supply socket 4 is appropriately secured into light source cell 2, by the power supply terminal 41 and light source list of socket 4 of powering
Member 2 is electrically connected.After power supply socket 4 is appropriately secured into light source cell 2, by the straight ring portion 132 of covering in heat shrink films 60
And the part of concave ring part 131 is configured between cover 1 and power supply socket 4.In addition, also heat shrink films 60 are open along the 2nd
Edge be configured to cover 1 power supply socket 4 between.That is, the edge along the 2nd opening of heat shrink films 60 is configured to
The inner side of power supply socket 4.The edge along the 2nd opening of 2nd opening and heat shrink films 60 is powered socket 4 and covered.Therefore, nothing
The above-mentioned edge of method heat shrink films 60 from outside.
Next, by the 1st end 140 for keeping socket 3 to be coated to cover 1, screw 5 is screwed into screwed hole in this condition
231.Thus, socket 3 will be kept to be fixed to light source cell 2.Figure 26 shows power supply socket 4 and keeps both sockets 3 to install
To the state of light source cell 2.The size L10 (left side) of long side direction shown in Figure 26 represents to be close to the heat shrink films 60 of cover 1
In by holding socket 3 hide part length.
When will keep socket 3 be appropriately secured to light source cell 2 after, by the straight ring portion 132 of covering in heat shrink films 60 with
And the part of concave ring part 131 is configured between cover 1 and holding socket 3.In addition, also by heat shrink films 60 along the 1st opening
Edge is configured between cover 1 and holding socket 3.That is, the edge along the 1st opening of heat shrink films 60 is configured into guarantor
Hold the inner side of socket 3.The edge along the 1st opening of 1st opening and heat shrink films 60 is kept socket 3 and covered.Therefore, it is impossible to
The above-mentioned edge of heat shrink films 60 from outside.
In the above description, prior to keeping socket 3 to be mounted with socket 4 of powering.This is an example.Guarantor can also be first installed
Hold and power supply socket 4 is installed after socket 3.
In the number of assembling steps shown in Figure 19, the process for not cutting off the part of the additional length of heat shrink films 60.Pass through
Suitably the length L8 of the heat shrink films 60 before management thermal contraction, can realize above-mentioned steps.If the group shown in Figure 19
Step is filled, then can further improve assembleability.In addition, the usage amount of heat shrink films 60 can be reduced, so economy is excellent
It is good, and can be with environmental protection.
Next, the other structures that explanation lamp 106 can be used.Using the structure of following explanation can also expect with it is above-mentioned
Effect identical effect.
As an example, can also possess and the photochromic photochromic tune of the adjustment identical of film 64 as the 1st wavelength discrimination layer 6A
Whole film.That is, photochromic adjustment film can also be set to be used as the 1st wavelength discrimination layer 6A in the outer peripheral face 10 of cover 1.In the feelings
Under condition, the thickness for being arranged at the photochromic adjustment film of the outer peripheral face 10 of cover 1 is set to combine the attenuation characteristic of photochromic adjustment film 64
And desired attenuation characteristic corresponding with the standard of lamp 106 can be obtained.If the thickness of photochromic adjustment film 64 is less than 40 μ
M value, the then thickness that will be arranged at the photochromic adjustment film of the outer peripheral face 10 of cover 1 is set as more than 40 μm of value.For example, can be by
The thickness of photochromic adjustment film 64 is set to 10 μm, and the thickness that will be arranged at the photochromic adjustment film of the outer peripheral face 10 of cover 1 is set to 120 μm.
That is, the outer peripheral face 10 and inner peripheral surface 11 in cover 1 set the photochromic adjustment films of different thickness.
In addition, being adjusted in the photochromic adjustment film for being arranged at the outer peripheral face 10 of cover 1 with photochromic adjustment film 64 similarly as photochromic
Whole timber material and comprising organic pigment in the case of, by by it is photochromic adjustment material volume containing ratio be set to and it is photochromic adjustment film 64
The different value of volume containing ratio, can also change wavelength discrimination characteristic.If the photochromic adjustment material of photochromic adjustment film 64
Volume containing ratio is less than 10.0% or so, then will be arranged at the photochromic adjustment material of the photochromic adjustment film of the outer peripheral face 10 of cover 1
Volume containing ratio is set as more than 10.0% or so.For example, the volume of the photochromic adjustment material of photochromic adjustment film 64 can be contained
There is rate to be set to 5.0% or so, the volume containing ratio of the photochromic adjustment material of the photochromic adjustment film of the outer peripheral face 10 of cover 1 will be arranged at
It is set to 15.0%.
As other examples, the 1st wavelength discrimination layer 6A and the 2nd wavelength discrimination layer can also be set in the identical face of cover 1
6B.For example, it is also possible to which the outer peripheral face 10 in cover 1 overlaps the 1st wavelength discrimination layer 6A and the 2nd wavelength discrimination layer 6B.In the feelings
Under condition, after setting the 1st wavelength discrimination layer of outer peripheral face 10 6A of cover 1, the 2nd is set on the 1st wavelength discrimination layer 6A surface
Wavelength discrimination layer 6B.Alternatively, it is also possible to which the 1st wavelength discrimination layer 6A and the 2nd wavelength discrimination layer 6B are overlapped in cover 1
Inner peripheral surface 11.In this case, after setting the 1st wavelength discrimination layer of inner peripheral surface 11 6A of cover 1, in the 1st wavelength discrimination layer
6A surface sets the 2nd wavelength discrimination layer 6B.
As other examples, wavelength discrimination layer 6 can also possess more than 3 layers of layer.In this case, both can be only in cover
1 outer peripheral face 10 sets wavelength discrimination layer 6, only can also set wavelength discrimination layer 6 in inner peripheral surface 11.Can also be in the outer of cover 1
Side face 10 sets a part of layer of wavelength discrimination layer 6, and other layers of the setting wavelength discrimination of inner peripheral surface 11 layer 6 in cover 1.
Shown spectral radiance in the present embodiment as an example in the short regions of wavelength ratio 500nm
(relative intensity) is substantially set to 0 lamp 106.By the body for adjusting the organic pigment (photochromic adjustment material) in photochromic adjustment film 64
Product containing ratio, can also make by it is photochromic adjustment film 64 light spectral radiance (relative intensity) substantially 0 frequency band it is inclined
Move.For example, in region short wavelength ratio 480nm, the spectral radiance (relative intensity) of the light of photochromic adjustment film 64 will be passed through
Substantially it is set to 0.That is, the volume containing ratio by adjusting organic pigment (photochromic adjustment material), makes spectral radiance
The frequency band of (relative intensity) substantially 0 is offset to short wavelength side.In addition, making the spectral radiance in the region of wavelength ratio 500nm length strong
Degree (relative intensity) relatively increases.Thereby, it is possible to obtain the low lamp 106 for luring worm property excellent.
Alternatively, it is also possible to make to decay or want increased light by the way that yellow fluorophor is mixed in into photochromic adjustment film 64
Band discontinuity.By such structure, the light with desired photochromic (spectrum) can be also obtained.In addition, by by Huang
Color fluorophor, which is mixed in photochromic adjustment film 64, to convert yellowly frequency band by the light of blue bands short wavelength ratio 500nm
Light.The reduction of the luminous flux of lamp 106 can not can be prevented lavishly effectively using the energy from the LED200 light sent.
By the inside of the packaging body in LED200 yellow fluorophor can be set to realize above-mentioned functions.Can also be by LED200
Vicinity such as LED200 packaging body and cover 1 between set yellow fluorophor to realize above-mentioned functions.
Embodiment 2.
Figure 27 is the sectional view of the example for the lamp 106a for showing embodiments of the present invention 2.Section shown in Figure 27
It is comparable to the section of Fig. 2 A-A sections.Lamp 106a shown in Figure 27 is kept by powered appliance 101.Lamp 106a for example possesses
Cover 1a, wavelength discrimination layer 6, keep socket 3, power supply socket 4 and light source cell 2.
Covering 1a includes the hollow part with opening.Formed in cover 1a each end 14 and lead to opening for internal space
Mouthful.Cover 1a has identical diameter from the 1st end 140 to the 2nd end 141.That is, cover 1a does not possess neck 13.
Outer side covers cover 1a of the heat shrink films 60 from cover 1a.It both can be figure to make the step of heat shrink films 60 are close to cover 1a
The step shown in step or Figure 19 shown in 10.Figure 27 shows the overall by heat shrink films 60 of cover 1a outer peripheral face 10
The example of covering.
Socket 3 is kept for example to form the ladder of the end face for abutting cover 1a in cylindric surrounding wall portion 300.In order to prevent
When socket 3 will be kept to coat cover 1a 1 end 140, heat shrink films 60 are peeled off, in surrounding wall portion 300 from bottom wall part 301 most
Remote edge part formation tapered portion.
After socket 3 will be kept to be appropriately secured to light source cell 2, by the portion close to the 1st end 650 of heat shrink films 60
Divide and be configured between cover 1a and holding socket 3.In addition, the edge along the 1st opening of heat shrink films 60 is configured into holding lamp
The inner side of mouth 3.The side along the 1st opening of 1st opening and heat shrink films 60 is covered by holding socket 3.Therefore, it is impossible to from outer
Observe the above-mentioned edge of heat shrink films 60 in side.
Power supply socket 4 for example forms the ladder of the end face for abutting cover 1a in cylindric surrounding wall portion 400.In order to prevent
When power supply socket 4 is coated into cover 1a 2 end, heat shrink films 60 are peeled off, farthest from bottom wall part 401 in surrounding wall portion 400
Edge part formation tapered portion.
After power supply socket 4 is appropriately secured into light source cell 2, by the power supply terminal 41 and light source list of socket 4 of powering
Member 2 is electrically connected.After power supply socket 4 is appropriately secured into light source cell 2, by close 2nd end 651 of heat shrink films 60
Part is configured between cover 1a and power supply socket 4.In addition, the edge along the 2nd opening of heat shrink films 60 is configured into power supply
The inner side of socket 4.The edge along the 2nd opening of 2nd opening and heat shrink films 60 is powered socket 4 and covered.Therefore, it is impossible to from
Observe the above-mentioned edge of heat shrink films 60 in outside.
If the lamp 106a with said structure, then the close property of heat shrink films 60 and cover 1a can be improved.It can grow
Phase prevents rolling and peeling off for heat shrink films 60.
Embodiment 3.
Figure 28 is the sectional view of the example for the lamp 106b for showing embodiments of the present invention 3.Section shown in Figure 28
It is comparable to the section of Fig. 3 B-B sections.Light source cell 2b is not accommodated in cover 1b by the lamp 106b shown in Figure 28.
Lamp 106b shown in Figure 28 is kept by powered appliance 101.Lamp 106b for example possesses cover 1b, wavelength discrimination layer 6, kept
Socket 3, power supply socket 4 and light source cell 2b.
In light source cell 2b, radiator 21b opposed portion 225b is integrally disposed upon between a pair of support parts 221.Light source
Unit 2b other structures are identical with the structure of the light source cell 2 disclosed in embodiment 1.Opposed portion 225b section is for example
In arc-shaped.
1b is covered for example in the shape for cutting the part of cylinder along axle.Cover 1b does not cover the whole of light source cell 2b
Body, only covers a light source cell 2b part.Cover 1b is set to light source cell 2b.For example, will be used to keep light source cell 2b
Jut 17 and 18 be arranged at cover 1b.Sliding light source cell 2b makes the edge part of light resource installing section 210 be clamped into jut
Between 17 and 18, so as to which cover 1b is installed into light source cell 2b.After cover 1b is suitably attached into light source cell 2b,
Opposed portion 225b is configured to block the opening formed on cover 1b long side direction.Thus, it is equipped with LED200 etc. substrate
201 quilt cover 1b are covered.
In lamp 106b in the present embodiment, pass through the part of cover 1b and light source cell 2b formation tubulars.Therefore, if
Cover 1b is not appropriately mounted at light source cell 2b, then not formed equivalent to the opening of the above-mentioned 1st opening and equivalent to above-mentioned
The opening of 2nd opening.These openings are formed as cover 1b and both light source cell 2b.
In the case of lamp 106b in manufacture present embodiment, when the inner peripheral surface 11 in cover 1b forms photochromic adjustment film 64
Afterwards, cover 1b is installed to light source cell 2b first and forms cartridge.Then, the cartridge is inserted into heat shrink films
60, and heat shrink films 60 is carried out thermal contraction.That is, both cover 1b of heat shrink films 60 and light source cell 2b.
Heat shrink films 60 are made to be close to after above-mentioned cartridge, as needed the part of the additional length of cut-out heat shrink films 60, will
Socket 3 and power supply socket 4 is kept to be installed to cartridge.
After power supply socket 4 is appropriately secured into light source cell 2b, by the power supply terminal 41 and light source list of socket 4 of powering
First 2b electrical connections.After power supply socket 4 is appropriately secured into light source cell 2b, by heat shrink films 60 close to the 2nd end 651
Part a part be configured to cover 1b power supply socket 4 between.Will be close to the 2nd end 651 part it is above-mentioned a part with
Outer part is configured between light source cell 2b and power supply socket 4.In addition, the edge by heat shrink films 60 along the 2nd opening
It is configured to the inner side of power supply socket 4.The edge along the 2nd opening of 2nd opening and heat shrink films 60 is powered socket 4 and covered.
Therefore, it is impossible to from outside heat shrink films 60 above-mentioned edge.
After socket 3 will be kept to be appropriately secured to light source cell 2b, by close 1st end 650 of heat shrink films 60
A partial part is configured between cover 1b and holding socket 3.Beyond an above-mentioned part for the part that will be close to the 1st end 650
Part be configured to light source cell 2b and keep socket 3 between.In addition, the edge along the 1st opening of heat shrink films 60 is matched somebody with somebody
Put the inner side for keeping socket 3.The edge along the 1st opening of 1st opening and heat shrink films 60 is kept socket 3 and covered.Cause
This, it is impossible to the above-mentioned edge of heat shrink films 60 from outside.
It can also expect what is played with the grade of lamp 106 disclosed in embodiment 1 in the lamp 106b with said structure
Effect identical effect.Further, relative to the lamp 106 disclosed in embodiment 1, the inner peripheral surface for being formed at cover 1b can be made
The area of 11 photochromic adjustment film 64 is reduced.I.e. it is capable to the usage amount of photochromic adjustment film 64 be reduced, so economy is excellent
It is good, and can be with environmental protection.In the present embodiment, illustrate cover 1b being installed to the section of light source cell 2b structure
External diameter be circular situation.This is an example.The profile of above-mentioned section is not limited to circle.The profile of above-mentioned section can also
It is ellipse, triangle, quadrangle or polygon etc..Cover 1b section shape only can also be set to other shapes.
Embodiment 4.
Figure 29 is the side view of the example for the lamp 106c for showing embodiments of the present invention 4.Lamp shown in Figure 29
106c is kept by powered appliance 101.Lamp 106c for example possesses cover 1, wavelength discrimination layer 6, keep socket 3c, power supply socket 4c and
Light source cell 2.
Keep socket 3c to possess such as frame 30c and keep terminal 31.Frame 30c includes such as He of surrounding wall portion 300
Bottom wall part 301.Socket 3c is kept in the edge part formation guiding groove 304 farthest from bottom wall part 301 of surrounding wall portion 300.Keep lamp
It is opposed with the junction surface 63 of heat shrink films 60 that mouth 3c is configured to guiding groove 304.Thereby, it is possible to which socket 3c will be kept relative to heat
The direction of shrink film 60 keeps fixing.
Power supply socket 4c possesses such as frame 40c and power supply terminal 41.Frame 40c includes such as He of surrounding wall portion 400
Bottom wall part 401.The socket 4c that powers forms guiding groove 404 in the edge part farthest from bottom wall part 401 of surrounding wall portion 400.Power supply lamp
It is opposed with the junction surface 63 of heat shrink films 60 that mouth 4c is configured to guiding groove 404.Thereby, it is possible to make power supply socket 4c relative to heat
The direction of shrink film 60 keeps fixing.
Embodiment 5.
Figure 30 is the side view of the example for the lamp 106d for showing embodiments of the present invention 5.Lamp shown in Figure 30
106d is kept by powered appliance 101.Lamp 106d possesses such as cover 1, wavelength discrimination layer 6, keep socket 3d, power supply socket 4d and
Light source cell 2.
Keep socket 3d for example to possess frame 30d and keep terminal 31.Frame 30d includes such as He of surrounding wall portion 300
Bottom wall part 301.Keep socket 3d that display part 305 is set in the outer surface of surrounding wall portion 300.The display lamp 106d of display part 305 type
Number, standard, producer and these important informations of grown place.Socket 3d is kept not covered by heat shrink films 60.Therefore, it is possible to incite somebody to action
The outer surface of surrounding wall portion 300 is used as the position of the information needed for display.In addition, keeping socket 3d can be by with that hot need not receive
Socket identical process is kept to manufacture used in the lamp of contracting film 60.
Power supply socket 4d possesses such as frame 40d and power supply terminal 41.Frame 40d includes such as He of surrounding wall portion 400
Bottom wall part 401.The socket 4d that powers sets display part 405 in the outer surface of surrounding wall portion 400.The display lamp 106d of display part 405 type
Number, standard, producer and these important informations of grown place.Power supply socket 4d is not covered by heat shrink films 60.Therefore, it is possible to incite somebody to action
The outer surface of surrounding wall portion 400 is used as the position of the information needed for display.In addition, power supply socket 4d can be by with that hot need not receive
The lamp of contracting film 60 is used to power socket identical process to manufacture.
In embodiment 1 to 5, the straight lamp for being shaped as JEL801 of socket is illustrated.The shape of socket
Shape is not limited to this.For example, can also apply the present invention to the straight lamp for being shaped as JEL802 of socket, this point need not go to live in the household of one's in-laws on getting married
Speech.
The structure illustrated in embodiment 1 to 5 can also combine implementation within the bounds of possibility.Alternatively, it is also possible to part
Implement one of structure illustrated in embodiment 1 to 5 in ground.The multiple knots illustrated in embodiment 1 to 5 can also partly be combined
Structure is implemented.The present invention is not limited only to the structure illustrated in embodiment 1 to 5, and various modifications can be carried out as needed.
Embodiment 6.
The example of the light with embodiment 1 to 5 undocumented photochromic (spectrum) is obtained in the present embodiment.Lamp
106 structure itself can also be using the arbitrary structures disclosed in embodiment 1 to 5.For example, lamp 106 is used as light source component
And possess LED200.In addition, lamp 106 possesses wavelength discrimination layer 6.For example, possessing heat shrink films as the 1st wavelength discrimination layer 6A
60.Possesses photochromic adjustment film 64 as the 2nd wavelength discrimination layer 6B.
Figure 31 is the figure for illustrating the action effect of embodiments of the present invention 6.Figure 31 from LED200 to sending
The spectral radiance of light of the spectral radiance of light with having passed through the photochromic adjustment film 64 using organic pigment is compared
Chart.Figure 31 is shown relative value when being set to 1 from the maximum of the LED200 light sent.
As shown in figure 31, LED200 has sent light relative near 450nm, near 520nm and near 640nm
The increased characteristic in ground.Amount from the LED200 light sent is greatest around in 450nm.
As shown in figure 31, according to experiment, as photochromic adjustment material in the case of using organic pigment, will be photochromic
The volume containing ratio of organic pigment (photochromic adjustment material) in adjustment film 64 is adjusted in the case of 0.5%~1.0% or so
Obtain optimal result.That is, containing by the volume of the organic pigment (photochromic adjustment material) in photochromic adjustment film 64
Rate is adjusted in the case of 0.5%~1.0% or so, and the frequency band light near 640nm is not almost decayed.On the other hand, exist
The frequency band near frequency band and 520nm near 450nm, wide width decay.
The volume containing ratio of organic pigment (photochromic adjustment material) in photochromic adjustment film 64 is being adjusted to 1.0% or so
In the case of, the spectral radiance of the light of the frequency band near the spectral radiance and 640nm of the light of the frequency band near 450nm
It is roughly equal.In addition, spectrum spoke of the spectral radiance of the light of frequency band near 520nm for the light of the frequency band near 450nm
Penetrate 40% of intensity or so value.
For example, can be carried out by the attenuation of the light of the 60 pairs of each frequency bands of heat shrink films for the outer peripheral face 10 for being arranged at cover 1
Fine setting.By suitably setting the wavelength discrimination characteristic for each layer for constituting wavelength discrimination layer 6, it can obtain with desired light
The light of color (spectrum).If the lamp 106 shown in present embodiment, then can obtain having makes the spectral radiance of red light bands
The light of photochromic (spectrum) that intensity relatively increases.Therefore, the lamp 106 of embodiment 6 is suitable for fresh fish or first-class meat etc.
The display equipment of food is the lighting device 100 of object.
The ripple that decay or want increased light can also be made by the way that red-emitting phosphors are mixed in into photochromic adjustment film 64
Field offset.By such structure, the light with desired photochromic (spectrum) can be also obtained.In addition, by the way that red is glimmering
Body of light is mixed in photochromic adjustment film 64, and the light of blue bands short wavelength ratio 500nm can be transformed into the light of red band.Energy
Enough energy not utilized lavishly from the LED200 light sent, can prevent the luminous flux of lamp 106 reduces.Can also by
The inside of LED200 packaging body sets red-emitting phosphors to realize above-mentioned functions.Can also by LED200 vicinity for example
Red-emitting phosphors are set to realize above-mentioned functions between LED200 packaging body and cover 1.
Embodiment 7.
In the present embodiment, illustrate to obtain the example with the light of undocumented photochromic (spectrum) in embodiment 1 to 6
Son.The structure of lamp 106 itself can also be using the arbitrary structures disclosed in embodiment 1 to 5.For example, lamp 106 possesses light source
Element LED200.LED200 can also be using the LED disclosed in embodiment 6.Lamp 106 possesses wavelength discrimination layer 6.For example, making
Possess heat shrink films 60 for the 1st wavelength discrimination layer 6A.Possesses photochromic adjustment film 64 as the 2nd wavelength discrimination layer 6B.
For example, as photochromic adjustment materials'use organic pigment, adjusting organic pigment (the photochromic tune in photochromic adjustment film 64
Whole timber material) volume containing ratio.Thus, obtain that frequency band light near 520nm is almost unattenuated, frequency band near 450nm
And the photochromic adjustment film 64 of the wide width decay of frequency band near 640nm.
For example, can be carried out by the attenuation of the light of the 60 pairs of each frequency bands of heat shrink films for the outer peripheral face 10 for being arranged at cover 1
Fine setting.By suitably setting the wavelength discrimination characteristic for each layer for constituting wavelength discrimination layer 6, it can obtain with desired light
The light of color (spectrum).If the lamp 106 shown in present embodiment, then can obtain having makes the spectral radiance of green bands strong
Spend the light of photochromic (spectrum) that relatively increases.Therefore, the lamp 106 of embodiment 7 is suitable for setting with the display of the food such as vegetables
Standby is the lighting device 100 of object.
The ripple that decay or want increased light can also be made by the way that green-emitting phosphor is mixed in into photochromic adjustment film 64
Field offset.By such structure, the light with desired photochromic (spectrum) can be also obtained.In addition, by the way that green is glimmering
Body of light is mixed in photochromic adjustment film 64, and the light of blue bands short wavelength ratio 500nm can be transformed into the light of green bands.Energy
Enough energy not utilized lavishly from the LED200 light sent, can prevent the luminous flux of lamp 106 reduces.Can also by
The inside of LED200 packaging body sets green-emitting phosphor to realize above-mentioned functions.Can also by LED200 vicinity for example
Green-emitting phosphor is set to realize above-mentioned functions between LED200 packaging body and cover 1.
Industrial applicability
The lamp of the present invention can be applied to the lighting device corresponding with various uses.
Claims (18)
1. a kind of lamp, possesses：
Light source cell, with light source component；
Cover, covers the light source component；And
Wavelength discrimination layer, is arranged at the cover,
The wavelength discrimination layer possesses：
1st wavelength discrimination layer, with the 1st wavelength discrimination characteristic；And
2nd wavelength discrimination layer, with the 2nd wavelength discrimination characteristic, the spectral radiance characteristic of the 2nd wavelength discrimination characteristic and institute
The spectral radiance characteristic for stating the 1st wavelength discrimination characteristic is different.
2. lamp according to claim 1, wherein,
The maximum attenuation wavelength of the 2nd wavelength discrimination characteristic is different from the maximum attenuation wavelength of the 1st wavelength discrimination characteristic.
3. lamp according to claim 1, wherein,
The half-amplitude duration relative to maximum attenuation wavelength of the 2nd wavelength discrimination characteristic and the 1st wavelength discrimination characteristic
Half-amplitude duration relative to maximum attenuation wavelength is different.
4. lamp according to claim 1, wherein,
The thickness of the 1st wavelength discrimination layer is different from the thickness of the 2nd wavelength discrimination layer.
5. lamp according to claim 1, wherein,
The 1st wavelength discrimination layer and the 2nd wavelength discrimination layer have the photochromic tune for the optical attenuation for being used to make specific wavelength
Whole timber material,
The photochromic adjustment material of the containing ratio and the 2nd wavelength discrimination layer of the photochromic adjustment material of the 1st wavelength discrimination layer
Containing ratio it is different.
6. lamp according to claim 1, wherein,
The 1st wavelength discrimination layer or the 2nd wavelength discrimination layer include any material in resin, organic pigment or dyestuff
Expect the photochromic adjustment material as the optical attenuation for making specific wavelength.
7. the lamp described in any one in claim 1 to 6, wherein,
The cover possesses：1st surface, the incident light from the light source component；And the 2nd surface, project and come from the light source
The light of element,
The 1st wavelength discrimination layer and the 2nd wavelength discrimination layer are overlapped in the 1st surface.
8. the lamp described in any one in claim 1 to 6, wherein,
The cover possesses：1st surface, the incident light from the light source component；And the 2nd surface, project and come from the light source
The light of element,
1st wavelength discrimination layer is arranged at the 1st surface,
2nd wavelength discrimination layer is arranged at the 2nd surface.
9. the lamp described in any one in claim 1 to 6, wherein,
The cover possesses：1st surface, the incident light from the light source component；And the 2nd surface, project and come from the light source
The light of element,
The 1st wavelength discrimination layer and the 2nd wavelength discrimination layer are overlapped in the 2nd surface.
10. the lamp according to claim 8 or 9, wherein,
The lamp is also equipped with socket of powering, and the power supply socket has the power supply terminal electrically connected with the light source cell,
The cover is the hollow cover with opening,
The light source cell is configured to the inside of the cover,
The power supply socket blocks the opening,
A part for the layer of the 2nd face side for being arranged at the cover in the wavelength discrimination layer is configured at the cover and institute
State between power supply socket, the layer of the 2nd face side for being arranged at the cover in wavelength discrimination layer is opened along described
The edge of mouth is configured at the inner side of the power supply socket.
11. a kind of lamp wavelength discrimination cover, possesses：
Cover, for covering light source component；And
Wavelength discrimination layer, is arranged at the cover,
The wavelength discrimination layer possesses：
1st wavelength discrimination layer, with the 1st wavelength discrimination characteristic；And
2nd wavelength discrimination layer, with the 2nd wavelength discrimination characteristic, the spectral radiance characteristic of the 2nd wavelength discrimination characteristic and institute
The spectral radiance characteristic for stating the 1st wavelength discrimination characteristic is different.
12. a kind of lighting device, wherein, possess：
The lamp described in any one in claim 1 to 10；
Power supply base, is electrically connected with the power supply socket of the lamp；And
Supply unit, electric power is lighted via the power supply base to lamp supply.
13. a kind of manufacture method of lamp, possesses：
Prepare the process of the hollow cover with opening；
The process that the 1st wavelength discrimination layer with the 1st wavelength discrimination characteristic is set in the inner surface of the cover or outer surface；
The 2nd wavelength with the 2nd wavelength discrimination characteristic is set to distinguish on the surface for the 1st wavelength discrimination layer for being arranged at the cover
The process of other layer, the spectral radiance characteristic of the 2nd wavelength discrimination characteristic and the spectrum spoke of the 1st wavelength discrimination characteristic
Penetrate strength characteristics different；
Light source cell is configured to the process of the inside of the cover；And
The process that the opening is covered by the power supply socket with power supply terminal.
14. the manufacture method of lamp according to claim 13, wherein,
1st wavelength discrimination layer is arranged to the outer surface of the cover,
1st wavelength discrimination layer along the edge of the opening and the 2nd wavelength discrimination layer along the opening
Edge with it is described opening together with by it is described power supply socket covering.
15. a kind of manufacture method of lamp, possesses：
Prepare the process of the hollow cover with opening；
The process that the 1st wavelength discrimination layer with the 1st wavelength discrimination characteristic is set in the outer surface of the cover；
There is the process of the 2nd wavelength discrimination layer of the 2nd wavelength discrimination characteristic, the 2nd wavelength in the inner surface setting of the cover
The spectral radiance characteristic of distinctive feature is different from the spectral radiance characteristic of the 1st wavelength discrimination characteristic；
Light source cell is configured to the process of the inside of the cover；And
The process that the opening is covered by the power supply socket with power supply terminal.
16. the manufacture method of lamp according to claim 15, wherein,
The process of the 1st wavelength discrimination layer is set to possess in the outer surface of the cover：
The process that the cover is covered with heat shrink films；And
The heat shrink films are shunk by carrying out heating, the heat shrink films is close to the process of the outer surface of the cover.
17. the manufacture method of the lamp according to claim 15 or 16, wherein,
The edge along the opening of the 1st wavelength discrimination layer is together with the opening by the power supply socket covering.
18. the manufacture method of the lamp according to claim 13 or 15, wherein,
The mixing liquid of the undissolved state of photochromic adjustment material comprising the photochromic adjustment material is coated with by painting and it is dried
To set the 1st wavelength discrimination layer or the 2nd wavelength discrimination layer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014256226 | 2014-12-18 | ||
| JP2014-256226 | 2014-12-18 | ||
| PCT/JP2015/085324 WO2016098846A1 (en) | 2014-12-18 | 2015-12-17 | Lamp, wavelength discrimination cover for lamp, illumination device, and method for manufacturing lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107110434A true CN107110434A (en) | 2017-08-29 |
| CN107110434B CN107110434B (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580068693.0A Expired - Fee Related CN107110434B (en) | 2014-12-18 | 2015-12-17 | Lamp, wavelength discrimination cover for lamp, lighting device, and method for manufacturing lamp |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6481695B2 (en) |
| CN (1) | CN107110434B (en) |
| WO (1) | WO2016098846A1 (en) |
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| US20210285623A1 (en) * | 2016-09-21 | 2021-09-16 | Sekisui Plastics Co., Ltd. | Led luminaire cover light diffuser and its use |
| JP2021153472A (en) * | 2020-03-27 | 2021-10-07 | シャープ株式会社 | Illumination device and plant growth method |
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| JP2002314136A (en) * | 2001-04-09 | 2002-10-25 | Toyoda Gosei Co Ltd | Semiconductor light emitting device |
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| JP2013098152A (en) * | 2011-11-07 | 2013-05-20 | Sanken Electric Co Ltd | Lighting system |
| JP5721644B2 (en) * | 2012-02-02 | 2015-05-20 | 三菱電機照明株式会社 | Lighting lamp |
| JP6259305B2 (en) * | 2014-02-13 | 2018-01-10 | アイリスオーヤマ株式会社 | LED illuminating lamp and manufacturing method of LED illuminating lamp |
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- 2015-12-17 CN CN201580068693.0A patent/CN107110434B/en not_active Expired - Fee Related
- 2015-12-17 JP JP2016564901A patent/JP6481695B2/en active Active
- 2015-12-17 WO PCT/JP2015/085324 patent/WO2016098846A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002199837A (en) * | 2000-12-28 | 2002-07-16 | Toshiba Lighting & Technology Corp | Lighting device |
| CN1880839A (en) * | 2005-05-31 | 2006-12-20 | 精工电子有限公司 | Phosphor film, lighting device using the same, and display device |
| CN101542197A (en) * | 2007-02-09 | 2009-09-23 | 索尼株式会社 | Optical device package, backlight and liquid crystal display |
| WO2009017913A2 (en) * | 2007-08-01 | 2009-02-05 | 3M Innovative Properties Company | Light management assembly |
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| JP2014154479A (en) * | 2013-02-13 | 2014-08-25 | Erebamu:Kk | LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6481695B2 (en) | 2019-03-13 |
| WO2016098846A1 (en) | 2016-06-23 |
| CN107110434B (en) | 2020-07-24 |
| JPWO2016098846A1 (en) | 2017-10-05 |
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