JP6459769B2 - LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE - Google Patents

Description

  The present invention relates to a method for manufacturing a light emitting device and a light emitting device.

2. Description of the Related Art A light emitting device including a light emitting element such as a light emitting diode is known in which a wavelength conversion member containing a phosphor is disposed on a light emitting element.
In such a wavelength conversion member, for example, in order to obtain high-luminance light, a plurality of wavelength conversion members are bundled and integrated through a reflection member or a reflection film to leak light from the side surface of the wavelength conversion member. The prevention (for example, patent document 1) is proposed. Further, in order to ensure the heat dissipation of the wavelength conversion member, there has been proposed one in which a reflective binder layer is arranged in the light emission direction (for example, Patent Document 2).

WO2012 / 066881 Special table 2012-527742 gazette

  On the other hand, in a situation where the number and arrangement of the light emitting elements are devised according to various applications, the number and arrangement of the light emitting elements, a light emitting device including a wavelength conversion member to which a function according to the usage form is added, There is a need for a method of manufacturing a light emitting device that can be manufactured with high accuracy, simplicity and ease.

  One embodiment according to the present invention provides a light emitting device manufacturing method and a light emitting device capable of easily, easily and easily manufacturing a light emitting device excellent in performance and function according to the usage pattern of the light emitting device. Objective.

This application includes the following disclosure.
(1) preparing a light distribution member having a plurality of translucent pieces containing a phosphor and a soluble adhesive layer provided between the plurality of translucent pieces;
A plurality of light emitting elements are provided separately on each light transmitting piece fractionated by the soluble adhesive layer,
The manufacturing method of the light-emitting device including the process of melt | dissolving the said soluble adhesive layer with a solvent, and separating the said translucent piece, respectively.
(2) a support substrate;
A plurality of light emitting elements provided separately from each other on the support substrate;
A light-transmitting piece containing a phosphor and provided in each of the plurality of light-emitting elements;
A light shielding film provided on a side surface of the translucent piece;
A reflective member filled between the light emitting elements,
A light emitting device in which a gap is formed between the light shielding films.

According to the method for manufacturing a light-emitting device in one embodiment of the present invention, a light-emitting device having excellent performance and function according to the usage pattern of the light-emitting device can be manufactured with high accuracy, simply and easily.
In addition, a light-emitting device that can ensure high performance and high functionality can be provided.

It is a manufacturing process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. FIG. 2 is a manufacturing process diagram continued from FIG. 1. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of another light-emitting device of this invention. FIG. 4 is a manufacturing process diagram continued from FIG. 3; It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of another light-emitting device of this invention. FIG. 6 is a manufacturing process diagram continued from FIG. 5. It is a top view of the light-emitting device obtained by another embodiment of the manufacturing method of the light-emitting device of this invention. FIG. 7B is a cross-sectional view taken along line A-A ′ of FIG. 7A. It is sectional drawing.

  A conventional light source used for a vehicle headlight including a plurality of light-transmitting pieces provided on a plurality of light-emitting elements is not adjacent to the lit light-emitting elements when the individual light-emitting elements are controlled to be lighted independently. If there is a light-emitting element that is lit, light leakage from the light-emitting element that is lit occurs, and a phenomenon occurs in which a translucent piece provided in the light-emitting element that is not lit emits a small amount of light. As a countermeasure against this, while developing a light distribution member in which an ultra-thin light-shielding film is arranged with high accuracy between light-transmitting pieces corresponding to adjacent light-emitting elements, one light distribution member emits light that is turned on / off. It has been found that due to the elements, partial thermal expansion occurs in the light distribution member, and the light shielding film may peel off or cracks may occur in the light transmitting piece. The inventors have conceived that these peeling and / or cracks can be effectively prevented by absorbing stress using an air gap, and have reached the present invention. The stress absorption effect can be obtained without a light shielding film as described later.

  In the present application, the size and positional relationship of members shown in each drawing may be exaggerated for clarity of explanation. In the following description, the same name and reference numeral indicate the same or similar members, and detailed description thereof will be omitted as appropriate. The contents described in one example and one embodiment can be used in other examples and other embodiments.

[Preparation of light distribution members]
First, a light distribution member is prepared. The light distribution member is a member having a light transmitting piece that can transmit light emitted from the light emitting element. The light distribution member includes, for example, a plurality of light transmitting pieces and a soluble adhesive layer provided between the plurality of light transmitting pieces. At least one of the translucent pieces contains a phosphor. It is preferable that a light shielding film is formed on the side surface of the translucent piece. At this time, a soluble adhesive layer will be arrange | positioned between adjacent light shielding films. In the present specification, the “translucent piece” means a translucent small piece constituting the light distribution member.

Such a light distribution member is, for example,
(A) Preparation of member with first light shielding film (b) Formation of first joined body (c) It can be formed by cutting the first joined body. further,
(D) Formation of member with second light shielding film (e) Formation of second bonded body (f) Cutting of the second bonded body may be performed.

(A) Preparation of member with first light-shielding film A plurality of members with first light-shielding film in which at least one surface of the light-transmitting plate is coated with the first light-shielding film are prepared.
As long as the translucent plate used is a plate-like member having translucency, either a flexible or rigid plate may be used.

  Such a translucent plate can be configured to include, for example, a binder made of resin, glass, or inorganic material. Moreover, you may contain a fluorescent substance and / or a filler. In particular, it preferably contains a phosphor.

  As the resin, a resin such as a silicone resin, a silicone-modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a hybrid resin containing one or more of these resins can be used. At this time, a material different from the material used for the meltable adhesive layer is used.

As the phosphor, those known in the art can be used. For example, yttrium aluminum garnet (YAG) phosphor activated with cerium, lutetium aluminum garnet (LAG) phosphor activated with cerium, nitrogen-containing calcium aluminosilicate activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ) -based phosphor, europium-activated silicate ((Sr, Ba) ₂ SiO ₄ ) -based phosphor, β-sialon phosphor, KSF (K ₂ SiF ₆ : Mn) -based Examples thereof include phosphors. When the phosphors described above are contained, they are preferably contained at about 5 to 50% with respect to the total weight of the light transmitting plate. As the light-transmitting plate, a resin or glass containing a phosphor may be used. Preferably, the phosphor itself or a sintered body of a phosphor and a binder made of an inorganic material is used. By carrying out like this, it can be set as a translucent board with high heat resistance.

  Examples of the filler (eg, light diffusing agent, colorant, etc.) include silicon oxide, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, Examples thereof include particles of barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, and the like.

The thickness and size of the light-transmitting plate are not particularly limited, and can be appropriately adjusted depending on the form of the light distribution member to be obtained. For example, the thickness of the translucent plate (the length in the vertical direction of FIG. 1A) corresponds to the size of the light emitting element and / or the distance between the light emitting elements when used as a light distribution member of the light emitting device. It is preferable that it is equal to or slightly larger than the entire circumference of the light emitting element. Specific examples include about 100 μm to several mm, and preferably about 100 to 1000 μm. Thereby, when using the obtained light distribution member for a light-emitting device, in addition to the further miniaturization of a light-emitting device being possible, higher brightness is obtained.
The shape of the translucent plate is not particularly limited, but the planar shape is preferably, for example, a rectangle. In the present specification, “rectangular” includes a square.

  The first light-shielding film formed on at least one surface of the light-transmitting plate is preferably a thin film and formed of a material that can shield light from the light-emitting element by 80% or more. For example, a metal such as gold, silver, copper, iron, nickel, chromium, aluminum, titanium, tantalum, tungsten, cobalt, ruthenium, tin, zinc, lead or an alloy thereof (for example, Al and Cu as Al alloys) , An alloy with a platinum group metal such as Ag or Pt), or a dielectric multilayer film in which a plurality of two or more kinds of dielectrics are stacked. As the dielectric multilayer film, a DBR (distributed Bragg reflector) film is preferable.

Examples of the dielectric constituting the DBR film include oxides or nitrides containing at least one element selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al. In a multilayered structure film of dielectric, normally, the refractive index n1 of one dielectric, the refractive index n2 of the other dielectric, and the wavelength of light emitted from the light emitting layer are λ, the thickness d1 of one dielectric and The thickness d2 of the other dielectric is
d1 = λ / (4n × 1) (1)
It is preferable that d2 = λ / (4n × 2) (2).
The thickness of the first light shielding film is not particularly limited. Several to several tens of micrometers are mentioned, About 0.1-10 micrometers is preferable and about 0.3-7 micrometers is more preferable.

  The first light-shielding film is, for example, a vacuum deposition method, an ion plating method, an ion vapor deposition (IVD) method, a sputtering method, an ECR sputtering method, a plasma deposition method, a chemical vapor deposition (CVD) method, or an ECR. It can be formed by a known method such as a -CVD method, an ECR-plasma CVD method, an electron beam evaporation (EB) method, or an atomic layer deposition (ALD) method. In particular, it is preferable to form the first light shielding film by a sputtering method that can be formed in a relatively short time.

  The first light shielding film may be formed only on one surface of the translucent plate, but is preferably formed on two surfaces positioned on opposite sides of each other. In addition, the first light-shielding film can be formed on the entire surface of the light-transmitting plate except the surface on which light from the light emitting element is incident and the surface on which light is emitted from the light emitting element. As a result, when the first joined body is cut to obtain the light distribution member, the light distribution member having the first light-shielding film formed on the entire side surface of the translucent piece can be obtained, and the light traveling in the lateral direction is reflected. can do. Although it is more preferable to form the first light-shielding film with a uniform thickness on the whole, it may be formed partially (lattice, sea-island, striped, etc.).

  When preparing a plurality of members with the first light-shielding film, they may have different planar shapes and thicknesses, but preferably have the same or substantially the same planar shape and thickness. Here, “substantially” means that a variation of about ± 10% is allowed. As the first light shielding film-attached members having different thicknesses, for example, when preparing two types of first light-shielding film-attached members, a thin first light-shielding film-attached member and a thicker first light-shielding film-attached member. As for what laminated | stacked two or more film-coated members, it is preferable to use the thing of the thickness equivalent to one thick 1st member with a light shielding film. That is, the thin first light-shielding film-attached member is preferably equivalent to a thickness of about one-half or one-third of the thick first light-shielding film-attached member. Thereby, the light distribution member which has the translucent piece from which a magnitude | size differs in a column or row direction can be formed. Further, in the formation of the second bonded body, the size is increased in the matrix direction as shown in FIGS. 7A and 7B by stacking in combination with the second light-shielding film members having different translucent thicknesses in the column or row direction. A light distribution member having different translucent pieces can be formed.

  The first light shielding film member may be cut, polished, or the like so as to have a desired shape, size, etc. after the first light shielding film is formed on the light transmitting plate.

(B) Formation of first joined body A plurality of first light-shielding film-attached members are joined to form a first joined body.
The bonding here is preferably performed using a soluble adhesive so that the first light-shielding films of the first light-shielding film-attached members face each other.
The soluble adhesive means an adhesive that can be dissolved and removed by an organic solvent even after the adhesive is cured.
Examples of the soluble adhesive include adhesion by acrylic, urethane, styrene, epoxy, polyimide, silicone, BT resin, ester, ether, urea, polyamide, phenol, and cellulose derivatives. An epoxy type, a polyimide type, an acrylic type, and a phenol type can be preferably used. These adhesives can be used in combination of two or more as required. Among these, a polyimide-based adhesive is preferable because it becomes relatively hard after curing and the first bonded body can be easily cut.

  In the joining of the first light shielding film-attached member, the member having the first light shielding film formed on two of the side surfaces may be used as the first light shielding film-attached member located at the extreme end, or the first light shielding is provided on the extreme end face. You may use what was formed only in one surface so that a film | membrane may not be arrange | positioned. As the first light-shielding film-attached member located in the first joined body other than the end portion, it is preferable to use a first light-shielding film-attached member in which the first light-shielding film is formed on at least two surfaces. Moreover, the member with the 1st light shielding film formed in four surfaces except the surface into which the light from a light emitting element injects, and the surface which radiate | emits the light from a light emitting element among light distribution members can also be used.

  In either case, the first joined body can be formed by joining the first light shielding film-attached member via the soluble adhesive so that the first light shielding films face each other. The number of the first light shielding film-attached members in the first bonded body is not particularly limited, and may be 2 or more, 3 or more, 4 or more, or 5 or more. Moreover, hundreds or less, tens or less, and tens or less are mentioned. Preferably, it can be 2 or more and 10 or less. A light distribution member provided with a plurality of translucent pieces can be formed in a lump by setting it to the above lower limit value or more, and the first bonded body can be easily cut by setting it to the above upper limit value or less.

  The shortest distance between adjacent light shielding films (the width of the soluble adhesive) is preferably 1 μm or more and 1000 μm or less, more preferably 3 μm or more and 100 μm or less, and further preferably 5 μm or more and 20 μm or less. By making the above lower limit value or more easier to obtain the stress relaxation effect, by making it less than the above upper limit value, when lighting adjacent light emitting elements simultaneously, it is uniform without being affected by the gap between the light shielding films. Luminescence can be obtained.

(C) Cutting the first joined body The obtained first joined body is cut. It is preferable to cut into a thickness that allows light from the light emitting element to pass therethrough. The cutting here is preferably performed perpendicularly to the laminated surface of the first light shielding film-coated member. Hereinafter, this cutting may be referred to as a first cutting.

  The first cutting may be any cutting as long as the cutting is performed in a direction perpendicular to the laminated surface of the first light shielding film-coated member, but it is preferable to use a cutting method in which the cutting surface is flat. . As such a cutting method, a method known in the art can be used. For example, blade dicing, laser dicing, wire saw, etc. are mentioned. Especially, since the member with a 1st light shielding film can be cut | disconnected collectively according to a wire saw, it is preferable. In this specification, “vertical” includes an inclination within ± 10%.

  In the direction perpendicular to the laminated surface of the first light shielding film-attached member, the cut portion (line) can be cut in various directions within the laminated surface. Therefore, when the translucent plate is rectangular, it is cut so as to obtain a cut surface parallel to one end surface (for example, the end surface 19 in FIG. 1C) adjacent to the surface on which the first light shielding film is formed. It is preferable (see, for example, FIG. 1D). A thin piece of the first bonded body having a uniform film thickness can be formed by such a single cutting (see FIG. 1E).

  Depending on the planar shape of one joined body, a desired light distribution member can be manufactured only by cutting once in the direction perpendicular to the laminated surface of the first light-shielding film-attached member. By cutting into two, a plurality of desired light distribution members can be manufactured (see, for example, FIG. 1 (d) and FIG. 3 (d)).

  Further, as described above, the first light distribution member obtained by the first cutting parallel to each other one or more times in the direction perpendicular to the laminated surface of the first light shielding film-coated member is further You may cut | disconnect in the orthogonal | vertical direction with respect to the lamination surface of a member with a light shielding film, and a direction (preferably orthogonal) to 1st cutting | disconnection (refer FIG.4 (b)). By performing cutting in such two directions, a plurality of light distribution members having a desired shape can be manufactured regardless of the shape of the joined body.

  The cutting here can be performed so that the light distribution member has the same thickness as the light-transmitting plate used. For example, it is preferable to cut so as to be about 100 μm to several mm, about 100 to 1000 μm, and further about 100 to 500 μm. After cutting, polishing or the like may be performed to obtain these thicknesses.

  The cutting in this step may be performed in an inclined manner instead of being performed perpendicularly to the laminated surface of the first light shielding film-attached member. Such cutting can be used when manufacturing a light distribution member intended for light distribution in a specific direction.

(D) Formation of member with second light-shielding film As described above, a second light-shielding film may be further formed on the cut surface of the flaky light distribution member obtained by performing the first cutting. That is, the light distribution member obtained by performing the first cutting is regarded as the above-described translucent plate, and the second light shielding film is formed on the surface thereof. As a result, one or a plurality of second light-shielding film-attached members can be formed. Therefore, the second light shielding film is formed so as to intersect perpendicularly to the first light shielding film.

The second light-shielding film can be formed using the above-described known method by using the material exemplified for the first light-shielding film. In particular, the second light shielding film is preferably formed of the same material as the first light shielding film. As a result, as will be described later, it is possible to make the light distribution characteristics of the light emitted from each translucent piece uniform.
The second light-shielding film may not be the same thickness as the first light-shielding film, but is preferably the same from the viewpoint of uniform light distribution characteristics.

(E) Formation of second bonded body The method of forming the second bonded body by bonding the second light-shielding film-attached member is the same as the method of forming the first bonded body using the above-described soluble adhesive. Can be done. The number of layers of the second light shielding film-attached member here can also be set arbitrarily.

(F) Cutting the second joined body The obtained second joined body is cut. The cutting here can be performed similarly to the cutting of the first joined body.
The cutting in this case may be performed perpendicularly to the laminated surface of the second light-shielding film-attached member, but both the laminated surface of the first light-shielding film-attached member and the laminated surface of the second light-shielding film-attached member It is preferable to cut perpendicularly.

  The thinned light distribution member includes the shape of the light-transmitting plate, the number of stacked first light shielding film-attached members, the cutting form of the first joined body, the number of stacked second light shielding film-attached members, and the cutting form of the second joined body. And the like, and can be processed into an arbitrary shape, an arbitrary number of translucent plates, first light-shielding films, and second light-shielding films. Thereby, the light distribution member corresponding to the number of light emitting elements to apply can be manufactured.

  Thus, by cutting the first joined body in a direction perpendicular to the first cut or by cutting the second joined body in a direction perpendicular to the first cut, a rectangular parallelepiped shape having a uniform thickness. Can be regularly arranged in the vertical direction and / or the horizontal direction. Further, since the light shielding film is provided between the adjacent light transmitting pieces, it is possible to easily and easily manufacture a light distribution member that secures light shielding in each of the adjacent light transmitting pieces with high accuracy. Here, the “cuboid” includes a cube.

[Arrangement of light emitting elements]
A light emitting element is arranged with respect to the light distribution member.
The arrangement of the light emitting elements here is such that a light emitting element is provided for a light transmitting piece, preferably one light emitting element is provided for one light transmitting piece, and a plurality of light emitting elements are provided separately from each other. It has been. The arrangement of the light emitting elements may be such that the light distribution member is attached to a plurality of light emitting elements mounted on the support substrate, or may be mounted on the support substrate after the plurality of light emitting elements are attached to the light distribution member. Accordingly, the plurality of light emitting elements can be provided separately from the plurality of light transmitting pieces fractionated by the soluble adhesive layer. The light distribution member is disposed on the light extraction surface side of the light emitting element, that is, on the light extraction surface side of the light emitting device.

  For example, when using a light distribution member in which translucent pieces separated by a soluble adhesive layer and / or a light shielding film are arranged in a row, a plurality of light emitting elements are arranged in a row corresponding to the translucent pieces. Arrange. In the case of using a light distribution member in which translucent pieces separated by a soluble adhesive layer and / or a light shielding film are arranged in a matrix, a plurality of light emitting elements are arranged in a matrix corresponding to the translucent pieces. Arranged in a shape. Thereby, the light-emitting device which provided each light emitting element with respect to each translucent piece by the simple manufacturing method mentioned above can be obtained. It is preferable to form a light shielding film in order to reliably prevent light leakage between adjacent light emitting elements.

  The plurality of light emitting elements to be arranged are preferably close to each other between adjacent light emitting elements. In consideration of the vehicle application and the luminance distribution, the distance between one light emitting element and the adjacent light emitting element is the light emission. Those shorter than the size of the element itself (for example, the length of one side) are preferable. For example, about 30% or less of the size of the light emitting element itself is more preferable, and 20% or less is more preferable. Specifically, 5 μm or more and 500 μm or less is preferable, and 50 μm or more and 200 μm or less is more preferable. Light leakage from a light emitting element that is lit to a non-lighting light emitting element can be suppressed by setting it to the above lower limit value or more, and a light emitting device with high light emission quality that has less light emission unevenness by being less than the above upper limit value. can do.

The light-emitting element may be disposed with respect to the light distribution member, but the light-emitting element may be provided separately from the light distribution member, but the light-emitting element is preferably disposed close to or in contact with the light distribution member. As a result, at least light emitted from the light emitting element can be efficiently introduced into the light distribution member. Here, the proximity means that they are disposed only through members (for example, a translucent adhesive layer or a translucent metal film) that are substantially involved in the adhesion between the two.
Here, when bonding a light distribution member to a light emitting element using a translucent adhesive layer, the translucent adhesive different from the adhesive which comprises the soluble adhesive layer mentioned above is used. That is, a translucent adhesive that does not dissolve or is difficult to dissolve in a solvent used when dissolving and removing the soluble adhesive layer as described later is used. Difficult to dissolve here means that the dissolution rate in the solvent for dissolving the soluble adhesive is 1/5 or less, 1/10 or less, 1/15 or less, 20 minutes Of 1 or less.

  Examples of other methods of arranging the light emitting element with respect to the light distribution member include an atomic diffusion bonding method and a surface activated bonding method. When the light distribution member and the light emitting element are bonded by the atomic diffusion bonding method, a light transmitting metal film is formed between the light emitting element and the light transmitting piece. Examples of the metal film include Ag, Cu, Au, Ti, Co, Fe, Cr, Pt, Ru, Ta, Si, Ni, and Al. Of these, Ti, Au, and Cr are preferable because of their excellent corrosion resistance. At this time, the thickness of the metal film is set to be thin enough to suppress light absorption in the metal film. For example, it can be 0.1 nm to 0.8 nm, preferably 0.1 nm to 0.4 nm, and more preferably 0.1 nm to 0.2 nm in terms of film formation rate.

  The “deposition rate conversion” in this specification will be described. First, a metal film is formed on a base having a flat surface for a predetermined time. Next, a required time for obtaining a metal film having a desired film thickness is determined based on the relationship between the predetermined time and the actually obtained metal film thickness. When the metal film is formed only for the required time, it is assumed that the film thickness obtained by conversion to the film forming speed is obtained to obtain a metal film having a desired film thickness corresponding to the required time. That is, the film thickness estimated from the required time is set as the film thickness formed in terms of film formation speed. Although a value smaller than one atom is included here, in this case, the metal film is not a film but is formed in an island shape. Therefore, even if the entire metal film is not formed with the aforementioned film thickness, it is within the scope of the present invention if it is formed with the aforementioned film thickness in terms of film formation rate. Further, when the surface activated bonding method is used, the light emitting element and the light transmitting piece are directly contacted and bonded. According to the surface activated bonding, since there is no member that absorbs light between the light-transmitting piece and the light-emitting element, light from the light-emitting element can be efficiently incident on the light-transmitting piece.

As the light emitting element, any of light emitting elements generally used in this field can be used. For example, as blue and green light emitting elements, those using semiconductor layers such as ZnSe, nitride-based semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, etc. Examples of the red light emitting element include those using a semiconductor layer such as GaAlAs and AlInGaP. The light-emitting element may be one in which these semiconductor layers are usually stacked on a substrate for semiconductor growth and configured with the substrate, or the substrate may be removed.
The light emitting element may be one in which electrodes are arranged on different sides of the semiconductor layer, but one in which electrodes are arranged on the same side is preferable. As a result, it can be mounted in a face-down manner to be described later.

  As the light-emitting element, a light-emitting element in which a reflective film is formed on the entire side surface can be used. Thereby, since the light which goes to a horizontal direction from a light emitting element can be reflected and extracted with a reflecting film, light extraction efficiency can be improved. Further, since light from the light emitting elements does not leak, it is not necessary to provide a reflecting member between the light emitting elements. Examples of the reflective film include the same material as the first light-shielding film, for example, a single-layer or multilayer structure of a metal film, a dielectric multilayer film, and the like. These reflective films are preferably formed in contact with the side surface of the light emitting element.

  When the light emitting elements are provided apart from each other in correspondence with the above-described light distribution member, usually, a plurality of light emitting elements are arranged on the support substrate in a connection form such as series, parallel, series parallel, or parallel series. . The light emitting element is electrically connected to the support substrate using a bonding member such as a eutectic material or a wire. The light emitting elements may be connected in a face-down or face-up bonding form, but are preferably connected in a face-down form. With such connection, the light emitting element can be disposed close to or in contact with the light distribution member, and desired light distribution characteristics can be easily obtained.

[Distribution of reflective members]
A reflective member is disposed between the light emitting elements. As the reflecting member, a material different from the soluble adhesive layer can be used. Thereby, the reflecting member can be left in a state where the side surface of the light emitting element is covered, and the light from the lighted light emitting element is prevented from entering the light transmitting piece provided in the non-lighted light emitting element. Can do. The reflecting member is not an essential configuration. For example, when a light-emitting element having a reflective film formed on the entire side surface is used as the light-emitting element, the reflective member need not be arranged. Here, for example, it is preferable to use a reflecting member that reflects 60% or more of light emitted from the light emitting element, and further reflects 70% or more, 80% or more, or 90% or more.

  The material of the reflecting member is not particularly limited, and may be selected from those exemplified for the first light shielding film. However, in consideration of the accuracy, simplicity, ease, and the like of the arrangement of the reflecting member, a resin is used. It is preferable.

Examples of the resin include the same materials as those exemplified as the material of the light-transmitting plate. In particular, it is preferable to include a reflective substance in these materials so that light emitted from the light-emitting element is not transmitted. . Examples of the reflective substance include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, alumina, aluminum nitride, boron nitride, and mullite. The content of the reflective substance or the like can be appropriately adjusted depending on the type of the reflective substance used. For example, it is preferably about 30% or more with respect to the total weight of the reflecting member. Of these, a white resin is preferable.
Moreover, it is preferable that the material which comprises a reflection member contains the same material as the material which comprises a translucent adhesive bond layer, for example, the same resin. Thereby, when melt | dissolving a soluble adhesive bond layer, there is no possibility that a reflection member will be melt | dissolved.

  Regardless of the presence or absence of the light-transmitting adhesive layer, the reflecting member preferably satisfies at least the space between adjacent light emitting elements. Moreover, it is preferable to arrange | position a reflection member so that it may contact with the 1st light shielding film in a light distribution member, a 2nd light shielding film, and / or a soluble adhesive layer between light emitting elements. In this contact, it is preferable that all of the first light shielding film, the second light shielding film and / or the soluble adhesive layer exposed on the light emitting element side of the light distribution member are in contact with the reflecting member. By such contact, light emitted from the individual light emitting elements can be separated for each light emitting element by the light distribution member between the light emitting elements and between the light emitting elements, and between the adjacent light emitting elements in the light emitting device. Light leakage can be prevented. As a result, it is possible to avoid the phenomenon that the light transmitting piece provided in the non-lighting light emitting element emits a minute amount of light.

  The reflecting member may not be disposed in contact with the side surface of the light emitting element, but is preferably disposed so as to be in contact with a part or all of the side surface. With such an arrangement, the light emitted in the lateral direction from the side surface of the light emitting element can be reflected by the reflecting member, and the light can be emitted to the light extraction surface. In addition, since light only propagates in the light emitting element, light absorption by other members can be avoided.

  The reflecting member is preferably disposed on the surface opposite to the light extraction surface side of the light emitting element, that is, between the light emitting element and the above-described support substrate. With this arrangement, light can be extracted to the light extraction surface side.

  Further, the reflecting member covers the entire outer surface of the light distribution member, that is, the end surface of the light distribution member when the end surface of the light distribution member is not covered with the first light shielding film and / or the second light shielding film. It is preferable. Thereby, the light emitted from the outer periphery of the light distribution member can be reflected and emitted to the light extraction surface. In addition, when the end surface of the light distribution member is covered with the first light shielding film and / or the second light shielding film, the end surface of the light distribution member may not be covered with the reflection member. By doing so, since the outer periphery of the light distribution member can be the outermost periphery of the light emitting device, the light emitting device can be downsized as compared with the case where the reflecting member is disposed on the outer periphery of the light distribution member.

The reflecting member can be formed by screen printing, potting, transfer molding, compression molding, or the like. In the manufactured light emitting device, the reflecting member does not cover the light extraction surface side surface of the light distribution member, but in the reflection member forming step, the light distribution surface side surface of the light distribution member is once coated and then polished. For example, the light extraction surface of the light distribution member may be exposed from the reflection member.
Therefore, it is preferable that the maximum thickness of the reflecting member is equal to the sum of the height of the light emitting element and the thickness of the light distribution member when connected to the support substrate.

  The arrangement of the reflecting member may be performed after the light emitting element is disposed with respect to the light distribution member, may be performed after the light transmitting pieces described later are separated from each other, or the light emitting element is disposed with respect to the light distribution member. Before disposing the light-emitting element, a light distribution member may be disposed on the light-emitting element coated with the reflective member after the light-emitting element is coated with the reflective member. Preferably, the reflecting member is disposed after the light emitting element is disposed with respect to the light distributing member and before the light transmitting pieces are separated from each other. Thereby, since it can prevent that a reflecting member enters into the space | gap formed between translucent pieces, it becomes easy to acquire the effect of the stress relaxation by a space | gap.

[Separation of translucent piece]
Dissolve the soluble adhesive layer with a solvent. Thereby, a plurality of translucent pieces can be separated from each other together with the light shielding film formed on the side surface. However, the dissolution of the soluble adhesive layer here is preferably carried out so as to completely remove the soluble adhesive layer, but the soluble adhesive layer is removed in all the thickness directions of the soluble adhesive layer. As long as there is a part that has been dissolved and removed, a part of the soluble adhesive layer may remain without being dissolved and removed in the entire periphery of the translucent piece covered with the light-shielding film. That is, the translucent pieces may not be completely separated from each other. As long as there is a site for dissolving all the soluble adhesive layers in the thickness direction, the above-described stress absorption and / or relaxation can be performed.

  The solvent used here is preferably appropriately selected from known materials that can dissolve and remove the soluble adhesive layer depending on the type of the soluble adhesive layer used.

  For example, when a polyimide resin is used as the soluble adhesive, it is preferable to use N-methyl-2-pyrrolidone (NMP) as the solvent. In this case, the translucent adhesive layer used for placing and fixing the translucent piece on the light emitting element is preferably a silicone resin, and the reflective member is preferably a silicone resin containing titanium oxide. .

  As a method for dissolving the soluble adhesive layer with a solvent, methods known in the art can be mentioned. For example, the method of immersing in a solvent, the method of spraying, etc. are mentioned. Among them, it is preferable to use a method of immersing in a solvent that can be dissolved in a relatively short time. In addition, when using the method to spray, the remaining soluble adhesive layer can also be removed by immersing in a solvent after spraying.

[Light emitting device]
A light-emitting device according to an embodiment of the present invention includes, for example, a support substrate, a plurality of light-emitting elements that are separately provided on the support substrate, and a phosphor, and is provided in each of the plurality of light-emitting elements. It has a translucent piece, a light shielding film provided on the side surface of the translucent piece, and a reflecting member filled between the light emitting elements. In addition, gaps are formed between the light shielding films. The gaps formed between the light shielding films are continuous over the entire thickness direction of the light shielding film, and are arranged over a part or the whole between the light shielding films. Furthermore, in other words, the adjacent translucent pieces are spaced apart from each other.
With such a configuration, light emitted from each light emitting element can be separated for each light emitting element, and light leakage between adjacent light emitting elements in the light emitting device can be prevented. As a result, it is possible to avoid the light transmitting piece provided in the non-lighting light emitting element from emitting light.
In addition, stress due to partial thermal expansion applied to the light distribution member due to the light emitting / non-lighting light emitting element can be effectively absorbed by the gap between the light shielding films. Accordingly, a light-emitting device with high reliability over a long period of time can be obtained in which the light-shielding film is not peeled off or the light-transmitting piece is not cracked.

  Each translucent piece formed on one light distribution member can have the same configuration (shape, thickness, characteristics, etc.), or a different configuration for each translucent piece as shown in FIGS. 7A and 7B. You can also. For example, the size of each translucent piece can be changed, a different phosphor can be included for each translucent piece so that light of different wavelengths can be formed, and the translucent piece can be formed in steps. In a vehicle headlight, a plurality of light-transmitting pieces having different configurations may be required for one light-emitting device. Even in the case of employing translucent pieces having different configurations as described above, according to the embodiment, stress can be absorbed by the gaps, so that it is less likely to be affected by characteristic deterioration.

  The structure of the light emitting element arrange | positioned at each translucent piece may be the same, or may differ. For example, as shown in FIGS. 7A and 7B, a plurality of light emitting elements may be provided for one light transmitting piece, or light emitting elements having a size corresponding to the size of each light transmitting piece may be provided. .

  Hereinafter, a method for manufacturing a light emitting device and a light emitting device in an embodiment of the present invention will be described in detail with reference to the drawings.

Embodiment 1
[Preparation of light distribution members]
In the method for manufacturing a light distribution member according to the first embodiment, first, as shown in FIG. 1A, a translucent plate 10b is prepared. The light-transmitting plate 10b is obtained by cutting a large YAG plate obtained by mixing about 10% by weight of a YAG phosphor with a glass material and sintering it to an appropriate size.
The thickness of the translucent plate 10b is the maximum width at which the light emitting element can be finally arranged. Therefore, the thickness of the light transmitting plate 10b is preferably larger than one side (width) of the light emitting element in a plan view, and for example, is preferably 50 μm or more larger than one side of the light emitting element.

As shown in FIG. 1 (b), (Nb ₂ O ₅ (lower) / SiO ₂ (upper)) n, n = 20, thickness: 1.5 / 2.5 μm only on one side of the light transmitting plate 10b. First light-shielding films 11 having a DBR structure (total thickness: 80 μm) are sequentially formed by sputtering to form two first light-shielding film-attached members 10a. In addition, a plurality of first light shielding film-attached members 10a each having the first light shielding film 11 formed on both surfaces of the translucent plate 10b are formed.

  Next, as shown in FIG. 1 (c), the first light shielding film member 10a is joined via the soluble adhesive layer 17 made of polyimide resin so that the first light shielding film 11 faces, for example, The first joined body 18 is formed by laminating the four first light shielding film members 10a. In this case, a surface on which the first light shielding film 11 is not formed is disposed on the lowermost surface and the uppermost surface of the first bonded body 18.

Thereafter, as shown in FIG. 1 (d), the first joined body 18 is cut into a thin piece perpendicular to the laminated surface of the first light shielding film-coated member 10a so as to have a desired thickness. The cutting is performed in parallel to the end surface 19 of the first joined body 18 (see FIG. 1C). Thereafter, the cut surface is polished for planarization.
Thereby, as shown in FIG. 1 (e), the translucent piece 10 and the first light-shielding film 11 covering the side surface of the adjacent light-transmitting piece 10 are bonded between the first light-shielding films 11. The light distribution member 12 having a desired thickness can be formed in a row via the line 17.

  In this light distribution member, since the DBR structure is used as the first light-shielding film for joining the light-transmitting pieces, a high light reflectance can be obtained, and the light-shielding effect can be further improved. In addition, since the light absorptance is low, even if such a light shielding film is used for the light distribution member, it is possible to avoid a decrease in the luminous flux as the light distribution member.

[Arrangement of light emitting elements]
As shown in FIG. 2A, a light emitting element 13 is provided corresponding to the light distribution member 12. That is, the four light emitting elements 13 are separately provided at the respective positions of the translucent piece 10 separated by the soluble adhesive layer 17 of the light distribution member 12.
The light-emitting elements 13 are arranged by arranging the light-emitting elements 13 in a line on a support substrate 15 having a wiring pattern formed on the surface and mounting the light-emitting elements 13 face-down using a eutectic material. And the light distribution member 12 is fixed to the light extraction surface side of the light emitting element 13 arrange | positioned in this way by a translucent adhesive layer. The translucent adhesive layer here is different from the soluble adhesive layer 17. For example, it is preferable to use an adhesive member made of a silicone resin as the translucent adhesive layer.

[Distribution of reflective members]
Subsequently, as shown in FIG. 2B, a reflecting member 14 including a silicone resin containing about 50% of titanium dioxide particles is disposed between the light emitting elements 13. The reflective member 14 is brought into contact with the first light shielding film 11 and the soluble adhesive layer 17 on the light distribution member 12 side between the light emitting elements 13. Further, the reflecting member 14 is disposed so as to cover all of the side surfaces of the light emitting element 13. Further, the reflection member 14 is disposed so as to cover the side surface of the light emitting element 13 and the outermost periphery of the light distribution member 12.

[Separation of translucent piece]
As shown in FIG. 2C, the soluble adhesive layer 17 is dissolved using N-methyl-2-pyrrolidone (NMP). As a result, the four light-emitting elements 13 fixed to the support substrate 15 are arranged with the four light-transmitting pieces 10 that are spaced apart from each other at the portion where the soluble adhesive layer 17 was present. A device 16 can be obtained. At this time, the reflecting member 14 remains at the same height as the upper surface of the light emitting element without being melted.

  A light-emitting device obtained by such a manufacturing method includes a support substrate 15, a plurality of light-emitting elements 13 spaced apart from each other on the support substrate, and a phosphor, and is provided in each of the plurality of light-emitting elements. The translucent piece 10, the light shielding film provided on the side surface of the translucent piece 10, and the reflecting member 14 filled between the light emitting elements 13. Adjacent light shielding films are separated from each other.

According to the manufacturing method as described above, the light distribution member 12 including the light-transmitting piece having the light shielding film on the side surface can be formed with high accuracy and simplicity.
Further, the obtained light-emitting device prevents the light-transmitting piece provided in the non-light-emitting light-emitting element adjacent to the light-emitting element from emitting light when the individual light-emitting elements are controlled to be lighted independently. Can do. Moreover, if the light transmitting piece expands due to heat, stress may be generated between the light transmitting pieces and the light transmitting pieces may be broken. However, since the light transmitting pieces 10 are separated from each other, the stress is absorbed by the gap. can do. As a result, it is possible to effectively prevent peeling of the translucent piece or generation of cracks such as a light shielding film, and to ensure long-term reliability.

Embodiment 2
The manufacturing method and the light emitting device of the light emitting device of this embodiment are substantially the same as the manufacturing method and the light emitting device of the light emitting device of Embodiment 1, except that the light transmitting plate is cut in two directions.

First, as shown in FIG. 3A, a translucent plate 20b is prepared.
Then, as shown in FIG. 3B, a first light shielding film 21 having a DBR structure is formed on the surface of the light transmitting plate 20b to form a first light shielding film-attached member 20a. For example, the width (the length of one side in the horizontal direction in FIG. 3B) of the first light shielding film member 20a in this case is about 200 μm.
Next, as shown in FIG. 3C, the first light shielding film-attached member 20a is joined via the soluble adhesive layer 27 made of polyimide resin so that the first light shielding films 21 face each other, for example, The first joined body 28 is formed by laminating the four first light shielding film-attached members 20a.

After that, as shown in FIG. 3D, the first joined body 28 is first cut perpendicularly to the laminated surface of the first light shielding film-attached member 20a to obtain an intermediate 22a. In this embodiment, FIG. 3D shows the intermediate 22a, but the intermediate 22a of FIG. 3D can also be used as a light distribution member.
Further, as shown in FIG. 4A, with respect to the light distribution member 22a that has been thinned, the first light shielding film-attached member is again in the direction perpendicular to the laminated surface of the first light shielding film-attached member 20a. In the laminated surface of 20a, it cut | disconnects in the direction orthogonal to the 1st cutting | disconnection mentioned above.
By performing cutting in such two directions, a plurality of light distribution members 22 having a desired shape can be manufactured as shown in FIG.

  As described above, when cutting is performed in two directions, it is preferable that the depth of the light transmitting plate 20b is large as shown in FIG.

  Thereafter, the light emitting device in which the light emitting elements are arranged in a row can be obtained by performing the same processes as in Embodiment 1 such as the arrangement of the light emitting elements, the arrangement of the reflecting members, and the separation of the light transmitting pieces.

  According to such a manufacturing method, the light distribution member provided with the same effect as Embodiment 1 can be manufactured collectively. That is, it is possible to manufacture a large amount of light distribution members that can prevent light leakage of adjacent light emitting elements by a highly accurate and simple method.

Embodiment 3
[Preparation of light distribution members]
In this embodiment, the light distribution member 22a shown in FIG. 3 (d) is further processed.
That is, as shown in FIG. 5A, the second light-shielding film 31 having the DBR structure is formed on the surface of the obtained light distribution member 22a, similarly to the formation of the first light-shielding film 21, and the second A member 22c with a light shielding film is formed.
Next, as shown in FIG. 5B, the second light shielding film-attached member 22c is joined via the soluble adhesive layer 37 made of polyimide resin so that the second light shielding films 31 face each other, for example, A second joined body 38 is formed by laminating four members 22c with the second light shielding film.

Subsequently, as shown in FIG. 5C, the second joined body 38 is cut perpendicularly to the laminated surface of the second light shielding film-coated member 22c to form the light distribution member 32a.
Thereafter, the obtained light distribution member 32a is optionally polished and / or cut to produce a light distribution member 32aa having a desired shape, for example, as shown in FIG. 5c. In this light distribution member 32aa, a plurality of light transmitting pieces 20 are arranged in a matrix.

According to such a manufacturing method, the light distribution member provided with the same effect as Embodiment 2 can be manufactured. That is, it is possible to manufacture a large amount of light distribution members that can prevent light leakage of adjacent light emitting elements by a highly accurate and simple method.
In addition, you may cut | disconnect the obtained light distribution member 32aa arbitrarily, in order to adjust the number of translucent members.

[Arrangement of light emitting elements]
As shown in FIG. 6A, a plurality of light emitting elements 13 are arranged in a matrix corresponding to the light distribution member 32 obtained by arbitrarily cutting the light distribution member 32aa.
The arrangement of the light emitting elements 13 at this time can be performed in the same manner as in the first and second embodiments. Further, the reflecting member 14 is formed and the light transmitting piece 20 is separated by the same method as in the first embodiment. Accordingly, the light emitting elements 13 fixed to the support substrate 15 are provided with the light transmitting pieces 20 that are spaced apart from each other by forming a gap in a portion (between the light transmitting pieces) where the soluble adhesive layer 17 was present. The light emitting device 36 can be obtained.

A light-emitting device obtained by such a manufacturing method includes a support substrate 15, a plurality of light-emitting elements 13 spaced apart from each other on the support substrate, and a phosphor, and is provided in each of the plurality of light-emitting elements. The translucent piece 20, the first light shielding film 21 and the second light shielding film 31 provided on the side surface of the translucent piece 20, and the reflecting member 14 filled between the light emitting elements 13. A gap is formed between the light shielding films. That is, adjacent light shielding films are separated from each other.
Even in such a light emitting device, the same effects as those of the first and second embodiments can be obtained.

Embodiment 4
As shown in FIG. 7A and FIG. 7B, the light emitting device 46 according to the present embodiment has the smallest light transmitting piece arranged in one light distribution member in the light distribution member 42. The translucent piece 41a having the highest concentration, the smallest size, the translucent piece 41b having the second highest phosphor concentration, and the translucent piece 41c having the second smallest size and the highest phosphor concentration. The light emitting device substantially includes a light transmitting piece 41d having the largest size and the second highest phosphor concentration and a light transmitting piece 41e having the largest size and the lowest phosphor concentration. The configuration is the same as 36. Therefore, the reflecting member 14 is provided from the side surface of the light emitting element to the side surface of the light distribution member 42.

  As shown in FIG. 7B, the second embodiment is different from the first and second embodiments in that two light emitting elements 13 are provided for the light transmitting pieces 41 d and 41 e having the largest size. By doing so, the entire light emitting device can emit light uniformly.

Such a light distribution member 42 is manufactured by using a light distribution plate having different thicknesses in the first embodiment to manufacture a light distribution member in which light transmission pieces are arranged in a row in a plurality of times, and in this example, three or more times. It can manufacture by combining the light distribution member obtained by this.
Even in such a light emitting device, the same effects as those of the first and second embodiments can be obtained. Moreover, when using the light distribution member of such a form, it can be set as the light-emitting device of the characteristic corresponding to various applications, such as a vehicle headlight, for example.

  A light distribution member manufacturing method and a light emitting device manufacturing method according to an embodiment of the present invention include: a light source for various display devices; a light source for illumination; a light source for indicators; a vehicle lamp; a light source for display; It can be used for manufacturing various light sources such as in-vehicle parts and signboard channel letters.

DESCRIPTION OF SYMBOLS 10, 20 Translucent piece 10a, 20a 1st light shielding film member 10b, 20b Light transmission board 11, 21 1st light shielding film 12, 22a, 22, 32a, 32, 42 Light distribution member 13 Light emitting element 14 Reflective member 15 Support Substrate 16, 36, 46 Light-emitting device 17, 27, 37 Soluble adhesive layer 18, 28 First joined body 19 End face 22c Second light shielding film member 31 Second light shielding film 38 Second joined body 41a, 41b, 41c, 41d, 41e Translucent piece

Claims (14)

Preparing a light distribution member having a plurality of translucent pieces containing a phosphor and a soluble adhesive layer provided between the plurality of translucent pieces;
A plurality of light emitting elements are arranged separately on each translucent piece fractionated by the soluble adhesive layer,
The manufacturing method of the light-emitting device including the process of melt | dissolving the said soluble adhesive layer with a solvent, and separating the said translucent piece, respectively. In the step of preparing the light distribution member, a light shielding film is provided between the light transmitting piece and the soluble adhesive layer,
After the step of providing the plurality of light emitting elements separately and before the step of separating the light transmitting pieces,
The method for manufacturing a light emitting device according to claim 1, wherein a reflective member made of a material different from that of the soluble adhesive layer is disposed between the light emitting elements.   The method for manufacturing a light emitting device according to claim 2, wherein the translucent pieces fractionated by the soluble adhesive layer are arranged in a line, and the plurality of light emitting elements are arranged in a line.   The method for manufacturing a light-emitting device according to claim 2, wherein the translucent pieces fractionated by the soluble adhesive layer are arranged in a matrix and the plurality of light-emitting elements are arranged in a matrix. The method for manufacturing a light emitting device according to claim 2, wherein in the step of preparing the light distribution member, the light transmitting piece is formed in a rectangular parallelepiped shape.   The method for manufacturing a light emitting device according to claim 2, wherein in the step of arranging the reflecting member, the reflecting member is arranged so as to be in contact with the light transmitting piece and the light shielding film.   The method for manufacturing a light emitting device according to claim 2, wherein the reflecting member is formed of a reflective resin.   In the step of disposing the plurality of light emitting elements, the light transmitting piece and the light emitting element are joined and disposed by a light transmitting adhesive layer made of a material different from the soluble adhesive layer. The manufacturing method of the light-emitting device as described in any one of these.   The method for manufacturing a light emitting device according to claim 8, wherein the translucent adhesive layer and the reflective member include the same material. A support substrate;
A plurality of light emitting elements provided separately from each other on the support substrate;
A light-transmitting piece containing a phosphor and provided on each of the plurality of light-emitting elements;
A light-shielding film provided only on the side surface between the adjacent light-transmitting pieces;
A reflective member that is filled between the light emitting elements and covers all of the side surfaces of the translucent piece that is not provided with the light shielding film ,
A light emitting device in which a gap is formed between the light shielding films.   The light emitting device according to claim 10, wherein the plurality of translucent pieces are arranged in a matrix.   The light emitting device according to claim 10 or 11, wherein the plurality of translucent pieces have a rectangular parallelepiped shape.   The light emitting device according to claim 10, wherein the shortest distance between the light shielding films is 1 μm or more and 1000 μm or less. The light-emitting device according to claim 10, wherein the light-shielding film has a single-layer or multilayer structure of a dielectric multilayer film or a metal film.