JP6721033B2 - Method for manufacturing light emitting device - Google Patents

Description

The present invention relates to a translucent member, a manufacturing method thereof, a light emitting device and a manufacturing method thereof.

2. Description of the Related Art In recent years, light emitting diodes have been used in various forms in general lighting fields, in-vehicle lighting fields, etc. as their quality has improved.
For example, as a light emitting device, a light emitting device in which a circuit board is integrated has been proposed, and further miniaturization and thinning have been achieved.
Further, by using a light-emitting diode that realizes high output and high brightness in combination with various color conversion materials, chromaticity and color reproducibility are improved (Patent Documents 1 to 4).

JP, 2012-119407, A Special table 2012-527742 gazette JP, 2013-197279, A WO2008/044759

However, it has become difficult to achieve both chromaticity and color reproducibility while realizing miniaturization and thinning in recent years, when the chances of using a color conversion material having weak resistance tend to increase.
The present invention provides a light-transmitting member, a method for manufacturing the same, a light-emitting device, and a method for manufacturing the same, which realizes better chromaticity and color reproducibility by a simple method while maintaining miniaturization and thinning. With the goal.

This application includes the following inventions.
(1) a light reflecting sheet having a through hole,
A translucent member comprising a color conversion material layer made of a color conversion material and a cured translucent resin in the through hole.
(2) Prepare the (a) sheet,
(B) forming through holes in the sheet,
(C) The sheet has a light reflecting function,
(D) A translucent resin containing a color conversion material is filled in the through holes and cured to form a color conversion material layer. (e) The sheet for each through hole or for each of a plurality of through hole groups. A method for manufacturing a light-transmissive member, the method including cutting.
(3) (A) The translucent member manufactured by the above method is fixed on the light emitting element so that the color conversion material layer is disposed on the light emitting element,
(B) A method for manufacturing a light emitting device, which comprises coating the side surface of the light emitting element with a light reflecting member.
(4) A light emitting element,
A light-transmissive member disposed on the light-emitting element,
A light emitting device comprising a light reflecting member covering the side surface of the light emitting element,
The translucent member includes a light reflective sheet having a through hole, and a color conversion material layer made of a color conversion material and a cured translucent resin in the through hole,
A light emitting device, wherein the color conversion material layer is fixed on the light emitting element so as to be disposed on the light emitting element.

According to the present invention, it is possible to realize even better chromaticity and color reproducibility by a simple method while maintaining miniaturization and thinning.

It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the translucent member of this invention. It is a schematic plan view which shows one Embodiment of the translucent member of this invention. It is a schematic plan view which shows another embodiment of the translucent member of this invention. FIG. 3B is a cross-sectional view taken along line X-X′ of the translucent member of FIG. 2B. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the translucent member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the translucent member of this invention. It is a schematic plan view which shows another embodiment of the translucent member of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows one Embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the translucent member of this invention. It is a schematic plan view which shows another embodiment of the translucent member of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light-emitting device of this invention. It is a schematic sectional drawing which shows one Embodiment of the light emitting element or light emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light emitting element or light emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light emitting element or light emitting device of this invention. It is a schematic sectional drawing which shows another embodiment of the light emitting element or light emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing-process figure which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing process side view which shows another embodiment of the manufacturing method of the light-emitting device of this invention. It is a manufacturing process side view which shows another embodiment of the manufacturing method of the light-emitting device of this invention. FIG. 15B is a vertical side view of FIG. 15B.

In the present application, the size, positional relationship, and the like of the members illustrated in each drawing may be exaggerated for clarity of explanation. In the following description, the same names and reference numerals indicate the same or similar members, and detailed description thereof will be appropriately omitted. The contents described in one example and one embodiment can be used in other examples and other embodiments.

(Translucent member)
The translucent member of the present invention includes a sheet and a color conversion material layer. The translucent member preferably has appropriate strength and is self-supporting. Therefore, it does not have to be rigid,
It is preferable that the color conversion material layer is flexible enough to be retained without damage.
The sheet and the color conversion material layer, at least one side thereof, for example, the upper surface is flush, that is,
Both upper surfaces can be made flat without any step (see FIG. 2C). Here, "no flush" and "step" means that one of them is not positively processed to project from the other, and unevenness of about several tens of μm, preferably about ten and several μm is allowed. Intended to. This makes it possible to stabilize the dimensions of the color conversion material layer, and thus the translucent member, and to improve the assembling to other members. Further, it is possible to provide a structure in which a lens or the like can be easily formed on the upper surface of the color conversion material layer.

Alternatively, the color conversion material layer may be concave and/or convex with respect to the upper surface and/or the lower surface of the sheet (see translucent members 10A to 10H in FIG. 8). When the color conversion material layer has a concave shape, it is possible to exert an effect such as light collection. In addition, when the lower surface of the sheet is convex, the adhesiveness or the adhesiveness to the light emitting element to be applied can be improved.
When the sheet has a convex shape on the upper surface, the light extraction efficiency can be improved.

In addition to the thickness of the transparent member itself, the transparent member may have a flat shape, for example, without being positively bent or curved. Thereby, the space occupied by the transparent member itself can be minimized. Alternatively, the upper surface of the color conversion material layer may be a so-called microlens, fly-eye lens, or the like having an uneven shape in the thickness direction of the transparent member itself (see transparent member 10K in FIG. 8). This can improve the coupling efficiency with the light guide plate depending on the use of the light transmissive member, for example, when the light transmissive member is used for a backlight.

The translucent member may have one color conversion material layer on one sheet, or may have a plurality of color conversion material layers on one sheet. In the case of a single color conversion material layer, the size of the translucent member is preferably slightly larger than the size of the light emitting element to be applied, and for example, 0.1 to 200×0.1 to 200 mm can be mentioned. The size in the case of a plurality of color conversion material layers can be appropriately set according to the size, number, etc. of the color conversion material layers described later.

The outer peripheral portion of the color conversion material layer of the translucent member may be processed with a through hole or a fitting shape. When the size of the translucent member is relatively large and long, it is preferable to provide positioning and fitting shapes. As a result, it is possible to assemble or join the light emitting element and the light emitting device described later without misalignment.

(Sheet)
The sheet is a substrate that supports the color conversion material layer. This sheet has light reflectivity. The light reflectivity here means that the reflectance with respect to the light emitted from the light emitting element is 60% or more, more preferably 70%, 80% or 90% or more.
The sheet may be a light-reflective sheet having a light-reflecting property itself in the whole process of manufacturing the light-transmitting member, or may be provided with the light-reflecting property in any process of manufacturing the light-transmitting member. hand,
As a result, a light reflective sheet may be used.

The sheet is formed of a light-reflecting material, other than the light-reflecting material, for example,
It may be either a light-transmitting material or a light-absorbing material.

Examples of the light-reflecting material include metals, light-reflecting substances (for example, titanium dioxide, silicon dioxide,
Examples thereof include zinc dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (eg, yttrium oxide, gadolinium oxide), colorants and the like. Metals and light-reflecting substances are
The sheet itself may be used, or a granular material may be formed into a sheet with a binder (for example, resin).

For example, about 10 to 95% by weight, preferably about 20 to 80% by weight, of the above-mentioned light-reflecting substance in a single-layer body or a laminated body of a metal or a dielectric material, a resin, an inorganic material, glass, or a composite thereof. Examples of the sheet include a sheet containing about 30 to 70% by weight, and more preferably about 30 to 60% by weight. Further, those in which the surface of these metal or dielectric and resin sheet is coated with a metal film or a light-reflecting substance can be cited. With such a composition, it can be molded into a sheet with an appropriate shape, freely and easily. Moreover, the strength can be ensured. Furthermore, sufficient resistance can be ensured even with temperature changes during filling and curing of the translucent resin, which will be described later.

These reflective metal films include Ag, Al, Cu, Au, Pt, Pd, Rh,
Examples thereof include a single layer film or a laminated film of Ni, W, Mo, Cr, Ti, or alloys thereof. The dielectric film is not particularly limited, and examples thereof include a single layer film or a laminated film used in the field. For example, it is a laminated layer of SiO ₂ /Nb ₃ O ₅ or the like.
Examples of the base resin include thermosetting resins, thermoplastic resins, modified resins thereof, hybrid resins containing one or more of these resins, and the like. Specifically, epoxy resin, modified epoxy resin (such as silicone modified epoxy resin), silicone resin, modified silicone resin (such as epoxy modified silicone resin), hybrid silicone resin, polyimide (PI), modified polyimide resin, polyamide (PA) , Polyethylene terephthalate resin, polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF
-PET), polycyclohexane terephthalate resin, polyphthalamide (PPA), polycarbonate (PC), polyphenylene sulfide (PPS), polysulfone (P
SF), polyether sulfone (PES), modified polyphenylene ether (m-PPE)
), polyetheretherketone (PEEK), polyetherimide (PEI), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, urea resin, BT resin, polyurethane resin, polyacetal (POM), super High molecular weight polyethylene (UHPE), syndiotactic polystyrene (SPS), amorphous polyarylate (P
AR), fluororesin, unsaturated polyester and the like.
Examples of the inorganic material include a single layer film or a laminated film containing ceramics such as aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, zinc oxide, or a mixture thereof, or low temperature firing ceramics.

Examples of the translucent material include translucent materials among the above-mentioned resins, glass, dielectrics and the like. Examples of the light absorbing material include the above-mentioned ceramics, paper, fibers, pulp, carbon, dielectrics, composite materials such as glass epoxy, and the like. The light absorbing material may have a light converting function.
When the sheet is formed of these translucent materials and/or light absorptive materials, the light reflection property given in the manufacturing process of the translucent member is, for example, that the surface of the sheet and the inner surface of the through hole described later are light reflective. It is preferably coated with a material. The surface of the sheet is preferably the entire surface of the front and back surfaces and side surfaces, but at least part of the surface of the side wall of the penetrating light that faces the light emitting element and is in contact with the color conversion material layer is covered. It may not be covered.

The sheet may be made of any material, and may contain a diffusing agent or a light scattering material (barium sulfate, titanium dioxide, aluminum oxide, silicon oxide, etc.).
Further, glass cloth and fillers (glass fiber, fibrous filler such as wollastonite, inorganic filler such as carbon and silicon oxide) used in the field of BGA mounting for semiconductors in order to secure heat dissipation and strength. May be contained.

As the sheet, among others, it is preferable to use a light-reflecting sheet formed of a light-reflecting material containing a light-reflecting substance and a resin because it is easily available.
The thickness of the sheet can be appropriately set depending on the material used and the like, but is preferably a thickness that can secure appropriate strength and light reflectance. For example, several tens of μm to 1 mm
The degree is, for example, several tens μm to 500 μm is preferable, and 100 to 300 μm is more preferable.

The sheet may partially include a light emitting material in addition to the light reflecting substance and the transparent resin. In particular, when the size of the through hole of the color conversion material sheet is smaller than that of the light emitting element, there is an effect of reducing the emission of blue light from the light emitting element.

The size of the through hole in plan view is not particularly limited, and may be, for example, several hundred μm to
The size may be about several mm×several hundred μm to several mm, several hundred μ-1 mm×several hundred μ-1 mm, or a size corresponding to this area. The shape of the through hole in plan view is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a polygonal shape, and a shape similar thereto.
Above all, a quadrangle that is similar to the planar shape of the light emitting element is preferable.
The through holes may have the same shape and size in the thickness direction of the sheet, or may have different shapes and sizes from one surface to the other surface (in FIG. 8, a transparent member). 10I, 1
0J). For example, an elliptical frustum, a quadrangular frustum, etc. are mentioned.
The size and shape of the through hole correspond to the size and shape of the color conversion material layer.

When a plurality of through holes are arranged in one sheet, the distance is not particularly limited, and it is preferable that the distance is such that the sheet is not broken by the arrangement of the through holes. For example, an interval of about 0.01 to several mm can be mentioned. In addition, the arrangement may be arranged randomly, or may be arranged in a ring shape (see the light transmissive member 100A in FIG. 9), but the arrangement is regularly arranged in the row and/or column direction. Preferably (see FIGS. 1D and 2A).

(Color conversion material layer)
A color conversion material layer is formed in the through hole without voids, and the color conversion material layer is made of a color conversion material and a cured translucent resin. However, the color conversion material layer may contain the above-mentioned diffusing agent or light scattering material, glass cloth, filler, and the like.

As the color conversion material, those known in the art can be used. For example, yttrium-aluminum-garnet (YAG)-based phosphor activated with cerium, lutetium-aluminum-garnet (LAG)-based phosphor activated with cerium, and nitrogen-containing calcium aluminosilicate activated with europium and/or chromium. (CaO-Al ₂ O ₃ -S
Examples thereof include io ₂ )-based phosphor, europium-activated silicate ((Sr,Ba) ₂ SiO ₄ )-based phosphor, β-sialon phosphor, KSF-based phosphor (K ₂ SiF ₆ :Mn), and the like.
Further, it may be a crystal or a sintered body of a phosphor, a sintered body of a phosphor and an inorganic binder, or the like.
As a result, a light-emitting device that emits mixed-color light (for example, white light) of primary light and secondary light having a visible wavelength and a light-emitting device that emits secondary light having a visible wavelength when excited by primary light of ultraviolet light can be provided. it can.

The color conversion material may be, for example, a so-called nanocrystal or a light emitting substance called a quantum dot. Examples of these materials include semiconductor materials such as II-VI group, III-V group, and IV.
-VI semiconductors, specifically, ZnS, CdS, CdSe, InAgS 2, InCuS 2,
Core-shell type CdS _x Se _1-x /ZnS, GaP and other nano-sized highly dispersed particles can be mentioned. InP, InAs, InAsP, InGaP, ZnTe, ZnSeTe, ZnSnP
, ZnSnP ₂ may be used.
In this embodiment, a color conversion material having problems with respect to heat resistance, water resistance, and environmental gas resistance can be effectively used. Specifically, a color conversion material that cannot withstand heat and/or moisture during the process of assembling a light emitting device described later, for example, a KSF phosphor that is easily deteriorated by water in a dicer, a quantum dot that is weak against heating during reflow, or the like is used. , Cut the translucent member with laser etc. in advance and fix it to the light emitting element that has been made uniform in size and separated. After secondary mounting by reflow, fix the translucent member to the light emitting element on the secondary mounting substrate. By doing so, the color conversion material can be effectively used without impairing its characteristics and the like.

In particular, when the light emitting device is used for a backlight of a liquid crystal display or the like, a color conversion material that is excited by blue light and emits red light (for example, KSF-based phosphor) and a color conversion material that emits green light (for example, β-sialon phosphor). Is preferably used. As a result, the color reproduction range of the display using the light emitting device can be expanded. Among them, KSF has a sharp emission spectrum peak as compared with other red color conversion materials (for example, CASN or SCASN). Therefore, when the light is extracted through the color filter, the light in the red portion with low visibility is reduced and the light passing through the multicolor (eg, green) color filter is reduced. As a result, green and red having high color purity can be obtained, and the color reproducibility of the liquid crystal can be improved.

The color conversion material may be used in any form such as crushed, spherical, hollow or porous particle size. The color conversion material preferably has, for example, a median particle diameter of 50 μm or less, 30 μm or less, 10 μm or less, or a size corresponding thereto. The median particle size is F. S. S. S. N
o (Fisher Sub Sieve Sizer's No) refers to the particle size obtained by the air permeation method.

The color conversion material is preferably contained in an amount of about 10 to 90% by weight based on the total weight of the color conversion material layer.

The light-transmissive resin forming the color conversion material layer can be selected from the light-transmissive resins among the above-mentioned resins and used. Above all, it is preferable to select a material that causes less expansion and contraction due to curing or temperature change. When a resin is used as a constituent material of the light-reflecting sheet, it is preferable to use the same resin as the resin. As a result, the adhesion between the two can be secured, and a stable translucent member can be manufactured.

By disposing the color conversion material layer in the through hole formed in the light reflective sheet, in other words, by disposing the color conversion material layer so as to be surrounded by the sheet having the light reflective property. It is possible to provide a light transmissive member that can improve the parting property of the light emitting device with high accuracy, easily and easily (that is, the boundary between the light emitting region and the non-light emitting region is clear).
In particular, when using a color conversion material that hardly absorbs light or whose light absorption is likely to decrease in the color conversion material layer, increase the ratio of the color conversion material in the color conversion material layer or secure the amount of color conversion material. In addition, it is necessary to make the color conversion material layer relatively thick. Even if it is a translucent resin containing a relatively large amount of color conversion material, and even if it is necessary to control the film thickness in order to secure the amount of color conversion material, the above-mentioned configuration facilitates Can be obtained, a high-quality light-transmitting member can be obtained, and it can be used for manufacturing a high-quality light-emitting device.

(Functional film)
The upper surface or the lower surface of the translucent member, in particular, the upper surface or the lower surface of the color conversion material layer may be protected for the purpose of humidity resistance, corrosion resistant gas, reinforcement, or the like. Specifically, in a single layer or a laminated structure, one or more functional films having functions such as protection, moisture proof, and reinforcement may be arranged (in FIG. 8,
See translucent member 10L).
For example, the functional film only needs to have a light-transmitting property, and can be formed of the resin or the like that can form the sheet described above. A filler or the like may be added to the resin for reinforcement or the like. Specific examples include SiOx, Al ₂ O _{3 and} other films having high gas barrier properties, films such as epoxy resins, silicone-epoxy hybrid resins, fluororesins, and parylene gas barrier films.

In addition, since the translucent member, in particular, one translucent member having one color conversion material layer is extremely small, a glass plate or the like is arranged on the upper surface in order to secure its own strength. Good
A translucent resin or the like may be applied to the upper surface, and may be further processed for reinforcement.

[Manufacturing Method 1 of Translucent Member]
For the translucent member, the following steps, that is, (a) preparing a sheet,
(B) forming through holes in this sheet,
(C) The sheet has a light reflection function,
(D) The through-hole can be manufactured by including a step of filling a translucent resin containing a color conversion material and curing the resin to form a color conversion material layer. Also, optionally,
(E) a step of cutting the sheet for each through hole or for each of a plurality of through hole groups,
(F) a step of forming a functional film,
(G) Depending on the light conversion performance of the through holes including the individual color conversion material layers on the sheet, it is possible to perform the step of selecting the luminous flux or the color tone.

(A) Preparation of Sheet First, a sheet is prepared. As described above, the sheet here may be formed of a light-reflecting material, or other than the light-reflecting material, for example, a light-transmitting material or a light-absorbing material. Good.
The sheet can be formed by a method known in the field of plastic molding, such as injection molding, extrusion molding, thermoforming, compression molding and the like.

(B) Formation of Through Holes Through holes are formed in the sheet. The through holes may be formed by any method known in the art. Laser light irradiation or drawing, punching, pressing, etching, blasting and the like can be mentioned.
In particular, by processing the through hole by irradiating the laser beam, the through hole can be formed with good accuracy. The laser is a CO ₂ laser, a fundamental wave of a solid-state laser, a second harmonic wave, a third harmonic wave,
A harmonic wave or the like can be used. The wavelength is preferably infrared.
After forming the through-holes, it is preferable to remove charring and smears by washing.
Further, when the sheet is prepared in the step (a), the sheet is prepared by forming the light reflecting material, the translucent material, or the light absorbing material by using a mold having irregularities corresponding to the through holes. The formation of the through holes may be performed at the same time.

(C) Addition of light reflection function to the sheet The addition of the light reflection function to the sheet may be performed when the sheet is formed. That is, step (a)
And step (c) may be performed at the same time. In addition, a light reflecting function may be separately added to the sheet after the through holes are formed in the sheet using a material other than the light reflecting material (step (b)).

When the light reflecting function is added to the sheet simultaneously with the formation of the sheet, the sheet may be formed of the light reflecting material (second light reflecting material) as described above. For example, a method of forming a metal film or a dielectric film as a sheet, a method of forming a material containing a light-transmitting resin, an inorganic material, glass or the like containing the above-mentioned light-reflecting substance into a sheet, a metal film or a dielectric film Examples thereof include a method of coating the surface of the body film and the sheet with a metal or a light-reflecting substance.

When imparting a light reflecting function to the sheet after forming the through-holes, the inner surface of the through-holes and the surface of the sheet are, for example, known in the art such as plating, various moldings, spraying, inkjet, vapor deposition, printing, and ALD method. A method of coating a light-reflecting material using any method is mentioned. The light reflective material is preferably coated as thinly as possible. The thickness of the coating of the light reflecting material is preferably, for example, about several tens of μm or less.

In this way, due to the miniaturization of the light emitting device, even when it is difficult to physically form the reflective side wall,
A light reflecting function can be easily added to the sheet, and by utilizing this, the light from the light emitting device can be introduced or distributed to necessary portions. As a result, the utilization efficiency of light can be improved and an efficient light emitting device can be obtained.

(D) Formation of color conversion material layer A translucent resin containing a color conversion material is filled in the through holes and cured to form a color conversion material layer.
As a method of filling the translucent resin containing the color conversion material into the through hole, any method known in the art, for example, various methods such as potting, molding, printing and spraying can be used. .. In this case, it is preferable to fill the upper surface of the color conversion material layer so as to be flush with the upper surface of the sheet after the translucent resin is cured.

Curing of the translucent resin can be appropriately set depending on the type of resin used. For example,
Method of standing or leaving for a predetermined time, method of blowing cold air, method of heating (several tens to hundreds of tens degrees Celsius
), and a method of irradiating energy rays (X-rays, ultraviolet rays, visible rays, etc.) and the like.

When forming a plurality of color conversion material layers on one sheet, the same color conversion material may not be used for all the color conversion material layers, and a plurality of color conversion materials may be used. In this case, RGB can be realized by using one light transmissive member by regularly disposing each color conversion material.

(E) Cutting of Sheet When a plurality of through holes are formed in the sheet in step (a) and a plurality of color conversion material layers are formed in step (d), even if the sheet is cut after step (d) Good. The cutting of the sheet is not particularly limited, and may be cut into any shape as long as the sheet, in particular, the sheet having light reflectivity is arranged around the entire circumference of the color conversion material layer.
For cutting, a sheet cutting method known in the art, such as blade dicing, laser dicing, or cutter scribing, can be used. The cutting may be performed for each color conversion material layer so that one color conversion material layer is arranged on one sheet. For example, 0. Several μm
It may be cut into a size of about several mm.
Further, the plurality of color conversion material layer groups may be cut so that the plurality of color conversion material layers are arranged on one sheet. In this case, for example, the color conversion material layer is preferably cut every 5 to 20 pieces, more preferably every 7 to 15 pieces, and more preferably every 8 to 12 pieces. These color conversion material layers are preferably arranged in a line, for example, 0. Several μm to 5 cm
, 0. Cutting into a size of about several μm to several cm may be mentioned.

The cutting method can be appropriately selected depending on the characteristics of the color conversion material, filler and resin material used. For example, when a color conversion material that is weak against moisture is used, it is preferable to select laser dicing. Blade dicing is preferably selected when a heat-sensitive color conversion material is used. In the case of being vulnerable to both moisture and heat, the color conversion material can be prevented from being directly exposed to moisture and/or heat unless the color conversion material layer is directly cut. Further, since it is in the form of a sheet, it is possible to easily carry out additional processing of a functional film such as a protective film.

[Manufacturing Method 2 of Translucent Member]
The translucent member can also be manufactured by the following steps.
(D') A light transmissive resin containing a color conversion material is cured to form a color conversion material layer,
(A′) A resin layer having a light reflecting function is formed in a sheet shape or a laminated shape on the outer peripheral side surface of the color conversion material layer.

(D': formation of color conversion material layer)
In forming the color conversion material layer here, the material forming the color conversion material layer described above is formed in an island shape on a sheet by using various methods such as potting, printing and spraying.
In order to form the color conversion material layer in an island shape, it is possible to use a mask or the like having an opening at a portion where the color conversion material layer is formed. Also, self-alignment utilizing hydrophilicity and water repellency can be used. Only one color conversion material layer may be formed, or a plurality of color conversion material layers may be formed. When a plurality of color conversion material layers are formed, it is preferable to form the color conversion material layers separately from each other.

(A': sheet formation)
As the material forming the resin layer that is molded into a sheet shape or a laminated shape, the above-described material forming the sheet can be used. This material is melted or dissolved in a solvent to impart fluidity, and the material is molded into a sheet shape or a laminated shape so as to surround the side surface of the color conversion material layer. The side surface of the color conversion material layer herein preferably surrounds all side surfaces.
When a plurality of color conversion material layers are formed in the previous step, it is preferable to integrally form all of the outer peripheral side surfaces with respect to all or a group of color conversion material layers.

The material here is preferably the light-reflecting material described above, but as a result, it is sufficient that the resin layer can have a light-reflecting function. Therefore, for example, when a material other than the light-reflecting material is used as the material for forming the resin layer, as described above, metal or light-reflecting property is applied to the side surface of the color conversion material layer, preferably all the side surfaces. It is preferably coated with a substance or the like. Specifically, a method of coating a metal or a light-reflecting substance by using any method known in the art such as plating, spraying, vapor deposition, printing and ALD method can be mentioned.

Specifically, in the case of spraying, a silicone resin containing a high concentration of titanium dioxide is directly sprayed onto the island-shaped color conversion material layer, and then a silicone resin containing a low concentration of titanium dioxide is compression molded. Form into a sheet. An optional method is to remove the titanium dioxide-containing layer by cutting the surface coated with titanium dioxide with a grinding machine. That is,
A resin layer having a light reflecting function is formed in a laminated shape on the outer peripheral side surface of the color conversion material layer.

Except for the points described above, the steps can be performed in the same manner as the steps performed in the method 1 for manufacturing a transparent member, and any step may be added.

(F) Formation of Functional Film In the above-described method for manufacturing a translucent member, the functional film described above may be formed. These films can be formed by an ALD method, a sputtering method, an evaporation method, a CVD method, or the like.

(G) Selection of luminous flux or color tone The light conversion performance of the color conversion material layer formed in the through hole is measured. In this case, the selected translucent member can be mounted on a light emitting element that emits a specific wavelength in a sheet form or in a state where the translucent member is changed before and after the step (e). This is expected to improve the yield of the light emitting device, particularly when the luminous flux or color tone is measured in advance in the sheet state.

[Method of manufacturing light emitting device]
The light emitting device is
(A) The above translucent member is fixed on the light emitting element so that the color conversion material layer is disposed on the light emitting element,
(B) It can be formed by covering the side surface of the light emitting element with a light reflecting member.
Steps (A) and (B) are preferably performed in this order, but these steps may be performed simultaneously or in the reverse order. Further, optionally, it is preferable to mount the light emitting element on the substrate of the light emitting device before and after the step (A), particularly before the step (A). Here, one light emitting element may be mounted on one substrate, or a plurality of light emitting elements may be mounted on a plurality of substrates.
You may mount several light emitting elements on one board|substrate.
Furthermore, when mounting a plurality of light emitting elements on one substrate, optionally after the step (B),
You may perform the process isolate|separated for every light-emitting device. That is, the light emitting element whose side surface is covered with the light reflecting material, or the light emitting element and the light transmitting member may be separated into pieces.
By performing the step (B), the separation for each light emitting device, and the step (A) in this order, the load applied to the color conversion material or the like in the assembly process of the light emitting device can be minimized.
The light emitting element used here may be mounted on a substrate on which terminals are formed, as described later.

(A) Fixing Light-Transmitting Member and Light-Emitting Element The light-transmitting member formed by the method described above is fixed to the upper surface of the light-emitting element. That is, the translucent member is arranged on the light extraction surface side of the light emitting device. A part of the upper surface of the light emitting element is preferably in direct contact with the light transmitting member, and more preferably in close contact therewith.
The number of translucent members used here may be one or plural. The number of light emitting elements used here may be one or more. That is, the light emitting device manufactured by the present invention may include only one light emitting element or may include a plurality of light emitting elements. With such a configuration, the number of light emitting elements and a combination of lighting/non-lighting can be selected, and various light distributions and color tones can be controlled.

Although one light-transmitting member may be fixed to the upper surfaces of a plurality of light-emitting elements, one light-transmitting member, in particular, one color conversion material layer of one light-emitting element may be provided from the viewpoint of ensuring parting. It is preferably fixed on top. As a result, it is possible to reliably prevent light leakage in the unintended direction of the light emitting element. As a result, it is possible to further improve the parting property of each light emitting element by the simple manufacturing method described above.
When a plurality of light emitting elements are mounted on the substrate, it is preferable to collectively fix, on these light emitting elements, a light transmissive member having a plurality of color conversion material layers arranged at positions corresponding to the light emitting elements.

As the light emitting element used here, any of the light emitting elements generally used in the relevant field can be used. For example, a blue or green light emitting element uses a semiconductor layer such as ZnSe, a nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0≦X, 0≦Y, X+Y≦1), or GaP. Examples of the red light emitting element include those using a semiconductor layer such as GaAlAs or AlInGaP.
The light emitting element is usually formed by stacking a semiconductor layer on an insulating semiconductor growth substrate such as sapphire, but the semiconductor growth substrate may be finally removed.
The light emitting element may have an electrode arranged on the opposite side of the semiconductor layer, but preferably has an electrode arranged on the same side. As a result, the electrodes can be mounted on the substrate in a face-down manner. However, the light emitting element may have a face-down structure having a growth substrate, a face-down structure without a growth substrate or a vertical structure, a face-up structure having a growth substrate, a face-up structure having no growth substrate, and the like.

As the light emitting element, it is preferable to use one that is equal to or smaller than the outer edge of the color conversion material layer in plan view (FIG. 5C). Accordingly, all the light emitted from the light emitting element can be efficiently introduced into the color conversion material layer, and the light extraction of the light emitting device can be improved. However, the light emitting element in plan view may be the same as or larger than the outer edge of the color conversion material layer (substantially coincident with the outer edge) or larger. Even in this case, by covering the side surface of the light emitting element with a light reflecting member described later, it is possible to form a light emitting device having a uniform emission color and excellent alignment chromaticity and a good cutoff.

The light emitting element 14 is preferably smaller than the outer edge of the transparent member 10 (FIGS. 5C and 12A).
~ 12C). As a result, the outer edge of the translucent member can be disposed outside the outer edge of the light emitting element, and as described above, a light emitting device having a uniform emission color and excellent alignment chromaticity can be formed. The through hole of the conversion material layer may be either inversely tapered or tapered from the element side toward the light extraction surface (FIGS. 12B and 12C).
In addition, you may use a light emitting element larger than the outer edge of the transparent member in planar view. In this case, by covering the side surface of the light emitting element and the upper surface of the light emitting element (and the side surface of the translucent member) with a light reflecting member to be described later, the emission color is uniform, the alignment color temperature is excellent, and the high brightness It is possible to form a light emitting device having a good quality. It is preferable that the through holes of the color conversion material layer are inversely tapered from the element side toward the light extraction surface.

The translucent member can be fixed to the upper surface of the light emitting element by, for example, a translucent adhesive member. The adhesive member is not particularly limited as long as it can secure the above-mentioned translucency and can fix the translucent member to the light emitting element. Further, a material that is not easily deteriorated by light is preferable. For example, a silicone-based adhesive, an epoxy-based adhesive, a silicone-epoxy hybrid-based adhesive, etc. may be mentioned.

The color conversion material layer or the sheet surface can be used as the adhesive member itself. That is, the color conversion material layer or sheet itself may have adhesiveness, or the adhesiveness of the color conversion material layer or sheet may be used.
The adhesive member can be formed in a fillet shape that spreads from the outer edge of the upper surface of the light emitting element to the outer edge of the lower surface of the light transmissive member when a light emitting element having a smaller outer edge than the translucent member in plan view is used. Also,
When a light emitting element whose outer edge is larger than that of the translucent member in plan view is used, a fillet-shaped adhesive member that spreads from the outer edge of the lower surface of the light transmissive member to the outer edge of the upper surface of the light transmissive element can be formed. here,
From the viewpoint of forming a light-emitting device having a good cutoff, it is preferable to dispose the outer edge of the adhesive member inside the outer edge of the translucent member or to cover the outer edge of the adhesive member with a light reflecting member described later.

The translucent member is fitted to the structure of the light source device such as the light emitting element, the light emitting device, and the light source by utilizing the unevenness on the sheet and the processed cross section that are simultaneously processed when forming the through hole described above. Alternatively, they may be mechanically mounted on the light emitting element by partial adhesion or the like.

As described above, the light emitting element is preferably mounted on the substrate. The substrate here is not particularly limited, and may be a substrate having a so-called pair of positive and negative terminals for mounting one light emitting element, or a substrate having a wiring pattern for mounting a plurality of light emitting elements. It may be.
Any of the substrates has, for example, an insulating base material and a conductive terminal or wiring pattern formed on the surface thereof. A material for forming a base material and terminals or wiring patterns,
The shape, size and the like can be appropriately selected depending on the form of the light emitting device to be obtained.

The light emitting element may be face-up mounted by bonding the growth substrate side (the side opposite to the electrode formation side) of the light emitting element to the substrate, but it is preferably flip chip mounted on the substrate.
In the case of face-up mounting, for example, the translucent adhesive member (resin or the like) described above may be disposed on the light emitting element to embed a part of the wire and dispose the translucent member thereon. it can. Further, as will be described later, in order to increase the light extraction on the upper surface of the light emitting element, the side surface of the transparent portion of the light emitting element such as sapphire can be covered with a reflecting member in advance in step (C) before mounting the light transmitting member. The transparent portion of the element and the reflective material may be simply tapered with a transparent material.

Mounting of the light emitting element on the substrate is usually performed via a joining member. Here, as the connecting member, for example, tin-bismuth-based solder, tin-copper-based solder, tin-silver-based solder, gold-tin-based solder, Au and Sn are used.
Eutectic alloys such as alloys containing as main components, alloys containing Au and Si as main components, alloys containing Au and Ge as main components, or conductive paste such as silver, gold or palladium, bumps, AC
An anisotropic conductive material such as P or ACF, a brazing material of a low melting point metal, a conductive adhesive in which these are combined, a conductive composite adhesive and the like can be mentioned.
In the case of flip chip mounting, the electrodes of the light emitting element can be directly connected to the wiring pattern of the substrate through these materials.

When mounting a plurality of light emitting elements on one or a plurality of substrates, a plurality of translucent members may be arranged on one support before step (A), or instead of this arrangement. Thus, a translucent member including a plurality of color conversion material layers may be used.
The support is not particularly limited, and it is preferable to use a peelable adhesive tape or sheet, a temporary fixing material for semiconductors, a temporary fixing material that can be patterned, and the like. By using the support, it is possible to simultaneously mount and fix a plurality of translucent members on a plurality of light emitting elements. As a result, the manufacturing process can be simplified. Further, the manufacturing process can be simplified by using a translucent member including a plurality of color conversion material layers.
It is also possible to directly use a printed wiring board, a printed circuit board, or the like which is actually used as a light source and which is wired for lighting, mounting various components such as LEDs and ZDs.

(B) Covering with light reflecting member The side surface of the light emitting element is covered with a light reflecting member.
The light reflecting member can be formed using the above-mentioned light reflecting material. In particular, it is preferable to use a resin or an inorganic material containing a light-reflecting material because the coating is easy and simple. The resin can be selected from the above-mentioned thermosetting resins, thermoplastic resins, modified resins thereof, hybrid resins containing one or more of these resins, and the like. The inorganic material can also be selected from the above-mentioned materials. Among them, it is preferable to use a light-transmitting resin, and from the viewpoint of adhesiveness to the light-transmitting member, etc., the same material as the material forming the light-transmitting member, particularly the material forming the sheet, particularly the same resin is included. It is preferable.

The light reflecting member may be indirectly coated through a space or the like as long as it covers the side surface of the light emitting element, but it may be arranged directly, that is, in contact with the side surface of the light emitting element. preferable. By covering in this way, the light emitted from the light emitting element can be more efficiently distributed in a specific direction.
The side surface of the light emitting element to be covered may be a part, but it is preferably the entire side surface. The side surface of the light emitting element here mainly means the side surface of the semiconductor layer forming the light emitting element, but when the electrode is arranged, it may be arranged over the side surface of the electrode.

Further, as described above, since the light emitting element is usually mounted on the substrate, it is preferable to cover the side surface of the light emitting element to the surface of the substrate with the light reflecting member. Furthermore, when there is a space between the semiconductor layer and the substrate, the space may be covered (embedded) with a light reflecting member. The same material may be used or a different material may be used as the light reflecting member in all of these portions (the side surface of the semiconductor layer, the side surface of the electrode, and between the semiconductor layer and the substrate).

When the same material as the above-mentioned material forming the translucent member is used as the light reflecting member, the side surface of the light emitting element can be covered by using potting, transfer molding, compression molding, or the like. By these methods, the side surface of the light emitting device can be easily covered. In addition, the light reflecting member can be simply, reliably, and accurately arranged only below the light transmitting member. Particularly, when the step (B) is performed after the step (A), the side surface of the light emitting element may be coated so that the upper surface of the light reflecting member and the lower surface of the light transmitting member are easily and surely aligned with each other. it can.
Further, the side surface of the light emitting element and the side surface of the translucent member may be covered so that the upper surface of the light reflecting member is aligned with the upper surface of the translucent member.
As the light reflecting member, the same material (for example, the same resin) as the material forming the above-mentioned light transmitting member.
In the case of using, the plurality of light emitting elements can be simply and collectively covered with the light reflecting member on the substrate on which the plurality of light emitting elements are arranged.

As the light reflecting member, a molded body having a hollow portion corresponding to the light emitting element may be used. In this case, the molded body of the light reflecting member is arranged on the substrate in advance, and then the light emitting element to which the light transmitting member is fixed is arranged on the light reflecting member so that the electrode of the light emitting element and the wiring of the substrate are in contact with each other. You may press. As such a molded body, it is preferable to use a molded body having a height corresponding to the height of the light emitting element. Thereby, the side surface of the light emitting element can be easily covered, and the light reflecting member can be simply and surely provided only below the light transmitting member (that is, without covering the side surface of the light transmitting member). Can be placed with high precision. Further, the upper surface of the light reflecting member can be easily and surely matched with the lower surface of the light transmitting member. In this case, the step (B) can be performed before the step (A).
The molded body is preferably fixed to the above-mentioned substrate using an adhesive or the like.

When a plurality of light emitting elements are mounted on one substrate, when one light transmitting member is fixed on the plurality of light emitting elements, and when a plurality of light transmitting elements corresponding to the plurality of light emitting elements are respectively mounted on the plurality of light emitting elements. If necessary, such as when the member is fixed, after step (B), the light-transmitting member, the light-reflecting member, and/or the substrate are separated for each light-emitting element or each group of light-emitting elements. You can
It does not have to be separated. This makes it possible to obtain a light emitting device having desired orientation, brightness, size, and the like. The separation in this case can be performed by using blade dicing, laser dicing, or the like.

[Light emitting device]
The light emitting device of the present invention mainly includes a light emitting element, a light transmitting member, and a light reflecting member.
The light-transmitting member may be the one described above, and is fixed on the light-emitting element so that the color conversion material layer is arranged on the light-emitting element. The color conversion material layer is preferably in contact with, and more preferably in close contact with, a part of the upper surface of the light emitting element.
The outer edge of the light emitting element preferably coincides with the outer edge of the color conversion material layer in plan view or is arranged inside the color conversion material layer.
When one light emitting device includes a plurality of light emitting elements, a light reflecting sheet including a plurality of color conversion material layers is used as a light transmitting member, so that a plurality of light emitting elements can be formed by such a light transmitting member. It can be configured integrally.

In one light emitting device, one light emitting element may be provided, or a plurality of light emitting elements may be arranged. In the latter case, it is preferable that the translucent member includes a plurality of color conversion material layers, and the color conversion material layers are arranged at positions corresponding to the respective light emitting elements and fixed on the light emitting elements. This makes it possible to obtain a light emitting device having a good parting property. Further, the plurality of color conversion material layers may include the same color conversion material or may include different color conversion materials.

The light emitting element may or may not be mounted on a substrate on which terminals are formed. For example, in the case where one light emitting device includes a plurality of light emitting elements, the plurality of light emitting elements can be integrally configured by the substrate on which such terminals are formed.

The upper surface of the light reflecting member may be aligned with the lower surface of the transparent member, or may be aligned with the upper surface of the transparent member so as to cover the side surface of the transparent member.
Further, when one light emitting device includes a plurality of light emitting elements, the plurality of light emitting elements can be integrally configured by the light reflecting member substrate.

With such a configuration, the light emitting device can have high accuracy very easily and easily.
In particular, when using a color conversion material or the like that hardly absorbs light or easily reduces light absorption for the color conversion material layer in the translucent member, increase the ratio of the color conversion material in the color conversion material layer or It is necessary to make the color conversion material layer relatively thick in order to secure the amount of material, but even with a translucent resin containing a relatively large amount of color conversion material, the amount of color conversion material is also secured. In order to
Even if it is necessary to control the film thickness, these requirements can be easily satisfied, and a high quality light emitting device can be obtained.

The translucent member, the light emitting device, and the manufacturing method thereof according to the present invention will be described in detail below.
Embodiment 1: Translucent member and method for manufacturing the same First, as shown in FIG. 1A, a light reflecting sheet 11 is prepared.
The light-reflecting sheet 11 is made of a silicone resin and 60% by weight of TiO ₂ which is a light-reflecting substance.
Is formed into a sheet having a thickness of 200 μm.
In this light reflecting sheet 11, a plurality of substantially rectangular through holes 11a of 1.1×0.2 mm are formed in the matrix direction.

Next, as shown in FIG. 1B, in the through hole 11a, a KSF phosphor having a particle size of about 20 μm, a β-sialon phosphor having a particle size of about 12 μm, and a translucent resin (silicone resin) are contained in 18% by weight and 26%, respectively. The mixture is mixed by weight% and 56% by weight, and the obtained slurry is filled by potting and cured. The translucent resin is cured by heating it in an oven heated to 150° C. for 240 minutes. Thereby, the color conversion material layer 12 is formed. This color conversion material layer 12
Has almost no depression at the center of the through hole 11a and is substantially flush with the light reflecting sheet 11.

As shown in FIG. 1C, the light reflective sheet 11 including the color conversion material layer 12 is cut in the longitudinal direction X of the light reflective sheet, and, for example, five color conversion material layers 12 shown in FIG. 2A are arranged in the row direction. A light transmissive member 100 in which are arranged is obtained.

Further, as shown in FIG. 1D, it is also possible to form the light-transmissive member 10 having one color conversion material layer 12 shown in FIG. 2B by dividing it into individual pieces in the direction Y orthogonal to the longitudinal direction X. This translucent member 10
Is, for example, a rectangle having a top view of 1.8×0.3 mm.
The cutting here is performed by a dicer with reduced water content.

In such a translucent member 10, the upper surfaces of the sheet and the color conversion material layer are flush with each other, that is, the upper surfaces of both are flat and have no step. This makes it possible to stabilize the dimensions of the color conversion material layer, and thus the translucent member, and to improve the assembling to other members.

Modified Example 1: Light-Transmissive Member Instead of the light-transmissive member 100 shown in FIG. 2A, as shown in FIG. 9, a plurality of color conversion material layers 12X are arranged in a ring shape in one light-reflecting sheet 11X. It may be one that has been created.

Modified Example 2: Light Transmissive Member Instead of the light transmissive member 10 shown in FIGS. 2B and 2C, the light transmissive members 10A to 10H shown in FIG.
10M, the color conversion material layers 12A to 12H and 12M may be concave and/or convex with respect to the upper surface and/or the lower surface of the sheet 11, respectively. When the upper surface and/or the lower surface of the color conversion material layer is formed in a concave shape with respect to the upper surface and/or the lower surface of the sheet, it is possible to exert an effect such as light collection. Further, when the upper surface and/or the lower surface of the color conversion material layer is made to have a convex shape with respect to the upper surface and/or the lower surface of the sheet, the adhesion or the adhesiveness to the light emitting element to be applied can be improved. Furthermore, when the sheet has a convex shape on the upper surface, the light extraction efficiency can be improved.
In particular, when the upper surface and/or the lower surface of the color conversion material layer of the translucent member has a curved surface, a linear light source,
It is advantageous to use the translucent member in a large area.

Modification 3: Translucent Member As shown in the translucent members 10I and 10J of FIG. 8, the through holes 11 of the sheets 11I and 11J are used.
The shapes of aI and 11aJ may be tapered or inversely tapered from the surface to the lower surface of the sheet.

Modified Example 4: Light-Transmissive Member As shown in the light-transmissive member 10K in FIG. 8, the so-called fly-eye lens or the like in which the upper surface of the color conversion material layer 12K has an uneven shape in the thickness direction of the light-transmissive member 10K itself. Good. This can improve the coupling efficiency with the light guide plate depending on the use of the light transmissive member, for example, when the light transmissive member is used for a backlight.

Modified Example 5: Light-Transmissive Member As shown in the light-transmissive member 10L in FIG. 8, for example, a moisture-proof film may be arranged on the upper surface. Further, as shown in the translucent member 10N in FIG. 8, for example, a transparent film may be arranged on the upper surface. Thereby, when a color conversion material that easily absorbs moisture or a color conversion material that becomes fragile due to moisture absorption is used, it is possible to prevent deterioration of the characteristics of the translucent member.

Embodiment 2: Translucent member and method for manufacturing the same First, as shown in FIG. 3A, a sheet 21 made of glass epoxy prepreg and having a thickness of 200 μm is prepared.
In this sheet 21, a substantially rectangular through hole 21 a of 1.1×0.2 mm is formed by a plurality of laser processings in the matrix direction, and desmear processing is performed.

Subsequently, as shown in FIG. 3B, the sheet 21 having the through holes 21a is dipped in a primer solution containing Pd fine particles to form a seedable layer on the entire surface of the sheet, followed by electroless Ni plating and electrolysis. An Ag film is formed by Ag plating to have a thickness of about several μm. Here, the entire surface of the sheet 21 refers to all of the inner surface of the through hole 21a, the front and back surfaces and the side surfaces of the sheet 21.

Next, as shown in FIG. 3C, in the through hole 21a, a KSF phosphor having a particle size of about 20 μm, a β-sialon phosphor having a particle size of about 12 μm, and a translucent resin (silicone resin) are added at 20% by weight and 30%, respectively. The mixture is mixed at 50% by weight and 50% by weight, and the obtained slurry is filled by potting and cured. Thereby, the color conversion material layer 12 was formed. This color conversion material layer 12 is
The through hole 11a has almost no depression at the center and is substantially flush with the light reflecting sheet 21.

As shown in FIG. 3D, the light-reflecting sheet 21 including the color conversion material layer 12 is singulated in the longitudinal direction X of the light-reflecting sheet and in the direction Y orthogonal to the longitudinal direction X to obtain the color conversion material shown in FIG. Layer 12
The translucent member 20 having one is formed. A light reflection film made of Ag is formed on the front and back surfaces of the translucent member 20 and the inner surface of the through hole 21a.

Modification 6: Method for Manufacturing Light-Transmissive Member As shown in FIG. 10A, for example, the color conversion material layer 42 is formed on the sheet 40. Here, a plurality of color conversion material layers 42 are formed, and each color conversion material layer 42 is formed in an island shape with a space therebetween.
Next, as shown in FIG. 10B, a light-reflecting resin layer 4 containing 60% by weight of TiO ₂ which is a light-reflecting substance in a silicone resin so as to cover only all side surfaces of the color conversion material layer 42.
1 is formed by, for example, a compression molding method.
Then, the light transmissive member 100 can be obtained by peeling off the sheet 40.
Other than the above, it can be manufactured by a method similar to that of the transparent member of the first embodiment.
Thereby, the same effects as those of the method for manufacturing the translucent member of the first embodiment are obtained.

Modification 7: Method of Manufacturing Light-Transmissive Member After forming the color conversion material layer 42 on the sheet 40 as shown in FIG. 10A, a mask 44 is formed on the upper surface of the color conversion material layer 42 as shown in FIG. 11A. To do. The light reflection film 43 is formed on the color conversion material layer 42 through the masks 44. Here, for example, a film containing 80% by weight of TiO ₂ which is a light-reflecting substance is formed on the silicone resin by a spray method.
After that, as shown in FIG. 11B, the light reflecting film 43 formed on the mask 44 is formed together with the mask 44.
Are removed by blasting or the like to expose the upper surface of the color conversion material layer 42.
As shown in FIG. 11C, the color conversion material layer 42 covers the side surface of the color conversion material layer 42.
In the meantime, a light-reflecting resin layer 41 containing 30% by weight of TiO ₂ which is a light-reflecting substance in a silicone resin is formed.
Subsequently, the light transmissive member 100B can be obtained by peeling off the sheet 40. Here, in the translucent member 100</b>B, the light reflection film 43 is also arranged on all side surfaces of the color conversion material layer 42 and on one surface of the light reflective resin layer 41 between the color conversion material layers 42.
Except for the points described above, the light-transmitting member according to the first embodiment and the modified example 7 can be manufactured by the same method.
Thereby, the same effects as those of the method for manufacturing the translucent member according to the first embodiment and the modified example 7 are obtained.

Embodiment 3: Light-Emitting Device and Manufacturing Method Thereof First, as shown in FIG. 5A, the light-emitting element 14 is mounted on a substrate 16 by face-down mounting using solder. To do.
The light emitting element 14 has a size of, for example, 1100×200×300 μm. The outer shape of the upper surface of the light emitting element 14 is equal to or slightly smaller than the outer shape of the color conversion material layer 12 of the translucent member 10.

As shown in FIG. 5B, the transparent member 10 obtained in the first embodiment is provided on the upper surface of the light emitting element 14.
Is placed and fixed with a translucent adhesive member. In the translucent member 10, the outer edge of the color conversion material layer 12 is
The light emitting element 14 is fixed on the light emitting element 14 so as to be disposed slightly outside the outer edge of the light emitting element 14.

Next, as shown in FIG. 5C, the light reflecting member 15 is discharged below the light transmitting member 10 to cover the entire side surface of the light emitting element 14 with the light reflecting member 15 by utilizing its fluidity.
The light reflecting member 15 contains a silicone resin containing silica and titanium oxide in an amount of 2 to 2, respectively.
． It is formed by containing 5% by weight and 40 to 50% by weight.
The light reflecting member 15 is arranged only below the light transmitting member 10, and its upper surface has the upper surface thereof.
It matches the lower surface of 0. In addition, the space between the light emitting element 14 and the substrate 16 also covers the light reflecting member 15
Is covered. Thereby, the light emitted from the light emitting element 14 toward the substrate 16 can be introduced into the light transmissive member 10 not covered with the light reflecting member 15. As a result, a light emitting device with a good parting property can be obtained.

Embodiment 4: Light-Emitting Device and Manufacturing Method Therefor First, as shown in FIG. 6A, the plurality of color conversion material layers 12 shown in FIG. 2A obtained in Embodiment 1 are obtained.
A translucent member 100 including is prepared.
Next, as shown in FIG. 6B, the color conversion material layer 1 of the translucent member 100 is formed on one substrate 36.
A plurality of light emitting elements 14 are regularly arranged and mounted so as to correspond to the position 2.
Subsequently, as shown in FIG. 6C, the translucent member 100 is collectively placed on the light emitting elements 14 so that the outer edges of the respective color conversion material layers 12 are arranged outside the outer edges of the light emitting elements 14, respectively. ,
Fix all at once.
Next, as shown in FIG. 6D, between the transparent member 100 and the substrate 36, the transparent member 10
By ejecting the light reflecting member 15 below 0, all the side surfaces of each of the plurality of light emitting elements 14 are integrally covered by utilizing the fluidity thereof.
In this way, a light emitting device in which five light emitting elements are arranged in rows can be obtained.

Further, as shown in FIG. 6E, the substrate 36, the light reflecting member 15 and the light transmitting member are formed between the light emitting elements 14 using the dicer at the cutting position C so that the side surface of the light reflecting member 15 is exposed. By cutting the sheet 11 of 100, a light emitting device including one light emitting element can be obtained.

By the manufacturing method as described above, the translucent member and the light emitting device can be manufactured accurately and easily.
Further, the obtained light emitting device can surely distribute the light emitted from each light emitting element to the light extraction surface regardless of the number of light emitting elements mounted. Therefore, it is possible to obtain a light emitting device having a good parting property.

Fifth Embodiment: Light-Emitting Device and Manufacturing Method Therefor First, as shown in FIG. 7A, a plurality of light-emitting elements 14 are mounted on one substrate 36 in a regular array.
Further, as shown in FIG. 7B, on the peelable pressure-sensitive adhesive sheet as the support body 37, at the positions corresponding to the light-emitting elements 14 arranged on the substrate 36, the plurality of the plurality of light-emitting elements shown in FIG. A translucent member 20 including the color conversion material layer 12 is prepared. The color conversion material layer 12 here may contain the same color conversion material, or may contain different color conversion materials.
Subsequently, as shown in FIG. 7C, the translucent member 20 is collectively placed on the light emitting element 14 so that the outer edge of the color conversion material layer 12 is disposed outside the outer edge of the light emitting element 14, respectively. , Fix them all together.

Next, as shown in FIG. 7D, while the translucent member 20 is attached to the support 37, the light reflecting member 15 is discharged below the translucent member 20 to utilize its fluidity, All side surfaces of each of the plurality of light emitting elements 14 are integrally covered. In this case, below the translucent member 20,
The lower surface of the translucent member 20 and the upper surface of the light reflecting member 15 coincide with each other. On the side of the transparent member 20, the upper surface of the transparent member 20 and the upper surface of the light reflecting member 15 coincide with each other.

After that, as shown in FIG. 7E, the support 37 is peeled off from the translucent member 20. This allows
The support 37 serves as a mask for the light reflecting member 15, and the light reflecting member 15 can be arranged mainly below the light transmitting member 20.
Subsequently, as shown in FIG. 7F, the substrate 36 and the light reflecting member 15 are cut using a dicer at the cutting position C between the light emitting elements 14 so that the side surface of the light reflecting member 15 is exposed. ,
Obtain a light emitting device.
Other than the above, the method is substantially the same as that of the fourth embodiment.
Also in such a light emitting device, the same effect as that of the fourth embodiment can be obtained.

Embodiment 6: Light-Emitting Device and Manufacturing Method Thereof In the light-emitting device manufacturing method of this embodiment,
The side surface of the light emitting element is covered with a light reflecting member, and then cut for each light emitting device, and subsequently,
The above-mentioned translucent member is fixed on the light emitting element so that the color conversion material layer is arranged on the light emitting element.

13A to 13A to cover the side surface of the light emitting element with the light reflecting member and cut the light emitting device.
It may be performed in any of the forms shown in FIG. 13D. That is, as shown in FIG. 13A, in the light emitting element 14A formed by the semiconductor laminated body 31 laminated on the sapphire substrate as the semiconductor growth substrate, the electrode 32 is arranged on the same surface side, and the semiconductor of the light emitting element 14A is formed. The side surface of the stacked body and the surface of the semiconductor stacked body between the electrodes may be covered with the light reflecting member 33.
As shown in FIG. 13B, the light emitting device 1 including the semiconductor stacked body 34 in which the sapphire substrate is removed after the semiconductor stacked body is formed on the sapphire substrate which is the semiconductor growth substrate.
4B, the electrode 32 may be arranged on the same surface side, and the light emitting element 14B may be reinforced with the reinforcing material 36a. The reinforcing material 36a preferably has light reflectivity. As shown in FIG. 13C, regardless of the presence or absence of a sapphire substrate which is a semiconductor growth substrate, in a light emitting element 14C constituted by a semiconductor laminated body, electrodes 32 are arranged on the same surface side and a substrate 36 having terminals is provided. It is mounted by face-up, the electrode 32 of the light emitting element 14C is connected to the terminal of the substrate 36 by the wire 35, and the side surface of the semiconductor laminated body of the light emitting element 14C is covered with the light reflecting member 33. Good. As shown in FIG. 13D, regardless of the presence or absence of a sapphire substrate which is a semiconductor growth substrate, in the light emitting device 14D formed by the semiconductor laminated body, the electrodes 32 are not arranged on the same surface side but are arranged on different surface sides respectively. And has a vertical structure mounted on a substrate 36 having terminals, one electrode 32 of the light emitting element 14C is connected to the terminal of the substrate 36 by a wire 35, and the other electrode is connected to a terminal of the substrate 36 by soldering, The side surface of the semiconductor laminated body may be covered with the light reflecting member 33.

For example, as shown in FIG. 14A, a plurality of light emitting elements 14A each including a light reflecting member 33 and divided into individual light emitting devices are mounted on a mounting substrate 50 of an actually used light source device such as a linear light source. To join. In this case, for example, the light emitting element 14A is joined so as to be a top view type so as to emit light in the direction of the arrow.
Then, as shown in FIG. 14B, the translucent member 100 having the plurality of color conversion material layers 12 is
As shown in FIG. 14C, the color conversion material layers 12 are fixed so as to be respectively arranged on the light emitting elements 14A by an adhesive member or fitting. This makes it possible to obtain a light emitting device in which a plurality of light emitting elements 14A are arranged.
Subsequently, the mounting substrate 50 and the sheet 11 of the transparent member 100 may be cut between the light emitting elements 14A using a dicer or the like to obtain a light emitting device including one light emitting element.

As described above, by fixing the translucent member after the secondary mounting of the light emitting element, it is possible to avoid thermal history of mounting the element and curing the resin in the assembly process. Also, thermal history such as solder reflow at the time of secondary mounting can be avoided.

Modified Example 8: Method of Manufacturing Light Emitting Device In this modified example, as shown in FIG. 15A, for example, the light emitting element 14A is joined so as to be a side-view type so as to emit light in the direction of the arrow.
After that, as shown in FIGS. 15B and 15C, the translucent member 100 having the plurality of color conversion material layers 12 is arranged by an adhesive member so that the color conversion material layers 12 are arranged on the light emitting surface of the light emitting element 14A. The mounting substrate 50 is fixed substantially vertically. This makes it possible to obtain a light emitting device in which a plurality of light emitting elements 14A are arranged.

The method for manufacturing a translucent member and the method for manufacturing a light emitting device according to the present invention include a light source for various display devices, a light source for illumination, a light source for various indicators, a light source for vehicles, a light source for displays, a light source for liquid crystal backlights, a traffic light, and a vehicle. It can be used to manufacture various light sources such as parts and channel letters for billboards.

10, 10A to 10N, 20, 100, 100A, 100B Light transmissive member 11, 11I, 11J Light reflective sheet 11a, 11aI, 11aJ, 21a Through hole 12, 12I, 12J, 12K, 42 Color conversion material layer 13 Light reflection Membrane 14, 14A to 14D Light emitting element 15 Light reflection member 16, 36 Substrate 17 Moisture-proof film 18 Second film 21 Sheet 31 Semiconductor laminate 32 laminated on sapphire substrate 32 Electrode 33 Light reflection member 34 Semiconductor laminate 35 Wire 36a Reinforcement Material 37 Support 40 Sheet 41 Light Reflective Resin Layer 43 Light Reflective Film 44 Mask 50 Mounting Substrate

Claims (11)

(A) and the light reflective sheet comprising a have a plurality of through-holes resin material, are respectively disposed the through hole, and made of a translucent resin containing a color conversion material, a plurality having an uneven shape on the upper surface Of the color conversion material layer, a light-transmitting member is arranged at a position corresponding to each of the plurality of color conversion material layers, and the color conversion material layer and the light-emitting element are fixed. ,
(B) A side surface of each light emitting element is covered with a light reflecting member containing the same resin material as the light reflecting sheet ,
(C) looking contains that perform in this order to cut the light reflecting member and the light reflecting sheet,
A method for manufacturing a light emitting device, the outer surface of which is formed by the light reflecting sheet and the light reflecting member . In the step (A), using the light emitting element which is equal to or smaller than the outer edge of the color conversion material layer in plan view,
The light emitting element is arranged in the color conversion material layer such that an outer edge of the light emitting element matches an outer edge of the color conversion material layer or is located inside the outer edge of the color conversion material layer. A method for manufacturing the light-emitting device described. The method for manufacturing a light emitting device according to claim 1, wherein in the step (B), the upper surface of the light reflecting member is aligned with the lower surface of the light transmitting member. In the step (A), the translucent member is
(A) Prepare the sheet,
(B) forming through holes in the sheet,
(C) The sheet has a light reflecting function,
(D) The through hole is filled with a light-transmissive resin containing a color conversion material and cured to form a color conversion material layer, which is prepared. Method for manufacturing light emitting device. The method for manufacturing a light-emitting device according to claim 4, wherein in step (d), the color conversion material layer is formed so that the upper surface of the cured light-transmissive resin is flush with at least one surface of the sheet. The method for manufacturing a light-emitting device according to claim 4, wherein steps (a) and (c) are performed simultaneously to prepare a sheet formed of the first light-reflecting material. In the step (c), the manufacturing method of a light-emitting device according to claim 4 or 5 coats the surface and the through hole inner surface of the sheet by the second light reflective material. The method for manufacturing a light emitting device according to claim 7, wherein in the step (c), the surface of the sheet and the inner surface of the through hole are coated with a metal or a light reflective material by plating, spraying or inkjet. Forming a plurality of through holes in the sheet in the step (b),
The method for manufacturing a light emitting device according to claim 4, further comprising a step of protecting the color conversion material layer from humidity and corrosive gas after the step (d). In the step (A), the translucent member is
(D') A light transmissive resin containing a color conversion material is cured to form a color conversion material layer,
(A') The method for manufacturing a light emitting device according to claim 1, wherein the color conversion material layer is prepared by molding a resin layer having a light reflecting function on the outer peripheral side surface of the color conversion material layer. In the step (d′), a plurality of color conversion material layers are formed so as to be separated from each other,
The method for manufacturing a light emitting device according to claim 10, wherein in the step (a′), a resin layer having a light reflecting function is integrally formed on the outer peripheral side surfaces of the plurality of color conversion material layers.