JP6458978B2 - 積層板 - Google Patents
積層板 Download PDFInfo
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- JP6458978B2 JP6458978B2 JP2014085254A JP2014085254A JP6458978B2 JP 6458978 B2 JP6458978 B2 JP 6458978B2 JP 2014085254 A JP2014085254 A JP 2014085254A JP 2014085254 A JP2014085254 A JP 2014085254A JP 6458978 B2 JP6458978 B2 JP 6458978B2
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- wiring
- resin layer
- resin
- wiring board
- layer
- Prior art date
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- 239000010410 layer Substances 0.000 claims description 75
- 229920005989 resin Polymers 0.000 claims description 65
- 239000011347 resin Substances 0.000 claims description 65
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 18
- 239000002657 fibrous material Substances 0.000 claims description 13
- 239000012792 core layer Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 3
- 238000012545 processing Methods 0.000 description 30
- 230000000052 comparative effect Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 239000000758 substrate Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Images
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- Laminated Bodies (AREA)
Description
1.樹脂層とめっきによって形成された金属層を有する積層板であり、樹脂層の25℃から260℃の範囲での平均熱膨張係数が4×10−6/℃以下であり、樹脂層の厚さが120μm以下であり、かつ樹脂層の樹脂分率が70%以下である、コア層に用いる、めっき配線形成用積層板。
2.樹脂層に繊維材料を含む、項1に記載のめっき配線形成用積層板。
3.繊維材料がガラス繊維材料である、項2に記載のめっき配線形成用積層板。
4.繊維材料が有機繊維材料である、項2に記載のめっき配線形成用積層板。
温度計、攪拌装置、還流冷却管の付いた加熱及び冷却可能な容積3リットルの反応容器に、ビスフェノールA型シアネート樹脂(ハンツマン社製、商品名:AroCy B−10(「AroCy」は、登録商標。))を500.0gと、下記一般式(1)に示すシロキサン樹脂(信越化学工業株式会社製、商品名:X−22−1821、水酸基当量;1600)を500.0gと、トルエンを1000g配合し、撹拌しながら昇温した。120℃に到達した後、ナフテン酸亜鉛の8質量%ミネラルスピリット溶液を0.01g添加し、約115〜125℃で4時間還流反応を行った後、室温に冷却し、熱硬化性樹脂の溶液を得た。
Claims (4)
- 樹脂層とめっきによって形成された金属層を有する積層板であり、樹脂層の25℃から260℃の範囲での平均熱膨張係数が4×10−6/℃以下であり、樹脂層の厚さが120μm以下であり、かつ樹脂層の樹脂分率が70%以下である、コア層に用いる、めっき配線形成用積層板。
- 樹脂層に繊維材料を含む、請求項1に記載のめっき配線形成用積層板。
- 繊維材料がガラス繊維材料である、請求項2に記載のめっき配線形成用積層板。
- 繊維材料が有機繊維材料である、請求項2に記載のめっき配線形成用積層板。
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---|---|---|---|
JP2014085254A JP6458978B2 (ja) | 2014-04-17 | 2014-04-17 | 積層板 |
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---|---|---|---|
JP2014085254A JP6458978B2 (ja) | 2014-04-17 | 2014-04-17 | 積層板 |
Publications (2)
Publication Number | Publication Date |
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JP2015205397A JP2015205397A (ja) | 2015-11-19 |
JP6458978B2 true JP6458978B2 (ja) | 2019-01-30 |
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JP2014085254A Active JP6458978B2 (ja) | 2014-04-17 | 2014-04-17 | 積層板 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109923947B (zh) * | 2016-11-09 | 2022-04-05 | 昭和电工材料株式会社 | 印刷线路板及半导体封装体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007211182A (ja) * | 2006-02-10 | 2007-08-23 | Kyocera Chemical Corp | 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 |
CN103189418B (zh) * | 2010-08-06 | 2015-08-12 | 日立化成株式会社 | 相容性树脂的制造方法、热固化性树脂组合物、预浸料及层叠板 |
JP6065845B2 (ja) * | 2012-01-31 | 2017-01-25 | 三菱瓦斯化学株式会社 | プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板 |
JP6163804B2 (ja) * | 2012-03-14 | 2017-07-19 | 日立化成株式会社 | 相容化樹脂の製造法、熱硬化性樹脂組成物、プリプレグ及び積層板 |
JP6221620B2 (ja) * | 2013-10-22 | 2017-11-01 | 住友ベークライト株式会社 | 金属張積層板、プリント配線基板、および半導体装置 |
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- 2014-04-17 JP JP2014085254A patent/JP6458978B2/ja active Active
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