JP6445283B2 - 窒化ガリウム結晶の製造方法 - Google Patents
窒化ガリウム結晶の製造方法 Download PDFInfo
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- JP6445283B2 JP6445283B2 JP2014179571A JP2014179571A JP6445283B2 JP 6445283 B2 JP6445283 B2 JP 6445283B2 JP 2014179571 A JP2014179571 A JP 2014179571A JP 2014179571 A JP2014179571 A JP 2014179571A JP 6445283 B2 JP6445283 B2 JP 6445283B2
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- 229910002601 GaN Inorganic materials 0.000 title claims description 185
- 239000013078 crystal Substances 0.000 title claims description 182
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 147
- 238000004519 manufacturing process Methods 0.000 title claims description 56
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 100
- 229910052751 metal Inorganic materials 0.000 claims description 87
- 239000002184 metal Substances 0.000 claims description 87
- 238000006243 chemical reaction Methods 0.000 claims description 84
- 229910001337 iron nitride Inorganic materials 0.000 claims description 80
- 239000000155 melt Substances 0.000 claims description 68
- 229910052733 gallium Inorganic materials 0.000 claims description 61
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 44
- 238000010438 heat treatment Methods 0.000 claims description 32
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 13
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 74
- 239000000758 substrate Substances 0.000 description 62
- 229910052757 nitrogen Inorganic materials 0.000 description 26
- 229910001873 dinitrogen Inorganic materials 0.000 description 24
- 239000007789 gas Substances 0.000 description 20
- 239000007788 liquid Substances 0.000 description 18
- 238000002441 X-ray diffraction Methods 0.000 description 17
- 229910052594 sapphire Inorganic materials 0.000 description 15
- 239000010980 sapphire Substances 0.000 description 15
- 238000005187 foaming Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000001228 spectrum Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 238000007716 flux method Methods 0.000 description 8
- 229910001195 gallium oxide Inorganic materials 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 7
- 238000000746 purification Methods 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 125000004433 nitrogen atom Chemical group N* 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007858 starting material Substances 0.000 description 5
- 238000002411 thermogravimetry Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000013068 control sample Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 150000004767 nitrides Chemical group 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- IDBFBDSKYCUNPW-UHFFFAOYSA-N lithium nitride Chemical compound [Li]N([Li])[Li] IDBFBDSKYCUNPW-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- -1 nitrogen ions Chemical class 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
- C30B19/04—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/0632—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with gallium, indium or thallium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B17/00—Single-crystal growth onto a seed which remains in the melt during growth, e.g. Nacken-Kyropoulos method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B9/00—Single-crystal growth from melt solutions using molten solvents
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B9/00—Single-crystal growth from melt solutions using molten solvents
- C30B9/04—Single-crystal growth from melt solutions using molten solvents by cooling of the solution
- C30B9/06—Single-crystal growth from melt solutions using molten solvents by cooling of the solution using as solvent a component of the crystal composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
まず、図1および図2を参照して、本発明の第1の実施形態に係る窒化ガリウム結晶の製造方法について説明する。
図2に示すように、反応装置100は、電気炉102内に管状炉104を有し、管状炉104の長手方向の中央部が灼熱ゾーン106となっている。また、管状炉104の内部(例えば、灼熱ゾーン106)には、窒化ホウ素等で形成された耐熱性を有する反応容器108が収容される。
本実施形態では、反応材料として、金属ガリウムおよび窒化鉄を使用する。
加熱工程では、金属ガリウムおよび窒化鉄を上述の反応装置100の反応容器108に入れ、該反応容器108を管状炉104内の灼熱ゾーン106に収容する。続いて、管状炉104内に窒素ガスを導入し、電気炉102にて、反応容器108に投入された金属ガリウムおよび窒化鉄を、例えば常圧下で加熱する。
上記の加熱工程にて得られた反応生成物には、通常、窒化ガリウムだけでなく、酸化ガリウム、鉄とガリウムの金属間化合物等も含まれる。そのため、精製工程により、窒化ガリウム結晶を分離精製する。
続いて、図3Aおよび図3Bを参照して、本発明の第2の実施形態に係る窒化ガリウム結晶の製造方法について説明する。
まず、本実施形態に係る窒化ガリウム結晶の製造方法にて使用する反応装置について説明する。図3Aは、本実施形態に係る窒化ガリウム結晶の製造方法にて使用する反応装置の一例を示した模式図である。
続いて、図3Bを参照して、本実施形態に係る窒化ガリウム結晶の製造方法にて使用する反応装置の変形例について説明する。図3Bは、本実施形態に係る窒化ガリウム結晶の製造方法にて使用する反応装置の変形例を示した模式図である。図3Bで示す反応装置200Bは、回転軸216の先端に結晶成長基板210Bを融液表面に対して水平に取り付けることができる点が図3Aで示す反応装置200Aと異なる。
以下、実施例を用いて本発明をより具体的に説明する。
まず、第1の実施形態に係る製造方法を用いて、金属ガリウムと一窒化四鉄とを出発原料として窒化ガリウム結晶を生成する実施例1について説明する。
次に、第1の実施形態に係る製造方法を用いて、金属ガリウムと一窒化三鉄とを出発原料として窒化ガリウム結晶を生成する実施例2について説明する。
続いて、金属ガリウムと窒化鉄との反応温度を検討するために、金属ガリウムと一窒化四鉄との混合物に対して、熱重量分析を行った実施例3について説明する。
次に、第2の実施形態に係る製造方法を用い、金属ガリウムと一窒化四鉄とを出発原料として短冊形状の結晶成長基板上に窒化ガリウム結晶膜を生成する実施例4について説明する。
続いて、第2の実施形態に係る製造方法を用い、金属ガリウムと一窒化四鉄とを出発原料として平板状の結晶成長基板上に窒化ガリウム結晶膜を生成する実施例5について説明する。
次に、金属ガリウムと窒化鉄とを加熱した際に発生する窒素ガスによる融液205の液面の隆起について検討した実施例6について説明する。
続いて、第2の実施形態に係る製造方法において、結晶成長基板を保持する保持具300を用い、融液205を撹拌することにより、複数枚の結晶成長基板に対して均一に窒化ガリウム結晶膜を生成することが可能な実施例7について説明する。
102 電気炉
104 管状炉
106 灼熱ゾーン
108 反応容器
200A、200B 反応装置
202 ヒーター
204 電気炉
205 融液
208 反応容器
210A、210B 結晶成長基板
212 ガス導入口
214 ガス排気口
216 回転軸
300 保持具
Claims (6)
- 金属ガリウムおよび窒化鉄の融液を、常圧の窒素雰囲気中で少なくとも前記金属ガリウムと前記窒化鉄とが反応する反応温度まで加熱するステップを含む、窒化ガリウム結晶の製造方法。
- 前記窒化鉄は、一窒化四鉄、一窒化三鉄、および一窒化二鉄のうち、少なくとも1つ以上を含む、請求項1に記載の窒化ガリウム結晶の製造方法。
- 前記反応温度は、500℃以上1000℃以下であり、
前記金属ガリウムおよび前記窒化鉄を前記反応温度まで加熱した後、前記金属ガリウムおよび前記窒化鉄を前記反応温度の範囲内の温度に保持するステップをさらに含む、請求項1または2に記載の窒化ガリウム結晶の製造方法。 - 前記金属ガリウムおよび前記窒化鉄は、窒化ホウ素製の坩堝を容器に用いて加熱される、請求項1〜3のいずれか一項に記載の窒化ガリウム結晶の製造方法。
- 前記金属ガリウムと前記窒化鉄中の鉄元素との合計モル数に対する前記窒化鉄中の鉄元素のモル数の割合は、0.1%以上50%以下である、請求項1〜4のいずれか一項に記載の窒化ガリウム結晶の製造方法。
- 前記反応温度をT[℃]とした場合、前記金属ガリウムと前記窒化鉄中の鉄元素との合計モル数に対する前記窒化鉄中の鉄元素のモル数の割合X[%]は、以下の数式1を満たす、請求項1〜5のいずれか一項に記載の窒化ガリウム結晶の製造方法。
X≦−1.44×10−2×T+14.4 ・・・数式1
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