JP6441874B2 - レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法 - Google Patents
レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法 Download PDFInfo
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- JP6441874B2 JP6441874B2 JP2016209925A JP2016209925A JP6441874B2 JP 6441874 B2 JP6441874 B2 JP 6441874B2 JP 2016209925 A JP2016209925 A JP 2016209925A JP 2016209925 A JP2016209925 A JP 2016209925A JP 6441874 B2 JP6441874 B2 JP 6441874B2
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2251—Oxides; Hydroxides of metals of chromium
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- Engineering & Computer Science (AREA)
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- General Chemical & Material Sciences (AREA)
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- Metallurgy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
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| US16/064,836 US20180363144A1 (en) | 2015-12-24 | 2016-12-06 | Laser direct structuring layer-forming composition, kit, and method for manufacturing resin molded article with plated layer |
| CN201680074863.0A CN108431297A (zh) | 2015-12-24 | 2016-12-06 | 激光直接成型层形成用组合物、组件、以及带镀层的树脂成型品的制造方法 |
| PCT/JP2016/086254 WO2017110458A1 (ja) | 2015-12-24 | 2016-12-06 | レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法 |
| EP16878351.2A EP3396019A4 (en) | 2015-12-24 | 2016-12-06 | COMPOSITION FOR PREPARING A LASER DIRECT STRUCTURING LAYER, KIT AND METHOD FOR PRODUCING A RESIN MOLD WITH A PLATING LAYER |
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| EP3543291A1 (en) * | 2018-03-21 | 2019-09-25 | SABIC Global Technologies B.V. | Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom |
| EP3901214A4 (en) * | 2018-12-18 | 2022-08-31 | Sumitomo Bakelite Co.Ltd. | HEAT CURING RESIN COMPOSITION FOR LDS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE |
| DE102019113973B4 (de) | 2019-05-24 | 2024-02-08 | Ensinger Gmbh | Verfahren zur Herstellung eines Formkörpers und Bauteil mit elektrischer Funktionalität |
| JP7188309B2 (ja) * | 2019-07-26 | 2022-12-13 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物及び半導体装置 |
| JP2021102728A (ja) * | 2019-12-25 | 2021-07-15 | 住友ベークライト株式会社 | Lds用熱硬化性樹脂組成物 |
| JP7562989B2 (ja) * | 2020-03-12 | 2024-10-08 | 住友ベークライト株式会社 | 電子装置 |
| KR20230046276A (ko) | 2020-07-28 | 2023-04-05 | 미쓰비시 엔지니어링-플라스틱스 코포레이션 | 수지 조성물, 성형품 및 도금이 형성된 성형품의 제조 방법 |
| EP3957685A1 (en) * | 2020-08-17 | 2022-02-23 | SHPP Global Technologies B.V. | Laser direct structuring compositions including a crystalline polyester |
| JP7657521B2 (ja) * | 2021-02-26 | 2025-04-07 | 三洋化成工業株式会社 | ブロックポリマー |
| WO2024190428A1 (ja) * | 2023-03-10 | 2024-09-19 | 旭化成株式会社 | 熱可塑性樹脂組成物、成形体及び通信機器用部品 |
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| US3226256A (en) * | 1963-01-02 | 1965-12-28 | Jr Frederick W Schneble | Method of making printed circuits |
| JP3343522B2 (ja) * | 1998-09-17 | 2002-11-11 | ポリプラスチックス株式会社 | プラスチック成形品の製造方法 |
| JP3949908B2 (ja) * | 2001-05-31 | 2007-07-25 | 三菱レイヨン株式会社 | 電気めっき部品 |
| JP2005298720A (ja) * | 2004-04-14 | 2005-10-27 | Teijin Chem Ltd | 光拡散性ポリカーボネート樹脂組成物から形成された車輌用外装成形品 |
| US20060083939A1 (en) * | 2004-10-20 | 2006-04-20 | Dunbar Meredith L | Light activatable polyimide compositions for receiving selective metalization, and methods and compositions related thereto |
| JP4641446B2 (ja) * | 2005-03-31 | 2011-03-02 | ダイセルポリマー株式会社 | 被メッキ樹脂組成物及びメッキ被覆体 |
| US7547849B2 (en) * | 2005-06-15 | 2009-06-16 | E.I. Du Pont De Nemours And Company | Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto |
| CN102242354A (zh) * | 2011-05-26 | 2011-11-16 | 深圳市泛友科技有限公司 | 选择性化学镀工艺和相应的激光涂料及其制备方法 |
| WO2014042070A1 (ja) * | 2012-09-14 | 2014-03-20 | 三菱エンジニアリングプラスチックス株式会社 | 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法 |
| CN103694697B (zh) * | 2012-09-27 | 2016-08-03 | 金发科技股份有限公司 | 一种具有选择性沉积金属的导热材料及其制备方法与应用 |
| CN106519740B (zh) * | 2012-10-26 | 2019-01-11 | 比亚迪股份有限公司 | 白色涂料组合物、绝缘基材表面选择性金属化的方法及复合制品 |
| DE102013007750A1 (de) * | 2013-05-07 | 2014-11-13 | Merck Patent Gmbh | Additiv für LDS-Kunststoffe |
| US9169390B2 (en) * | 2013-05-31 | 2015-10-27 | Sabic Global Technologies B.V. | Polycarbonate-siloxane copolymer compositions with improved appearance properties |
| JP6275482B2 (ja) * | 2013-06-03 | 2018-02-07 | 株式会社レグルス | プラスチック製成形品への回路パターンの形成方法及びこれに用いる塗工液 |
| JP5710826B2 (ja) * | 2013-07-09 | 2015-04-30 | 三菱エンジニアリングプラスチックス株式会社 | 樹脂組成物、樹脂成形品、樹脂成形品の製造方法およびレーザーダイレクトストラクチャリング添加剤 |
| KR101717753B1 (ko) * | 2013-11-29 | 2017-03-17 | 주식회사 엘지화학 | 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체 |
| EP2957661A1 (en) * | 2014-06-16 | 2015-12-23 | Wistron Neweb Corporation | Method of forming metallic pattern on polymer substrate |
| CN107001813A (zh) * | 2014-12-12 | 2017-08-01 | 沙特基础工业全球技术公司 | 激光直接结构化材料及其制备方法 |
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| JP2018141172A (ja) | 2018-09-13 |
| JP2018024812A (ja) | 2018-02-15 |
| EP3396019A1 (en) | 2018-10-31 |
| JP6622877B2 (ja) | 2019-12-18 |
| EP3396019A4 (en) | 2019-08-14 |
| US20180363144A1 (en) | 2018-12-20 |
| JP2019011514A (ja) | 2019-01-24 |
| CN108431297A (zh) | 2018-08-21 |
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