JP6435973B2 - Electrical resistance measurement probe and electrical resistance measurement system - Google Patents

Description

  The present invention relates to an electrical resistance measurement probe and an electrical resistance measurement system using the probe.

  2. Description of the Related Art In recent years, electronic devices have been improved in performance and manufacturing efficiency by using electronic circuit modules obtained by connecting electronic components to circuit boards and modularizing them. An example of such an electronic circuit module M is shown in FIG.

  In the electronic circuit module M, electronic components EC1 and EC2 constituting a circuit are connected to connection lands CL1 to CL5 formed on one main surface B1 of the circuit board B. Further, an embedded layer R for embedding the electronic components EC1 and EC2 is formed on the one main surface B1. Inside the circuit board B, a pattern conductor Pm including a grounding conductor GP and a via conductor V are provided. On the other main surface B2 of the circuit board B, a ground electrode including the first ground electrode E1 and the second ground electrode E2, and a signal electrode including the first signal electrode S1 and the second signal electrode S2 are provided. Is formed.

  On the surface of the buried layer R and the side surface of the circuit board B, a conductive film C is provided which is connected to the ground electrode via the ground conductor GP and the via conductor V and functions as a shield.

  The electronic circuit module M is shipped after measuring an electric resistance representing a conduction state between the conductive film C and the ground electrode for the inspection of the shielding performance. JP 2012-159359 A (Patent Document 1) proposes an example of such an electrical resistance measurement system.

  FIG. 12 is a schematic diagram of an electrical resistance measurement system 300 described in Patent Document 1. The electrical resistance measurement system 300 includes a measurement board MB, an electrical resistance measurement probe Pr, and a control device CU.

  The measurement board MB has a placement surface MBa on which an electronic circuit module M to be measured is placed and a measurement terminal (not shown) is provided, and is fixedly arranged on the base PD. A connection terminal MBb electrically connected to the measurement terminal is provided on the outer surface of the measurement board MB, and the connection terminal MBb and the control unit CU are electrically connected via a cable (not shown). .

  The electrical resistance measurement probe Pr is driven in the directions of arrows X, Y, and Z in FIG. 12 by the drive mechanism DU so as to come into contact with the conductive film C of the electronic circuit module M placed on the placement surface MBa. The The control unit CU includes an electrical resistance measurement probe Pr that is in contact with the conductive film C, and a grounding electrode (not shown) that is electrically connected to the conductive film C via wiring in the circuit board of the electronic circuit module M. Measure the electrical resistance between the contact terminals.

  In the electrical resistance measurement system 300, the electrical resistance between the conductive film C provided on the electronic circuit module M and the ground electrode is inspected together with other electrical characteristics of the electronic circuit module M by the above configuration. can do.

JP 2012-159359 A

  In the electrical resistance measurement system 300, the electrical resistance measurement probe Pr is also a suction nozzle for sucking and holding the electronic circuit module M when measuring the conduction state. However, the positional relationship between the electrode in contact with the conductive film C to measure the conduction state and the suction hole is not clearly shown. When the electronic circuit module M is transported from the tray to the mounting surface MBa of the measurement substrate MB, the tip of the electrical resistance measurement probe Pr is in close contact with the conductive film C, and the inside of the suction hole has a sufficient negative pressure. Need to be.

  On the other hand, if the degree of close contact between the tip of the electrical resistance measurement probe Pr and the conductive film C is reduced due to the presence of the electrode, the inside of the suction hole does not have a sufficient negative pressure, and the electronic circuit module M has an electrical resistance during transportation. There is a risk of falling from the tip of the measurement probe Pr.

  Accordingly, an object of the present invention is to provide an electrical resistance measurement probe capable of measuring the electrical resistance between the conductive film and the grounding electrode in a state where the electronic circuit module is securely adsorbed, and the electrical resistance using the probe. To provide a measurement system.

  In the present invention, since the electric resistance between the conductive film and the grounding electrode is measured in a state where the electronic circuit module is securely adsorbed, the structure of the tip of the electric resistance measuring probe is improved.

  The present invention is first directed to an electrical resistance measurement probe.

  The electrical resistance measurement probe according to the present invention is applied to an electronic component, a circuit board to which the electronic component is connected, an embedded layer in which the electronic component connected to the circuit board is embedded, and a surface of the embedded layer, In addition, the electronic circuit module including the conductive film connected to the ground electrode of the circuit board is used to measure the electrical resistance between the conductive film and the ground electrode.

  The electrical resistance measurement probe according to the present invention includes a tubular probe body having a bottom at one end, and a first electrode and a second electrode each having one main surface and the other main surface. The bottom of the probe body includes a through hole and a trapezoidal protrusion having a top surface perpendicular to the central axis in the longitudinal direction of the probe body. Moreover, the through hole is formed in the top surface of the protrusion. The first electrode and the second electrode are joined to the end surface of the bottom portion of the other main surface so that the respective one main surface is orthogonal to the longitudinal central axis of the probe body, and the protrusions are electrically connected to each other. Is electrically insulated. The one main surface of the first electrode, the one main surface of the second electrode, and the top surface of the protrusion are in the same plane.

  In the electrical resistance measurement probe described above, the one main surface of the first electrode, the one main surface of the second electrode, and the top surface of the protruding portion in which the through hole communicating with the decompression device is formed are in the same plane. is there. Therefore, the tip of the electrical resistance measurement probe and the conductive film are in close contact with each other, and a sufficient negative pressure is generated when a pressure reducing device is connected to the other end of the probe main body to reduce the pressure inside the probe main body.

  That is, when measuring the electrical resistance between the conductive film of the electronic circuit module and the grounding electrode, the electronic circuit module does not come off the tip of the electrical resistance measurement probe. Therefore, the electronic circuit module can be reliably adsorbed to the tip of the electrical resistance measurement probe, and the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  Another electrical resistance measurement probe according to the present invention is for measuring the electrical resistance between the conductive film and the grounding electrode in the electronic circuit module, similar to the electrical resistance measurement probe.

  Another electrical resistance measurement probe according to the present invention includes a tubular probe body having a bottom at one end, and a first electrode and a second electrode each having one main surface and the other main surface. The bottom is provided with a through hole. The first main electrode and the second electrode are joined to the end surface of the bottom and electrically insulated from each other such that the first main surface of each of the first electrode and the second electrode is perpendicular to the longitudinal center axis of the probe body. Has been. Either one of the first electrode and the second electrode is formed with an electrode through hole communicating with the through hole at the bottom of the probe body. The one main surface of the first electrode and the one main surface of the second electrode are in the same plane.

  In the electrical resistance measurement probe, an electrode through hole communicating with the through hole at the bottom of the probe main body is formed in one of the first electrode and the second electrode, and one main surface of the first electrode One main surface of the second electrode is in the same plane. The first electrode and the second electrode are electrically insulated by the space between them. In this case, the degree of adhesion between the tip of the electrical resistance measurement probe and the conductive film depends only on the height positions of the first electrode and the second electrode. Since the adjustment is easy, the tip of the electrical resistance measurement probe and the conductive film can be easily adhered.

  That is, a sufficient negative pressure is generated when a pressure reducing device is connected to the other end of the probe body to decompress the inside of the probe body. Therefore, the electronic circuit module can be reliably adsorbed to the tip of the electrical resistance measurement probe, and the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  Another electrical resistance measurement probe according to the present invention preferably has the following features. That is, the bottom portion of the probe body further includes a trapezoidal protrusion having a top surface orthogonal to the central axis in the longitudinal direction of the probe body. The first electrode and the second electrode are electrically insulated from each other by the protruding portion. The one main surface of the first electrode, the one main surface of the second electrode, and the top surface of the protrusion are in the same plane.

  In the electrical resistance measurement probe described above, a protrusion is interposed between the first electrode and the second electrode. That is, by using a material having a sufficiently high insulation resistance as the material constituting the probe body, the electrical insulation between the first electrode and the second electrode can be improved. The one main surface of the first electrode, the one main surface of the second electrode, and the top surface of the protruding portion are in the same plane.

  Therefore, the electronic circuit module can be reliably adsorbed to the tip of the electrical resistance measurement probe, and the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  Still another electrical resistance measurement probe according to the present invention is for measuring the electrical resistance between the conductive film and the ground electrode in the electronic circuit module, similar to the electrical resistance measurement probe. .

  Yet another electrical resistance measurement probe according to the present invention includes a tubular probe body having a bottom at one end, and a first electrode pin and a second electrode pin. The bottom is provided with a through hole. A first concave portion and a second concave portion that are provided apart from each other are formed on the end surface of the bottom portion.

  Here, the first electrode pin is installed in the first recess with the tip protruding from the end surface of the bottom, and the tip is movable forward and backward in the central axis direction in the longitudinal direction of the probe body. The second electrode pin is installed in a state of being insulated from the first electrode pin, with the tip projecting from the end surface of the bottom portion in the second recess, and the tip is in the direction of the central axis in the longitudinal direction of the probe body It is free to advance and retreat. And the front-end | tip of a 1st electrode pin, the front-end | tip of a 2nd electrode pin, and the end surface in which the 1st recessed part and 2nd recessed part of a bottom part are provided are in the same plane at the time of an electrical resistance measurement.

  In the above-described electrical resistance measurement probe, the first electrode pin is installed in the first recess with the tip protruding from the end surface of the bottom, and the tip is movable forward and backward in the central axis direction in the longitudinal direction of the probe body. It has become. Further, the second electrode pin is installed in the second recess with the tip protruding from the end surface of the bottom, and the tip is movable forward and backward in the central axis direction of the longitudinal direction of the probe body.

  Therefore, when the tip of the electrical resistance measurement probe and the conductive film are brought into contact with each other, the tips of the first electrode pin and the second electrode pin first come into contact with the conductive film. Next, the end surface of the bottom of the probe main body comes into contact with the conductive film. Therefore, the tip of the electrical resistance measurement probe and the conductive film can be brought into close contact while maintaining the contact between the tip of each electrode pin and the conductive film.

  That is, a sufficient negative pressure is generated when a pressure reducing device is connected to the other end of the probe body to decompress the inside of the probe body. Therefore, the electronic circuit module can be reliably adsorbed to the tip of the electrical resistance measurement probe, and the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  Each of the aforementioned electrical resistance measurement probes according to the present invention preferably has the following characteristics. That is, the bottom portion of the probe main body has a flange portion protruding from the outer peripheral surface of the probe main body.

  The above-described electrical resistance measurement probe has a wide ridge extending from the outer peripheral surface of the probe body. That is, when the electronic circuit module is attracted to the tip of the electrical resistance measurement probe, the electronic circuit module is supported by the heel part, so that the posture is stabilized. Therefore, the electronic circuit module can be reliably adsorbed to the tip of the electrical resistance measurement probe, and the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  The present invention is also directed to an electrical resistance measurement system.

  The electrical resistance measurement system according to the present invention measures the electrical resistance between the conductive film in the electronic circuit module described above and the grounding electrode including the first grounding electrode and the second grounding electrode. belongs to.

  The electrical resistance measurement system according to the present invention includes the aforementioned electrical resistance measurement probe according to the present invention, a measurement substrate, and an electrical resistance measurement device. The measurement board has a first upper terminal and a second upper terminal on one main surface, a first lower terminal and a second lower terminal on the other main surface, and a grounding conductor inside. doing.

  The first upper terminal and the first lower terminal are connected via a grounding conductor, and the second upper terminal and the second lower terminal are connected without passing through a grounding conductor. The electrical resistance measurement apparatus includes a first current source terminal and a second current source terminal that supply a constant current, a first voltage measurement terminal that measures a voltage drop that occurs when the constant current flows through the device under test, and A second voltage measurement terminal is provided.

  Here, the first current source terminal is connected to the second electrode or the second electrode pin of the electrical resistance measurement probe, and the second current source terminal is connected to the first lower terminal of the measurement substrate. Yes. The first voltage measurement terminal is connected to the first electrode or the first electrode pin of the electrical resistance measurement probe, and the second voltage measurement terminal is connected to the second lower terminal of the measurement board. .

  In the electrical resistance measurement system described above, the electronic circuit module measures so that the first grounding electrode and the first upper terminal are in contact with each other, and the second grounding electrode and the second upper terminal are in contact with each other. It is mounted on one main surface of the substrate. In this state, the first electrode and the second electrode are brought into contact with the conductive film, thereby forming an electric resistance measurement circuit between the conductive film and the ground electrode based on the four-terminal measurement method. The

  That is, in the electrical resistance measurement system described above, voltage measurement can be performed without being affected by the electrical resistance of the wiring used for connecting the electrical resistance measurement probe, the measurement substrate, and the electrical resistance measurement device. Therefore, the electrical resistance between the conductive film and the grounding electrode in the electronic circuit module can be measured with high accuracy.

  In the electrical resistance measurement probe according to the present invention, when measuring the electrical resistance between the conductive film of the electronic circuit module and the grounding electrode, the electronic circuit module does not come off the tip of the electrical resistance measurement probe. Therefore, the electrical resistance between the conductive film and the ground electrode can be reliably measured.

  In the electrical resistance measurement system according to the present invention, voltage measurement can be performed without being affected by the electrical resistance of the wiring used for connecting the electrical resistance measurement probe, the measurement board, and the electrical resistance measurement device. . Therefore, the electrical resistance between the conductive film and the grounding electrode in the electronic circuit module can be measured with high accuracy.

A side view, a front view, a cross-sectional view of the surface including the B1-B1 line of the front view, and an A1 of the side view of the electrical resistance measurement probe 10 which is the first embodiment of the electrical resistance measurement probe according to the present invention. It is arrow sectional drawing of the surface containing -A1 line. It is arrow sectional drawing of the surface containing the B2-B2 line | wire of a side view, a front view, and a front view of the electrical resistance measurement probe 20 which is 2nd Embodiment of the electrical resistance measurement probe which concerns on this invention. It is arrow sectional drawing of the surface containing the B3-B3 line | wire of the front view of the electrical resistance measurement probe 30 which is 3rd Embodiment of the electrical resistance measurement probe which concerns on this invention, and a front view. It is arrow sectional drawing of the surface containing the B4-B4 line | wire of the front view of the electrical resistance measurement probe 40 which is 4th Embodiment of the electrical resistance measurement probe which concerns on this invention, and a front view. It is arrow sectional drawing of the surface containing the B5-B5 line | wire of the front view of the electrical resistance measurement probe 50 which is 5th Embodiment of the electrical resistance measurement probe which concerns on this invention, and a front view. It is arrow sectional drawing of the surface containing the B6-B6 line | wire of the front view of the electrical resistance measurement probe 60 which is 6th Embodiment of the electrical resistance measurement probe which concerns on this invention, and a front view. It is arrow sectional drawing of the surface containing the B7-B7 line | wire of a side view, a front view, and a front view of the electrical resistance measurement probe 70 which is 7th Embodiment of the electrical resistance measurement probe which concerns on this invention. It is sectional drawing for demonstrating an example of measurement board | substrate MB used for the electrical resistance measurement system which concerns on this invention. 1 is a schematic diagram of an electrical resistance measurement system 100 which is a first embodiment of an electrical resistance measurement system according to the present invention. It is a schematic diagram of the electrical resistance measurement system 200 which is 2nd Embodiment of the electrical resistance measurement system which concerns on this invention. 4 is a cross-sectional view for explaining an example of an electronic circuit module M. FIG. It is a schematic diagram of the electrical resistance measurement system 300 of background art.

  Embodiments of the present invention will be described below to describe the features of the present invention in more detail.

-First Embodiment of Electrical Resistance Measurement Probe-
An electrical resistance measurement probe 10 which is a first embodiment of an electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 10 is for measuring the electrical resistance between the conductive film C and the ground electrode of the electronic circuit module M as shown in FIG. 11 as an example.

  FIG. 1A is a side view of the electrical resistance measurement probe 10. In FIG. 1A, a through-hole 1b described later is seen through. FIG. 1B is a front view of the electrical resistance measurement probe 10. FIG. 1C is a cross-sectional view of the electrical resistance measurement probe 10 taken along the arrow line of the plane including the B1-B1 line of FIG. FIG. 1D is a cross-sectional view of the electric resistance measurement probe 10 taken along the arrow line of the surface including the A1-A1 line of FIG.

  The electrical resistance measurement probe 10 includes a tubular probe body 1, a first electrode 2a having one main surface 2a1 and the other main surface 2a2, and a second electrode 2b having one main surface 2b1 and the other main surface 2b2. Including. The probe body 1 is made of a material having a sufficiently high insulation resistance and strength, such as polyether ether ketone, for example, and has a bottom portion 1a at one end and a decompression device (not shown) connected to the other end.

  The bottom 1a of the probe main body 1 has a through-hole 1b and a top surface tp orthogonal to the central axis ax in the longitudinal direction of the probe main body 1, and a trapezoidal protrusion 1c provided on the diameter of the bottom 1a. I have. Moreover, the through-hole 1b is formed in the top surface tp of the protrusion part 1c. Therefore, the electronic circuit module M is attracted to the top surface tp of the protrusion 1c.

  In FIG. 1, the through hole 1 b is provided at the center of the protruding portion 1 c so that the central axis thereof is the same as the central axis ax in the longitudinal direction of the probe main body 1. On the other hand, the central axis of the through hole 1b and the central axis ax in the longitudinal direction of the probe body 1 may be shifted. That is, the through hole 1b may be formed at any position as long as it is formed on the top surface tp of the projecting portion 1c so as not to cause air leakage during decompression.

  The first electrode 2a and the second electrode 2b have a flat plate shape, and each other main surface is joined to the end surface of the bottom 1a of the probe body 1 so that each one main surface is orthogonal to the central axis ax. And are electrically insulated from each other by the protruding portion 1c. In FIG. 1, the first electrode 2a and the second electrode 2b are arcuate in the same area. On the other hand, the shape of the 1st electrode 2a and the 2nd electrode 2b is not restricted to this, It can be set as arbitrary shapes.

  Each of the first electrode 2a and the second electrode 2b is provided with a terminal for attaching a wiring necessary for connection to an electrical resistance measuring device to be described later, but the illustration is omitted in FIG. Yes. The one main surface 2a1 of the first electrode 2a, the one main surface 2b1 of the second electrode 2b, and the top surface tp of the protruding portion 1c are in the same plane.

  Therefore, the tip of the electrical resistance measurement probe 10 and the conductive film C of the electronic circuit module M are in close contact. That is, when a decompression device (not shown) is connected to the other end of the probe body 1 and the inside of the probe body 1 is decompressed, the electronic circuit module M is attracted and held at the tip of the electrical resistance measurement probe 10 with a sufficient negative pressure. The Therefore, the electronic circuit module M does not come off from the tip of the electric resistance measurement probe 10, and the electric resistance between the conductive film C and the ground electrode can be reliably measured.

  In FIG. 1, the projecting portion 1 c extends in the diameter direction of the probe main body 1 and is formed so that the end in the longitudinal direction reaches the outer peripheral surface of the probe main body 1. On the other hand, the end in the longitudinal direction of the projecting portion 1c does not reach the outer peripheral surface of the tubular probe body 1, and a space exists between a part between the first electrode 2a and the second electrode 2b. May be. That is, the one main surface 2a1 of the first electrode 2a, the one main surface 2b1 of the second electrode 2b, and the top surface tp of the protruding portion 1c must be in the same plane, and air leakage during decompression must occur. For example, the shape of the protrusion 1c is not limited.

-Second Embodiment of Electrical Resistance Measuring Probe-
An electrical resistance measurement probe 20 which is a second embodiment of the electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 20 is for measuring electrical resistance similar to the electrical resistance measurement probe 10 shown in FIG. 1, but is characterized by the shape of the bottom 1 a of the probe body 1. Description of other parts common to the electrical resistance measurement probe 10 is omitted.

  FIG. 2A is a side view of the electrical resistance measurement probe 20. In FIG. 2A, the through hole 1b is seen through. FIG. 2B is a front view of the electrical resistance measurement probe 20. FIG. 2C is a cross-sectional view of the surface of the electrical resistance measurement probe 20 including the B2-B2 line in FIG.

  In the electrical resistance measurement probe 20, the bottom 1 a of the probe main body 1 has a flange 1 d that protrudes from the outer peripheral surface of the probe main body 1. In FIG. 2, the first electrode 2 a and the second electrode 2 b are joined to the end surface of the bottom 1 a of the probe main body 1 so as to cover the flange 1 d other than the portion where the protruding portion 1 c is formed. . In addition, the 1st electrode 2a and the 2nd electrode 2b should just be joined to the end surface of the bottom part 1a so that at least one part of the collar part 1d may be coat | covered.

  Therefore, when the electronic circuit module M is attracted to the tip of the electrical resistance measurement probe 20, the electronic circuit module M is supported by the flange portion 1d, so that the posture is stabilized. Therefore, the electrical resistance between the conductive film C and the grounding electrode can be measured more reliably.

  In FIG. 2, the protruding portion 1c extends in the diameter direction of the probe main body 1, and is formed so that the end portion in the longitudinal direction reaches the outer peripheral surface of the flange portion 1d. On the other hand, as in the first embodiment, the end portion of the protruding portion 1c in the longitudinal direction does not reach the outer peripheral surface of the flange portion 1d, and a part between the first electrode 2a and the second electrode 2b. There may be a space.

-Third embodiment of the electrical resistance measurement probe-
An electrical resistance measurement probe 30 as a third embodiment of the electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 30 is for measuring the electrical resistance similar to the electrical resistance measurement probe 20 shown in FIG. 2, but is characterized by the form of the bottom 1 a of the probe body 1. Description of other parts common to the electrical resistance measurement probe 20 is omitted.

  FIG. 3A is a front view of the electrical resistance measurement probe 30. FIG. 3B is an arrow cross-sectional view of the surface of the electrical resistance measurement probe 30 including the B3-B3 line in FIG.

  In the electrical resistance measurement probe 30, each of the first main electrode 2 a and the second electrode 2 b has the other main surface of the probe main body so that the one main surface is orthogonal to the central axis ax in the longitudinal direction of the probe main body 1. 1 are joined to the end face of the bottom 1a and electrically insulated from each other. In FIG. 3, the first electrode 2a and the second electrode 2b are arcuate with different areas, and the first electrode 2a has a larger area than the second electrode 2b.

  Here, the bottom portion 1a of the probe body 1 has a through hole 1b, but does not have a protruding portion 1c, and the first electrode 2a and the second electrode 2b are between them. It is insulated by the space G. In addition, an electrode through hole 2ab communicating with the through hole 1b is formed in the first electrode 2a. That is, the electronic circuit module M is attracted to the first electrode 2a. The one main surface 2a1 of the first electrode 2a and the one main surface 2b1 of the second electrode 2b are in the same plane.

  For this reason, the degree of adhesion between the tip of the electrical resistance measurement probe 30 and the conductive film C depends only on the height positions of the first electrode 2a and the second electrode 2b, and takes into account the height position of the protruding portion 1c. There is no need. Since the height position can be easily adjusted with only each electrode, the tip of the electrical resistance measurement probe 30 and the conductive film C can be easily brought into close contact with each other. Therefore, the electrical resistance between the conductive film C and the ground electrode can be reliably measured.

-Fourth Embodiment of Electrical Resistance Measuring Probe-
An electrical resistance measurement probe 40, which is a fourth embodiment of the electrical resistance measurement probe according to the present invention, will be described with reference to FIG. The electrical resistance measurement probe 40 is for measuring the electrical resistance similar to that of the electrical resistance measurement probe 20 shown in FIG. 2. However, the configuration of the bottom 1 a of the probe main body 1, the first electrode 2 a, The second electrode 2b has a feature. Description of other parts common to the electrical resistance measurement probe 20 is omitted.

  FIG. 4A is a front view of the electrical resistance measurement probe 40. FIG. 4B is a cross-sectional view of the electric resistance measurement probe 40 as viewed from the direction of the plane including the line B4-B4 of FIG.

  In the electrical resistance measurement probe 40, the first electrode 2a and the second electrode 2b are flat, but are not concentric like the electrical resistance measurement probe 10, but are concentric rings. Here, the bottom 1a of the probe main body 1 has the through hole 1b as in the electrical resistance measurement probe 30, but does not have the protruding portion 1c, and the first electrode 2a and the second electrode 2b. Is insulated by a space G between them. Further, in FIG. 4, a hole h is formed in which one end reaches the second electrode 2b and the other end reaches the outer peripheral surface of the flange 1d. This hole h is for passing wiring necessary for connection to an electrical resistance measuring apparatus to be described later.

  The second electrode 2b is formed with an electrode through hole 2bb that communicates with the through hole 1b of the bottom 1a of the probe body 1 and is concentric with the first electrode 2a and the second electrode 2b. That is, the electronic circuit module M is attracted to the second electrode 2b. The one main surface 2a1 of the first electrode 2a and the one main surface 2b1 of the second electrode 2b are in the same plane.

  Therefore, similarly to the electrical resistance measurement probe 30, the tip of the electrical resistance measurement probe 40 and the conductive film C can be easily adhered. Therefore, the electrical resistance between the conductive film C and the ground electrode can be reliably measured. Further, since the electrode through hole 2bb of the electrical resistance measurement probe 40 is positioned at the center of the second electrode 2b, the processing is easy.

-Fifth Embodiment of Electrical Resistance Measuring Probe-
An electrical resistance measurement probe 50 which is a fifth embodiment of the electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 50 has the same first electrode 2a and second electrode 2b as the electrical resistance measurement probe 30 shown in FIG. 3, but is characterized by the form of the bottom 1a of the probe body 1. Description of other parts common to the electrical resistance measurement probe 30 is omitted.

  FIG. 5A is a front view of the electrical resistance measurement probe 50. FIG. 5B is a cross-sectional view of the electric resistance measurement probe 50 taken along the arrow line of the surface including the B5-B5 line in FIG.

  In the electrical resistance measurement probe 50, the bottom 1a of the probe main body 1 has a through hole 1b and a top surface tp perpendicular to the central axis ax in the longitudinal direction of the probe main body 1, and is shifted from the diameter of the bottom 1a. It has a trapezoidal protrusion 1c provided on a certain string. That is, the through hole 1b is not formed on the top surface tp of the protruding portion 1c. The one main surface 2a1 of the first electrode 2a, the one main surface 2b1 of the second electrode 2b, and the top surface tp of the protruding portion 1c are in the same plane.

  Therefore, the electrical insulation between the first electrode 2a and the second electrode 2b can be improved by using a material having a sufficiently high insulation resistance as the material constituting the probe body 1. As in the electrical resistance measurement probe 30 shown in FIG. 3, the tip of the electrical resistance measurement probe 30 and the conductive film C of the electronic circuit module M are in close contact. Therefore, the electrical resistance between the conductive film C and the ground electrode can be reliably measured.

-Sixth Embodiment of Electrical Resistance Measuring Probe-
An electrical resistance measurement probe 60 which is a sixth embodiment of the electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 60 has the same first electrode 2a and second electrode 2b as the electrical resistance measurement probe 40 shown in FIG. 4, but is characterized by the form of the bottom 1a of the probe body 1. Description of other parts common to the electrical resistance measurement probe 40 is omitted.

  FIG. 6A is a front view of the electrical resistance measurement probe 60. FIG. 6B is a cross-sectional view of the electric resistance measurement probe 60 taken along the arrow line of the surface including the B6-B6 line of FIG.

  In the electrical resistance measurement probe 60, the bottom 1a of the probe body 1 has a through hole 1b and a top surface tp orthogonal to the longitudinal central axis ax of the probe body 1, and the first electrode 2a and the second electrode It has an annular and trapezoidal protrusion 1c concentric with 2b. The one main surface 2a1 of the first electrode 2a, the one main surface 2b1 of the second electrode 2b, and the top surface tp of the protruding portion 1c are in the same plane.

  Therefore, the electrical insulation between the first electrode 2a and the second electrode 2b can be improved by using a material having a sufficiently high insulation resistance as the material constituting the probe body 1. Then, similarly to the electrical resistance measurement probe 40 shown in FIG. 4, the tip of the electrical resistance measurement probe 40 and the conductive film C of the electronic circuit module M are in close contact with each other. Therefore, the electrical resistance between the conductive film C and the ground electrode can be reliably measured.

-Seventh embodiment of the electrical resistance measurement probe-
An electrical resistance measurement probe 70 which is a seventh embodiment of the electrical resistance measurement probe according to the present invention will be described with reference to FIG. The electrical resistance measurement probe 70 is for measuring the electrical resistance similar to the electrical resistance measurement probe 20 shown in FIG. 2, but the form of the bottom 1 a of the probe body 1, the first electrode 2 a and the first electrode The second electrode 2b has a feature. Description of other parts common to the electrical resistance measurement probe 20 is omitted.

  FIG. 7A is a side view of the electrical resistance measurement probe 70. In FIG. 7A, the through hole 1b is seen through. FIG. 7B is a front view of the electrical resistance measurement probe 70. FIG. 7C is an arrow cross-sectional view of the surface including the B7-B7 line of FIG.

  In the electrical resistance measurement probe 70, the first electrode 2a is a first electrode pin, and the second electrode 2b is a second electrode pin. In FIG. 7, the columnar first concave portion 3 a and the first concave portion 3 a are provided on the end surface of the bottom portion 1 a of the probe body 1 so as to be separated from each other so that the longitudinal direction is parallel to the central axis ax of the probe body 1. Two recesses 3b are formed. However, the 1st recessed part 3a and the 2nd recessed part 3b are not limited to said shape. In FIG. 7, the bottom 1a of the probe body 1 has a flange 1d, and the first recess 3a and the second recess 3b are symmetrically located with respect to the central axis ax of the flange 1d. Is formed.

  Further, the flange 1d is formed with a hole h1 having one end reaching the bottom surface of the first recess 3a and the other end reaching the outer surface where the first recess 3a of the bottom 1a is not provided. Furthermore, a hole h2 is formed in which one end reaches the bottom surface of the second recess 3b and the other end reaches the outer surface where the second recess 3b of the bottom 1a is not provided. The holes h1 and h2 are for passing wirings necessary for connection to an electrical resistance measuring device to be described later.

  The first electrode pin includes a rigid body portion 2as and an elastic portion 2ae, and the distal end (the distal end of the rigid body portion 2as) protrudes from the end surface of the bottom portion 1a of the probe body 1 into the first recess 3a. is set up. The distal end of the first electrode pin is movable forward and backward in the direction of the central axis ax in the longitudinal direction of the probe main body 1 due to the displacement of the elastic portion 2ae. The second electrode pin includes a rigid portion 2bs and an elastic portion 2be, and the tip (the tip of the rigid portion 2bs) is in the first recess 3a while being insulated from the first electrode pin. The probe body 1 is installed in a state protruding from the end surface of the bottom 1a. Then, like the first electrode pin, the tip of the second electrode pin is movable forward and backward in the direction of the central axis ax in the longitudinal direction of the probe body 1 by the displacement of the elastic portion 2be.

  When the tip of the electrical resistance measurement probe 70 is brought into contact with the conductive film C, the tips of the first electrode pin and the second electrode pin first come into contact with the conductive film C. Next, the elastic portion 2ae and the elastic portion 2be are displaced, and the end face of the bottom portion 1a of the probe body 1 is made of the conductive film while the tip of the first electrode pin and the tip of the second electrode pin are in contact with the conductive film C. Contact C. That is, the end surfaces of the first electrode pins, the second electrode pins, and the end surfaces of the bottom 1a of the probe main body 1 where the first recesses 3a and the second recesses 3b are provided are measured during electrical resistance measurement. In the same plane.

  Therefore, like the electrical resistance measurement probe described so far, the tip of the electrical resistance measurement probe 70 and the conductive film C of the electronic circuit module M are in close contact with each other. Therefore, the electrical resistance between the conductive film C and the ground electrode can be reliably measured.

-First Embodiment of Electrical Resistance Measurement System-
An electrical resistance measurement system 100 that is a first embodiment of the electrical resistance measurement system according to the present invention will be described with reference to FIGS. 8 and 9. The electrical resistance measurement system 100 is for measuring the electrical resistance between the conductive film C and the ground electrode of the electronic circuit module M as shown in FIG. 11 as an example.

  FIG. 8 is a cross-sectional view of an example of the measurement substrate MB used in the electrical resistance measurement system 100. The measurement board MB has a first upper terminal UE1 and a second upper terminal UE2 on one main surface, a first lower terminal LE1 and a second lower terminal LE2 on the other main surface, and inside It has a grounding conductor GL. The first upper terminal UE1 and the first lower terminal LE1 are connected by the via conductor V via the grounding conductor GL. On the other hand, the second upper terminal UE2 and the second lower terminal LE2 are connected by the via conductor V without passing through the grounding conductor GL.

  Further, a first connection terminal MBb1 connected to the third upper terminal UE3 by a pattern conductor (not shown) provided on one main surface is provided on one side surface of the measurement substrate MB. Furthermore, a second connection terminal MBb2 connected to the fourth upper terminal UE4 by a pattern conductor (not shown) is provided on the other side opposite to the one side of the measurement substrate MB.

  FIG. 9 is a schematic diagram of the electrical resistance measurement system 100. The electrical resistance measurement system 100 includes the electrical resistance measurement probe 20 shown in FIG. 2, the measurement board MB shown in FIG. 8, and the electrical resistance measurement device MM. The electrical resistance measurement device MM has a first current source terminal MI1 and a second current source terminal MI2, and a first voltage measurement terminal MV1 and a second voltage measurement terminal MV2. Each current source terminal is a terminal for supplying a constant current to the device under test. Each voltage measuring terminal is a terminal for measuring a voltage drop generated when a constant current flows through the device under test.

  The first current source terminal MI1 is connected to the second electrode 2b of the electrical resistance measurement probe 20, and the second current source terminal MI2 is connected to the first lower terminal LE1 of the measurement substrate MB. The first voltage measurement terminal MV1 is connected to the first electrode 2a of the electrical resistance measurement probe 20, and the second voltage measurement terminal MV2 is connected to the second lower terminal LE2 of the measurement board MB. .

  The electrical resistance measurement system 100 includes a high frequency characteristic measurement device NA in addition to the above-described components. The high-frequency characteristic measuring device NA has a first high-frequency characteristic measuring terminal NT1 and a second high-frequency characteristic measuring terminal NT2. The first high frequency characteristic measurement terminal NT1 is connected to the first connection terminal MBb1 of the measurement substrate MB. The second high frequency characteristic measurement terminal NT2 is connected to the second connection terminal MBb2 of the measurement board MB.

  Next, an outline of measurement of electric resistance between the conductive film C and the ground electrode in the electronic circuit module M by the electric resistance measurement system 100 will be described.

  The plurality of electronic circuit modules M are prepared in a state where they are arranged, for example, on a chip tray (not shown). The electronic circuit module M is sucked and held by the electrical resistance measurement probe 20 and placed on one main surface of the measurement substrate MB. As described above, the one main surface 2a1 of the first electrode 2a of the electrical resistance measurement probe 20, the one main surface 2b1 of the second electrode 2b, and the top surface tp of the protruding portion 1c are in the same plane.

  That is, there is no air leakage from the tip of the electrical resistance measurement probe 20 during decompression, and the electronic circuit module M does not come off from the tip of the electrical resistance measurement probe 20. Therefore, the electronic circuit module M is reliably conveyed from the chip tray to the measurement substrate MB, and the conductive film C and the grounding electrode are grounded with the first electrode 2a and the second electrode 2b and the conductive film C in close contact with each other. The electrical resistance between the electrodes is measured.

  When the electronic circuit module M is placed on one main surface of the measurement board MB, the measurement board MB is brought into contact with the first grounding electrode E1 and the first upper terminal UE1, and the second grounding board. The electrode E2 and the second upper terminal UE2 are configured to contact each other. In this state, the first electrode 2a and the second electrode 2b are brought into contact with the conductive film C to measure the electrical resistance between the conductive film C and the grounding electrode based on the four-terminal measurement method. A circuit is formed.

  In other words, in the electrical resistance measurement system 100, it is possible to perform a voltage drop measurement by the object to be measured with respect to a constant current without being affected by the electrical resistance of the wiring used for connecting each component. Therefore, the electrical resistance between the conductive film C and the ground electrode in the electronic circuit module M can be measured with high accuracy.

  Note that when the electronic circuit module M is placed on one main surface of the measurement substrate MB, the measurement signal MB contacts the first signal electrode S1 and the third upper terminal UE3, and the second signal The electrode S2 and the fourth upper terminal UE4 are also configured to contact each other.

  As described above, the first high frequency characteristic measurement terminal NT1 is connected to the first connection terminal MBb1 of the measurement board MB, and the second high frequency characteristic measurement terminal NT2 is the second connection terminal of the measurement board MB. It is connected to MBb2. That is, when the electronic circuit module M is placed on one main surface of the measurement substrate MB, the high-frequency characteristics can be measured by the high-frequency characteristic measuring device NA. Therefore, the electrical resistance measurement system 100 can simultaneously measure the electrical resistance between the conductive film C and the ground electrode in the electronic circuit module M and measure the high frequency characteristics.

-Second Embodiment of Electrical Resistance Measurement System-
An electrical resistance measurement system 200 that is a second embodiment of the electrical resistance measurement system according to the present invention will be described with reference to FIG. The electrical resistance measurement system 200 includes an electrical resistance measurement probe 70 as a component. Description of other parts common to the electrical resistance measurement system 100 is omitted.

  In the electrical resistance measurement probe 70, the first electrode 2a is a first electrode pin, and the second electrode 2b is a second electrode pin. As described above, the tips of the first electrode pin and the second electrode pin can be advanced and retracted in the direction of the central axis ax in the longitudinal direction of the probe main body 1 by the displacement of the elastic portion provided in each.

  When the electronic circuit module M is sucked and held by the electrical resistance measurement probe 70, the tips of the first electrode pins and the second electrode pins first contact the conductive film C. Next, each elastic portion is displaced, and the end surface of the bottom 1a of the probe body 1 is in contact with the conductive film C while the tip of the first electrode pin and the tip of the second electrode pin are in contact with the conductive film C. To do.

  That is, there is no air leak from the tip of the electrical resistance measurement probe 70 during decompression, and the electronic circuit module M does not come off from the tip of the electrical resistance measurement probe 70. Therefore, the electronic circuit module M is reliably conveyed from the chip tray to the measurement substrate MB, and the conductive film C and the grounding electrode are in contact with the first electrode pin and the second electrode pin and the conductive film C. The electrical resistance between is measured. Therefore, the electrical resistance measurement system 200, like the electrical resistance measurement system 100, accurately measures the electrical resistance between the conductive film C and the ground electrode in the electronic circuit module M based on the four-terminal measurement method. Can be done.

  In addition, this invention is not limited to said embodiment, A various application and deformation | transformation can be added within the scope of this invention. In addition, it is pointed out that each embodiment described in this specification is an exemplification, and a partial replacement or combination of configurations is possible between different embodiments.

10, 20, 30, 40, 50, 60, 70 Electrical resistance measurement probe 1 Probe body 1a Bottom 1b Through hole 1c Projection 2a First electrode 2a1 One main surface 2a1 of the first electrode The other main of the first electrode Surface 2ab Electrode through hole 2as of first electrode Rigid body portion 2ae of first electrode pin Elastic portion 2b of first electrode pin Second electrode 2b1 One main surface 2b2 of second electrode The other main of second electrode Surface 2bb Electrode through-hole 2bs of second electrode Rigid body portion 2be of second electrode pin Elastic portion ax of second electrode pin Center axis tp of probe main body Top surface 100, 200 of projecting portion Electrical resistance measurement system MB Measurement board GL Grounding conductor UE1 First upper terminal UE2 Second upper terminal LE1 First lower terminal LE2 Second lower terminal MM Electrical resistance measuring device MI1 First current source terminal MI2 Second current source terminal V1 first voltage measurement terminal MV2 second voltage measurement terminal M electronic circuit module B circuit board B1 one main surface B2 of the circuit board other main surface C of the circuit board conductive film E1 first grounding electrode E2 second Grounding electrode R buried layer

Claims (6)

An electronic component, a circuit board to which the electronic component is connected, an embedded layer in which the electronic component connected to the circuit board is embedded, and a grounding of the circuit board that is applied to a surface of the embedded layer An electrical resistance measurement probe for measuring electrical resistance between the conductive film and the ground electrode of an electronic circuit module comprising a conductive film connected to the electrode for use,
A tubular probe body having a bottom at one end;
A first electrode and a second electrode each having one main surface and the other main surface;
Including
The bottom portion includes a through hole and a trapezoidal protrusion having a top surface orthogonal to the central axis in the longitudinal direction of the probe body,
The through hole is formed on the top surface of the protrusion,
Each of the first and second electrodes is joined to the end surface of the bottom so that each one principal surface is orthogonal to the longitudinal central axis of the probe body, and Are electrically isolated from each other by the protrusions,
The electrical resistance measurement probe according to claim 1, wherein one main surface of the first electrode, one main surface of the second electrode, and a top surface of the protruding portion are in the same plane. An electronic component, a circuit board to which the electronic component is connected, an embedded layer in which the electronic component connected to the circuit board is embedded, and a grounding of the circuit board that is applied to a surface of the embedded layer An electrical resistance measurement probe for measuring electrical resistance between the conductive film and the ground electrode of an electronic circuit module comprising a conductive film connected to the electrode for use,
A tubular probe body having a bottom at one end;
A first electrode and a second electrode each having one main surface and the other main surface;
Including
The bottom includes a through hole;
The first electrode and the second electrode are electrically connected to each other such that the other main surface is joined to the end surface of the bottom so that the one main surface is orthogonal to the central axis of the probe body. Is insulated,
In either one of the first electrode and the second electrode, an electrode through hole communicating with the through hole is formed,
The electrical resistance measurement probe according to claim 1, wherein one main surface of the first electrode and one main surface of the second electrode are in the same plane. The bottom portion further includes a trapezoidal protrusion having a top surface orthogonal to the central axis of the probe body,
The first electrode and the second electrode are electrically insulated from each other by the protrusion;
The electrical resistance measurement probe according to claim 2, wherein one main surface of the first electrode, one main surface of the second electrode, and a top surface of the protruding portion are in the same plane. . An electronic component, a circuit board to which the electronic component is connected, an embedded layer in which the electronic component connected to the circuit board is embedded, and a grounding of the circuit board that is applied to a surface of the embedded layer An electrical resistance measurement probe for measuring electrical resistance between the conductive film and the ground electrode of an electronic circuit module comprising a conductive film connected to the electrode for use,
A tubular probe body having a bottom at one end;
A first electrode pin and a second electrode pin;
Including
The bottom includes a through hole;
The end surface of the bottom is formed with a first recess and a second recess that are provided apart from each other,
The first electrode pin is installed in the first recess with the tip protruding from the end surface of the bottom, and the tip is movable in the longitudinal central axis direction of the probe body, The second electrode pin is installed in a state of being insulated from the first electrode pin, the tip of the second electrode pin protruding from the end surface of the bottom portion, and the tip of the second electrode pin in the longitudinal direction of the probe body. Can move forward and backward in the central axis direction of
The tip of the first electrode pin, the tip of the second electrode pin, and the end surface of the bottom where the first and second recesses are provided are in the same plane when measuring the electrical resistance. An electrical resistance measurement probe according to claim 1.   5. The electrical resistance measurement probe according to claim 1, wherein the bottom portion has a flange portion protruding from an outer peripheral surface of the probe main body. 6. An electronic component, a circuit board to which the electronic component is connected, an embedded layer in which the electronic component connected to the circuit board is embedded, and a grounding of the circuit board that is applied to a surface of the embedded layer An electrical resistance measurement system for measuring electrical resistance between the conductive film and the grounding electrode of an electronic circuit module including a conductive film connected to the electrode for use,
The electrical resistance measurement probe according to any one of claims 1 to 5,
A measurement board;
An electrical resistance measuring device;
Including
The measurement board has a first upper terminal and a second upper terminal on one main surface, a first lower terminal and a second lower terminal on the other main surface, and a grounding conductor inside. Have
The first upper terminal and the first lower terminal are connected via the grounding conductor, and the second upper terminal and the second lower terminal are not connected via the grounding conductor. Connected,
The electrical resistance measuring device includes a first current source terminal and a second current source terminal for supplying a constant current, and a first voltage measurement for measuring a voltage drop generated when the constant current flows through the device under test. A terminal and a second voltage measuring terminal;
The first current source terminal is connected to the second electrode or the second electrode pin of the electrical resistance measurement probe, and the second current source terminal is the first lower terminal of the measurement substrate. The first voltage measurement terminal is connected to the first electrode or the first electrode pin of the electrical resistance measurement probe, and the second voltage measurement terminal is connected to the first electrode of the measurement board. 2 is connected to the lower terminal of
The electronic circuit module is arranged on one side of the measurement substrate so that the first grounding electrode and the first upper terminal are in contact with each other, and the second grounding electrode and the second upper terminal are in contact with each other. The conductive film and the grounding electrode based on a four-terminal measurement method, placed on the main surface and in contact with the first electrode and the second electrode, and the conductive film. An electrical resistance measurement system, wherein a circuit for measuring electrical resistance is formed.

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