JP6423418B2 - Ｌｄｓプラスチック用添加剤 - Google Patents

Ｌｄｓプラスチック用添加剤 Download PDF

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Publication number
JP6423418B2
JP6423418B2 JP2016512243A JP2016512243A JP6423418B2 JP 6423418 B2 JP6423418 B2 JP 6423418B2 JP 2016512243 A JP2016512243 A JP 2016512243A JP 2016512243 A JP2016512243 A JP 2016512243A JP 6423418 B2 JP6423418 B2 JP 6423418B2
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JP
Japan
Prior art keywords
core
composite pigment
coating
lds
polymer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016512243A
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English (en)
Japanese (ja)
Other versions
JP2016520139A5 (zh
JP2016520139A (ja
Inventor
ヘルゲ ベティーナ ニース、
ヘルゲ ベティーナ ニース、
ウルリッヒ クイットマン、
ウルリッヒ クイットマン、
オリバー ロベルト ピーニク、
オリバー ロベルト ピーニク、
シルヴィア ローゼンバーガー、
シルヴィア ローゼンバーガー、
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck Patent GmbH
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Merck Patent GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of JP2016520139A publication Critical patent/JP2016520139A/ja
Publication of JP2016520139A5 publication Critical patent/JP2016520139A5/ja
Application granted granted Critical
Publication of JP6423418B2 publication Critical patent/JP6423418B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2231—Oxides; Hydroxides of metals of tin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0227—Insulating particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
JP2016512243A 2013-05-07 2014-05-05 Ｌｄｓプラスチック用添加剤 Expired - Fee Related JP6423418B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013007750.8A DE102013007750A1 (de) 2013-05-07 2013-05-07 Additiv für LDS-Kunststoffe
DE102013007750.8 2013-05-07
PCT/EP2014/001183 WO2014180550A1 (de) 2013-05-07 2014-05-05 Additiv für lds-kunststoffe

Publications (3)

Publication Number Publication Date
JP2016520139A JP2016520139A (ja) 2016-07-11
JP2016520139A5 JP2016520139A5 (zh) 2017-11-24
JP6423418B2 true JP6423418B2 (ja) 2018-11-14

Family

ID=50828857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016512243A Expired - Fee Related JP6423418B2 (ja) 2013-05-07 2014-05-05 Ｌｄｓプラスチック用添加剤

Country Status (7)

Country Link
EP (1) EP2995178A1 (zh)
JP (1) JP6423418B2 (zh)
KR (1) KR102171893B1 (zh)
CN (1) CN105230133B (zh)
DE (1) DE102013007750A1 (zh)
TW (1) TWI632205B (zh)
WO (1) WO2014180550A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2022030370A1 (ja) 2020-08-05 2022-02-10 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置

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EP3230387A1 (en) * 2014-12-12 2017-10-18 SABIC Global Technologies B.V. Laser direct structured materials and their methods of making
KR102079655B1 (ko) * 2014-12-12 2020-04-08 사빅 글로벌 테크놀러지스 비.브이. 폴리머 필름 및 시트의 레이저-직접 구조화 및 제조 방법
US10822505B2 (en) * 2015-07-28 2020-11-03 Merck Patent Gmbh Laser-markable polymers and coatings
JP6441874B2 (ja) * 2015-12-24 2018-12-19 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング層形成用組成物、キット、およびメッキ層付樹脂成形品の製造方法
CN109963702B (zh) * 2016-11-22 2022-02-18 默克专利股份有限公司 用于激光可标记及激光可焊接的聚合物材料的添加剂
KR101970510B1 (ko) * 2016-11-30 2019-04-22 유림특수화학 주식회사 광반응성 필러를 이용한 코팅용 도료
CN106751389B (zh) * 2016-11-30 2019-03-26 上海中镭新材料科技有限公司 一种浅色的用于lds技术的工程塑料及其制备方法
CN110300778A (zh) * 2017-01-11 2019-10-01 沙特基础工业全球技术公司 通过芯-壳结构lds添加剂与涂覆在矿物填料表面上的金属化合物而具有导热性和激光电镀性能的组合物
CN110325578B (zh) * 2017-01-11 2022-04-01 高新特殊工程塑料全球技术有限公司 具有可激光活化的金属化合物的激光可镀覆热塑性组合物和由其成形的制品
US20210130585A1 (en) * 2017-01-11 2021-05-06 Sabic Global Technologies B.V. Laser platable thermoplastic compositions with a laser activatable metal compound and shaped articles therefrom
WO2019042906A1 (de) * 2017-08-29 2019-03-07 Merck Patent Gmbh Laseradditiv und additiv für lds-kunststoffe
WO2019149900A1 (de) * 2018-02-02 2019-08-08 Sivantos Pte. Ltd. Zusammensetzung zur herstellung von hörgerätekomponenten
EP3543291A1 (en) 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Laser platable thermoplastic compositions with good flame retardancy, high heat property and good ductility and shaped articles made therefrom
EP3794076A1 (en) * 2018-05-16 2021-03-24 Merck Patent GmbH Laser additive and its use in polymer materials
WO2020126189A1 (en) * 2018-12-19 2020-06-25 Mep Europe B.V. Polycarbonate composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
KR20220145385A (ko) 2020-02-26 2022-10-28 티코나 엘엘씨 회로 구조체
CN113831672B (zh) * 2020-06-24 2023-05-16 华为机器有限公司 共混的热塑性复合材料、天线支架及终端
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN115926521B (zh) * 2022-12-13 2024-02-13 惠州市日大实业有限公司 数字信号纳米涂料及其制备方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022030370A1 (ja) 2020-08-05 2022-02-10 信越化学工業株式会社 熱硬化性樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
EP2995178A1 (de) 2016-03-16
WO2014180550A1 (de) 2014-11-13
TW201510109A (zh) 2015-03-16
CN105230133B (zh) 2019-01-15
KR102171893B1 (ko) 2020-10-30
CN105230133A (zh) 2016-01-06
DE102013007750A1 (de) 2014-11-13
TWI632205B (zh) 2018-08-11
JP2016520139A (ja) 2016-07-11
KR20160005742A (ko) 2016-01-15

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