JP6408217B2 - Electronic circuit device for compressor - Google Patents

Description

  The present invention relates to an electronic circuit for a compressor for driving a hermetic electric compressor used in a refrigeration apparatus or the like having a configuration in which a printed circuit board on which an electronic component such as a semiconductor element is mounted is stored in a storage box. It relates to the device.

  Conventionally, in an electronic circuit device for a compressor, a printed circuit board on which electronic components such as semiconductor elements are mounted is stored in the storage box from the opening of the storage box, and the opening of the storage box is closed with a lid. It has a configuration.

  Since the electronic circuit device for a compressor having such a configuration generates heat when the semiconductor element on the printed circuit board stored in the storage box is energized and driven, it is necessary to dissipate this heat outside the storage box.

  Therefore, the applicant attaches a heat sink to the semiconductor element, and closes the heat sink to an aluminum plate that closes the opening of the storage box via an insulating sheet, and dissipates heat from the semiconductor element to the outside of the storage box via the aluminum plate. (See, for example, Patent Document 1).

  FIG. 8 is an exploded perspective view of a conventional electronic circuit device for a compressor described in Patent Document 1.

  In FIG. 8, a printed circuit board 102 stored in the storage box 101 is attached with a mini-board 103 and a semiconductor element 104 is attached thereto, and a heat sink 105 is closely attached to the semiconductor element 104. The heat sink 105 is in close contact with the inner surface of an aluminum plate 106 that closes the opening of the storage box 101 via an insulating sheet 107.

  Thereby, this electronic circuit device for a compressor can transmit the heat of the semiconductor element 104 to the aluminum plate 106 through the heat sink 105 and the insulating sheet 107, and can efficiently dissipate to the outside through the aluminum plate 106. The printed circuit board 102 insulated by the insulating sheet 107 can also be prevented from being damaged.

JP 2010-186846 A

  However, in the above-described conventional configuration, a special heat sink 105 having a substantially U shape is required to attach the mini substrate 103 to the printed circuit board 102 and attach the semiconductor element 104 to the mini substrate 103 and cover the semiconductor element 104. The configuration becomes complicated. In addition, there is a problem that the heat sink becomes expensive, for example, a dedicated heat sink having a special structure corresponding to the semiconductor element 104 mounted on the mini substrate is required.

  The present invention has been made in view of these points, and an object thereof is to provide an electronic circuit device for a compressor that is inexpensive and has good heat dissipation efficiency.

  In order to solve the above-described conventional problems, an electronic circuit device for a compressor according to the present invention includes a printed circuit board on which a semiconductor element that generates heat when energized is mounted, a storage box in which the printed circuit board is disposed, and an opening of the storage box. The electronic circuit device for a compressor provided with a closed lid, wherein the lid is made of a metal plate having good thermal conductivity and a part thereof is in thermal contact with the semiconductor element as a heat sink It is as.

  Accordingly, the heat of the semiconductor element can be directly conducted to the lid and diffused over the entire surface without using a heat sink having a special structure dedicated to the semiconductor element, and can be efficiently radiated to the outside. In addition, a heat sink having a special structure dedicated to the semiconductor element is not required, and the number of steps for attaching such a heat sink member to the semiconductor element in advance is not necessary, so that it can be provided at low cost.

  The electronic circuit device for a compressor according to the present invention can dissipate heat generated by a semiconductor element mounted on a printed circuit board outside a storage box without using a heat sink having a special structure dedicated to the semiconductor element. It can be set as the electronic circuit apparatus for compressors with sufficient.

1 is a front view of a compressor equipped with an electronic circuit device for a compressor according to Embodiment 1 of the present invention. The side view which looked at the compressor in Embodiment 1 from the electronic circuit device attachment surface side for compressors Sectional drawing of the electronic circuit apparatus for compressors in Embodiment 1 The exploded perspective view of the electronic circuit device for compressors in Embodiment 1 Sectional drawing of the electronic circuit apparatus for compressors in Embodiment 2 of this invention The exploded perspective view of the electronic circuit device for compressors in Embodiment 2 An exploded perspective view of a conventional electronic circuit device for a compressor

  1st invention is equipped with the printed circuit board which mounted the semiconductor element which generate | occur | produces heat by electricity supply, the storage box which has arrange | positioned the said printed circuit board, and the lid | cover which closed the opening part of the said storage box, and the said lid | cover has favorable heat conduction. A metal plate is used, and a part of the metal plate is used as a heat sink and is in thermal contact with the semiconductor element.

  Accordingly, the heat of the semiconductor element can be directly conducted to the lid and diffused over the entire surface without using a heat sink having a special structure dedicated to the semiconductor element, and can be efficiently radiated to the outside. That is, since there is no need to interpose a heat sink member dedicated to a substantially U-shaped semiconductor element as shown in the conventional example between the lid and the semiconductor element, the heat of the semiconductor element is efficiently conducted directly to the lid and externally provided. Can be dissipated. In addition, a heat sink having a special structure dedicated to the semiconductor element is not required, and the number of steps for attaching such a heat sink member to the semiconductor element in advance is not necessary, so that it can be provided at low cost. In addition, since the storage box is directly attached to the compressor or placed close to it, it is easily affected by vibrations. When a heat sink with a special structure is installed, the mounting screws, etc. are loosened, and the semiconductor element and heat sink In the present invention, since the semiconductor element is directly brought into close contact with the lid, the reliability of the heat radiation performance can be improved.

  According to a second invention, in the first invention, the lid is integrally formed with a convex portion projecting toward the semiconductor element side at a portion facing the semiconductor element, and the convex portion is used as a heat sink portion to thermally affect the semiconductor element. It is as the structure made to contact.

  Thereby, since the heat sink part is formed by processing the lid itself, the configuration can be simplified and can be provided at low cost. In addition, since the convex portion for the heat sink improves the rigidity of the lid, it is possible to suppress micro vibration resonance due to compressor vibration while reducing the plate thickness to the minimum necessary for heat dissipation. In addition, since the side wall surface of the heat sink convex part is also a heat radiating surface, the heat radiation area can be expanded compared to the case where there is no convex part, and when the metal lid (storage box) constituting the lid is installed vertically, the semiconductor Natural convection of ambient air generated from the element contact portion can meander on the side wall surface, and the amount of heat transfer from the metal lid to the ambient air can be increased to increase the amount of heat dissipation.

  According to a third invention, in the first or second invention, an insulating sheet is interposed between the semiconductor element and a heat sink portion of a lid that is in thermal contact with the semiconductor element.

  Thereby, even if the semiconductor element is of a type that is not reinforced and insulated, the insulating action of the insulating sheet is added and the insulating property of the metal lid that may be touched by the hand can be reliably maintained.

  According to a fourth invention, in the second or third invention, the heat sink convex portion provided on the lid is configured such that the side wall portion is an inclined wall.

  As a result, when the metal plate constituting the lid is thermally expanded, if the four corners of the lid are screwed to the storage box, the thermal expansion force is directed toward the convex portion, the expansion force is Compressor with high reliability that can be applied along the sloped wall of the convex part and press the bottom of the convex part for heatsink into the semiconductor element, maintaining good heat dissipation of the semiconductor element when the lid temperature rises. Electronic circuit device.

  According to a fifth invention, in the first to fourth inventions, the printed circuit board is configured by mounting an electronic component such as a coil or a capacitor other than a semiconductor element on one surface and mounting a semiconductor element on the other surface, In addition, the surface on which the semiconductor element is mounted is disposed so as to face the opening of the storage box, and the heat sink portion of the lid or the heat sink convex portion is in thermal contact with the semiconductor element.

  As a result, the electronic component with a high height is not positioned on the surface on which the semiconductor element is mounted, and only the electronic component pin legs that are sufficiently lower in height than the semiconductor element are positioned. The heat sink of the lid in close contact with the semiconductor element The part other than the heat sink or the heat sink convex part is separated from the printed board by the convex depth dimension of the heat sink part or the heat sink convex part, and sufficient space insulation from the charging part such as the electronic component pin leg on the printed board can be secured. , A safe electronic circuit device for a compressor can be obtained. In addition, the configuration required when the semiconductor element is mounted on the same surface as the electronic component mounting surface, that is, each electronic component is mounted by attaching the semiconductor element to the printed circuit board as shown in the conventional example. In addition, it is not necessary to employ a complicated configuration that increases the height of the semiconductor element, and it is possible to significantly reduce the number of assembling steps and reduce the cost by eliminating the need for a heat sink dedicated member as well as a mini-substrate. Further, since the deep convex depth dimension required when the semiconductor element is mounted on the surface on which the electronic component is mounted is not required, in the case where the heat sink convex portion is integrally formed on the lid, the heat sink convex portion The heat sink as shown in the conventional example is not necessary because the heat sink convex part having such a convex depth dimension cannot be formed, and the second invention is not required. The effects shown can be easily achieved.

According to a sixth aspect of the invention, in the first to fifth aspects of the invention, the semiconductor element is mounted on a printed circuit board by superposing individual semiconductor elements, and the heat sink portion of the lid or the heat sink convex portion is heated on the superposed semiconductor element. It is the structure which made it contact.

  As a result, the total height of the semiconductor element is increased, and the height difference between the electronic component pin leg and the height can be increased. While ensuring a sufficient insulation distance from the printed circuit board on the flat part other than the heat sink convex part of the close lid, it is possible to reduce the material of the heat sink part and the convex depth dimension of the heat sink convex part to be in thermal contact with the semiconductor element The heat sink convex part can be formed without difficulty by reducing the size, and it is possible to suppress the deformation of the lid due to the residual stress due to the formation of the deep convex part, and to prevent the close contact state between the convex part and the semiconductor element, and highly reliable compression. It can be set as the electronic circuit device for machines.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a front view of a compressor equipped with an electronic circuit device for a compressor according to Embodiment 1 of the present invention, and FIG. 2 is a view of the compressor according to Embodiment 1 as viewed from the electronic circuit device mounting surface side FIG. 3 is a side view, FIG. 3 is a cross-sectional view of the compressor electronic circuit device according to the first embodiment, and FIG. 4 is an exploded perspective view of the compressor electronic circuit device according to the first embodiment.

  1 and 2, the compressor 1 is detachably mounted with an electronic circuit device 2 for a compressor which is a subject of the present invention on the outer peripheral surface thereof.

  As shown in FIGS. 3 and 4, the compressor electronic circuit device 2 is configured such that a printed circuit board 4 is housed in a storage box 3.

  The storage box 3 is injection-molded with a resin such as a modified polyphenylene ether resin, and has an opening 5 that is slightly larger than the size of the printed circuit board 4 so that the printed circuit board 4 can be stored therein.

  The printed circuit board 4 is made of a glass cloth / glass nonwoven cloth epoxy resin, and a connector (not shown) is mounted on one side edge.

  The storage box 3 is opened at a position facing the connector to form a cord lead-out portion 6.

  A plurality of board mounting holes for mounting the board are provided at four corners of the printed circuit board 4, and two of the board mounting holes 7 a are fixed to the storage box 3 by the board fixing screws 8. Yes.

  Projecting portions 3a projecting toward the opening are integrally formed at the two bottom portions of the storage box 3, and a cylindrical rubber bush 9 having a hollow portion is provided on the projecting portion 3a. Are fitted in the hollow portions of the rubber bush 9 respectively.

  The height of the protruding portion 3 a is higher than the height of the rubber bush 9, and the tip protrudes from the rubber bush 9, and the protruding portion fits into the remaining two board mounting holes 7 c of the printed board 4. It is like that. In this state, the rubber bush 9 is sandwiched and compressed between the storage box 3 and the printed board 4 screwed to the storage box 3.

  Further, the hole diameter of the board mounting hole 7c is designed so that there is an appropriate clearance when the protruding part 3a is inserted (for example, if the diameter of the protruding part 3a is 3.5 mm, the hole diameter of the board mounting hole 7c). Is 4 mm).

  The printed circuit board 4 is provided with a control circuit such as an inverter circuit for controlling the compressor 1 at a variable speed. In this embodiment, an electronic component 10 such as a coil or a capacitor is particularly mounted on one surface and the other surface is mounted. And a semiconductor element 11 that generates heat when energized, such as an IPM (intelligent power module). Further, the semiconductor element 11 is mounted on the printed circuit board 4 by superposing individual semiconductor elements 11a and 11b that generate heat when energized. The printed circuit board 4 configured as described above is arranged so that the surface on which the semiconductor element 11 is mounted faces the opening 5 of the storage box 3, and the mounting side of the semiconductor element 11 is the substrate mounting hole 7a and the substrate. The rubber bush 9 is located on the side opposite to the side fixed with the fixing screw 8. The semiconductor element 11a is an IPM, and the semiconductor element 11b is a rectifying diode for a smoothing circuit of an inverter power supply.

  The storage box 3 is provided with attachment holes 12 at four corners of the opening 5, and the lid 14 can be fixed to the storage box 3 with screws 13 so that the opening 5 can be closed. .

  The lid 14 is made of a pressed metal plate with high thermal conductivity, for example, an aluminum plate made of an aluminum alloy (hereinafter referred to as an aluminum lid plate 14 in the description of the embodiment), and the semiconductor of the printed circuit board 4. A heat-sink portion 15 is integrally formed by mounting a flat plate made of aluminum alloy having good heat conductivity on the portion facing the element 11. The heat sink 15 is in close contact with the semiconductor element 11 of the printed circuit board 4 via the insulating sheet 16, that is, is in thermal contact.

  The insulating sheet 16 is in close contact with the inner surface side of the heat sink portion 15 of the aluminum lid plate 14 and is fixed by caulking, for example, by overlapping two sheets, and withstands electrical insulation performance (for example, 1750 V, 1 minute dielectric strength test) that satisfies safety standards. )have.

  The insulating sheet 16 is preliminarily coated with a heat diffusion compound 17 to improve the close contact between the insulating sheet 16 and the heat sink 15 of the aluminum cover plate 14, and to conduct heat conduction between the insulating sheet 16 and the aluminum cover plate 14. I'm doing better. Further, an adhesive (not shown) having high thermal conductivity is applied to the surface of the insulating sheet 16 that faces the semiconductor element 11.

  The operation and action of the electronic circuit device for a compressor configured as described above will be described below.

  In assembling the electronic circuit device for the compressor, first, the rubber bush 9 is inserted into the protruding portion 1 a of the storage box 3. Next, the printed circuit board 4 is inserted into the storage box 3 so that the surface on which the semiconductor element 11 is mounted faces the opening 5 of the storage box 3.

  At this time, the two protruding portions 3 a of the storage box 3 are inserted into the board mounting holes 7 c in the printed board 4. Then, the board mounting hole 7 a of the printed board 4 is fixed to the storage box 3 by the board fixing screw 8.

  On the other hand, the aluminum cover plate 14 is mounted and integrated with the heat sink portion 15 in advance, and the insulating sheet 16 is further crimped and fixed. Note that a compound 17 for heat diffusion is applied in advance to the surface of the insulating sheet 16 in contact with the aluminum cover plate 14.

An adhesive is applied to the surface of the insulating sheet 16 provided on the surface of the heat sink portion of the aluminum lid plate 14 and the aluminum lid plate 14 is attached to the opening 5 of the storage box 3 with the fixing screw 13 before the adhesive is solidified. . At this time, the heat sink portion 15 of the aluminum cover plate 14 is in close contact with the semiconductor element 11 such that the upper surface of the semiconductor element 11 is pushed into the storage box 3 by about 2 mm, for example, and the rubber bush 9 below the printed circuit board 4 is vertical. Will be compressed in the direction. At this time, the adhesive applied to the insulating sheet 16 of the heat sink 15 is also compressed.

  In the electronic circuit device for a compressor assembled as described above, the semiconductor element 11 generates heat when it is energized and driven. This heat generation is directly conducted from the semiconductor element 11 to the heat sink portion 15 of the aluminum lid 14, It diffuses over the entire surface of the aluminum lid plate 14 and efficiently dissipates heat to the outside of the storage box 3. Therefore, the temperature of the semiconductor element 11 does not rise excessively, the temperature of the semiconductor element 11 can be reduced, and the reliability of the electronic circuit device for a compressor can be improved.

  In particular, in this embodiment, since the heat sink portion 15 is provided on the aluminum lid plate 14 and the heat sink portion 15 is in direct contact (thermal contact) with the semiconductor element 11 via the insulating sheet 16, the aluminum lid plate 14 Can directly conduct heat from the semiconductor element 11 without passing through a heat sink dedicated to the substantially U-shaped semiconductor element as shown in the conventional example, and the heat conduction effect is enhanced and efficient heat dissipation is achieved. It becomes possible. That is, since the heat sink portion 15 is provided on the aluminum lid plate 14 and there is no need to interpose a heat sink member dedicated to a substantially U-shaped semiconductor element as shown in the conventional example between the lid and the semiconductor element. The heat of the element can be efficiently conducted directly to the lid and radiated to the outside.

  In addition, the heat sink having a special structure dedicated to the semiconductor element and the man-hour for attaching such a heat sink to the semiconductor element in advance are unnecessary, and can be provided at low cost.

  Further, since the storage box 3 is directly attached to the compressor 1 or arranged close to it, it is easily affected by vibrations. When a heat sink having a special structure as shown in the conventional example is attached, its mounting screws, etc. May occur, leading to poor connection between the semiconductor element and the heat sink. However, since the structure of the present embodiment brings the semiconductor element 11 into direct contact with the heat sink portion 15 of the aluminum cover plate 14, good heat is always obtained. Can be maintained and the reliability of the heat dissipation performance can be improved.

  Moreover, since the insulating sheet 16 is attached between the aluminum cover plate 14 and the semiconductor element 11, the insulation of the aluminum cover plate 14 can be ensured, and the compressor can be used in an environment where the aluminum cover plate 14 can be touched. Even when the electronic circuit device is installed, a safer electronic circuit device for the compressor can be provided.

  Furthermore, in this embodiment, the printed circuit board 4 is configured by mounting the semiconductor element 11 on the surface opposite to the surface on which the electronic component 10 such as a coil or a capacitor is mounted. The configuration required when mounted on the same surface as the component mounting surface, that is, as shown in the conventional example, the mini-board is attached to the printed circuit board, and the semiconductor element is mounted on the printed circuit board. It is no longer necessary to employ a complicated configuration that increases the manufacturing cost, and there is no need for parts such as a mini-board as well as a specially designed heat sink member, which can greatly reduce the number of assembly steps and reduce costs. In addition, since the aluminum cover plate 14 is in a state where the heat sink portion 15 protrudes toward the printed circuit board 4 by the aluminum alloy flat plate constituting the heat sink portion 15, the heat sink portion 15 of the aluminum cover plate 14 in close contact with the semiconductor element 11. The parts other than those are separated from the printed circuit board 4 by the thickness (convex) depth dimension of the aluminum alloy flat plate constituting the heat sink part 15, and thereby the space insulation from the charging part such as the pin leg 10 a of the electronic component 10 is also achieved. A sufficiently secure electronic circuit device for a compressor can be obtained.

In addition, in this embodiment, the semiconductor element 11 is configured such that the individual semiconductor elements 11a and 11b are overlapped and mounted on the printed circuit board 4, and the heat sink portion 15 is brought into close contact with the overlapped semiconductor element 11. The thickness of the heat sink portion 15 can be reduced correspondingly, and the material cost can be reduced.

  In the electronic circuit device for a compressor according to this embodiment, the printed circuit board 4 is strongly fixed only at two places by the board fixing screws 8 at the board mounting holes 7a in the mounting to the storage box 3. Even when the linear expansion coefficients of the printed circuit board 4 and the storage box 3 are different from each other, since the stress due to thermal expansion is not applied to the portion of the substrate mounting hole 7a, the printed circuit board 4 is not damaged, The reliability of the compressor electronic circuit device is ensured even when the temperature of the electronic circuit device for the compressor itself rises due to heat generation of the electronic components mounted on the printed circuit board 4 or a temperature rise outside the storage box 3. be able to.

  Further, when the temperature of the electronic circuit device for the compressor rises, the storage box 3 is thermally expanded, and a gap is likely to be generated at a close portion between the semiconductor element 11 and the heat sink portion 15. The expansion is absorbed by the rubber bush 9 to securely maintain the close contact between the insulating sheet 16 of the heat sink portion 15 provided on the aluminum cover plate 14 and the semiconductor element 11, and the heat generated by the semiconductor element 11 is reliably transferred to the aluminum cover plate 14. Heat can be transferred to prevent an excessive temperature rise of the semiconductor element 11 and improve the reliability of the electronic circuit device for the compressor.

  For example, when the temperature of the electronic circuit device for the compressor rises due to energization or an increase in the surrounding temperature, the storage box 3 thermally expands in the vertical direction, and the linear expansion coefficient of the storage box 3 is about 7 × −5 / ° C. Therefore, in the case where the vertical dimension of the storage box 3 is 40 mm, for example, when the temperature of the electronic circuit device for the compressor is increased by 50K, the vertical dimension of the storage box 3 is increased by about 0.14 mm. Since the rubber bush 9 is compressed and always pushes up the printed board 4 vertically upward, no gap is generated between the insulating sheet 16 of the heat sink 15 and the semiconductor element 11.

  Further, since the rubber bush 9 is provided on the side where the semiconductor element 11 is mounted, that is, on the non-fixed portion side opposite to the side fixed with the board mounting hole 7a and the board fixing screw 8, the rubber bush 9 The effect of can be exhibited effectively. In addition, since the electronic circuit device for the compressor is attached to the compressor, the printed circuit board 4 is easily affected by the vibration, and particularly the semiconductor element 11 is easily affected by the rubber bush 9 on the semiconductor element 11 side. Therefore, the influence of such vibration can be reduced.

  In addition, when the rubber bush 9 is attached, the rubber bush 9 is simply inserted into the protruding portion 1a of the storage box 3. Therefore, the rubber bush 9 can be easily assembled and the workability of the assembly of the compressor electronic circuit device is improved. be able to.

  In addition, positioning in mounting the printed circuit board 4 by the projecting portion 3a has an effect of preventing the printed circuit board 4 from moving in the horizontal direction, and can improve the assembly workability of the electronic circuit device for the compressor. There is also an advantage.

  If the semiconductor element 11 is not attached in parallel to the printed circuit board 4, the surface of the semiconductor element 11 and the heat sink portion 15 and the insulating sheet 16 are not in surface contact, but the semiconductor element 11 is inclined to the printed circuit board 4 due to assembly variations. Even when the contact between the surface of the semiconductor element 11 and the heat sink portion 15 and the insulating sheet 16 becomes a line contact or a point contact, the adhesive having a high thermal conductivity fills a gap generated between them. As a result, the heat generated by the semiconductor element 11 can be directly and reliably conducted to the aluminum lid plate 14 to prevent an excessive temperature rise of the semiconductor element 11 and to provide a highly reliable electronic circuit device for a compressor. be able to.

  Further, since the thermal diffusion compound 17 is applied to the contact surface between the insulating sheet 16 and the heat sink portion 15 of the aluminum lid plate 14, the insulating sheet 16 and the heat sink portion 15 even when the aluminum lid plate 14 is deformed. The thermal diffusion compound 17 fills the gap generated between the two, and the heat generated by the semiconductor element 11 can be reliably conducted to the aluminum cover plate 14 to prevent an excessive temperature rise of the semiconductor element 11, A highly reliable electronic circuit device for a compressor can be provided.

(Embodiment 2)
FIG. 5 is a cross-sectional view of the electronic circuit device for a compressor according to the second embodiment of the present invention, and FIG. 6 is an exploded perspective view of the electronic circuit device for the compressor according to the second embodiment.

  In this embodiment, the heat sink portion 15 of the aluminum lid plate 14 shown in the first embodiment is integrally formed with the aluminum lid plate itself, and the same parts as those in the first embodiment are denoted by the same reference numerals and described. Are omitted, and only different parts will be described.

  5 and 6, the aluminum lid plate 24 according to the second embodiment is integrally formed with a heat sink convex portion 25 protruding toward the semiconductor element side at a portion facing the semiconductor element 11. As shown in FIGS. 5 and 6, the heat sink convex part 25 has an inclined wall 26 whose side wall part inclines toward the bottom of the convex part. Similar to the first embodiment, the semiconductor element 11 is in close contact with the insulating sheet 16.

  Therefore, according to this configuration, the heat of the semiconductor element 11 can be directly conducted to the aluminum cover plate 14 without being provided as a separate member, diffused over the entire surface, and efficiently radiated to the outside. The heat sink member having a special structure dedicated to the semiconductor element shown in the figure is not required separately, and the number of steps for attaching such a heat sink member to the semiconductor element 11 in advance is not required, and the heat sink part as shown in the first embodiment is used. The man-hour for attaching 15 to the aluminum cover plate 14 is also unnecessary, and can be provided at a lower cost.

  Moreover, since the heat sink convex portion 25 improves the rigidity of the aluminum lid plate 24, it is possible to suppress micro vibration resonance due to compressor vibration while reducing the plate thickness to the minimum necessary for heat dissipation. In particular, in the case where the compressor 1 is controlled at a variable speed by an inverter circuit as exemplified in this embodiment, the fine vibration of the compressor 1 tends to resonate in an unspecified region of the variable speed region. Since it is difficult to cope with the resonance prevention by design, it is effective in preventing noise caused by vibration.

  In addition, since the aluminum cover plate 24 has an inclined wall 26 of the heat sink convex portion 25 that also serves as a heat radiating surface, the heat radiating area can be increased as compared with the case where the heat sink convex portion 25 is not provided, and the storage box 3 is installed vertically. In addition, the aluminum cover plate 24 is also vertical, and natural convection of ambient air generated from the intimate portion of the semiconductor element can meander on the surface of the inclined wall 26, thereby increasing the amount of heat transfer from the aluminum cover plate 24 to the ambient air. The heat dissipation can be expanded.

  Further, when the aluminum lid plate 24 is thermally expanded, the four corners of the aluminum lid plate 24 are screwed to the storage box 3 so that the thermal expansion force is directed to the heat sink convex portion 25. The bottom surface 27 of the heat sink convex portion 25 is brought into pressure contact with the semiconductor element 11 along the inclined wall 26 of the convex portion 25, and the heat dissipation of the semiconductor element heat when the temperature of the aluminum lid plate rises can be maintained well. A highly reliable electronic circuit device for a compressor can be obtained.

Further, as described in the first embodiment, the printed circuit board 4 has an electronic component 10 such as a coil or a capacitor other than a semiconductor element mounted on one surface and a semiconductor element 11 mounted on the other surface. And the surface on which the semiconductor element 11 is mounted is disposed so as to face the opening 5 of the storage box 3, and the heat sink of the aluminum cover plate 24 is interposed on the semiconductor element 11 with an insulating sheet 16 interposed therebetween. Since the convex portions 25 for use are in close contact with each other, the cost can be reduced by simplifying the configuration and reducing the number of assembly steps. That is, a configuration required when the semiconductor element 11 is mounted on the same surface as the electronic component mounting surface, that is, as shown in the conventional example, a mini-board is attached to the printed circuit board, and each semiconductor element is mounted on the printed circuit board. It is no longer necessary to adopt a complicated configuration that makes the height of the semiconductor element higher than that of the component, and it is possible to greatly reduce the number of assembly steps and reduce the cost by eliminating the need for a heat sink-dedicated member and mini-substrate components. It is.

  In addition, a sufficient space insulation distance from the charging portion such as the pin leg 10a of the electronic component 10 mounted on the printed circuit board 4 can be secured, and in the case of the configuration of this embodiment, the heat sink convex portion 25 can be easily press-formed. become. That is, with the above-described configuration, the aluminum cover plate 24 is in a state in which the heat sink convex portion 25 protrudes toward the printed circuit board 4, so that the plane other than the heat sink convex portion 25 of the aluminum cover plate 24 in close contact with the semiconductor element 11. The part is separated from the printed circuit board 4 by the convex depth dimension of the convex part 25 for the heat sink, and thereby sufficient space insulation from the charging part such as the pin leg 10a of the electronic component 10 can be secured, so that the safer electronic for the compressor It can be a circuit device. In addition, in the case of this embodiment, since the deep convex depth dimension required when the semiconductor element 11 is mounted on the surface on which the electronic component 10 is mounted is not required, the heat sink convex portion 25 is also press-molded. In addition, the heat sink convex portion 25 having such a convex depth dimension cannot be press-molded, and the heat sink as shown in the conventional example is not required.

  In addition, in this embodiment, the semiconductor element 11 is superposed, so that unlike the first embodiment, the heat sink convex portion 25 can be easily pressed without difficulty, and at the same time, the heat sink It is also possible to suppress a decrease in the close state between the convex portion 25 for use and the semiconductor element 11. That is, since the total height of the semiconductor element is increased and the height difference dimension from the electronic component pin leg can be further increased, the convex depth dimension of the heat sink convex portion 25 is reduced correspondingly, and the semiconductor element 11 is closely contacted. While ensuring sufficient space insulation distance from the printed circuit board 4 on the flat surface portion of the aluminum lid plate 24 other than the heat sink convex portion, the convex depth dimension of the heat sink convex portion 25 is made small so that the heat sink convex The portion 25 can be formed, the aluminum cover plate 24 can be prevented from being deformed due to the residual stress due to the formation of the convex portion, and the close contact state between the convex portion 25 for the heat sink and the semiconductor element 11 can be suppressed, and a highly reliable compressor Electronic circuit device.

  As mentioned above, although main embodiment of this invention was described, the said embodiment was shown as an example in implementing this invention, and can be variously changed within the range which achieves the objective of this invention. Needless to say.

  For example, the lid 14 for radiating the heat of the semiconductor element 11 has been described by taking an aluminum plate as an example, but a metal other than aluminum may be used as long as it is a metal material having high thermal conductivity.

  Moreover, in order to ensure the insulation between the semiconductor element 11 and the lid 14, an example in which the insulating sheet 16 is interposed between the two is illustrated. However, it is necessarily required when the insulation of the package of the semiconductor element 11 is high. It can also be omitted.

As described above, the electronic circuit device for a compressor according to the present invention can radiate the heat generated by the semiconductor element mounted on the printed circuit board to the outside of the storage box without using a heat sink having a special structure dedicated to the semiconductor element. In addition, since the electronic circuit device for a compressor can be inexpensive and has good heat dissipation efficiency, it can be applied to other electronic circuit devices using semiconductor elements.

DESCRIPTION OF SYMBOLS 1 Compressor 2 Electronic circuit apparatus for compressors 3 Storage box 4 Printed circuit board 5 Opening part 6 Cord extraction part 7a, 7c Board mounting hole 8 Board fixing screw 9 Rubber bush 10 Electronic component 11, 11a, 11b Semiconductor element 12 Mounting hole 13 Fixing screw 14, 24 Lid (aluminum lid plate)
DESCRIPTION OF SYMBOLS 15 Heat sink part 16 Insulation sheet 17 Compound 25 Heat sink convex part 26 Inclined wall 27 Bottom face

Claims (4)

A printed circuit board on which a semiconductor element that generates heat when energized is mounted;
A storage box in which the printed circuit board is disposed;
A lid that closes the opening of the storage box;
The lid is composed of a heat conductive metal plate and part of it forms a heat sink part,
The printed circuit board is mounted with an electronic component having a pin leg other than the semiconductor element on one surface, the pin leg penetrates the printed circuit board and protrudes to the other surface side, Is mounted so that the semiconductor element is mounted, and the surface on which the semiconductor element is mounted faces the opening of the storage box,
Said lid, said semiconductor element portion facing the molded projections integral projecting toward the side of the semiconductor elements has been the protrusions with respect to the semiconductor device as the heat sink portion in thermal contact ,
In the lid, the pin leg of the electronic component is disposed between the printed board and a portion other than the convex portion, and a spatial insulation distance from the printed board to a portion other than the convex portion is from the printed board. It is larger than the space insulation distance to the convex part by the convex depth dimension of the convex part,
Electronic circuit device for compressors. 2. The electronic circuit device for a compressor according to claim 1 , wherein an insulating sheet having electrical insulation is interposed between the semiconductor element and a heat sink portion of the lid that is in thermal contact with the semiconductor element. The electronic circuit device for a compressor according to claim 1 or 2 , wherein the heat sink convex portion provided on the lid has a side wall portion as an inclined wall. The compressor according to any one of claims 1 to 3 , wherein the semiconductor element is mounted on a printed circuit board by stacking individual semiconductor elements, and a heat sink portion of a lid is brought into thermal contact with the stacked semiconductor elements. Electronic circuit device.

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