JP6398554B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

In recent years, light emitting devices using light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) have been used as various light sources.
As such a light emitting device, for example, a configuration in which a light emitting element is mounted on a wiring portion on a substrate via an anisotropic conductive member (ACP) and covered with a sealing resin is known. Yes.

  Here, in the light emitting device described above, the paste-like anisotropic conductive member is disposed on the substrate and the wiring portion, and then the light emitting element is pressure-bonded while being heated, and the anisotropic conductive member is cured and bonded. For this reason, during thermocompression bonding, the solvent contained in the anisotropic conductive member is vaporized, and voids (voids) due to bubbles are formed at the interface between the anisotropic conductive member filled between the wiring portions and other members. May occur. Further, during the pressure bonding of the light emitting element, the central portion (above the gap) of the light emitting element is deformed downward according to the pressure. Therefore, the reaction inside the pressure bonding is completed and the deformation of the light emitting element returns to the original state, the inside of the anisotropic conductive member is in a reduced pressure state, and a cavity due to bubbles may be generated.

  Conventionally, in order to prevent the generation of a cavity of a semiconductor element as described above, a method of forming a hole that allows ventilation in the thickness direction of the substrate (see Patent Document 1), or a protective film that covers the substrate is formed in the cavity. A method of forming a groove for discharging bubbles (see Patent Document 2) has been proposed.

JP-A-5-343844 JP 2005-101125 A

  However, for example, when the method according to Patent Document 1 or Patent Document 2 is applied to the light-emitting device, the anisotropic conductive member or the sealing resin enters the above-described hole or groove, and ventilation becomes difficult.

  In addition, when the present inventors drive a light-emitting device including such a cavity due to bubbles, the bubbles expand as the temperature of the light-emitting element rises, and the bubbles try to escape to the outside. It has been found that an air layer is formed at the interface with the sealing resin, causing problems such as a decrease in light output.

  The present invention has been made in view of the above points, and even if there is a cavity at the interface between the anisotropic conductive member and the other member and bubbles in the cavity move due to heat during driving, It is an object of the present invention to provide a light emitting device and a method for manufacturing the light emitting device in which the bubbles can be effectively discharged and the light output is hardly reduced.

  In order to solve the above problems, a light-emitting device according to an embodiment of the present invention includes a substrate having at least a pair of wiring portions that are spaced apart from each other on a base, and the pair of anisotropic conductive members. And a light emitting element bonded onto the wiring part, and having a release agent provided on at least one of the wiring part and the gap between the pair of wiring parts.

  In order to solve the above problems, a method of manufacturing a light emitting device according to the present invention includes a substrate preparation step of preparing a substrate in which at least a pair of wiring portions are provided apart from each other on a base, and an anisotropic method on the substrate. An anisotropic conductive member disposing step of disposing a conductive conductive member, and a light emitting element bonding step of bonding a light emitting element onto the pair of wiring portions via the anisotropic conductive member, the anisotropic Prior to the conductive member arranging step, a mold releasing agent arranging step of arranging at least a releasing agent in a line at a position facing the lower surface of the anisotropic conductive member in plan view is further included.

  According to the light emitting device of the present invention, the mold release agent arrangement is formed by the mold release agent for the bubbles that expand and move from the cavity such as the interface between the anisotropic conductive member and the other member due to heat during driving. Can be discharged outside through the area. Therefore, in the light emitting device, an air layer is not formed at the interface between the light emitting element and the sealing resin, and problems such as a decrease in light output can be prevented.

  According to the method for manufacturing a light emitting device according to the present invention, since the release agent arranging step of providing the release agent at least in a linear form is performed before the anisotropic conductive member is arranged, the release agent is disposed outside the sealing resin. By using the release agent arrangement region formed by the above as a discharge path, bubbles moving from a cavity that may be generated when using an anisotropic conductive member can be discharged to the outside. Therefore, in the method for manufacturing a light-emitting device according to the present invention, the air layer is not formed at the interface between the light-emitting element and the sealing resin without a large change in the manufacturing process, and the manufacture of the light-emitting device that prevents problems such as a decrease in light output. Is possible.

It is sectional drawing which shows typically the structure of the light-emitting device which concerns on 1st Embodiment. It is the expanded sectional view which expanded some light emitting devices shown in Drawing 1A. It is a top view which shows typically the structure of the light-emitting device which concerns on 1st Embodiment. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention, Comprising: It is a top view which shows a wiring part formation process typically. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows a board | substrate preparation process typically. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically an anisotropic conductive member arrangement | positioning process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment of this invention, Comprising: It is a top view which shows typically a light emitting element joining process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 1st Embodiment, Comprising: It is a top view which shows typically sealing resin formation process. It is a top view which shows typically the structure of the light-emitting device which concerns on 2nd Embodiment. It is a top view which shows typically the structure of the light-emitting device which concerns on 3rd Embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on 4th Embodiment. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows a board | substrate preparation process typically. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows a reflective material layer formation process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows typically a mold release agent arrangement | positioning process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows typically an anisotropic conductive member arrangement | positioning process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows typically a light emitting element joining process. It is a figure which shows the manufacturing method of the light-emitting device which concerns on 4th Embodiment, Comprising: It is a top view which shows typically sealing resin formation process. It is a top view which shows typically the light-emitting device which concerns on other embodiment. It is a figure which shows typically the light-emitting device which concerns on other embodiment, Comprising: It is the figure which expanded a part of FIG. 8A. It is a figure which shows typically the light-emitting device which concerns on other embodiment, Comprising: It is sectional drawing which shows typically the cross-sectional state of XX of FIG. 8A.

  Hereinafter, a light emitting device as an example of an embodiment according to the present invention and a manufacturing method thereof will be described with reference to the drawings. Note that the drawings referred to in the following description schematically show the present invention, and therefore the scale, spacing, positional relationship, etc. of each member are exaggerated, or some of the members are not shown. There is a case. Moreover, in the following description, the same name and code | symbol indicate the same or the same member in principle, and shall omit detailed description suitably.

<First Embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device 1 according to the first embodiment will be described with reference to FIGS. 1A, 1B, and 2. FIG. The light emitting device 1 can be used as a light source of a display device or a lighting device, for example. As shown in FIG. 1A, the light emitting device 1 includes a substrate 10, a wiring part 20, an anisotropic conductive member 30, a release agent placement region 40 provided with a release agent 41, a light emitting element 50, a sealing element. And a stop resin 60.

The substrate 10 is for installing each member constituting the light emitting device 1. As shown in FIG. 1A, the substrate 10 includes a base body 11 made of a resin layer and a wiring portion 20 formed on one surface of the base body 11 through an adhesive layer 12. The above-mentioned “one surface of the substrate 11” means the surface of the substrate 11 on the light emitting element 50 side.
The material of the base 11 is not particularly limited, and insulating ceramics, resins, and the like can be used.

Further, as the substrate 11, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyetherimide (PEI), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), unsaturated polyester, glass epoxy, etc. When using a flexible or flexible resin material such as an insulating resin film, an anisotropic conductive member that can be bonded at a lower temperature than solder or the like is used for mounting the light emitting element. Is preferred. However, when the anisotropic conductive member 30 is crimped, the base body 11 bends in the vertical direction and returns to the original state after the crimping is completed, so that a cavity 40 is generated between the anisotropic conductive member 40 and the base body 10 or the wiring portion 20. It becomes easy to do. Therefore, the present invention capable of reducing the adverse effect of the cavity 40 generated when the anisotropic conductive member 30 is used is particularly preferably applied to the light emitting device 1 using a resin material having flexibility or flexibility as a base. can do.
The adhesive layer 12 is for adhering the wiring part 20 to one surface of the base 11 and is made of, for example, urethane resin, epoxy resin, or the like. The thickness of the substrate 10 is not particularly limited, and can be formed with an arbitrary thickness depending on the purpose and application.

The wiring unit 20 is for electrically connecting an external power source and the light emitting element 50.
As shown in FIGS. 1A and 2, the wiring portion 20 of the present embodiment is configured as a pair corresponding to a pair of positive and negative electrodes 51 of the light emitting element 50, and only a predetermined gap G is formed on the adhesive layer 12 of the substrate 10. They are spaced apart. The gap G is provided at a position corresponding to the diameter of the sealing resin 60 described later. The wiring part 20 is formed in a film shape having a predetermined thickness when viewed in cross section as shown in FIG. 1A. Further, when viewed in plan as shown in FIG. 2, the wiring portion 20 is composed of a circular region and linear regions extending from the circular region to the left and right end portions of the substrate 10, respectively. Divides the circular region into two. The circular region of the wiring part 20 has an area equal to or wider than the circular region covered with the sealing resin 60 described later, and the periphery is exposed to the outside of the sealing resin 60. doing.

  In the gap G of the wiring part 20, as shown in FIG. 2, the adhesive layer 12 that is the uppermost surface of the substrate 10 is exposed, and a release agent placement region 40 is formed on the adhesive layer 12. Details of the release agent placement region 40 will be described later. As a material of the wiring part 20, for example, copper, silver, gold, aluminum, nickel, tin and alloys thereof, or a laminate thereof can be used. The outermost surface of the wiring part 20 is preferably gold or tin. Thereby, joining with the electroconductive particle 32 in the anisotropic conductive member 30 mentioned later can be performed favorably. Moreover, the thickness of the wiring part 20 is not specifically limited, It can form by arbitrary thickness according to the objective and a use. As the wiring portion 20 is thicker and the difference in height between the base 11 and the upper surface of the wiring portion 20 is larger, a cavity is more likely to be generated at the interface between the anisotropic conductive member 30 and other members. Therefore, the thickness of the wiring part 20 is preferably about 10 to 100 μm, 20 to 80 μm, or about 30 to 50 μm.

  Further, the width of the gap G described above can be set within a range of 150 μm to 300 μm, for example. The shape of the wiring part 20 and the gap G in plan view is not particularly limited. However, as shown in FIG. 1, the gap G does not have a bent part or a wide part in the part facing the anisotropic conductive member 30, that is, A linear or curved shape is preferred. When the gap G has a bent portion or a wide portion, a cavity is likely to be generated at the interface between the anisotropic conductive member 30 and other members around the gap G. However, by forming the gap G so as not to have a linear or curved bent portion, the generation of cavities such as an interface between the anisotropic conductive member 30 and other members can be suppressed. In addition, when the gap | interval G has a bending part and a wide part, it is preferable to provide the mold release agent mentioned later so that the part may be contact | connected or adjacent.

  The anisotropic conductive member 30 is for adhering and fixing the light emitting element 50 to the substrate 10 and for conducting the light emitting element 50 and the wiring portion 20. As shown in FIGS. 1A and 1B, the anisotropic conductive member 30 is usually disposed over the pair of wiring portions 20, the release agent placement region 40, and the gap G when viewed in cross section. Further, the anisotropic conductive member 30 is formed in a circular region so as to include the gap G on the pair of wiring portions 20, the release agent placement region 40, and the plan view as shown in FIG. 2. Yes. The anisotropic conductive member 30 is disposed in a larger area than the light emitting element 50 to be bonded.

Since the anisotropic conductive member 30 has two functions of adhesion and conduction of the light emitting element 50, the transparent resin 31 as the adhesive and the conductive particles 32 as the conduction member mixed therein Contains at least a composite.
As the material of the translucent resin 31, a material excellent in light resistance and heat resistance is preferable. Specifically, an epoxy resin, a silicone resin, a polyimide resin, a modified resin thereof, a hybrid resin, or the like can be used. In addition, the conductive particles 32 are preferably those in which at least a part is a magnetic material, and specifically, a material having a conductive material such as nickel (Ni), iron (Fe), cobalt (Co), stainless steel on the surface. Can be used. The shape and size of the conductive particles 32 are not particularly limited. For example, as shown in FIG. 1A, a spherical shape, a needle shape or an indefinite shape, and a size of 1 μm to 20 μm can be used.

The conductive particles 32 may be constituted by a core made of a resin and a conductive layer made of a metal that covers the core. By using a flexible resin for the core, bonding by pressure bonding can be easily performed. For example, a methacrylic resin can be used as the material of the core, and the above-described metal can be used as the conductive layer. The conductive layer can be formed by electroless plating, electrolytic plating, mechanofusion (mechanochemical reaction), or the like.
Further, although the conductive particles 32 are present in the anisotropic conductive member 30 at a substantially uniform concentration, the illustration is omitted in a part of the drawing, for example, in the gap G or the like.
The anisotropic conductive member 30 may contain a light reflecting material such as titanium dioxide and zinc oxide in order to increase the light reflectance.
The arrangement region of the anisotropic conductive member 30 is not limited to a circular shape in a plan view as shown in FIG. In addition, it is not limited to be disposed in a larger area than the light emitting element, and may have an area substantially equal to or less than that as long as adhesion and conduction can be sufficiently performed.

  The release agent arrangement region 40 discharges bubbles such as an interface between the anisotropic conductive member 30 and other members to the outside. For example, as shown in FIG. 2, the release agent placement region 40 is a region in which the release agent 41 is provided in a line and forms a fine space with the facing member. Examples of the release agent 41 include a fluorine resin release agent, a melamine resin release agent, a silicone resin release agent, an acrylic resin release agent, a cellulose derivative release agent, a urea derivative release agent, Any of a polyolefin resin release agent, a paraffin release agent, and a composite release agent thereof can be used.

  The release agent 41 of the present embodiment is provided in a film shape with a predetermined thickness on the adhesive layer 12 when viewed in cross section as shown in FIG. 1B. The release agent 41 is formed in the gap G from the position facing the lower surface of the anisotropic conductive member 30 to the position of the end portion of the sealing resin 60 when viewed in plan as shown in FIG. That is, the release agent 41 starts from a certain point (position) in the gap G in the range where the anisotropic conductive member 30 is applied and starts along the gap G in the outer circumferential direction of the anisotropic conductive member 30. And is provided in a straight line continuously up to the end of the sealing resin 60. In addition, the application | coating width | variety of the mold release agent 41 can be in the range of 50 micrometers-300 micrometers, for example, More preferably, it can be in the range of 100 micrometers-300 micrometers.

  More specifically, the release agent arrangement region 40 is formed by providing the release agent 41 in the gap G from the position immediately below the light emitting element 50 to the position of the end portion of the sealing resin 60. That is, the release agent 41 starts from a position corresponding to the center of the light emitting element 50 in the gap G and extends linearly toward the outer periphery of the anisotropic conductive member 30 to the end of the sealing resin 60. It is provided continuously. In other words, the release agent 41 is provided in the gap G corresponding to the radius of the sealing resin 60.

  The range in which the release agent 41 is provided may be an area where air bubbles can be discharged. For example, as shown on the left side of FIG. 2, the range from the end of the anisotropic conductive member 30 to the end of the sealing resin 60. a, a range b from the center of the anisotropic conductive member 30 to the end of the sealing resin 60, a range c from the end of the sealing resin 60 to the end, and the like. As shown in FIGS. 1A and 1B, when viewed in the thickness direction, the release agent 41 is provided between the sealing resin 60 and the gap G in the range a, and different in the ranges b and c. It can be provided between the isotropic conductive member 30 and the gap G and between the sealing resin 60 and the gap G. In this case, the gap G always exists below the release agent 41, and different members exist depending on the formation position above the release agent 41.

  Further, since the release agent 41 is provided, the release agent 41 has a release agent arrangement region 40 in which fine voids are formed at the interface with the upper member. Then, the inside of the anisotropic conductive member 30 and the outside are ventilated through the fine gaps in the release agent arrangement region 40.

  By providing the release agent 41, the light emitting device 1 discharges the bubbles to the outside through the release agent arrangement region 40 when the bubbles in the cavities move due to heat even if the cavities formed at the time of manufacture exist. be able to. Therefore, in the light emitting device 1 including the release agent arrangement region 40, an air layer is not formed at the interface between the light emitting element 50 and the sealing resin 60, unlike the conventional light emitting device.

  In the present embodiment, as shown in FIG. 1A, the light emitting element 50 includes a pair of positive and negative electrodes 51 on the surface opposite to the light emitting surface, and the electrodes 51 respectively correspond to wirings via the anisotropic conductive member 30. It is joined to the part 20. More specifically, as shown in FIG. 2, the light emitting element 50 is flip-chip on the pair of wiring portions 20 via the anisotropic conductive member 30 so as to straddle the gap G between the pair of wiring portions 20. It is joined. The light emitting element 50 is provided at the center of a sealing resin 60 described later. The “light emitting surface” described above is a surface opposite to the surface facing the substrate 10 when the light emitting element 50 is bonded to the wiring portion 20 on the substrate 10, and the light extraction of the light emitting device 1 is performed. It is a surface on the direction side.

As the light emitting element 50, for example, a light emitting diode having a semiconductor layer composed of an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer can be used, and a light emitting diode having an arbitrary wavelength can be selected. For example, as a light emitting element 50 of blue (light having a wavelength of 430 nm to 490 nm) and green (light having a wavelength of 490 nm to 570 nm), ZnSe, nitride-based semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, or the like can be used. As the red light emitting element 50 (light having a wavelength of 620 nm to 750 nm), GaAlAs, AlInGaP, or the like can be used. In the case of the light emitting device 1 using a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 capable of efficiently exciting the fluorescent material and capable of emitting light of a short wavelength. ≦ Y, X + Y ≦ 1) is preferably used. Note that the component composition, emission color, size, and the like of the light emitting element 50 can be appropriately selected according to the purpose and application.

The electrodes of the light emitting element 50 are not limited to those having a pair of positive and negative electrodes on the surface opposite to the light emitting surface as shown in FIG. 1A, but have a pair of positive and negative electrodes on the light emitting surface and the surface on the substrate 10 side. May be.
Note that when the light-emitting element is bonded by flip chip, a substrate is not provided above the semiconductor layer or a light-transmitting substrate such as sapphire is provided so that light can be sufficiently extracted from the light-emitting surface. It is preferable.

  The sealing resin 60 protects the light emitting element 50 bonded to the substrate 10 from dust, moisture, external force, and the like, and arbitrarily adjusts optical characteristics such as light extraction efficiency improvement and wavelength conversion of the light emitting element 50. It is. 1A, the sealing resin 60 of the present embodiment covers the upper surface on the substrate 10, the anisotropic conductive member 30, and the light emitting element 50, and is formed in a dome shape (hemisphere). Has been. In addition, the sealing resin 60 is formed in a circular shape so as to substantially include the circular regions of the pair of wiring portions 20 when viewed in plan as shown in FIG. Further, as shown in FIGS. 1A and 2, the above-described release agent 41 is disposed so as to face the lower side of the sealing resin 60.

  As the material of the sealing resin 60, a material having translucency capable of transmitting light from the light emitting element 50 is preferable. Specifically, an epoxy resin, a silicone resin, a modified type thereof, a urea resin, or the like is used. Can do. In addition to the organic material described above, an inorganic material such as an oxide may be used as the sealing resin 60. In addition to these, a phosphor, a colorant, a light diffusing agent, a filler, and the like for converting light distribution and wavelength may be included as desired.

  According to the light emitting device 1 of the present embodiment having the above configuration, it is generated by heat during driving through the release agent placement region 40 formed from below the anisotropic conductive member 30 to the outside of the sealing resin 60. The bubbles moving from the cavity formed at the interface of the anisotropic conductive member 30 can be discharged to the outside. That is, in the light emitting device 1, the release agent placement region 40 is provided at a position that becomes an interface between the members when the bubbles expand and move due to heat along the interface between the anisotropic conductive member 30 and the other members. Therefore, the bubbles are discharged to the outside through the release agent arrangement region. Therefore, in the light-emitting device 1, it is possible to reduce the problems associated with the movement of bubbles, for example, the risk of an air layer being formed at the interface between the light-emitting element 50 and the sealing resin 60, and reduce the occurrence of a decrease in light output and the like. can do.

[Method for Manufacturing Light Emitting Device]
Hereinafter, a method for manufacturing the light emitting device 1 according to the first embodiment of the present invention will be described with reference to FIGS. 3A to 3E. The manufacturing method of the light emitting device 1 includes a substrate preparation step (FIG. 3A), a release agent placement step (FIG. 3B), an anisotropic conductive member placement step (FIG. 3C), and a light emitting element joining step (FIG. 3D). The sealing resin forming step (FIG. 3E) is sequentially performed.

  In the substrate preparation step, for example, as shown in FIG. 3A, a substrate 10 is prepared in which at least a pair of wiring parts 20 are formed on a base 11 with a bonding layer 12 therebetween.

  For example, in the present embodiment, first, a metal foil is formed on the substrate 11 via the adhesive layer 12, and then a resist layer is formed by printing or the like so as to cover almost the entire surface of the metal foil and dried. Next, a mask having an opening is disposed on the resist layer.

  Next, exposure is performed by irradiating light (ultraviolet light) to the mask and the resist in the opening of the mask using an exposure apparatus, and then the mask is removed and developed. As a result, the resist layer in the region irradiated with light (or the region covered with the mask) is removed, and a resist layer having an opening is formed. The metal foil is exposed in the opening. Next, using the resist layer in which the opening is formed as a mask, the metal foil exposed in the opening of the resist layer is etched, whereby the metal foil corresponding to the resist opening is removed. As a result, the upper surface (adhesive layer 12) of the base 11 is exposed, and this exposed portion becomes a portion other than the gap G and the wiring portion 20, and becomes a substrate 10 having a pair of wiring portions 20 having the gap G (see FIG. 1A). .

  In the mold release agent arranging step, for example, as shown in FIG. 3B, from a position facing the lower surface of the anisotropic conductive member 30 in a plan view to a position of the end portion of the sealing resin 60 facing the sealing resin 60. In the gap G, a release agent 41 (see FIG. 1B) is applied in a linear form. More specifically, in the release agent arranging step, the position corresponding to the position immediately below the light emitting element 50 to the position corresponding to the end of the sealing resin 60, that is, in the gap G corresponding to the radius of the sealing resin 60. A release agent 41 is applied and provided. Here, in the releasing agent arranging step, the releasing agent 41 can be applied by, for example, a potting (dropping) method, a compression molding method, a printing method, a transfer mold method, a jet dispensing method, a spray method, or the like. In addition, since the position to the edge part of the sealing resin 60 becomes equivalent to the outer shape part of the wiring part 20 here, the release agent 41 is in the range from the center of the pair of wiring parts 20 to the outer shape part. It is provided in the gap G. Further, since the anisotropic conductive member 30 and the sealing resin 60 are usually applied in a paste-like, liquid-like, soft or fluid state, the end positions are not always constant. Absent. Therefore, the release agent placement region 40 can be reliably formed by applying the release agent 41 to a certain length longer than the expected range. Furthermore, the one end part of the mold release agent 41 comes to be located directly under the light emitting element 50 to be described later. Here, the term “directly under the light emitting element 50” does not need to be the center of the light emitting element 50, and may be a position facing the light emitting element 50.

In the anisotropic conductive member arrangement step, for example, as shown in FIG. 3C, a paste-like anisotropic conductive member 30 is applied to the central portion on the pair of wiring portions 20. More specifically, in the anisotropic conductive member arranging step, on a circular region including a part of the release agent 41 and a part of the gap G at a position which is the center of the pair of wiring parts 20 in a plan view. The paste-like anisotropic conductive member 30 is applied. Here, in the anisotropic conductive member arranging step, the paste-like anisotropic conductive member 30 is applied and provided by, for example, a potting (dropping) method, a compression molding method, a printing method, a transfer mold method, a jet dispensing method, or the like. Can do.
In the anisotropic conductive member arranging step, a necessary amount of the anisotropic conductive member 30 may be provided at one place at a time, but may be provided at one place or a plurality of positions at a plurality of times.

In the light emitting element bonding step, as shown in FIG. 3D, the light emitting element 50 is bonded onto the pair of wiring parts 20 via the anisotropic conductive member 30 so as to straddle the gap G between the pair of wiring parts 20. More specifically, in the light emitting element bonding step, the light emitting element 50 is disposed on the anisotropic conductive member 30 before curing with the electrode 51 facing downward, and thermocompression bonding is performed from above the light emitting element 50. As a result, the light emitting element 50 is bonded to the pair of wiring portions 20. In this light emitting element bonding step, the anisotropic conductive member 30 is solidified in a state where the conductive particles 32 in the translucent resin 31 are crushed (see FIG. 1A). The light emitting element 50 is connected to the wiring part 20 through the conductive particles 32.
Note that the anisotropic conductive member 30 is provided in a larger area than the light emitting element 50 by crushing the paste-like anisotropic conductive member 30 during the pressurization.

  In the sealing resin forming step, for example, as illustrated in FIG. 3E, the substrate 10, the anisotropic conductive member 30, and the light emitting element 50 are covered with the sealing resin 60. More specifically, in the sealing resin forming step of the present embodiment, the sealing resin 60 is formed in a dome shape so as to substantially include the circular regions of the pair of wiring portions 20 in plan view. Here, in the sealing resin forming step, the sealing resin 60 can be formed by, for example, a potting method, a compression molding method, a printing method, a transfer molding method, a jet dispensing method, a spray method, or the like. The release agent 41 is provided at a position facing or facing the lower surface of the sealing resin 60. And the mold release agent 41 forms the mold release agent arrangement | positioning area | region 40 between the anisotropic conductive members 30 and between the sealing resin 60. FIG. The shape of the sealing resin 60 is not particularly limited as long as the anisotropic conductive member 30 and the light emitting element 50 are sealed, and the release agent placement region 40 is disposed even outside the sealing resin 60.

According to the manufacturing method of the light emitting device 1 that performs the above steps, the release agent 41 is provided in the gap G of the wiring portion 20 from the anisotropic conductive member 30 to the outside of the sealing resin 60. An arrangement region 40 is formed. Therefore, when the anisotropic conductive member 30 is used, there is a cavity that may be formed at the interface between the anisotropic conductive member 30 and the bubbles that expand and move from the cavity due to heat during driving. Even if it exists, the mold release agent arrangement | positioning area | region 40 formed along the interface between the members which face the anisotropic conductive member 30 can discharge | emit a bubble more reliably outside. Therefore, it is not necessary to machine holes, grooves and the like in each component of the light emitting device 1 as compared with the conventional device. And in the manufacturing method of the light-emitting device 1, an air layer is not formed in the interface of the light emitting element 50 and the sealing resin 60 of the manufactured light-emitting device 1, and troubles, such as a fall of the light output of the light-emitting device 1, are prevented. Can do.
In the above manufacturing method, the sealing resin forming step may be omitted depending on the configuration of the light emitting device. When the sealing resin molding step is omitted, the release agent 41 is provided up to the end of the anisotropic conductive member 30 in the gap G or on the wiring portion 20.

Second Embodiment
The configuration of the light emitting device 1A according to the second embodiment will be described with reference to FIG. The light emitting device 1A is different from the above-described light emitting device 1 in the parting agent arrangement region 40A to which the parting agent 41A is applied. That is, the release agents 41A provided at two locations of the light emitting device 1A are, as shown in FIG. 4, first release agents (first release agent portions) 41a provided along the outer shape of the light emitting element 50, respectively. And a second release agent (second release agent part) 41b provided up to the position of the end of the sealing resin 60 continuously to the first release agent part 41a. In the light emitting device 1 </ b> A, the release agent 41 </ b> A is provided at a position that is point-symmetric with respect to the center of the light emitting element 50. Note that the release agent 41A is applied linearly over both the wiring portion 20 and the gap G as shown here.

  The first release agent portion 41a of the present embodiment forms a first release agent placement region 40a that collects bubbles that expand and move from the already formed cavities and guides them to the second release agent placement region 40b. ing. More specifically, as shown in FIG. 4, the first release agent part 41 a extends along the one side of the light emitting element 50 in a region below the anisotropic conductive member 30 at the position of the one side. It is provided in the shape. The first release agent part 41 a is provided over one upper side of the pair of wiring parts 20, the gap G, and the other upper side of the pair of wiring parts 20. The first release agent portion 41a is a path through which bubbles can pass along the provided first release agent portion 41a by providing a linear shape between the first release agent portion 41a and the anisotropic conductive member 30. The agent arrangement region 40a is formed.

  The 2nd mold release agent part 41b forms the 2nd mold release agent arrangement | positioning area | region 40b which discharges | emits the bubble collected by the 1st mold release agent arrangement | positioning area | region 40a outside. More specifically, as shown in FIG. 4, the second release agent portion 41 b is formed on the upper side of one (the other) of the pair of wiring portions 20 from the end portion of the anisotropic conductive member 30. It is provided linearly to the end. The second release agent part 41 b forms a second release agent placement region 40 b that is a path through which bubbles can pass between the second release agent part 41 b and the sealing resin 60.

  When manufacturing 1 A of light-emitting devices of this embodiment, the mold release agent arrangement | positioning area | region 40A can be formed by passing through the following processes. In the release agent arranging step in the manufacturing method of the light emitting device 1 described above, the release agent 41A is provided with the first release agent portion 41a at least along the portion where the light emitting element 50 is installed, and is continuously sealed. The second release agent portion 41 b is provided up to the portion corresponding to the end portion of the resin 60. (1st, 2nd mold release agent arrangement | positioning process). And an anisotropic conductive member arrangement | positioning process and a sealing resin formation process are performed, and the 1st mold release agent arrangement | positioning area | region 40a is formed between the 1st mold release agent part 41a and the anisotropic conductive member 30. FIG. At the same time, a second release agent placement region 40b is formed between the second release agent portion 41b and the sealing resin 60.

  Since the light emitting device 1A having the above-described configuration has a wider area to which the release agent 41A is applied than the above light emitting device 1, the light emitting device 1A is heated from the cavity at the interface with the anisotropic conductive member 30. When the bubbles move, the release agent placement region 40A formed at the interface facing the anisotropic conductive member 30 can reliably discharge the bubbles to the outside.

<Third Embodiment>
The configuration of the light emitting device 1B according to the third embodiment will be described with reference to FIG. The light emitting device 1B is different from the above light emitting device 1 in the area where the release agent 41 is applied. That is, the release agent 41B of the light emitting device 1B is linearly formed on the wiring portion 20 from the position of the end of the anisotropic conductive member 30 to the position of the end of the sealing resin 60 as shown in FIG. Is provided. And the mold release agent arrangement | positioning area | region 40B which a bubble can pass between the mold release agent 41B and the anisotropic conductive member 30 is formed. Therefore, when a cavity exists at the interface between the anisotropic conductive member 30 and the release agent 41B or the like, when the bubbles move in the cavity due to heat during operation, the bubbles are sealed from the release agent placement region 40B where the bubbles easily pass. It is possible to exhaust to the outside of the stop resin 60. As described above, the release agent 41 </ b> B only needs to be applied on the wiring part 20 and at least one of the gaps G, and even if it is applied only on the wiring part 20, there is an effect.

  When the light emitting device 1B is manufactured, the release agent placement region 40B is sealed from a position corresponding to the outer peripheral portion where the anisotropic conductive member 30 is placed in the release agent placement step in the method for manufacturing the light emitting device 1 described above. The release agent 41 </ b> B can be formed on one of the wiring portions 20 of the pair of wiring portions 20 up to a position corresponding to the end portion of the stop resin 60. In addition, it becomes possible to form the mold release agent arrangement | positioning area | region 40B reliably by apply | coating the length which the mold release agent 41B provides to some extent rather than the range assumed.

The light-emitting device 1B having the above-described configuration is a bubble that moves by heat from a cavity such as the interface between the anisotropic conductive member 30 and the release agent 41B with a simpler configuration than the light-emitting device 1 described above. Can be discharged to the outside. That is, when there is a cavity at a position that becomes the interface of the anisotropic conductive member 30 and bubbles move, the bubbles move along the interface. For this reason, the continuous release agent placement region 40B is formed at the interface of the anisotropic conductive member 30, so that the bubbles are exhausted to the outside from the release agent placement region 40B where the bubbles easily move and pass along the interface. Will be.
Note that the release agent placement region 40B of the light-emitting device 1B shown in FIG. 5 is provided in a direction obliquely below the light-emitting element 50, but the sealing resin starts from the position of the end of the anisotropic conductive member 30. The release agent placement region 40B may be provided anywhere as long as it is on the wiring portion 20 up to the position of the end portion of 60. In addition, the release agent placement region 40B is provided only on one upper side of the pair of wiring parts 20, but may be provided on one side and the other upper side of the pair of wiring parts 20, respectively. By providing the release agent arrangement regions 40B in two places in this way, the effect of discharging cavities such as the interface between the anisotropic conductive member 30 and the release agent 41B is further improved.

<Fourth embodiment>
[Configuration of light emitting device]
The configuration of the light emitting device 1C according to the fourth embodiment will be described with reference to FIG. As shown in FIG. 6, the light emitting device 1 </ b> C includes a reflective material layer (reflective member) 70 in addition to the configuration of the light emitting device 1 described above (see FIG. 1A). Although not shown, the region where the release agent 41 is applied in the light emitting device 1C is the release agent placement region 40, shown in FIG. 2, FIG. 4 and FIG. Either 40A or 40B may be used.

  The reflective material layer 70 is for reflecting light from the light emitting element 50. As shown in FIG. 6, the reflective material layer 70 is provided on the wiring portion 20 and the substrate 10 other than the bonding region J to which the light emitting element 50 is bonded. The details of the reflective material layer 70 will be described later in the description of the manufacturing method.

Examples of the reflective material of the reflective material layer 70 include epoxy resin, silicone resin, modified silicone, urethane resin, oxetane resin, fluororesin, acrylic, polycarbonate, polyimide, polyphthalamide, etc., TiO ₂ , ZrO ₂ , Al ₂ O ₃ , A material containing a reflective material such as SiO ₂ can be used. Further, the thickness of the reflective material layer 70 is not particularly limited, and can be formed with any thickness depending on the purpose and application. By providing such a reflective material layer 70, the light emitting device 1C can reflect the light emitted from the light emitting element 50, and can improve the light output.

[Method for Manufacturing Light Emitting Device]
Hereinafter, a method for manufacturing the light emitting device 1 </ b> C according to the fourth embodiment will be described with reference to FIGS. 7A to 7F. The manufacturing method of the light emitting device 1C includes a substrate preparation step (FIG. 7A), a reflective material layer formation step (FIG. 7B), a release agent placement step (FIG. 7C), and an anisotropic conductive member placement step (FIG. 7D). Then, a light emitting element bonding step (FIG. 7E) and a sealing resin forming step (FIG. 7F) are performed. Since the manufacturing method of the light emitting device 1C is the same as the manufacturing method of the light emitting device 1 described above (see FIG. 3) except for the reflective material layer forming step, the reflective material layer forming step will be mainly described below.

  As shown in FIG. 7B, the reflective material layer forming step is included in the substrate preparing step for preparing the substrate 10, and the reflective material layer 70 that reflects light is connected to the wiring portion 20 other than the bonding region J to which the light emitting element 50 is bonded. It is provided on the top and the substrate 10. That is, after the wiring portion 20 is formed on the substrate 10 (see FIG. 7A), the reflective material is applied while masking the predetermined junction region J of the light emitting element 50 in the reflective material layer forming step, as shown in FIG. 7B. A reflective material layer 70 is provided. Here, in the reflective material layer forming step, the reflective material can be provided by, for example, a printing method, a coating method, a spray method, or the like, with the bonding region J being masked.

  Then, after the reflective material layer 70 is provided in the reflective material layer forming step and the mask is removed, as shown in FIG. 7C, the gap G between the reflective material layer 70 and the bonding region J is formed in the release agent arranging step. A release agent 41 (see FIG. 6) is applied linearly over the top. Here, also in the light emitting device 1C, the release agent 41 is linearly formed along the gap G in the same manner as the light emitting device 1 described above, but the lower side of the release agent 41 is on the gap G and on the reflective material layer 70. become. That is, in the light emitting device 1 </ b> C, in the region where the reflective material layer 70 is provided on the gap G, the release agent placement region 40 is provided between the reflective material layer 70 and the anisotropic conductive member 30 or the sealing resin 60. In a region where the reflective material layer 70 is not provided on the gap G (bonding region J), a release agent arrangement region 40 is formed between the gap G (inside the gap G) and the anisotropic conductive member 30. Is done.

  Then, the light emitting device 1C is manufactured through an anisotropic conductive member arranging step (FIG. 7D), a light emitting element bonding step (FIG. 7E), and a sealing resin forming step (FIG. 7F). According to the method for manufacturing the light emitting device 1C performing such a process, even if a cavity due to bubbles exists in the anisotropic conductive member 30, anisotropy occurs when the bubbles in the cavity move due to heat during driving. It moves along the interface with the conductive member 30. Therefore, bubbles can be removed through the release agent arrangement region 40 formed at a position along the interface of the anisotropic conductive member 30, and the reflective material layer 70 is formed in addition to the bonding region J of the light emitting element 50. By doing so, it is possible to provide the light emitting device 1C with improved light output.

  The light-emitting device and the manufacturing method thereof according to the embodiments have been described with specific configurations as examples. However, the gist of the present invention is not limited to these descriptions, and is based on the descriptions in the claims. Must be interpreted widely. Needless to say, various changes and modifications based on these descriptions are also included in the spirit of the present invention.

  For example, in the above-described light emitting devices 1 to 1C, as shown in FIGS. 1A and 6, the wiring portion 20 is bonded to one surface of the base 11 via the adhesive layer 12, and the configuration of the substrate 10 and the wiring portion 20 is total. In addition to this, in addition to this, a metal layer may be provided on the other surface of the substrate 11 via another adhesive layer or the like, and a total of five layers may be formed. The above-mentioned “the other surface of the substrate 11” means a surface opposite to the surface on which the light emitting element 50 side of the substrate 11 is mounted.

  In this case, the metal layer provided in the lowermost layer is for improving the mechanical strength and heat dissipation of the substrate 10 as a part of the base, and for example, aluminum and its alloy can be used. Further, as the adhesive layer for adhering the substrate 11 and the metal layer, for example, a urethane resin, an epoxy resin, or the like can be used similarly to the adhesive layer 12 described above.

  Further, as shown in FIG. 2, in the light emitting devices 1 and 1 </ b> A, the release agent placement region 40 is provided in the gap G extending to the position of the length of the radius of the sealing resin 60 by the release agent 41. However, the formation range of the release agent placement region 40 is not limited to this.

  For example, the release agent placement region 40 may be provided with the release agent 41 in the gap G extending to the position of the length of the diameter of the sealing resin 60. The release agent 41 may be provided in the gap G from a position exceeding one end of the sealing resin 60 to a position exceeding the other end. Further, when the release agent 41 is provided so as to exceed the diameter of the sealing resin 60, when the light emitting device includes the reflective material layer 70 (see FIG. 6), the surface of the reflective material layer 70 where the gap G is located and the bonding region. What is necessary is just to provide over J.

  Thus, by providing the release agent 41 beyond the length of the diameter of the sealing resin 60, the lower side of the anisotropic conductive member 30 below the light emitting element 50, which becomes an interface where cavities due to bubbles tend to occur. The mold release agent arrangement region 40 can be formed so as to be longitudinally cut. Therefore, in the light emitting device, the area of contact between the release agent placement region 40 and the bubbles moving from the cavity in the anisotropic conductive member 30 increases, and the position of one end and the other end of the sealing resin 60 are increased. Since two bubble outlets are formed at the position, the bubbles are more easily discharged to the outside.

  Further, the release agent arrangement region 40 may be provided in the gap G from the position of the end portion of the anisotropic conductive member 30 to the position of the end portion of the sealing resin 60. In this case, the releasing agent arranging step in manufacturing the light emitting device may be performed after the anisotropic conductive member arranging step. Even if the release agent placement region 40 is shorter than the light emitting device 1 shown in FIG. 2, the release agent placement region is at least in the range from the end of the anisotropic conductive member 30 to the end of the sealing resin 60. If the region 40 is formed, it becomes easy to provide an escape path to the bubbles moving from the cavity that is likely to be formed at the interface of the anisotropic conductive member 30 and to discharge the bubbles to the outside.

  In the light emitting device 1, as shown in FIG. 2, the release agent 41 is provided in the gap G from the position immediately below the light emitting element 50 to the end position of the sealing resin 60. The mold material 41 may be provided in the gap G from a position immediately below the light emitting element 50 and extended to the outside of the sealing resin 60. As shown in FIG. 5, in the light emitting device 1 </ b> B, the release agent placement region 40 </ b> B formed by the release agent 41 </ b> B is positioned from the end position of the anisotropic conductive member 30 to the end position of the sealing resin 60. The release agent 41B is, for example, on the wiring unit 20 from the position facing the lower surface of the anisotropic conductive member 30 in plan view to the end of the sealing resin 60. It may be provided.

  Furthermore, as shown in FIGS. 2, 4, and 5, the light emitting devices 1 to 1 </ b> C are configured such that one light emitting element 50 is disposed on one substrate 10 and the wiring portion 20 is a circular region. The linear regions extending from the circular region to the left and right ends of the substrate 10 are configured, but the configurations of the substrate 10 and the wiring unit 20 are not limited thereto.

  For example, as shown in FIGS. 8A to 8C, a plurality of pairs of wiring parts 20A may be formed on a single long substrate 10A, and the light emitting element 50 may be joined to each of the wiring parts 20A. Absent. In this case, the substrate 10A of the light emitting device 1D is a flexible substrate that is flexible and can be bent and deformed, and is made of, for example, polyethylene terephthalate (PET) or polyimide (PI). As shown in FIG. 8A, a wiring portion 20A is provided on the substrate 10A.

  The wiring portion 20A of the light emitting device 1D is made of, for example, aluminum in order to increase the reflectance, and one or the other of the pair of wiring portions 20A to which the light emitting element 50 is bonded is adjacent to the light emitting element 50. It is comprised so that it may serve as the other or one of a pair of wiring part 20A joined. That is, in the light emitting device 1D, as shown in FIG. 8A, one wiring part 20Ab that joins the central light emitting element 50b becomes the other wiring part 20Ab that joins the light emitting element 50a adjacent to the left side in the drawing. It is configured as follows. Similarly, the light emitting device 1D is configured such that the other wiring part 20Ac that joins the central light emitting element 50b becomes one wiring part 20Ac that joins the light emitting element 50c adjacent to the right side in the drawing. Yes. Note that reference numerals 20Ab and 20Ac and reference numerals 50a, 50b, and 50c in FIG. 8A are used for convenience to distinguish the positions of the wiring portion 20A and the light emitting element 50, and have the same configuration.

  Even in the light emitting device 1 </ b> D having such a configuration, the release agent placement regions 40 to 40 </ b> C are formed from the anisotropic conductive member 30 to the outside of the sealing resin 60 similarly to the light emitting devices 1 to 1 </ b> C described above. Thus, if there is a cavity at the interface between the anisotropic conductive member 30 and the other member, and the bubbles in the cavity expand and move due to heat, the bubbles that move along the interface between the members are exposed to the outside. Can be discharged. As shown in FIGS. 8A to 8C, the light emitting device 1D is provided with only the wiring portion 20 on the substrate 10A. However, like the light emitting device 1C (see FIG. 6), a reflective material layer is further provided. 70 may be provided. In this case, the wiring part 20A of the light emitting device 1D is made of, for example, copper.

  In the light emitting device 1B shown in FIG. 5, two or three release agent placement regions 40B are provided by the release agent 41B provided from the end of the anisotropic conductive member 30 to the end of the sealing resin 60. A configuration may be adopted in which four or the like are provided at equal intervals. In addition, when providing the some release agent 41B, the part of the release agent (function similar to the 1st release agent part of FIG. 2) of predetermined length along the outer periphery of the anisotropic conductive member 30 is provided. As a result, the ability to discharge bubbles is improved. Further, in the light emitting device 1A shown in FIG. 4, two release agent placement regions 40A are provided in pairs, two on each of the upper side and the lower side of the light emitting element 50, but either one may be used.

  Furthermore, in the release agent arranging step in the method for manufacturing the light emitting device 1A of FIG. 4, the first release agent portion 41a and the second release agent portion 41b may be provided at different timings. That is, in the release agent arranging step, the first release agent portion 41a is formed along the portion where the light emitting element 50 is installed (first release agent arranging step). And between the anisotropic conductive member arrangement | positioning process and sealing resin formation process, it continues to the 1st mold release agent part 41a and the 2nd mold release agent part 41b to the position corresponding to the edge part of the sealing resin 60. It may be provided (second release agent arranging step). Note that the release agents 41, 41A to 41C may be provided so as to extend beyond the end of the sealing resin 60, and the width and shape (linear shape) provided are not particularly limited. That is, when the light emitting element 50 is provided via a viscous member such as the anisotropic conductive member 30, the release agents 41 and 41 </ b> A to 41 </ b> C move the interface between the members by heat from the cavity generated in the viscous member. The width, shape, and length provided are not limited as long as the bubbles to be discharged can be discharged.

  Further, as described above, the anisotropic conductive member 30 described above has a light-transmitting thermosetting resin or light reflecting material as a main component, and more preferably a thermosetting resin as a main component. Thus, light absorption by the anisotropic conductive member can be prevented to the maximum. Moreover, in such a light-transmitting thermosetting resin, since the light reflecting material is more uniformly distributed than the solder, not only the light absorption by the solder is minimized, but also the wiring. In the meantime, light irradiation to the base 11 can be minimized, and deterioration of the substrate 10 can be avoided. Furthermore, even when light emitted from the light emitting element 50 is not directly reflected by the anisotropic conductive member 30 and reflected, that is, when reflected / scattered light from the peripheral member enters the anisotropic conductive member 30 again, Light can be reflected efficiently.

  The anisotropic conductive member 30 preferably contains, for example, 25 to 85 parts by weight of a thermosetting resin, 5 to 30 parts by weight of solder, and 10 to 70 parts by weight of a light reflecting material. It is more preferable that 35 to 85 parts by weight, 5 to 30 parts by weight of solder, and 10 to 40 parts by weight of light reflecting material are contained.

1, 1A, 1B, 1C, 1D Light emitting device 10, 10A Substrate 11 Base (resin layer)
12 Adhesive layer 20, 20A, 20Ab, 20Ac Wiring part 30 Anisotropic conductive member 31 Translucent resin 32 Conductive particles 40, 40A, 40B, 40C Release agent placement region 40a First release agent placement region 40b Second release Mold release regions 41, 41A, 41B, 41C Release agent 41a First release agent part (first release agent)
41b Second release agent part (second release agent)
50, 50a, 50b, 50c Light-emitting element 51 Electrode 60 Sealing resin 70 Reflective material layer G Gap J Bonding region

Claims (10)

A substrate having at least a pair of wiring portions disposed apart from each other on the substrate;
A light-emitting element bonded onto the pair of wiring parts via an anisotropic conductive member;
A sealing resin for sealing the light emitting element ,
Have a release agent disposed on at least one of the gap the upper wiring portions and the pair of the wiring portions are separated from each other,
The release agent is arranged to face the lower side of the sealing resin, and on the wiring part from the position facing the lower surface of the anisotropic conductive member in a plan view to the end of the sealing resin. A light emitting device provided . A substrate having at least a pair of wiring portions disposed apart from each other on the substrate;
A light-emitting element bonded onto the pair of wiring parts via an anisotropic conductive member;
A sealing resin for sealing the light emitting element,
A release agent provided on at least one of the wiring part and a gap between the pair of wiring parts,
The release agent is arranged to face the lower side of the sealing resin, and from the position directly below the light emitting element at the position facing the lower surface of the anisotropic conductive member in plan view, the end of the sealing resin light emission device provided in the gap of the position to the. In plan view, the sealing resin is circular, the light emitting element is provided at a central portion of the sealing resin, and the gap is provided at a position corresponding to the diameter of the sealing resin, The light-emitting device according to claim 2 , wherein the release agent is provided in the gap from a position immediately below the light-emitting element and extended to the outside of the sealing resin. The release agent includes a first release agent portion that follows the outer shape of the light emitting element in a plan view, and a second release agent that is continuous with the first release agent portion and extends to an end portion of the sealing resin. the light emitting device as claimed in any one of claims 3 having a section, a. Before SL reflective material layer for reflecting light emitted from the light emitting element is provided on the on the wiring portion other than the junction area is joined with the light-emitting element and the substrate,
The releasing agent in the non-pre-Symbol junction region, the light emitting device according to any one of claims 1 to 4 is provided on the reflective material layer. A substrate preparation step of preparing a substrate in which at least a pair of wiring portions are provided apart from each other on a base;
An anisotropic conductive member arrangement step of arranging an anisotropic conductive member on the substrate;
A light emitting element bonding step of bonding a light emitting element on the pair of wiring portions via the anisotropic conductive member;
A sealing resin forming step of covering the anisotropic conductive member and the light emitting element with a sealing resin after the light emitting element bonding step ;
Before the anisotropic conductive member arranging step, at a position opposed to the lower surface of the anisotropic conductive member in a plan view, further seen containing a release agent disposing step of disposing the mold release agent to at least a linear,
The method for manufacturing a light emitting device, wherein in the releasing agent arranging step, the releasing agent is provided from the lower surface of the anisotropic conductive member to the end portion of the sealing resin in a plan view . A substrate preparation step of preparing a substrate in which at least a pair of wiring portions are provided apart from each other on a base;
An anisotropic conductive member arrangement step of arranging an anisotropic conductive member on the substrate;
A light emitting element bonding step of bonding a light emitting element on the pair of wiring portions via the anisotropic conductive member;
A sealing resin forming step of covering the anisotropic conductive member and the light emitting element with a sealing resin after the light emitting element bonding step;
Before the anisotropic conductive member placement step, further includes a release agent placement step of placing the release agent at least linearly at a position facing the lower surface of the anisotropic conductive member in plan view,
In the release agent disposing step, the production method of the anisotropic conductive member end the releasing agent you place a light emission device on the wiring part to the position of the end portion of the sealing resin from the position of . The releasing agent disposing step, from the position directly below the light emitting element to the position of the end portion of the sealing resin, according to claim 6 or claim 7 placing the releasing agent in the gap to the wiring portion spaced A method for manufacturing the light emitting device according to claim 1. In plan view, the sealing resin is circular, the light emitting element is provided at the center of the sealing resin, and the gap extends to the outside of the sealing resin at a position corresponding to the diameter of the sealing resin. Extended,
The method for manufacturing a light emitting device according to claim 8 , wherein in the releasing agent arranging step, the releasing agent is arranged in the gap so as to extend to the outside of the sealing resin. In the substrate preparing step, the substrate is provided further the on the wiring portion other than the bonding region for bonding the light emitting element and the substrate, a reflective material layer which reflects light before Symbol emitting element,
The light emitting device according to any one of claims 6 to 9 , wherein, in the releasing agent arranging step, the releasing agent is arranged linearly over the reflective material layer and between the bonding regions. Manufacturing method.

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