JP6396199B2 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
- Publication number
- JP6396199B2 JP6396199B2 JP2014255974A JP2014255974A JP6396199B2 JP 6396199 B2 JP6396199 B2 JP 6396199B2 JP 2014255974 A JP2014255974 A JP 2014255974A JP 2014255974 A JP2014255974 A JP 2014255974A JP 6396199 B2 JP6396199 B2 JP 6396199B2
- Authority
- JP
- Japan
- Prior art keywords
- air
- unit
- processing apparatus
- laser processing
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012545 processing Methods 0.000 title claims description 59
- 238000001816 cooling Methods 0.000 claims description 71
- 238000005192 partition Methods 0.000 claims description 34
- 230000003287 optical effect Effects 0.000 claims description 19
- 230000002265 prevention Effects 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 5
- 244000241838 Lycium barbarum Species 0.000 claims 1
- 235000015459 Lycium barbarum Nutrition 0.000 claims 1
- 235000015468 Lycium chinense Nutrition 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 235000012907 honey Nutrition 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Landscapes
- Laser Beam Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014255974A JP6396199B2 (ja) | 2014-12-18 | 2014-12-18 | レーザ加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014255974A JP6396199B2 (ja) | 2014-12-18 | 2014-12-18 | レーザ加工装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016112612A JP2016112612A (ja) | 2016-06-23 |
| JP2016112612A5 JP2016112612A5 (cg-RX-API-DMAC7.html) | 2018-02-01 |
| JP6396199B2 true JP6396199B2 (ja) | 2018-09-26 |
Family
ID=56140532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014255974A Active JP6396199B2 (ja) | 2014-12-18 | 2014-12-18 | レーザ加工装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6396199B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3410549B1 (en) * | 2016-01-26 | 2022-08-31 | FUJIFILM Corporation | Laser device |
| CN115070218B (zh) * | 2022-06-27 | 2025-07-04 | 武汉中谷联创光电科技股份有限公司 | 一种激光标刻设备 |
| JP7787048B2 (ja) * | 2022-09-22 | 2025-12-16 | 東芝テック株式会社 | 電子機器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747184Y2 (ja) * | 1990-02-23 | 1995-11-01 | ミヤチテクノス株式会社 | レーザ加工装置 |
| JPH09206308A (ja) * | 1996-01-31 | 1997-08-12 | Matsushita Electric Ind Co Ltd | レーザメス装置 |
| JPH10229990A (ja) * | 1997-02-20 | 1998-09-02 | Olympus Optical Co Ltd | レーザプローブ |
| JP4603936B2 (ja) * | 2005-05-31 | 2010-12-22 | 財団法人光科学技術研究振興財団 | レーザ加工装置 |
| JP4860227B2 (ja) * | 2005-10-04 | 2012-01-25 | 浜松ホトニクス株式会社 | 半導体レーザ装置 |
-
2014
- 2014-12-18 JP JP2014255974A patent/JP6396199B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016112612A (ja) | 2016-06-23 |
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