JP6396199B2 - Laser processing equipment - Google Patents

Description

  The present invention relates to a laser processing apparatus including a heat exchanger that cools an LD unit.

  Conventionally, a laser processing apparatus that directly irradiates a workpiece with laser light output from a laser diode (LD: Laser Diode) through an optical system such as an optical fiber is suitably used for soldering or resin welding. Yes. In this type of laser processing apparatus, it is necessary to cool the LD in order to suppress the degradation of the LD performance and the shortening of the service life. Conventionally, for example, a water cooling method has been used as a method for cooling an LD. However, since the cooling water channel is complicated, there is a risk of water leakage.

  In Patent Document 1, an LD is disposed on one surface of a metal substrate via a Peltier element and a heat sink, and a heat radiation fin is provided on the other surface of the substrate, and the heat radiation fin is forcibly cooled by a cooling fan. Thus, a technical idea for cooling the LD is disclosed.

JP 2005-166735 A

  By the way, in the laser processing apparatus mentioned above, the high output of the processing fiber end is desired. When the output of the LD is increased to meet such demands, the heat generation position (heat generation range) is concentrated because the heat generation amount of the LD alone increases.

  If it does so, LD may not fully be cooled by the cooling system like said patent document 1 which blows the air of normal temperature to a radiation fin.

  The present invention has been made in consideration of such problems, and a laser processing apparatus capable of efficiently air-cooling an LD with a simple configuration, thereby achieving an increase in the output of the LD. The purpose is to provide.

A laser processing apparatus according to the present invention includes an LD unit including a laser diode, a heat exchanger provided in the LD unit for cooling the LD unit, a housing for housing the LD unit and the heat exchanger, In the laser processing apparatus comprising: the housing houses an optical member to which laser light oscillated from the LD unit is guided, an upper case that houses the optical member, the LD unit, and the heat exchanger. A lower case, and a partition wall formed with ventilation that communicates the internal space of the lower case and the internal space of the upper case, and sucks and cools the air in the lower case into the upper case a cooling unit that blows, and a blower means for guiding air blown from the cooling unit to the heat exchanger, the air blowing means, before the air in the lower case A cooling fan for guiding into the upper casing, wherein the air in the upper case includes an intermediate fan for guiding in the lower case, the air blown from the cooling unit, the heat while suppressing the temperature rise of the optical member The exchanger is cooled.

According to such a configuration, air (cold air) cooled by the cooling unit can be efficiently guided from the upper case into the lower case to cool the heat exchanger, and from the LD unit and the heat exchanger, Since heat transfer to the optical member can be suppressed, the heat exchanger is efficiently cooled while suppressing a temperature rise of the optical member, and the laser diode (LD) can be efficiently air-cooled with a simple configuration. As a result, the output of the LD can be increased.

In the laser processing apparatus, the heat exchanger is disposed to face the air suction port of the cooling unit, and the cooling fan is disposed between the heat exchanger and the air suction port. You may guide the air in the said lower case to the said air inlet.

  According to such a configuration, it is possible to efficiently guide the cold air guided from the upper case into the lower case through the vent hole to the heat exchanger.

  In the above laser processing apparatus, the optical member includes a shutter unit that blocks the laser light, and an output measurement unit that measures the output of the laser beam, and the output measurement unit includes air in the cooling unit. The shutter unit may be provided at a position not facing the air outlet, and the shutter unit may be provided at a position facing the air outlet.

  According to such a configuration, the shutter unit can be efficiently cooled and overcooling of the output measuring means can be suppressed.

  In the above laser processing apparatus, the shutter unit includes a shutter unit main body and a support portion that is provided on the partition wall and supports the shutter unit main body, and the vent hole is provided below the shutter unit main body. A through hole that guides the air blown from the air outlet to the vent hole may be formed in a portion of the support portion that faces the air outlet. According to such a configuration, the cool air can be efficiently guided to the shutter unit main body and the vent hole.

  In the laser processing apparatus, the output measuring unit is provided adjacent to the shutter unit, and the air blown from the air outlet is interposed between the output measuring unit and the shutter unit. A guide unit that guides to a side where the shutter unit is located may be provided.

  According to such a configuration, it is possible to efficiently guide cool air to the shutter unit and the vent hole by the guide portion, and it is possible to suitably suppress overcooling of the output measuring means.

  In the laser processing apparatus, a flow hole through which air flows is formed at a position facing the cooling unit in the housing, and air blown from an air outlet of the cooling unit exchanges the heat. A prevention wall may be provided that prevents the air from being led to the air suction port of the cooling section through the flow hole without passing through a vessel.

  According to such a configuration, it is possible to efficiently increase the circulation amount of the cold air to the heat exchanger, so that the cooling efficiency of the LD can be further increased.

  In the above laser processing apparatus, the control unit for controlling the laser light, the internal space of the lower case into an LD chamber in which the LD unit and the heat exchanger are provided, and a control chamber in which the control unit is provided A partition wall for partitioning, and the vent hole may communicate with the LD chamber. According to such a configuration, heat transfer from the LD unit and the heat exchanger to the control unit can be suppressed by the partition walls.

  In the above laser processing apparatus, the LD chamber may be provided with an LD power source for driving the laser diode and a shielding unit for preventing the exhaust of the LD power source from flowing to the heat exchanger. . According to such a structure, it can suppress that the cooling effect of LD falls by exhaust of LD power supply.

  In the above laser processing apparatus, the heat exchanger is supported by the partition wall in a state of being separated from the bottom surface of the lower case, and the exhaust of the LD power source is connected to the cooling unit via a space below the heat exchanger. It may be led to the air inlet. According to such a configuration, the exhaust of the LD power source can be efficiently guided to the air suction port of the cooling unit.

  According to the present invention, since the heat exchanger can be cooled by the air (cold air) cooled by the cooling unit, the LD can be efficiently air-cooled with a simple configuration. As a result, the output of the LD can be increased.

1 is a perspective view of a laser processing apparatus according to an embodiment of the present invention. It is a disassembled perspective view of the laser processing apparatus of FIG. It is a longitudinal cross-sectional view of the laser processing apparatus of FIG. It is a plane sectional view of the laser processing device of FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a laser processing apparatus according to the invention will be described with reference to the accompanying drawings. In the following description, the front-rear and up-down directions follow the directions of the arrows in each figure.

  A laser processing apparatus 10 according to an embodiment of the present invention processes a laser beam output from a laser diode (LD50) by directly irradiating a workpiece through an optical system such as an optical fiber. It is suitably used for soldering or resin welding.

  As shown in FIG. 1, the laser processing apparatus 10 includes a housing 14 formed with a plurality of (four) wheels 12 and formed in a substantially rectangular parallelepiped shape, and a housing 14 provided on the rear surface of the housing 14. And a cooling unit 16 that sucks and cools the air and blows it out into the housing 14.

  As shown in FIG. 2, the housing 14 has a lower case 18 and an upper case 20. The lower case 18 includes a frame 22 formed in a hollow rectangular parallelepiped shape with each surface open, a bottom plate 24 that covers an opening on the lower surface of the frame 22, a front cover 26 that covers an opening on the front surface of the frame 22, a frame A pair of side covers 28 and 30 that cover the openings on both side surfaces of the frame 22 and a rear cover 32 that covers the openings on the rear surface of the frame 22 are included.

  The frame 22 is configured by, for example, connecting elongated metal plates or metal bars to each other. The rear cover 32 is formed with a rectangular long hole (flow hole) 34 extending in the vertical direction.

  The lower case 18 is provided with a partition wall 40 that partitions the internal space 18 a of the lower case 18 into an LD chamber 36 and a control chamber 38. In the present embodiment, the partition wall 40 is positioned between the pair of side covers 28 and 30 and extends in parallel with the side covers 28 and 30. The partition wall 40 is fixed to the frame 22 and is made of, for example, a metal material such as iron. However, the partition wall 40 can be made of an arbitrary material. For example, the partition wall 40 can be made of a resin material having a heat transfer coefficient lower than that of iron and a light weight.

  As shown in FIGS. 2 and 3, the LD chamber 36 is provided with an LD power source 42, an LD unit 44 that oscillates laser light based on a drive current supplied from the LD power source 42, and the LD unit 44. A heat exchanger 46 and a shielding plate (shielding portion) 48 are provided.

  The LD power source 42 is fixed to the bottom plate 24 at a position adjacent to the front cover 26. The LD unit 44 includes one high-power (for example, 100 W or more) LD (laser diode 50. However, the LD unit 44 may include a plurality of LDs 50.

  In this case, the output at the end of the processed fiber 92 (see FIG. 4) can be increased by coupling (bundling or fusing) the optical fibers of the LDs 50. The LD unit 44 is connected to a transmission fiber 52 that transmits laser light oscillated from the LD 50.

  The heat exchanger 46 is for cooling the LD 50 and is formed in a substantially rectangular parallelepiped shape and is larger than the LD unit 44 in a front view (viewed from the direction in which the side cover 28 is located). ing. The heat exchanger 46 has a heat pipe (not shown), a plate on which the LD 50 is installed is provided in the heat receiving part of the heat pipe, and a heat radiating fin is provided in the heat radiating part of the heat pipe.

  Such a heat exchanger 46 is attached to the partition wall 40 via a vibration isolation member 54 in a state of being separated from the bottom plate 24 by a predetermined distance. The anti-vibration member 54 can be comprised with rubber materials, such as honey night (trademark), for example.

  A plurality of (for example, three) cooling fans 56 are attached to the rear surface of the heat exchanger 46 via a frame body 58. The plurality of cooling fans 56 are arranged in the vertical direction. An air suction port 16 a of the cooling unit 16 is located behind the cooling fan 56 through the long hole 34 of the rear cover 32. In other words, the cooling fan 56 is disposed between the air inlet 16 a of the cooling unit 16 and the heat exchanger 46.

  The cooling fan 56 is configured to guide the air in front thereof (air in the lower case 18) to the air suction port 16a. Note that an air outlet 16b is positioned above the air inlet 16a of the cooling unit 16.

  On the upper surface of the frame body 58, a prevention wall 60 extending backward to a position close to the cooling unit 16 is provided. The prevention wall 60 extends over the entire width of the frame body 58, and is positioned above the air intake port 16a and below the air outlet port 16b. Thereby, the air (cold air) blown out from the air outlet 16b is prevented from being guided to the air inlet 16a through the long hole 34 without passing through the heat exchanger 46.

  The shielding plate 48 extends obliquely downward from above the LD power source 42 toward the rear, and extends substantially horizontally from the front to the rear of the heat exchanger 46. The width dimension of the shielding plate 48 is set to be approximately the same as the dimension between the side covers 28 and 30 and the partition wall 40. By providing such a shielding plate 48, the exhaust of the LD power source 42 is suppressed from being guided to the heat exchanger 46. In the control room 38, a control unit 62 for controlling the LD power source 42 (laser light) is disposed.

  The upper case 20 includes a partition wall 64 provided so as to cover the opening on the upper surface of the frame 22, a pair of side walls 66 and 68 erected upward from both sides of the partition wall 64, and a rear portion of the partition wall 64. A rear wall 70 erected upward and an upper cover 72 that covers the partition wall 64 from above are included.

  The partition wall 64 is formed with a vent hole 74 that allows the LD chamber 36 and the internal space 20a of the upper case 20 to communicate with each other. The vent hole 74 is formed in a rectangular shape in plan view, and is located in the middle in the front-rear direction of the partition wall 64. The side walls 66 and 68 extend over the entire length of the partition wall 64. A notch 76 is formed in a part of the rear wall 70 on the side of the side wall 66.

  The notch 76 communicates with the long hole 34 of the rear cover 32. In other words, the notch 76 is positioned in front of the air outlet 16 b of the cooling unit 16. An operation screen (display screen) 78 is provided on the front upper surface of the upper cover 72, and a pair of insertion holes 80 through which the processing fibers 92 are inserted are formed on the rear upper surface of the upper cover 72.

  As shown in FIG. 4, the upper case 20 accommodates an optical member 82 to which the laser light transmitted through the transmission fiber 52 is guided. The optical member 82 includes a shutter unit 84 to which the transmission fiber 52 is coupled, and a power monitor (output measuring means) 86 that measures the output of the laser light.

  The shutter unit 84 includes a shutter unit main body 88 that blocks the laser light from entering the processing fiber 92, and a support portion 90 that supports the shutter unit main body 88. The shutter unit main body 88 branches or blocks the laser light with a lens or the like, and is disposed so as to cover the vent hole 74 from above.

  A processing fiber 92 is connected to the shutter unit main body 88, and the laser light transmitted from the transmission fiber 52 is guided to the processing fiber 92 via the shutter unit main body 88.

  The support portion 90 is a plate-like member extending in the front-rear direction, and a shutter unit main body 88 is fixed to the center thereof, and leg portions 96 and 98 extending downward are formed at both ends thereof. The pair of leg portions 96 and 98 are positioned so as to sandwich the vent hole 74 from the front-rear direction and are locked to the partition wall 64 via the vibration isolation members 100 and 102. The anti-vibration members 100 and 102 can be made of the same material as the anti-vibration member 54 described above.

  Thus, by forming the pair of leg portions 96 and 98 on the support portion 90, a predetermined space is formed above the vent hole 74. A through hole 104 is formed in the leg portion 98 located on the rear side. In other words, the through hole 104 is formed in a portion of the rear leg portion 98 that faces the air outlet 16b of the cooling portion 16. That is, the air blown from the air outlet 16 b is guided to the space below the shutter unit main body 88 through the through hole 104.

  Below the shutter unit main body 88, a plurality of (for example, two) intermediate fans 106 that guide the air in the space below the shutter unit main body 88 (air in the upper case 20) to the LD chamber 36 are provided. These intermediate fans 106 are attached to the frame 22 and the partition wall 40 via a frame body 108 in a state of being arranged side by side in the width direction.

  The power monitor 86 is connected to the shutter unit main body 88 through the optical fiber 110. That is, part of the laser beam branched by the shutter unit main body 88 is guided to the power monitor 86 through the optical fiber 110. The power monitor 86 is provided at a position adjacent to the shutter unit 84 and not facing the air outlet 16b.

  Between the shutter unit 84 and the power monitor 86, a guide plate (guide unit) 112 that guides the air blown from the air outlet 16b of the cooling unit 16 to the shutter unit 84 is provided. The guide plate 112 extends from the center in the front-rear direction to the rear end at the center in the width direction of the partition wall 64. By providing such a guide plate 112, the air blown from the air outlet 16b is prevented from directly hitting the power monitor 86.

  A drain pipe 114 for discharging water in the cooling unit 16 and a drain pan 116 for storing water guided from the drain pipe 114 are provided at the lower part of the cooling unit 16. The drain pan 116 is configured to be transparent or translucent, and the amount of water inside can be visually confirmed. Further, the drain pan 116 is provided with a magnet 118 and can be attached to and detached from the cooling unit 16.

  The laser processing apparatus 10 according to the present embodiment is basically configured as described above. Next, the operation and effects thereof will be described.

  In the laser processing apparatus 10, the control unit 62 drives the LD power source 42 and supplies a drive current to the LD 50, so that laser light oscillates from the LD 50. The laser light oscillated from the LD 50 is guided to the shutter unit main body 88 via the transmission fiber 52 and is incident on the processing fiber 92 via a predetermined optical system path constituted by a mirror or the like. Then, the laser beam incident on the processing fiber 92 is irradiated onto the workpiece via an emission unit (scanner or the like), and soldering, resin welding, or the like is performed.

  When laser light is oscillated from the LD 50, the LD 50 generates heat. In particular, in this embodiment, since the high output LD 50 is used, the heat generation amount of the LD 50 is relatively large and the heat generation position (heat generation range) is concentrated. The LD 50 that has generated heat is air-cooled by the action of the heat exchanger 46, the cooling unit 16, and the air blowing means (the intermediate fan 106 and the cooling fan 56).

  That is, in the laser processing apparatus 10, the air in the LD chamber 36 (air heated by the heat of the LD 50) is sucked from the air suction port 16 a of the cooling unit 16, cooled in the cooling unit 16, and cooled as air. 16b is blown into the upper case 20. Air (cold air) blown out from the air outlet 16b is guided to the shutter unit 84 to cool the shutter unit main body 88.

  At this time, cold air is blown out radially from the air outlet 16b. The cool air toward the side where the power monitor 86 is located is efficiently guided to the shutter unit 84 by the guide plate 112. The cold air that has entered the LD chamber 36 from the air outlet 16b through the long hole 34 is prevented from being sucked into the air inlet 16a by the prevention wall 60. That is, this cold air goes to the heat exchanger 46.

  The cool air guided to the shutter unit 84 is guided to the space below the shutter unit main body 88 through the through holes 104 of the legs 96 and 98. Then, due to the action of the intermediate fan 106, the cold air is forced to flow downward (in the LD chamber 36) through the vent hole 74. The cold air guided by the intermediate fan 106 hits the inclined surface of the shielding plate 48 and flows backward, and is forcibly guided toward the heat exchanger 46 by the action of the cooling fan 56.

  In the heat exchanger 46, the heat generated in the LD 50 is transferred from the heat receiving portion to the heat radiating fin, and the heat radiating fin is cooled by cold air. Thereby, since the heat of the LD 50 is efficiently transferred to the heat exchanger 46, the LD 50 is efficiently air-cooled. The air warmed by the heat of the LD 50 is guided to the air suction port 16a via the cooling fan 56, cooled by the cooling unit 16, and then circulated in the housing 14 again.

  Thus, in this embodiment, cold air flows in the order of the upper case 20, the LD chamber 36, and the heat exchanger 46 (LD50). In other words, since cool air flows from the low temperature area toward the high temperature area, sufficient cool air can be delivered to the heat exchanger 46 while the shutter unit body 88 is efficiently cooled. The cold air led to the LD power source 42 in the LD chamber 36 is led to the cooling unit 16 without passing through the heat exchanger 46.

  By the way, when the cooling unit 16 according to the present embodiment is not provided, for example, when the use environment temperature (external temperature) is 40 ° C., the atmosphere in the upper case 20 is about 40 ° C., and the vicinity of the LD power source 42 in the LD chamber 36. Is about 45 ° C., and the temperature of the LD 50 is about 50 ° C. However, since the laser processing apparatus 10 according to the present embodiment includes the cooling unit 16, for example, when the use environment temperature is 40 ° C., the atmosphere in the upper case 20 and the vicinity of the LD power source 42 in the LD chamber 36. The atmosphere is 40 ° C. or lower, and the temperature of the LD 50 is 30 ° C. or lower.

  According to the present embodiment, since the heat exchanger 46 can be cooled by the air cooled by the cooling unit 16, the LD 50 can be efficiently cooled with a simple configuration. As a result, the output of the LD 50 can be increased.

  Moreover, since the laser processing apparatus 10 includes the air blowing means (the intermediate fan 106 and the cooling fan 56) that guides the air blown from the cooling unit 16 to the heat exchanger 46, the cooling efficiency of the LD 50 can be further increased. .

  Further, the LD unit 44 and the heat exchanger 46 are accommodated in the LD chamber 36 of the lower case 18, and the optical member 82 is accommodated in the upper case 20. Therefore, heat transfer from the LD unit 44 and the heat exchanger 46 to the optical member 82 can be suppressed.

  A vent hole 74 that communicates between the LD chamber 36 and the internal space 20 a of the upper case 20 is formed in the partition wall 64, and cool air is blown out from the air outlet 16 b to the internal space 20 a of the upper case 20. Thereby, since the cool air can be circulated in the upper case 20, the vent hole 74, and the LD chamber 36, the heat exchanger 46 can be efficiently cooled while suppressing the temperature rise of the optical member 82.

  Further, since the intermediate fan 106 is provided, the cool air can be efficiently guided from the upper case 20 into the LD chamber 36. Furthermore, a heat exchanger 46 is provided opposite to the air suction port 16a, and the air in the heat exchanger 46 is guided to the air suction port 16a by a cooling fan 56 provided between the heat exchanger 46 and the air suction port 16a. Therefore, the cold air led into the LD chamber 36 can be efficiently guided to the heat exchanger 46.

  In the present embodiment, the shutter unit 84 is provided at a position facing the air outlet 16 b and the power monitor 86 is provided at a position not facing the air outlet 16 b, and the guide plate 112 is provided between the power monitor 86 and the shutter unit 84. Provided. And the through-hole 104 is formed in the site | part which opposes the air blower outlet 16b among the support parts 90 (leg part 98) which supports the shutter unit main body 88. As shown in FIG. Therefore, the cool air can be efficiently guided to the shutter unit 84 and the vent hole 74. That is, the shutter unit 84 can be efficiently cooled, and overcooling of the power monitor 86 can be suppressed.

  According to the present embodiment, the air blown from the air outlet 16b is prevented by the prevention wall 60 from being guided to the air inlet 16a through the long hole 34 of the rear cover 32 without passing through the heat exchanger 46. Yes. Therefore, since the amount of cold air flowing through the heat exchanger 46 can be increased efficiently, the cooling efficiency of the LD 50 can be further increased.

  Further, since the internal space 18a of the lower case 18 is partitioned into the LD chamber 36 and the control chamber 38 by the partition wall 40 and the control unit 62 is provided in the control chamber 38, the LD unit 44 and the heat exchanger 46 are transferred to the control unit 62. Heat transfer can be suppressed by the partition wall 40.

  Furthermore, since the flow of the exhaust of the LD power source 42 to the heat exchanger 46 is blocked by the shielding plate 48, it is possible to suppress the cooling efficiency of the LD 50 from being lowered by the exhaust of the LD power source 42. Since the heat exchanger 46 is supported on the partition wall 40 in a state of being separated from the bottom plate 24 (bottom surface), the exhaust of the LD power source 42 is efficiently sent to the air suction port 16a through the space below the heat exchanger 46. Can lead to.

  In the present embodiment, since one LD 50 is provided, a transmission fiber 52 and a processing fiber 92 having a small diameter (small inner diameter) can be used as compared with a case where optical fibers of a plurality of LD 50 are coupled. The minimum condensing diameter of the laser beam can be reduced. When the minimum condensing diameter of the laser light is reduced, the maximum swing angle of the scanner mirror provided in the emission unit can be increased, so that the processing area of the laser processing apparatus 10 can be expanded. Further, by reducing the minimum condensing diameter of the laser light, it is possible to cope with further fine processing, and it is possible to set the focal length of the laser light longer.

  The laser processing apparatus according to the present invention is not limited to the above-described embodiment, and it is needless to say that various configurations can be adopted without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Laser processing apparatus 14 ... Housing | casing 16 ... Cooling part 16a ... Air suction inlet 16b ... Air blower outlet 18 ... Lower case 18a, 20a ... Internal space 20 ... Upper case 34 ... Long hole (circulation hole) 36 ... LD chamber 38 ... Control room 40 ... Partition wall 42 ... LD power supply 44 ... LD unit 46 ... Heat exchanger 48 ... Shielding plate (shielding part)
DESCRIPTION OF SYMBOLS 50 ... LD (laser diode) 56 ... Cooling fan 60 ... Prevention wall 62 ... Control part 64 ... Partition wall 74 ... Vent hole 82 ... Optical member 84 ... Shutter unit 86 ... Power monitor (output measurement means) 88 ... Shutter unit main body 90 ... support part 92 ... processed fiber 96, 98 ... leg part 104 ... through hole 106 ... intermediate fan 112 ... guide plate (guide part)

Claims (9)

An LD unit including a laser diode;
A heat exchanger provided in the LD unit for cooling the LD unit;
In a laser processing apparatus comprising a housing for housing the LD unit and the heat exchanger,
The housing includes an optical member that guides laser light oscillated from the LD unit, an upper case that houses the optical member, a lower case that houses the LD unit and the heat exchanger, and a lower case A partition wall formed with a vent hole communicating the internal space and the internal space of the upper case,
A cooling unit that sucks and cools the air in the lower case and blows it out into the upper case ;
Air blowing means for guiding the air blown out from the cooling section to the heat exchanger,
The blowing means includes a cooling fan that guides air in the lower case into the upper case, and an intermediate fan that guides air in the upper case into the lower case,
The laser processing apparatus, wherein the heat exchanger is cooled by air blown from the cooling unit while suppressing a temperature rise of the optical member . In the laser processing apparatus of Claim 1 ,
The heat exchanger is disposed to face the air inlet of the cooling unit,
It said cooling fan, laser processing device comprising a guide wolfberry is disposed the air in the lower casing to the air inlet between said heat exchanger and said air inlet. The laser processing apparatus according to claim 2 , wherein
The optical member includes a shutter unit that blocks the laser beam;
Output measuring means for measuring the output of the laser beam,
The output measuring means is provided at a position not facing the air outlet of the cooling unit,
The laser processing apparatus, wherein the shutter unit is provided at a position facing the air outlet. In the laser processing apparatus of Claim 3 ,
The shutter unit includes a shutter unit body,
A support portion provided on the partition wall and supporting the shutter unit main body,
The vent hole is located below the shutter unit body,
The laser processing apparatus according to claim 1, wherein a through hole for guiding the air blown from the air blowout port to the vent hole is formed in a portion of the support portion facing the air blowout port. The laser processing apparatus according to claim 4 , wherein
The output measuring means is provided adjacent to the shutter unit,
A laser processing apparatus, characterized in that a guide part is provided between the output measuring means and the shutter unit for guiding the air blown from the air blower outlet to the side where the shutter unit is located. In the laser processing apparatus of any one of Claims 2-5 ,
A flow hole through which air flows is formed at a position facing the cooling unit in the housing,
A laser comprising a prevention wall that prevents air blown from an air outlet of the cooling unit from being led to the air suction port of the cooling unit through the flow hole without passing through the heat exchanger. Processing equipment. The laser processing apparatus according to claim 2 , wherein
A control unit for controlling the laser beam;
A partition that partitions the internal space of the lower case from the LD chamber in which the LD unit and the heat exchanger are provided and the control chamber in which the control unit is provided;
The laser processing apparatus, wherein the vent hole communicates with the LD chamber. The laser processing apparatus according to claim 7 , wherein
In the LD chamber, an LD power source for driving the laser diode;
A laser processing apparatus, comprising: a shielding unit that prevents the exhaust of the LD power source from flowing to the heat exchanger. The laser processing apparatus according to claim 8 , wherein
The heat exchanger is supported by the partition wall in a state of being separated from the bottom surface of the lower case,
The laser processing apparatus according to claim 1, wherein the exhaust of the LD power source is guided to an air suction port of the cooling unit through a space below the heat exchanger.

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