JP2009302112A - Electronic apparatus housing rack - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus housing rack capable of efficiently cooling an electronic apparatus. <P>SOLUTION: Heat of amplifier unit drive elements 11 and power source drive elements 12 is absorbed by heat-absorbing parts 3 arranged to contact a rack body 10, housing amplifier units 13 and power source units 14. The heat absorbed by the heat-absorbing parts 3 is radiated from heat radiation fins 5 arranged in an exhaust passage 30 formed in the rack body 10. The air heated by the heat radiation fins 5 is discharged to the outside of the rack body, from an exhaust opening 1A formed on the rack body 10 by using an exhaust fan 7. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device storage rack.

  2. Description of the Related Art Conventionally, an electronic device housing rack that can accommodate a plurality of electronic device (for example, amplifier) housings for driving a stage is known (see the following patent publication).

  An air guide chamber extending in the vertical direction of the rack body is formed between the housing of the electronic device and the rack body.

  A heat radiating fan is provided in the casing of the electronic device. The heat dissipation fan rotates when the power is turned on, and the heated air in the housing of the electronic device is discharged to the outside.

  The air guide chamber is provided with a blower fan, and the air discharged from the housing is sent below the air guide chamber.

An exhaust fan is provided at the lower part of the rack body, and the air guided by the blower fan is discharged to the outside.
JP 2005-268546 A

  When the number of motors on the stage is increased, the number of electronic devices for driving the motors must be increased accordingly.

  However, when the number of electronic devices increases, there is a problem that the heated air in the housing of the electronic device cannot be sufficiently discharged outside the rack by the blower fan and the exhaust fan, and the electronic device cannot be sufficiently cooled. On the other hand, it is conceivable to use a water-cooled cooling device, but the cooling structure such as the piping of the electronic device housing rack is enlarged, and therefore an electronic device housing rack that can efficiently cool the electronic device by air cooling has appeared. It is desired.

  This invention is made | formed in view of such a situation, The subject is providing the electronic device accommodation rack which can cool an electronic device efficiently.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a rack main body that houses a casing of an electronic device, a heat absorption part that is disposed so as to contact the rack main body and absorbs heat of the electronic device, A heat dissipating part that is disposed in an exhaust passage formed in the rack main body and releases heat absorbed by the heat absorbing part, and air in the exhaust passage from the exhaust port provided in the rack main body. And an air blowing means for discharging to the outside.

  According to a second aspect of the present invention, in the electronic equipment housing rack according to the first aspect, the heat absorbing portion is a heat transfer member in contact with the housing and a heat pipe embedded in the heat transfer member. And

  According to this invention, an electronic device can be efficiently cooled.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a conceptual diagram showing a longitudinal section of an electronic equipment storage rack according to an embodiment of the present invention.

  An electronic equipment housing rack (hereinafter simply referred to as a rack) 1 includes a rack body 10, a shelf 20, and an exhaust passage 30.

  The rack body 10 has a box shape. An amplifier unit (electronic device housing) 13 and a power supply unit (electronic device housing) 14 are placed on the three shelves 20 of the rack body 10 via the heat absorption unit 3. The amplifier unit 13 includes an amplifier unit drive element 11, and the power supply unit 14 includes a power supply drive element 12.

  The heat transfer member 3A is made of, for example, copper or aluminum, and a cylindrical heat pipe 4 is disposed therein. One end portion of the heat pipe 4 is exposed to the outside of the heat transfer member 3A, and a radiation fin (heat radiation portion) 5 is provided in the exposed portion. The heat pipe 4 transmits the heat generated by the amplifier unit driving element 11 and the power source driving element 12 to the radiation fin (heat radiation part) 5. The heat absorbing member 3 is configured by the heat transfer member 3 </ b> A and the heat pipe 4.

  The exhaust passage 30 is formed between the power supply unit 14 in the rack body 10 and the rack body 10. Radiating fins 5 are arranged in the exhaust passage 30. An intake fan 6 is disposed in the upper part of the exhaust passage 30. The intake fan 6 guides the air that has entered the rack body 10 (inside the exhaust passage 30) downward as indicated by an arrow a through the intake port 1B provided in the rack body 10.

  In addition, an exhaust fan (air blowing means) 7 is disposed below the exhaust passage 30. The exhaust fan 7 exhausts the air in the exhaust passage 30 to the outside through the exhaust port 1A provided in the rack body 10 as indicated by the arrow b. An exhaust duct 8 is provided at the exhaust port 1A. The intake fan 6 and the exhaust fan 7 constitute a blowing means.

  When a switch (not shown) of the power supply unit 14 is pushed and the amplifier unit 13 is driven, an air flow is generated in the rack body 10 as described below.

  Heat generated by the amplifier unit drive element 11 of the amplifier unit 13 and the power supply drive element 12 of the power supply unit 14 is absorbed by the heat transfer member 3A and transmitted from the heat transfer member 3A to the heat pipe 4. The heat transmitted to the heat pipe 4 is transmitted to the radiating fins 5, and the heat of the radiating fins 5 is released into the exhaust passage 30. The heated air in the exhaust passage 30 is guided to the lower side of the exhaust passage 30 by the intake fan 6, and is forcibly discharged to the outside by the exhaust fan 7 through the exhaust port 1A.

  According to this embodiment, even if there are many electronic devices such as the amplifier unit 13, the electronic device can be efficiently cooled. In addition, since the amplifier unit 13 and the power supply unit 14 can be disposed in close contact with each other, the size of the rack body 10 in the depth direction can be reduced to save space. Furthermore, since the number of fans can be reduced, the manufacturing cost can be reduced. Further, since the intake air amount of the rack body 10 can be reduced, the burden on the ventilation mechanism in the clean area where the rack 1 is disposed can be reduced.

  In the above embodiment, the air heated by using the intake fan 6 disposed above the exhaust passage 30 is guided to the lower side of the exhaust passage 30 and discharged to the outside. For example, the intake fan 6 is connected to the exhaust passage 30. The heated air may be guided to the upper side of the exhaust passage 30 and discharged to the outside.

FIG. 1 is a conceptual diagram showing a longitudinal section of an electronic equipment storage rack according to an embodiment of the present invention.

Explanation of symbols

  1: Electronic equipment housing rack, 1A: exhaust port, 3A: heat transfer member, 4: heat pipe, 5: heat radiation fin (heat radiation part), 6: intake fan, 7: exhaust fan (air blowing means), 10: rack body , 13: amplifier unit (enclosure of electronic device), 14: power supply unit (enclosure of electronic device), 30: exhaust passage.

Claims (2)

A rack body that houses the housing of the electronic device;
A heat absorption part disposed so as to be in contact with the rack body and absorbing heat of the electronic device;
A heat dissipating part that is disposed in an exhaust passage formed in the rack body, and that releases heat absorbed by the heat absorbing part;
An electronic device accommodation rack comprising: air blowing means for discharging air in the exhaust passage from an exhaust port provided in the rack body to the outside of the rack body.   The electronic device accommodation rack according to claim 1, wherein the heat absorption part is a heat transfer member in contact with the housing and a heat pipe disposed in the heat transfer member.

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