JP6380932B2 - ナノオーダ構造体の製造方法および製造装置 - Google Patents
ナノオーダ構造体の製造方法および製造装置 Download PDFInfo
- Publication number
- JP6380932B2 JP6380932B2 JP2014214096A JP2014214096A JP6380932B2 JP 6380932 B2 JP6380932 B2 JP 6380932B2 JP 2014214096 A JP2014214096 A JP 2014214096A JP 2014214096 A JP2014214096 A JP 2014214096A JP 6380932 B2 JP6380932 B2 JP 6380932B2
- Authority
- JP
- Japan
- Prior art keywords
- nano
- order structure
- substrate
- manufacturing
- order
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014214096A JP6380932B2 (ja) | 2014-10-21 | 2014-10-21 | ナノオーダ構造体の製造方法および製造装置 |
| EP15002952.8A EP3012344A1 (en) | 2014-10-21 | 2015-10-16 | Method and apparatus for producing nanostructures, and substrate structure including nanostructures |
| US14/887,788 US20160108514A1 (en) | 2014-10-21 | 2015-10-20 | Method and apparatus for producing nanostructures, and substrate structure including nanostructures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014214096A JP6380932B2 (ja) | 2014-10-21 | 2014-10-21 | ナノオーダ構造体の製造方法および製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016079486A JP2016079486A (ja) | 2016-05-16 |
| JP2016079486A5 JP2016079486A5 (enExample) | 2017-03-23 |
| JP6380932B2 true JP6380932B2 (ja) | 2018-08-29 |
Family
ID=54697421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014214096A Expired - Fee Related JP6380932B2 (ja) | 2014-10-21 | 2014-10-21 | ナノオーダ構造体の製造方法および製造装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20160108514A1 (enExample) |
| EP (1) | EP3012344A1 (enExample) |
| JP (1) | JP6380932B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020107515A1 (de) * | 2020-03-18 | 2021-09-23 | Nanowired Gmbh | Multimetall Klettwelding |
| DE102020118446A1 (de) * | 2020-07-13 | 2022-01-13 | Nanowired Gmbh | Verbindungselement |
| CN116445887A (zh) * | 2023-06-20 | 2023-07-18 | 中国科学院理化技术研究所 | 一种利用螺旋外延生长制备金属性二维过渡金属硫族化合物的方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3259844B2 (ja) * | 1990-03-27 | 2002-02-25 | 株式会社豊田中央研究所 | 異方性ナノ複合材料およびその製造方法 |
| US7658991B2 (en) * | 2004-10-21 | 2010-02-09 | University Of Georgia Research Foundation, Inc. | Structures having aligned nanorods and methods of making |
| JP4923477B2 (ja) * | 2004-11-24 | 2012-04-25 | 株式会社豊田中央研究所 | 量子ドットアレイ及びその製造方法、並びに量子ドットアレイ素子及びその製造方法 |
| JP4938365B2 (ja) | 2006-06-26 | 2012-05-23 | パナソニック株式会社 | カーボン金型、およびその製造方法 |
| US8282993B2 (en) * | 2007-04-02 | 2012-10-09 | Rensselaer Polytechnic Institute | Ultrathin magnesium nanoblades |
| TWI372418B (en) * | 2008-08-14 | 2012-09-11 | Univ Nat Chiao Tung | Nanostructured thin-film formed by utilizing oblique-angle deposition and method of the same |
| US8405996B2 (en) | 2009-06-30 | 2013-03-26 | General Electric Company | Article including thermal interface element and method of preparation |
| JP2011150154A (ja) * | 2010-01-22 | 2011-08-04 | Showa Shinku:Kk | 薄膜、及び、薄膜の形成方法 |
| JP5870113B2 (ja) * | 2011-10-31 | 2016-02-24 | 株式会社日立製作所 | 半導体装置 |
| TWI490474B (zh) * | 2012-01-12 | 2015-07-01 | Phansco Corp | 表面增強拉曼光譜(sers)感測基板及其製造方法 |
| US20140142252A1 (en) | 2012-11-19 | 2014-05-22 | Sangho Cho | Self-assembled structures, method of manufacture thereof and articles comprising the same |
| CN104903998A (zh) * | 2013-01-09 | 2015-09-09 | 株式会社日立制作所 | 半导体装置及其制造方法 |
-
2014
- 2014-10-21 JP JP2014214096A patent/JP6380932B2/ja not_active Expired - Fee Related
-
2015
- 2015-10-16 EP EP15002952.8A patent/EP3012344A1/en not_active Withdrawn
- 2015-10-20 US US14/887,788 patent/US20160108514A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20160108514A1 (en) | 2016-04-21 |
| JP2016079486A (ja) | 2016-05-16 |
| EP3012344A1 (en) | 2016-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Singh et al. | Revisiting the structure zone model for sculptured silver thin films deposited at low substrate temperatures | |
| JP6259915B2 (ja) | ダイヤモンド被覆及びこれを堆積させる方法 | |
| Ye et al. | Uniform Si nanostructures grown by oblique angle deposition with substrate swingrotation | |
| KR102163211B1 (ko) | 금속 및 결정 기판 상에 펄스 레이저를 기초로 한 대면적 그래핀의 합성 방법 | |
| Robbie et al. | Thin films with nanometer-scale pillar microstructure | |
| JP6380932B2 (ja) | ナノオーダ構造体の製造方法および製造装置 | |
| JP6723603B2 (ja) | 多層グラフェンの製造方法及び多層グラフェン積層体 | |
| Banerjee et al. | Size controlled deposition of Cu and Si nano-clusters by an ultra-high vacuum sputtering gas aggregation technique | |
| CN103938160A (zh) | 一种坩埚 | |
| Zhou et al. | Competitive growth of Ta nanopillars during glancing angle deposition: Effect of surface diffusion | |
| El Beainou et al. | Correlation between structure and electrical resistivity of W-Cu thin films prepared by GLAD co-sputtering | |
| Jo et al. | Effects of capillarity on pool boiling using nano-textured surfaces through electrosprayed BiVO4 nano-pillars | |
| CN103215528B (zh) | 镁基金属玻璃薄膜及其制备方法和应用 | |
| US20150325649A1 (en) | Nanowires and Methods of Forming | |
| Deniz et al. | Temperature threshold for nanorod structuring of metal and oxide films grown by glancing angle deposition | |
| Wang et al. | Exploiting physical vapor deposition for morphological control in semi‐crystalline polymer films | |
| TWI810631B (zh) | 金屬奈米孿晶薄膜結構的形成方法 | |
| JP2016079486A5 (enExample) | ||
| RU2401246C1 (ru) | Способ формирования проводящего элемента нанометрового размера | |
| CN118308701B (zh) | 用于磁控溅射的薄膜精确沉积方法以及沉积薄膜 | |
| JP2015010280A (ja) | ワーク及びその製造方法 | |
| Savaloni et al. | Fabrication, characterization and some applications of graded chiral zigzag shaped nano-sculptured silver thin films | |
| CN107604331A (zh) | 一种运用固相反应技术制备Cu/Ti非晶多层膜的方法 | |
| JPS6215630B2 (enExample) | ||
| Andalouci et al. | Morphological and magnetic study of plasma assisted solid-state dewetting of ultra-thin cobalt films on conductive titanium silicon nitride supports |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170216 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170216 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20170216 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171019 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171205 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180131 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180703 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180723 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6380932 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313117 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |