JP6373766B2 - 半導体素子の放熱構造 - Google Patents
半導体素子の放熱構造 Download PDFInfo
- Publication number
- JP6373766B2 JP6373766B2 JP2015012148A JP2015012148A JP6373766B2 JP 6373766 B2 JP6373766 B2 JP 6373766B2 JP 2015012148 A JP2015012148 A JP 2015012148A JP 2015012148 A JP2015012148 A JP 2015012148A JP 6373766 B2 JP6373766 B2 JP 6373766B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat dissipation
- heat
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
1a シリコン基板
1b ガラス基板
2 放熱器
3 プリント基板
4 粘着材
5 熱伝導性接着剤
6 リード
7 導電性樹脂
8 半導体素子
9 ハンダ
10 螺子
11 受動及び能動素子
12 受熱部
13 放熱ピン
14 パッド
15 開口
16 ワイヤ
Claims (2)
- プリント基板に実装される半導体素子の放熱構造であって、
前記プリント基板と前記半導体素子との間に放熱器が設けられ、
前記放熱器は、前記半導体素子と対向する面と異なる面に複数の放熱ピンを備え、
前記プリント基板に設けられた開口内を貫通し、突出した複数の前記放熱ピンにより、前記半導体素子の冷却を行い、
複数の前記放熱ピンの間に配置された前記プリント基板に電子部品が実装されている、
ことを特徴とする半導体素子の放熱構造。 - 前記半導体素子は、反射型LCOSパネルであることを特徴とする請求項1記載の半導体素子の放熱構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015012148A JP6373766B2 (ja) | 2015-01-26 | 2015-01-26 | 半導体素子の放熱構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015012148A JP6373766B2 (ja) | 2015-01-26 | 2015-01-26 | 半導体素子の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016139641A JP2016139641A (ja) | 2016-08-04 |
JP6373766B2 true JP6373766B2 (ja) | 2018-08-15 |
Family
ID=56559288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015012148A Expired - Fee Related JP6373766B2 (ja) | 2015-01-26 | 2015-01-26 | 半導体素子の放熱構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6373766B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6016582U (ja) * | 1984-06-14 | 1985-02-04 | 日本電気株式会社 | 集積回路実装構造 |
JPH06252299A (ja) * | 1993-02-26 | 1994-09-09 | Nippon Steel Corp | 半導体装置及びこの半導体装置を実装した基板 |
JP4906496B2 (ja) * | 2006-12-25 | 2012-03-28 | 新光電気工業株式会社 | 半導体パッケージ |
JP2013084674A (ja) * | 2011-10-06 | 2013-05-09 | Shindengen Electric Mfg Co Ltd | 発熱電子デバイスの放熱構造 |
-
2015
- 2015-01-26 JP JP2015012148A patent/JP6373766B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2016139641A (ja) | 2016-08-04 |
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