JP6373473B2 - 複合無電解ニッケルめっき - Google Patents
複合無電解ニッケルめっき Download PDFInfo
- Publication number
- JP6373473B2 JP6373473B2 JP2017501026A JP2017501026A JP6373473B2 JP 6373473 B2 JP6373473 B2 JP 6373473B2 JP 2017501026 A JP2017501026 A JP 2017501026A JP 2017501026 A JP2017501026 A JP 2017501026A JP 6373473 B2 JP6373473 B2 JP 6373473B2
- Authority
- JP
- Japan
- Prior art keywords
- ptfe
- substrate
- nickel plating
- plating bath
- electroless nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1671—Electric field
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Description
1)浴温度の上昇;
2)浴pHの上昇;及び
3)次亜リン酸ナトリウム濃度の上昇;
によって増加する。
1)ニッケル−リン析出;
2)PTFE粒子共析出;及び
3)水素発生;
の3つの作用が同時に起こる。
1)浴温度の低下;
2)浴pHの低下;及び
3)PTFE粒子濃度の増加;
とともに増大する。
a)前記基材を、
i)ニッケルイオン源;
ii)還元剤;及び
iii)PTFE分散系;を含み、前記PTFE分散系が、
1)PTFE粒子;
2)非イオン性界面活性剤と陽イオン性界面活性剤との混合物;及び
3)水;
を含む無電解ニッケルめっき浴と接触させる工程と;
b)(i)アノードを前記無電解ニッケルめっき浴中に配置して前記アノードをDC整流器の正端子に接続し;(ii)前記基材を前記DC整流器の負端子に接続して前記基材を負に荷電させることにより、前記無電解ニッケルめっき浴中に静電界を発生させる工程と;を含み、
前記静電界によって発生した引力が、正に荷電した前記PTFE粒子の負に荷電した前記基材への引力を増大させ、正に荷電した前記PTFE粒子を負に荷電した前記基材へと駆動することを特徴とする方法に関する。好ましくは、CD整流器は、アノードとカソードとの間の回路内にキャパシタ(コンデンサ)を有する。
a)前記基材を、
i)ニッケルイオン源;
ii)還元剤;及び
iii)PTFE分散系;を含み、前記PTFE分散系が、
1)PTFE粒子;
2)非イオン性界面活性剤と陽イオン性界面活性剤との混合物;及び
3)水;
を含む無電解ニッケルめっき浴と接触させる工程と;
b)(i)アノードを前記無電解ニッケルめっき浴中に配置して前記アノードをDC整流器の正端子に接続し;(ii)前記基材を前記DC整流器の負端子に接続して前記基材を負に荷電させることにより、前記無電解ニッケルめっき浴中に静電界を発生させる工程と;を含み、
前記静電界によって発生した引力が、正に荷電した前記PTFE粒子の負に荷電した前記基材への引力を増大させ、正に荷電した前記PTFE粒子を負に荷電した前記基材へと駆動する方法に関する。好ましくは、CD整流器は、アノードとカソードとの間の回路内に電流を提供する(present)ためのキャパシタを有する。
以下の組成を有する無電解ニッケル浴を調製した。
6g/Lのニッケル(硫酸ニッケルとして)
40g/Lの次亜リン酸ナトリウム
5g/LのPTFE粒子
pH−5.0
本発明に従い1Vの静電界を印加した点を除き、比較例1と同じ浴を用い、同じ加工条件でめっきした。生成した析出物は、14重量%のPTFEを含有していた。
Claims (13)
- 基材上の複合無電解ニッケル層の製造方法であって、
a)前記基材を、
i)ニッケルイオン源;
ii)還元剤;及び
iii)PTFE分散系;を含み、前記PTFE分散系が、
1)PTFE粒子;
2)非イオン性界面活性剤と陽イオン性界面活性剤との混合物;及び
3)水;
を含み、
前記PTFE粒子の無電解めっき浴中への含有前に、前記陽イオン性界面活性剤が、前記PTFE粒子上に吸着され、かつ前記PTFE粒子が正に帯電されるように、前記PTFE粒子が、前記陽イオン性界面活性剤で処理され、
無電解ニッケルめっき浴と接触させる工程と;
b)(i)アノードを前記無電解ニッケルめっき浴中に配置して前記アノードをDC整流器の正端子に接続し;(ii)前記基材を前記DC整流器の負端子に接続することにより、前記無電解ニッケルめっき浴中に静電界を発生させる工程と;を含み、
前記静電界によって発生した引力が、正に荷電した前記PTFE粒子の負に荷電した前記基材への前記引力を増大させ、正に荷電した前記PTFE粒子を負に荷電した前記基材へと駆動し、
前記アノードとカソードとの間の回路内にキャパシタが配置されていることを特徴とする方法。 - 発生した前記静電界が、0.5V〜2.0Vの大きさを有する請求項1に記載の方法。
- 発生した前記静電界が、0.8V〜1.5Vの大きさを有する請求項2に記載の方法。
- 前記還元剤が、次亜リン酸ナトリウム、次亜リン酸カリウム、水素化ホウ素ナトリウム、n−ジメチルアミンボラン、n−ジエチルアミンボラン、ホルムアルデヒド、ヒドラジン、及びこれらの1以上の組合せからなる群から選択される請求項1に記載の方法。
- 前記還元剤が、次亜リン酸ナトリウム又は次亜リン酸カリウムを含む請求項4に記載の方法。
- 前記無電解ニッケルめっき浴が、少なくとも1種の錯化剤を含む請求項1に記載の方法。
- 前記少なくとも1種の錯化剤が、モノカルボン酸、ジカルボン酸、ヒドロキシカルボン酸、アンモニア、及びアルカノールアミンからなる群から選択される請求項1に記載の方法。
- 前記無電解ニッケルめっき浴が、促進剤、安定剤、pH緩衝剤、及びpH調整剤の少なくとも1つを含む請求項1に記載の方法。
- 前記複合ニッケルめっき析出物が、12重量%〜16重量%のPTFEを含む請求項1に記載の方法。
- 前記複合ニッケルめっき析出物が、少なくとも10重量%のPTFEを含む請求項1に記載の方法。
- 前記基材が、スチール、真ちゅう、アルミニウム、アルミニウム合金、銅、チタン、チタン合金、鉄、マグネシウム、マグネシウム合金、ニッケル、ニッケル合金、ブロンズ、又はステンレス鋼、及びこれらの1以上の組合せからなる群から選択される請求項1に記載の方法。
- 前記基材の少なくともめっきを受ける表面が、前処理されている請求項1に記載の方法。
- 前記無電解ニッケルめっき浴が、170F〜180Fの温度に維持される請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/327,995 | 2014-07-10 | ||
US14/327,995 US20160010214A1 (en) | 2014-07-10 | 2014-07-10 | Composite Electroless Nickel Plating |
PCT/US2015/038295 WO2016007320A1 (en) | 2014-07-10 | 2015-06-29 | Composite electroless nickel plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017521561A JP2017521561A (ja) | 2017-08-03 |
JP6373473B2 true JP6373473B2 (ja) | 2018-08-15 |
Family
ID=55064696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017501026A Expired - Fee Related JP6373473B2 (ja) | 2014-07-10 | 2015-06-29 | 複合無電解ニッケルめっき |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160010214A1 (ja) |
EP (1) | EP3167097A4 (ja) |
JP (1) | JP6373473B2 (ja) |
CN (1) | CN106574370A (ja) |
BR (1) | BR112017000360A2 (ja) |
WO (1) | WO2016007320A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3759260A4 (en) | 2018-02-26 | 2022-04-06 | Graphene Leaders Canada (GLC) Inc. | ELECTRICAL PLATING OF ARTICLES WITH CARBON CONTAINING MATERIAL |
US11970779B2 (en) | 2019-07-26 | 2024-04-30 | Eni S.P.A. | Multilayered nickel-phosphorus composite |
CN112251739B (zh) * | 2020-10-23 | 2021-09-03 | 哈尔滨工业大学 | 一种预镀铜膜的铝诱导化学镀方法 |
CN113249712B (zh) * | 2021-04-28 | 2022-06-24 | 南京航空航天大学 | 一种钛合金丝材铜/氧化钇复合改性方法及应用 |
CN114016009B (zh) * | 2021-11-09 | 2022-05-24 | 东北电力大学 | 一种Ni-P-PFA-SiO2纳米复合镀层及其制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE301180B (ja) * | 1963-05-16 | 1968-05-27 | Asea Ab | |
CH623851A5 (ja) * | 1975-10-04 | 1981-06-30 | Akzo Nv | |
JPS5844738B2 (ja) * | 1980-10-09 | 1983-10-05 | 関東化成工業株式会社 | 複合めつき方法 |
US4503131A (en) * | 1982-01-18 | 1985-03-05 | Richardson Chemical Company | Electrical contact materials |
JPS58157957A (ja) * | 1982-03-16 | 1983-09-20 | Suzuki Motor Co Ltd | ニツケルメツキ法 |
CH667108A5 (de) | 1985-04-22 | 1988-09-15 | Fluehmann Ag Werner | Galvanisches bad zum gemeinsamen abscheiden von metall und einem dauerschmierenden feststoffschmiermittel. |
US5605565A (en) * | 1992-01-23 | 1997-02-25 | Surface Technology, Inc. | Process for attaining metallized articles |
US6697268B2 (en) * | 2001-04-06 | 2004-02-24 | Mitsubishi Denki Kabushiki Kaisha | Dc-Dc power supply |
US6837923B2 (en) * | 2003-05-07 | 2005-01-04 | David Crotty | Polytetrafluoroethylene dispersion for electroless nickel plating applications |
JP4458057B2 (ja) * | 2005-07-28 | 2010-04-28 | Tdk株式会社 | めっき装置及びめっき方法 |
TR201816579T4 (tr) | 2007-12-11 | 2018-11-21 | Macdermid Enthone Inc | Nano parçacıklar içeren metal bazlı kompozit kaplamaların elektrolitik biriktirmesi. |
EP2182089A1 (en) * | 2008-10-29 | 2010-05-05 | Koninklijke Philips Electronics N.V. | Metallic coating and method to obtain the coating |
WO2012001134A2 (de) | 2010-06-30 | 2012-01-05 | Schauenburg Ruhrkunststoff Gmbh | Verfahren zur abscheidung einer nickel-metall-schicht |
JP5614538B2 (ja) * | 2010-09-30 | 2014-10-29 | アイテック株式会社 | 複合めっき被膜の形成方法 |
CN103205736A (zh) * | 2012-01-11 | 2013-07-17 | 深圳富泰宏精密工业有限公司 | 镀膜件及其制备方法 |
-
2014
- 2014-07-10 US US14/327,995 patent/US20160010214A1/en not_active Abandoned
-
2015
- 2015-06-29 EP EP15818405.1A patent/EP3167097A4/en not_active Withdrawn
- 2015-06-29 JP JP2017501026A patent/JP6373473B2/ja not_active Expired - Fee Related
- 2015-06-29 BR BR112017000360A patent/BR112017000360A2/pt not_active Application Discontinuation
- 2015-06-29 CN CN201580037348.0A patent/CN106574370A/zh active Pending
- 2015-06-29 WO PCT/US2015/038295 patent/WO2016007320A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
BR112017000360A2 (pt) | 2017-11-07 |
JP2017521561A (ja) | 2017-08-03 |
EP3167097A1 (en) | 2017-05-17 |
WO2016007320A1 (en) | 2016-01-14 |
EP3167097A4 (en) | 2017-11-29 |
US20160010214A1 (en) | 2016-01-14 |
CN106574370A (zh) | 2017-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6373473B2 (ja) | 複合無電解ニッケルめっき | |
JP6076138B2 (ja) | カーボンブラックと金属との複合体 | |
CN105297085B (zh) | 一种镀镍液制备镍基镀层的方法 | |
JP5820950B1 (ja) | ニッケルめっき液及び固体微粒子付着ワイヤーの製造方法 | |
JP2004537647A (ja) | ニッケル、ホウ素および粒子を含有する塗料 | |
CA2415724A1 (en) | Electroless silver plating | |
JP2007152485A (ja) | ソーワイヤの製造方法 | |
JPWO2012133613A1 (ja) | 三価クロムめっき液 | |
JP2022141949A (ja) | 少なくとも1つの基板上にクロム層またはクロム合金層を堆積するための制御された方法 | |
CA3092257C (en) | Electroless plating of objects with carbon-based material | |
WO2013039097A1 (ja) | 固体微粒子付着ワイヤー及びその固体微粒子付着ワイヤーの製造方法 | |
JP6262710B2 (ja) | 三価クロムめっき液 | |
TWI417429B (zh) | An electroplating bath using the electroplating bath, and a substrate deposited by the electrolytic plating | |
JP2001192850A (ja) | 摺動部品用表面処理液及び摺動部品の表面処理方法及び摺動部品 | |
JP2020196914A (ja) | めっき前処理方法 | |
JP5363142B2 (ja) | 錫めっき皮膜の成膜方法 | |
Henuset et al. | Effect of Ceramic Particle Pretreatment & Surface Chemistry on Electrocomposite Coatings | |
JP2007321218A (ja) | 無電解めっき液、それを用いた無電解めっき方法及びその方法により得られるめっき皮膜 | |
JP4960142B2 (ja) | 無電解ニッケルめっき液及びそれを用いた無電解ニッケルめっき方法 | |
JP2004143489A (ja) | 電気複合めっき浴及び電気複合めっき方法 | |
KR102485602B1 (ko) | TBAB(tert-butylamine borane, 3차 부틸아민보란)를 포함한, 리튬 이온 전지의 전극 단자 도금용 니켈-보론 무전해 도금액, 이를 이용한 니켈-보론 무전해 도금 방법, 및 이를 이용하여 제조된 니켈-보론 무전해 도금층이 형성된 리튬 이온 전지의 전극 단자 | |
JPWO2010089840A1 (ja) | ガドリニウム含有金属層を有する製品 | |
EP0458828A1 (en) | Plating composition and process | |
JP2012241258A (ja) | 無電解イリジウムめっき液およびそれを用いた無電解めっき方法 | |
JP2016098418A (ja) | 無電解ニッケル複合めっき浴、及び無電解ニッケル複合めっき製品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180302 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180313 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180612 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180626 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180717 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6373473 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |