JP6370077B2 - Electronic device manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to an electronic device manufacturing method for forming a pillar by discharging a conductive material, and a manufacturing apparatus using the manufacturing method.

  As a manufacturing method of a three-dimensional model, there is an additive manufacturing method in which a three-dimensional model is manufactured by sequentially stacking layered materials formed by dividing a three-dimensional model into a plurality of layers. As an additive manufacturing method, for example, an inkjet method is known in which a melted resin or a liquid resin is discharged from a nozzle of an inkjet head, and the discharged resin is stacked to form a three-dimensional object. In addition, there is a technique in which a conductive material is discharged from a nozzle by applying this ink jet method to form pillars that connect wirings of respective layers of a circuit board (for example, Patent Document 1).

JP 2005-101552 A

  In the manufacturing method disclosed in Patent Document 1, the insulating layer is formed so that the pillar formed on the wiring is embedded. In the next step, part of the insulating layer is etched in order to remove the portion of the insulating layer that covers the upper end surface of the pillar. For this reason, in this manufacturing method, a process requiring etching is included in the work process using the ink jet method, and the manufacturing process may become complicated, and there is room for improvement.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic device manufacturing method and a manufacturing apparatus that can simplify the manufacturing process.

In order to solve the above-mentioned problem, the electronic device manufacturing method according to claim 1 of the present application is a manufacturing method of an electronic device by an additive manufacturing method, and a pillar is formed by discharging a conductive material on a wiring. A step of discharging a liquid repellent to the upper end of the pillar, a step of discharging an insulating material having liquid repellency on the wiring at the periphery of the pillar, and a step of curing the insulating material, An insulating layer is formed over the wiring by repeatedly performing the step of discharging the insulating material and the step of curing .

A manufacturing apparatus according to claim 2 is characterized in that an electronic device is manufactured by the manufacturing method according to claim 1 .

In the electronic device manufacturing method according to the first aspect, the liquid repellent is discharged to the upper end of the pillar formed by discharging the conductive material on the wiring. Next, an insulating layer is formed of an insulating material having liquid repellency on the periphery of the pillar to which the liquid repellent is applied. Here, if the pillar is formed in advance and the insulating layer is formed so that the pillar is not buried, the resin is wet when the insulating resin for forming the insulating layer is discharged to the periphery of the pillar. It may spread and cover the upper end surface of the pillar. As a result, a failure occurs in the electrical connectivity of the manufactured electronic device. On the other hand, in the manufacturing method, by applying a liquid repellent agent to the upper end portion of the pillar, it is possible to prevent the resin forming the insulating layer from spreading to the upper end surface of the pillar. For this reason, pillars formed in advance by the layered manufacturing method can be satisfactorily connected to the wiring of each layer without being embedded in the insulating layer. Therefore, in the manufacturing method, a process such as etching for removing a portion covering the pillar of the insulating layer is not required, and thus the manufacturing process can be simplified.
In the method of manufacturing an electronic device according to the first aspect, an insulating material having liquid repellency is discharged and cured on the periphery of the pillar. The insulating layer is formed by repeatedly performing the step of discharging the insulating material and the step of curing. Accordingly, when the insulating resin is further discharged onto the cured insulating resin, it is possible to prevent the discharged insulating resin from spreading on the cured resin. Thus, according to the manufacturing method, an insulating layer having a desired thickness that matches the position of the upper end of the pillar is obtained by repeatedly performing the discharge process and the curing process using an insulating resin having liquid repellency. Can be formed. Accordingly, it is not necessary to perform a process such as etching for removing a portion of the insulating layer covering the pillar, so that the manufacturing process can be simplified.

In the manufacturing apparatus according to claim 2 , by using the manufacturing method according to claim 1, it is possible to simplify the manufacturing process of the electronic device.

It is a top view which shows the electronic device manufacturing apparatus which manufactures the electronic device which is an Example of this invention. It is a block diagram which shows the structure of the electronic device manufacturing apparatus of 1st Example. It is sectional drawing of the circuit board manufactured with an electronic device manufacturing apparatus. It is a schematic diagram for demonstrating the manufacturing process which forms a pillar. It is a schematic diagram for demonstrating the manufacturing process which discharges a liquid repellent to a pillar. It is a schematic diagram for demonstrating the manufacturing process which forms an insulating layer. It is a schematic diagram which shows the state after forming an insulating layer. It is a manufacturing process in 2nd Example, and is a schematic diagram for demonstrating the manufacturing process which embeds a pillar in an insulating layer. It is a manufacturing process in 2nd Example, and is a schematic diagram for demonstrating the manufacturing process which forms a through-hole in an insulating layer. It is a manufacturing process in 2nd Example, and is a schematic diagram for demonstrating the manufacturing process which extends the upper end part of a pillar. It is a manufacturing process in 3rd Example, and is a schematic diagram for demonstrating the manufacturing process which forms a support material in the upper end part of a pillar. It is a manufacturing process in 3rd Example, and is a schematic diagram for demonstrating the manufacturing process which forms an insulating layer.

<First embodiment>
A first embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view of an electronic device manufacturing apparatus 10 according to an embodiment of the present invention. The electronic device manufacturing apparatus 10 is an apparatus for manufacturing an electronic device using an ultraviolet curable resin and a conductive material. The electronic device manufacturing apparatus 10 includes a transport device 21, a head unit 23, and an ultraviolet irradiation device 25. In the electronic device manufacturing apparatus 10, these various apparatuses are provided on the upper portion of the base 11. The base 11 has a substantially rectangular shape in plan view, and has a frame portion 13 that surrounds the transport device 21. In the following description, as shown in FIG. 1, the longitudinal direction of the base 11 (vertical direction in FIG. 1) is the X-axis direction, the short direction of the base 11 (horizontal direction in FIG. 1) is the Y-axis direction, X A direction orthogonal to both the axial direction and the Y-axis direction will be described as the Z-axis direction (see FIG. 3).

  The transport device 21 has a pair of X-axis slide mechanisms 31 extending in the X-axis direction and a Y-axis slide mechanism 33 extending in the Y-axis direction. Each of the X-axis slide mechanisms 31 is held by the base 11 and the frame portion 13 and has an X-axis slider 35 provided to be movable in the X-axis direction. Each of the X-axis slide mechanisms 31 is driven by an electromagnetic motor 61 (see FIG. 2), and the pair of X-axis sliders 35 are moved to arbitrary positions in the X-axis direction while maintaining positions facing each other in the Y-axis direction. To do. The Y-axis slide mechanism 33 has a Y-axis direction end portion held by an X-axis slider 35 and a plate holding portion 37 that can move in the Y-axis direction. In the Y-axis slide mechanism 33, the plate holding portion 37 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor 63 (see FIG. 2). Therefore, the plate holding part 37 can be moved to any position on the base 11 by driving the X-axis slide mechanism 31 and the Y-axis slide mechanism 33.

  The plate holding part 37 has a base 38 and a holding device 39. The base 38 is formed in a flat plate shape, and a modeling plate P (see FIG. 3) is placed on the upper surface. The holding device 39 is provided on both sides of the base 38 in the Y-axis direction. The plate holding unit 37 clamps the end of the modeling plate P placed on the base 38 in the Y-axis direction between the base 38 and the holding device 39 and clamps the modeling plate P at a predetermined position. Hold it in place.

  In addition, the electronic device manufacturing apparatus 10 includes an elevating device 45 for elevating and lowering the plate holding portion 37 and the modeling plate P in the Z-axis direction. The elevating device 45 drives the drive unit 47 (see FIG. 2) to raise or lower the base 38 and change the position of the modeling plate P in the Z-axis direction. The elevating device 45 is moved together with the plate holding portion 37 to an arbitrary position on the base 11.

  Moreover, the head part 23 shown in FIG. 1 is attached to the upper part of the electronic device manufacturing apparatus 10 so as to face the plate holding part 37 and the modeling plate P in the Z-axis direction. The head unit 23 includes an inkjet head 51 and a laser irradiation device 53. The inkjet head 51 is provided with a plurality of nozzles 55 that eject different types of liquid. The inkjet head 51 has a nozzle 55 that discharges an ultraviolet curable resin for forming an insulating layer. The ink jet head 51 has a nozzle 55 that discharges a conductive material for forming wirings and pillars. The ink jet head 51 has a nozzle 55 for discharging a liquid repellent. For example, the inkjet head 51 may be configured to replace the nozzle 55 according to the type of liquid to be ejected, or may be configured to replace the liquid filling the nozzle 55.

  The inkjet head 51 ejects various liquids from the nozzle ports of the plurality of nozzles 55 by, for example, a piezo method using a piezoelectric element 65 (see FIG. 2). The configuration in which the inkjet head 51 discharges various liquids is not limited to the piezo method, but other configurations, for example, a thermal method in which the liquid in the nozzle 55 is heated to generate bubbles and the liquid is discharged from the nozzle port. A configuration using may be used.

  The laser irradiation device 53 is held by the head unit 23 via the moving device 57. The laser irradiation device 53 moves up and down in the Z-axis direction when the moving device 57 is driven. The laser irradiation device 53 irradiates the conductive material discharged on the modeling plate P with a laser beam and fires it. For example, in the pillar manufacturing process, when the modeling plate P moves to a position below the head unit 23 with the movement of the plate holding unit 37, the inkjet head 51 causes the head unit 23 to move onto the modeling plate P. The discharged conductive material is baked by the laser irradiation device 53 while discharging the conductive material.

  Moreover, the ultraviolet irradiation device 25 is attached to the upper part of the electronic device manufacturing apparatus 10 so as to face the plate holding part 37 and the modeling plate P in the Z-axis direction. The ultraviolet irradiation device 25 has an LED 67 for irradiating ultraviolet rays, and is fixed so that the irradiation direction of the LED 67 is downward. For example, in the manufacturing process of the insulating layer, when the modeling plate P moves to a lower position, the head unit 23 ejects an ultraviolet curable resin having insulating properties onto the modeling plate P by the inkjet head 51. In addition, when the modeling plate P moves to a lower position, the ultraviolet irradiation device 25 drives the LED 67 to irradiate the ultraviolet curing resin on the modeling plate P and cure it.

  As shown in FIG. 2, the electronic device manufacturing apparatus 10 includes a control device 71. The control device 71 includes a controller 73, a plurality of drive circuits 75, and a control circuit 77. The controller 73 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 75 and a control circuit 77. Each of the plurality of drive circuits 75 is connected to the holding device 39, the electromagnetic motors 61 and 63, the piezoelectric element 65, and the drive unit 47 described above. Each of the plurality of control circuits 77 is connected to the LED 67 and the laser irradiation device 53. The controller 73 controls the operation of the holding device 39 and the head unit 23 through the drive circuit 75 and the control circuit 77.

<Manufacturing process of electronic devices>
Next, an electronic device manufacturing process will be described. The electronic device manufacturing apparatus 10 divides the electronic device into a plurality of layers, forms one or a plurality of layers with an ultraviolet curable resin or a conductive material, and manufactures the electronic device by sequentially stacking the formed layers. . For example, the electronic device manufacturing apparatus 10 manufactures the circuit board 81 shown in FIG. 3 as an electronic device.

  3 includes a wiring 83 formed on the modeling plate P, an insulating layer 85 stacked on the wiring 83, and a wiring 87 formed on the upper end surface 85A of the insulating layer 85. Have. The wiring 83 formed on the lower surface of the insulating layer 85 and the wiring 87 formed on the upper end surface 85A are electrically connected by a plurality of pillars 89 penetrating the insulating layer 85 in the Z-axis direction (vertical direction). Yes. In the following description, the process of manufacturing the insulating layer 85 on the periphery of the pillar 89 will be mainly described.

  The electronic device manufacturing apparatus 10 forms a wiring 83 having a predetermined pattern on the modeling plate P held by the plate holding unit 37 (see FIG. 1) based on the design data of the circuit board 81. As the modeling plate P, for example, a plastic substrate having heat resistance that can withstand heat in the manufacturing process can be used. For example, the wiring 83 is formed by using an ink jet method in the same manner as a method of manufacturing the pillar 89 described later. Note that the wiring 83 can be formed by a method different from the ink jet method, for example, a sputtering method, an evaporation method, a CVD method, or the like.

  Next, the control device 71 controls the X-axis slide mechanism 31 and the Y-axis slide mechanism 33 so that the plate holding portion 37 that holds the modeling plate P on which the wiring 83 is formed is placed below the head portion 23 that is the working position. To move. The control device 71 controls the head unit 23 to discharge the conductive material 91 from the nozzle 55 of the inkjet head 51 to a predetermined position on the wiring 83 as shown in FIG. For example, the conductive material 91 is obtained by dispersing a conductor in a solvent. The conductor is, for example, a metal such as gold (Au), silver (Ag), copper (Cu), ITO, tin (Sn), nickel (Ni), or a compound thereof. The solvent is, for example, tetradecane, cyclohexylbenzene, butyl acetate, isopropyl alcohol, or water.

  The control device 71 discharges the conductive material 91 from the inkjet head 51, and then fires the discharged conductive material 91 by the laser irradiation device 53. The control device 71 ejects one or a plurality of conductive material 91 droplets from the inkjet head 51 onto the modeling plate P, and then moves the plate holding portion 37 toward one in the X-axis direction (leftward in FIG. 4). Let The laser irradiation device 53 irradiates and fires the conductive material 91 discharged onto the modeling plate P with the focus of the laser light. The laser irradiation device 53 is, for example, a gas laser. The control device 71 repeatedly performs the ejection processing by the inkjet head 51 and the firing processing by the laser irradiation device 53 to form the pillar 89. Note that this baking treatment may be a method in which the conductive material 91 is stacked as a pillar 89 by a sufficient height and then the entire pillar 89 is baked together, or the insulating layer 85 is formed around the pillar 89 and then baked. The method may be used. Further, the firing of the pillar 89 can be omitted when the solvent of the conductive material 91 discharged by a decompression process or the like is volatilized. The method for solidifying the conductive material 91 is not limited to the firing method, and other methods such as a drying method may be used.

  Next, as shown in FIG. 5, the control device 71 discharges the liquid repellent 95 from the nozzle 55 of the inkjet head 51 toward the upper end portion 89 </ b> A of the pillar 89 formed on the wiring 83. The pillar 89 is coated with a liquid repellent 95 downward from the upper end 89A. Here, in the manufacturing method in which the insulating layer 85 is formed after the pillar 89 is formed in advance as in the electronic device manufacturing apparatus 10 of the present embodiment, an ultraviolet curable resin having insulating properties for forming the insulating layer 85 is used. When discharged onto the wiring 83 on the periphery of the pillar 89, the ultraviolet curable resin may spread and cover a part or all of the upper end surface of the pillar 89. As a result, the pillar 89 is deteriorated in electrical connectivity to the upper layer wiring 87 (see FIG. 3) connected to the upper end surface. In particular, the pillar 89 may be formed on the order of several μm (micrometers), and depending on the outer diameter of the droplets of the ultraviolet curable resin, even one or several drops of the ultraviolet curable resin may be used. The possibility of spreading to the upper end surface is very high. In addition, the wetting and spreading of the insulating resin for forming the insulating layer 85 is not limited to the ink jet method, and similarly occurs in other methods such as a spin coating method.

  On the other hand, in the electronic device manufacturing apparatus 10 of the present embodiment, the resin for forming the insulating layer 85 is added to the pillar 89 by applying the liquid repellent 95 around the upper end 89A of the pillar 89 formed in advance. To prevent it from spreading to the top of the top. As shown in FIG. 6, the control device 71 controls the head portion 23 to discharge the ultraviolet curable resin 97 from the nozzle 55 of the inkjet head 51 onto the modeling plate P. The plate holding unit 37 is conveyed by the control device 71 toward one side in the X-axis direction (leftward in FIG. 6). The inkjet head 51 discharges the ultraviolet curable resin 97 toward the modeling plate P while synchronizing with the operation in which the plate holding unit 37 and the modeling plate P are conveyed in the X-axis direction. On the modeling plate P, a resin film 99 for one layer formed by a plurality of droplets of the ultraviolet curable resin 97 is formed. At this time, the liquid repellent 95 is applied to the pillar 89 in advance, so that the ultraviolet curable resin 97 discharged to the periphery is prevented from getting wet over the upper end surface of the pillar 89.

  Next, the control device 71 drives the ultraviolet irradiation device 25 (see FIGS. 1 and 2) to irradiate the resin film 99 formed on the modeling plate P with ultraviolet rays and cure it. More specifically, when the control device 71 discharges the ultraviolet curable resin 97 on the modeling plate P to form one layer of the resin film 99, the control device 71 moves the plate holding portion 37 toward a position below the ultraviolet irradiation device 25. . The ultraviolet irradiation device 25 drives the LED 67 to irradiate the resin film 99 with ultraviolet rays based on the control of the control device 71. Thereby, the cured resin film 99 for one layer is formed on the modeling plate P.

  Further, the control device 71 controls the inkjet head 51 to further discharge the ultraviolet curable resin 97 on the cured resin film 99 to laminate the resin film 99 (see FIG. 6). Further, the ultraviolet irradiation device 25 irradiates the discharged second layer resin film 99 with ultraviolet rays. The electronic device manufacturing apparatus 10 repeatedly performs the discharge process and the ultraviolet irradiation process, thereby stacking the cured resin film 99 to form the insulating layer 85.

  In this embodiment, a resin having liquid repellency is used as the ultraviolet curable resin 97 shown in FIG. Here, as described above, the insulating layer 85 includes a plurality of layers obtained by curing the resin film 99. In this case, the ultraviolet curable resin 97 further discharged onto the cured resin film 99 may spread on the cured resin film 99. For this reason, using a resin having liquid repellency prevents the ultraviolet curable resin 97 from spreading on the resin film 99 when the ultraviolet curable resin 97 is further discharged onto the cured resin film 99. It becomes possible. Further, by curing the resin film 99 for each layer, it is possible to more reliably prevent the ultraviolet curable resin 97 from spreading out. As described above, in the electronic device manufacturing apparatus 10 according to the present embodiment, the ultraviolet curable resin 97 is formed on the pillar 89 by repeatedly performing the discharge process and the curing process using the ultraviolet curable resin 97 having liquid repellency. More reliably prevent wet spread to the end face. The insulating layer 85 may be formed by laminating a plurality of liquid resin films 99 and then curing them together. Further, the method for forming the insulating layer 85 is not limited to the ink jet method, and a plasma CVD method, a sputtering method, or a spin coating method may be used.

  As shown in FIG. 7, the circuit board 81 manufactured by the above-described manufacturing method is insulated on the wiring 83 in a state in which the UV curable resin 97 is prevented from spreading on the periphery of the upper end portion 89 </ b> A of the pillar 89. Layer 85 will be formed. Then, a wiring 87 (see FIG. 3) having a desired pattern is formed by a known method so as to be connected to the upper end portion 89A of the pillar 89 exposed from the insulating layer 85. In this way, the electronic device manufacturing apparatus 10 can manufacture the circuit board 81 in which the wiring 83 and the wiring 87 are electrically well connected via the pillar 89.

As described above, according to the above-described embodiment, the following effects can be obtained.
<Effect 1> In the manufacturing method of the present embodiment, the liquid repellent 95 is discharged to the upper end portion 89A of the pillar 89 formed by discharging the conductive material 91 on the wiring 83 (see FIG. 5). Next, an insulating layer 85 is formed on the periphery of the pillar 89 to which the liquid repellent 95 is applied. In this manufacturing method, by applying the liquid repellent 95 to the upper end portion 89 A of the pillar 89, it is possible to prevent the UV curable resin 97 forming the insulating layer 85 from spreading to the upper end surface of the pillar 89. Become. For this reason, the pillar 89 formed in advance by the inkjet method, which is one of the additive manufacturing methods, can be satisfactorily connected to the wirings 83 and 87 of each layer of the insulating layer 85 without being embedded in the insulating layer 85 even once. It becomes. Therefore, in the manufacturing method, a process such as etching for removing a portion covering the pillar 89 of the insulating layer 85 is not required, and thus the manufacturing process can be simplified.

  <Effect 2> The insulating layer 85 is formed of a resin film formed by discharging the ultraviolet curable resin 97 having liquid repellency from the nozzle 55 to form the resin film 99 (see FIG. 6) and the ultraviolet irradiation device 25 (see FIG. 1). And the step of curing 99 is repeatedly performed. The UV curable resin 97 having liquid repellency is prevented from spreading when wet on the cured resin film 99. As a result, according to the manufacturing method, the ultraviolet curable resin 97 can be manufactured while simplifying the manufacturing process by repeatedly performing the discharge process and the curing process using the ultraviolet curable resin 97 having liquid repellency. It is possible to more reliably prevent the wetting and spreading to the upper end surface of the pillar 89.

  Incidentally, the electronic device manufacturing apparatus 10 is an example of a manufacturing apparatus. The circuit board 81 is an example of an electronic device.

<Second embodiment>
Next, a second embodiment of the present invention will be described with reference to FIGS. The difference from the first embodiment described above is that the pillar 89 formed by the ink jet method is once embedded in the insulating layer. In the following description, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  First, as shown in FIG. 8, the insulating layer 101 is formed so that the pillar 89 formed on the wiring 83 is buried. The insulating layer 101 can be formed using, for example, an inkjet method or a spin coating method. Next, as shown in FIG. 9, in the insulating layer 101, a through hole 101 </ b> A is formed in a portion covering the upper end surface of the pillar 89. The control device 71 controls the head unit 23 to emit laser light from the laser irradiation device 53, and removes a part of the insulating layer 101 (evaporation by laser ablation or the like) to form the through hole 101A. Thereby, the upper end surface of the pillar 89 is exposed from the through hole 101A. In the formation of the through-hole 101A by laser irradiation, for example, a method of controlling the output of the laser irradiation device 53 using a difference in reflectance or absorption rate with respect to laser light between the insulating layer 101 and the pillar 89 can be used.

  Next, the control device 71 controls the inkjet head 51 to discharge the conductive material 91 from the nozzle 55 toward the inside of the through hole 101A. In the pillar 89, the conductive material 91 is discharged to the upper end surface exposed from the through hole 101A. Further, the control device 71 discharges the conductive material 91 from the inkjet head 51, and then fires the conductive material 91 by the laser irradiation device 53. The control device 71 repeatedly performs, for example, discharge and firing, and extends the upper end portion 89A of the pillar 89 to the upper end surface 101B of the insulating layer 101. The electronic device manufacturing apparatus 10 of the second embodiment forms the pillar 89 in this way.

As described above, according to the above-described embodiment, the following effects can be obtained.
<Effect> In the manufacturing method of the present embodiment, the pillar 89 formed on the wiring 83 is embedded in the insulating layer 101. Next, the control device 71 irradiates laser light from the laser irradiation device 53, and removes the portion of the insulating layer 101 covering the upper end surface to form the through hole 101A. Then, the control device 71 discharges the conductive material 91 from the inkjet head 51 into the through hole 101 </ b> A, and then fires the conductive material 91 by the laser irradiation device 53. The pillar 89 has an upper end portion 89 </ b> A extending to the upper end surface 101 </ b> B of the insulating layer 101. Here, in the conventional manufacturing method, the insulating layer 101 is etched in order to expose the upper end surface of the pillar 89 once buried, which may increase the number of steps in the manufacturing process and thus lead to a decrease in yield. There is. On the other hand, in the manufacturing method of the present embodiment, for example, etching for exposing the upper end surface of the pillar 89 is not necessary, and the manufacturing process can be simplified and the yield can be improved. In addition, the electronic device manufacturing apparatus 10 is insulated by integrating the inkjet head 51 that discharges the ultraviolet curable resin 97 and the conductive material 91 and the laser irradiation device 53 that irradiates laser light into one head portion 23. The formation of the layer 101, the formation of the through-hole 101A, and the extension of the pillar 89 can be performed as a series of operations in one apparatus, and this also simplifies the manufacturing process. It has been.

<Third embodiment>
Next, a third embodiment of the present invention will be described with reference to FIGS. The difference from the second embodiment described above is that the upper end surface of the pillar 89 formed by the ink jet method is covered with a support material, and after forming the insulating layer, the support material is removed to form a through hole. In the following description, the same components as those in the second embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  First, as shown in FIG. 11, the support material 121 is formed so as to cover the upper end surface of the pillar 89 formed on the wiring 83. The support material 121 is formed, for example, by discharging a solution having a curing property by ultraviolet rays from the inkjet head 51 toward the upper end surface, and irradiating the ultraviolet rays by the ultraviolet irradiation device 25 (see FIG. 1) and curing.

  Next, as shown in FIG. 12, an insulating layer 123 is formed on the wiring 83 at the periphery of the pillar 89 and the support material 121. The insulating layer 123 is formed with a through hole 123 </ b> A by removing the support material 121. The support material 121 can be removed by a method of melting by heat or a method of melting using a specific liquid such as water or chemicals. Note that the support material 121 can be appropriately used as long as it can be removed after the insulating layer 123 is formed. Since the process of extending the upper end portion 89A of the pillar 89 to the upper end surface 123B of the insulating layer 123 after forming the through hole 123A is the same as in the second embodiment described above, description thereof is omitted here.

As described above, according to the above-described embodiment, the following effects can be obtained.
<Effect> In the manufacturing method of the present embodiment, the support material 121 is formed so that the pillar 89 formed on the wiring 83 covers the upper end surface. Next, an insulating layer 123 is formed on the periphery of the pillar 89 and the support material 121. The insulating layer 123 is formed with a through hole 123 </ b> A by removing the support material 121. The pillar 89 has an upper end 89 </ b> A extending to the upper end surface 123 </ b> B of the insulating layer 123. According to the manufacturing method, etching for exposing the upper end surface of the pillar 89 is not necessary, and the manufacturing process can be simplified.

In addition, this invention is not limited to said each Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art.
For example, in the first embodiment, both the method of applying the liquid repellent to the pillar 89 and the method of using the UV curable resin 97 having liquid repellency as the insulating resin for forming the insulating layer 85 are used in combination. The circuit board 81 may be manufactured by only one of the methods.
Moreover, although the electronic device manufacturing apparatus 10 of each said Example was set as the structure which implements a modeling process by moving the modeling plate P by making the inkjet head 51 into a fixed state, it is not limited to this. For example, the electronic device manufacturing apparatus 10 may perform the modeling process by moving the inkjet head 51 with the base 38 on which the modeling plate P is placed fixed. Alternatively, the electronic device manufacturing apparatus 10 may perform the modeling process while relatively moving both the inkjet head 51 and the modeling plate P.
Although not particularly mentioned in the above embodiments, the insulating layer 85 and the insulating layer 85 are formed in a process after the pillar 89 and the insulating layer 85 are formed or after the wiring 87 connected to the upper end surface of the pillar 89 is formed. In addition, a baking process for enhancing the adhesion with the pillar 89 and the wirings 83 and 87 may be performed. This firing step may be performed by laser irradiation or infrared lamp irradiation.
Further, the ultraviolet irradiation device 25 is not limited to the LED system, and a light source such as a mercury lamp may be used.
Moreover, the apparatus which discharges curable resin is not restricted to the inkjet head 51, A dispenser head etc. are employable.
(Appendix)
Moreover, although the Example which actualized the manufacturing method of the electronic device which concerns on this application was demonstrated above, the manufacturing method of an electronic device can also have the following structures, and there exists the following effect in that case.
For example, the first configuration is as follows.
The electronic device manufacturing method according to appendix 1 is a method of manufacturing an electronic device by an additive manufacturing method, the step of forming a pillar by discharging a conductive material on a wiring, and an insulating layer so that the pillar is embedded Forming a through hole by irradiating a portion of the insulating layer covering the upper end of the pillar with laser light, removing the insulating layer covering the upper end, and an upper end surface of the pillar exposed from the through hole And discharging the conductive material toward the upper surface, and extending the upper end portion of the pillar to the upper end surface of the insulating layer.
In this electronic device manufacturing method, a pillar formed by discharging a conductive material on a wiring is formed by embedding an insulating layer. Next, the insulating layer is irradiated with laser light on a portion covering the upper end of the pillar to form a through hole. Then, the conductive material is discharged into the through hole, and the upper end portion of the pillar extends to the upper end surface of the insulating layer. Here, in the conventional manufacturing method, the insulating layer is etched (etchback, CMP (chemical mechanical polishing), etc.) in order to expose the upper end surface of the pillar that has been buried once. There is a risk that man-hours will increase. On the other hand, according to the manufacturing method, etching for exposing the upper end surface of the pillar is unnecessary, and the manufacturing process can be simplified.
The electronic device manufacturing method according to appendix 2 is a method of manufacturing an electronic device by additive manufacturing, and includes a step of discharging a conductive material on a wiring to form a pillar, and a support so as to cover the upper end surface of the pillar. Forming a material, forming an insulating layer on the wiring at the periphery of the pillar and the support material, removing the support material and forming a through hole in the insulating layer, and on the pillar exposed from the through hole And discharging a conductive material toward the end face, and extending the upper end of the pillar to the upper end face of the insulating layer.
In this method for manufacturing an electronic device, a support material is formed so as to cover the upper end surface of a pillar formed by discharging a conductive material onto a wiring. Next, an insulating layer is formed on the wiring at the periphery of the pillar and the support material. The through hole is formed in the insulating layer by removing the support material. Then, the conductive material is discharged into the through hole, and the upper end portion of the pillar extends to the upper end surface of the insulating layer. According to the manufacturing method, etching for exposing the upper end surface of the pillar is not required, and the manufacturing process can be simplified.

  DESCRIPTION OF SYMBOLS 10 Electronic device manufacturing apparatus, 81 Circuit board, 83, 87 wiring, 91 electroconductive material, 89 pillar, 89A upper end part, 95 liquid repellent, 85,101,123 insulating layer, 101A, 123A through-hole, 91 electroconductive material, 85A, 101B, 123B Upper end surface, 121 Support material.

Claims (2)

An electronic device manufacturing method by additive manufacturing,
Discharging a conductive material on the wiring to form pillars;
Discharging a liquid repellent to the upper end of the pillar;
Discharging a liquid repellent insulating material onto the wiring at the periphery of the pillar ;
Curing the insulating material;
A method of manufacturing an electronic device , wherein an insulating layer is formed on the wiring by repeatedly performing the step of discharging the insulating material and the step of curing . An electronic device is manufactured by the manufacturing method according to claim 1 .

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