JP6349382B2 - 補助エンクロージャを利用するガスエンクロージャシステムおよび方法 - Google Patents

補助エンクロージャを利用するガスエンクロージャシステムおよび方法 Download PDF

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Publication number
JP6349382B2
JP6349382B2 JP2016501353A JP2016501353A JP6349382B2 JP 6349382 B2 JP6349382 B2 JP 6349382B2 JP 2016501353 A JP2016501353 A JP 2016501353A JP 2016501353 A JP2016501353 A JP 2016501353A JP 6349382 B2 JP6349382 B2 JP 6349382B2
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Japan
Prior art keywords
enclosure
assembly
gas
gas enclosure
printhead
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JP2016501353A
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English (en)
Japanese (ja)
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JP2016518675A (ja
Inventor
ジャスティン マウック,
ジャスティン マウック,
アレクサンダー ソ−カン コー,
アレクサンダー ソ−カン コー,
イリアフ ブロンスキー,
イリアフ ブロンスキー,
シャンドン アルダーソン,
シャンドン アルダーソン,
Original Assignee
カティーバ, インコーポレイテッド
カティーバ, インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from US13/802,304 external-priority patent/US9048344B2/en
Application filed by カティーバ, インコーポレイテッド, カティーバ, インコーポレイテッド filed Critical カティーバ, インコーポレイテッド
Publication of JP2016518675A publication Critical patent/JP2016518675A/ja
Application granted granted Critical
Publication of JP6349382B2 publication Critical patent/JP6349382B2/ja
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/02Framework
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12Guards, shields or dust excluders
    • B41J29/13Cases or covers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/54Providing fillings in containers, e.g. gas fillings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Facsimiles In General (AREA)
JP2016501353A 2013-03-13 2014-03-11 補助エンクロージャを利用するガスエンクロージャシステムおよび方法 Active JP6349382B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/802,304 2013-03-13
US13/802,304 US9048344B2 (en) 2008-06-13 2013-03-13 Gas enclosure assembly and system
PCT/US2014/023820 WO2014164932A2 (en) 2013-03-13 2014-03-11 Gas enclosure systems and methods utilizing an auxiliary enclosure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017231845A Division JP6463827B2 (ja) 2013-03-13 2017-12-01 補助エンクロージャを利用するガスエンクロージャシステムおよび方法

Publications (2)

Publication Number Publication Date
JP2016518675A JP2016518675A (ja) 2016-06-23
JP6349382B2 true JP6349382B2 (ja) 2018-06-27

Family

ID=51659308

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2016501353A Active JP6349382B2 (ja) 2013-03-13 2014-03-11 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2017231845A Active JP6463827B2 (ja) 2013-03-13 2017-12-01 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2019000246A Active JP6831046B2 (ja) 2013-03-13 2019-01-04 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2020181803A Active JP7177521B2 (ja) 2013-03-13 2020-10-29 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2022177620A Active JP7454878B2 (ja) 2013-03-13 2022-11-04 補助エンクロージャを利用するガスエンクロージャシステムおよび方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2017231845A Active JP6463827B2 (ja) 2013-03-13 2017-12-01 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2019000246A Active JP6831046B2 (ja) 2013-03-13 2019-01-04 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2020181803A Active JP7177521B2 (ja) 2013-03-13 2020-10-29 補助エンクロージャを利用するガスエンクロージャシステムおよび方法
JP2022177620A Active JP7454878B2 (ja) 2013-03-13 2022-11-04 補助エンクロージャを利用するガスエンクロージャシステムおよび方法

Country Status (5)

Country Link
EP (2) EP3474317B1 (enExample)
JP (5) JP6349382B2 (enExample)
KR (6) KR20220162809A (enExample)
CN (2) CN109130549B (enExample)
WO (1) WO2014164932A2 (enExample)

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Also Published As

Publication number Publication date
EP2973676A4 (en) 2017-07-19
WO2014164932A2 (en) 2014-10-09
KR20180107319A (ko) 2018-10-01
JP2021035678A (ja) 2021-03-04
JP2019091702A (ja) 2019-06-13
CN105190860A (zh) 2015-12-23
CN105190860B (zh) 2018-09-21
WO2014164932A3 (en) 2015-02-26
KR102098613B1 (ko) 2020-04-08
CN109130549A (zh) 2019-01-04
EP3474317B1 (en) 2022-06-22
CN109130549B (zh) 2021-02-26
JP2016518675A (ja) 2016-06-23
KR20150131111A (ko) 2015-11-24
JP7177521B2 (ja) 2022-11-24
KR102851236B1 (ko) 2025-08-26
JP6831046B2 (ja) 2021-02-17
KR101903226B1 (ko) 2018-10-01
KR102267858B1 (ko) 2021-06-22
EP3474317A1 (en) 2019-04-24
EP2973676B1 (en) 2018-11-28
JP7454878B2 (ja) 2024-03-25
EP2973676A2 (en) 2016-01-20
JP6463827B2 (ja) 2019-02-06
KR20220162809A (ko) 2022-12-08
KR20200038326A (ko) 2020-04-10
KR102470120B1 (ko) 2022-11-22
KR20240146089A (ko) 2024-10-07
KR20210077007A (ko) 2021-06-24
JP2018041744A (ja) 2018-03-15
JP2023010755A (ja) 2023-01-20

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