CN109130549B - 气体封闭系统和利用辅助封闭装置的方法 - Google Patents

气体封闭系统和利用辅助封闭装置的方法 Download PDF

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Publication number
CN109130549B
CN109130549B CN201811010130.8A CN201811010130A CN109130549B CN 109130549 B CN109130549 B CN 109130549B CN 201811010130 A CN201811010130 A CN 201811010130A CN 109130549 B CN109130549 B CN 109130549B
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China
Prior art keywords
enclosure
assembly
printing system
printhead
auxiliary
Prior art date
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CN201811010130.8A
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English (en)
Chinese (zh)
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CN109130549A (zh
Inventor
J.莫克
A.S-K.高
E.弗龙斯基
S.阿尔德森
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Kedihua Display Technology Shaoxing Co ltd
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Codiva
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Priority claimed from US13/802,304 external-priority patent/US9048344B2/en
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Publication of CN109130549A publication Critical patent/CN109130549A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/02—Framework
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/12—Guards, shields or dust excluders
    • B41J29/13—Cases or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/54—Providing fillings in containers, e.g. gas fillings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Facsimiles In General (AREA)
CN201811010130.8A 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法 Active CN109130549B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/802,304 US9048344B2 (en) 2008-06-13 2013-03-13 Gas enclosure assembly and system
US13/802304 2013-03-13
CN201480027671.5A CN105190860B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480027671.5A Division CN105190860B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Publications (2)

Publication Number Publication Date
CN109130549A CN109130549A (zh) 2019-01-04
CN109130549B true CN109130549B (zh) 2021-02-26

Family

ID=51659308

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201811010130.8A Active CN109130549B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法
CN201480027671.5A Active CN105190860B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201480027671.5A Active CN105190860B (zh) 2013-03-13 2014-03-11 气体封闭系统和利用辅助封闭装置的方法

Country Status (5)

Country Link
EP (2) EP3474317B1 (enExample)
JP (5) JP6349382B2 (enExample)
KR (6) KR20220162809A (enExample)
CN (2) CN109130549B (enExample)
WO (1) WO2014164932A2 (enExample)

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CN118181360B (zh) * 2024-05-15 2024-07-16 成都德力斯实业有限公司 一种在役核手套箱及其改造方法

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Also Published As

Publication number Publication date
EP2973676A4 (en) 2017-07-19
WO2014164932A2 (en) 2014-10-09
KR20180107319A (ko) 2018-10-01
JP2021035678A (ja) 2021-03-04
JP2019091702A (ja) 2019-06-13
CN105190860A (zh) 2015-12-23
CN105190860B (zh) 2018-09-21
JP6349382B2 (ja) 2018-06-27
WO2014164932A3 (en) 2015-02-26
KR102098613B1 (ko) 2020-04-08
CN109130549A (zh) 2019-01-04
EP3474317B1 (en) 2022-06-22
JP2016518675A (ja) 2016-06-23
KR20150131111A (ko) 2015-11-24
JP7177521B2 (ja) 2022-11-24
KR102851236B1 (ko) 2025-08-26
JP6831046B2 (ja) 2021-02-17
KR101903226B1 (ko) 2018-10-01
KR102267858B1 (ko) 2021-06-22
EP3474317A1 (en) 2019-04-24
EP2973676B1 (en) 2018-11-28
JP7454878B2 (ja) 2024-03-25
EP2973676A2 (en) 2016-01-20
JP6463827B2 (ja) 2019-02-06
KR20220162809A (ko) 2022-12-08
KR20200038326A (ko) 2020-04-10
KR102470120B1 (ko) 2022-11-22
KR20240146089A (ko) 2024-10-07
KR20210077007A (ko) 2021-06-24
JP2018041744A (ja) 2018-03-15
JP2023010755A (ja) 2023-01-20

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Effective date of registration: 20220726

Address after: Room 402, 4th floor, building 1, No. 326, Yinqiao Road, Gaobu street, Yuecheng District, Shaoxing City, Zhejiang Province

Patentee after: Kedihua display technology (Shaoxing) Co.,Ltd.

Address before: California, USA

Patentee before: KATEEVA, Inc.

TR01 Transfer of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Gas Closed system and method of using auxiliary closed device

Effective date of registration: 20230625

Granted publication date: 20210226

Pledgee: Xinji Co.,Ltd.

Pledgor: Kedihua display technology (Shaoxing) Co.,Ltd.

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