JP6332303B2 - 金属被覆方法及び発光装置とその製造方法 - Google Patents

金属被覆方法及び発光装置とその製造方法 Download PDF

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Publication number
JP6332303B2
JP6332303B2 JP2016034643A JP2016034643A JP6332303B2 JP 6332303 B2 JP6332303 B2 JP 6332303B2 JP 2016034643 A JP2016034643 A JP 2016034643A JP 2016034643 A JP2016034643 A JP 2016034643A JP 6332303 B2 JP6332303 B2 JP 6332303B2
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Prior art keywords
light emitting
metal layer
light
metal
covering
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Japanese (ja)
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JP2016225598A5 (enExample
JP2016225598A (ja
Inventor
義和 松田
義和 松田
鈴木　亮
亮 鈴木
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Nichia Corp
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Nichia Corp
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Application filed by Nichia Corp filed Critical Nichia Corp
Priority to US15/169,133 priority Critical patent/US9893256B2/en
Publication of JP2016225598A publication Critical patent/JP2016225598A/ja
Publication of JP2016225598A5 publication Critical patent/JP2016225598A5/ja
Priority to US15/846,696 priority patent/US10290787B2/en
Application granted granted Critical
Publication of JP6332303B2 publication Critical patent/JP6332303B2/ja
Priority to US16/373,473 priority patent/US11114596B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2016034643A 2015-06-01 2016-02-25 金属被覆方法及び発光装置とその製造方法 Active JP6332303B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/169,133 US9893256B2 (en) 2015-06-01 2016-05-31 Metal coating method, light-emitting device, and manufacturing method for the same
US15/846,696 US10290787B2 (en) 2015-06-01 2017-12-19 Metal coating method, light-emitting device, and manufacturing method for the same
US16/373,473 US11114596B2 (en) 2015-06-01 2019-04-02 Light-emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015111525 2015-06-01
JP2015111525 2015-06-01

Publications (3)

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JP2016225598A JP2016225598A (ja) 2016-12-28
JP2016225598A5 JP2016225598A5 (enExample) 2017-03-02
JP6332303B2 true JP6332303B2 (ja) 2018-05-30

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Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019066454A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ、センサモジュール
JP6793103B2 (ja) 2017-09-29 2020-12-02 ミネベアミツミ株式会社 ひずみゲージ
JP2019066453A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ
JP2019066312A (ja) 2017-09-29 2019-04-25 ミネベアミツミ株式会社 ひずみゲージ
JP2019082424A (ja) 2017-10-31 2019-05-30 ミネベアミツミ株式会社 ひずみゲージ
JP6806042B2 (ja) 2017-11-28 2021-01-06 日亜化学工業株式会社 発光装置
JP2019113411A (ja) 2017-12-22 2019-07-11 ミネベアミツミ株式会社 ひずみゲージ、センサモジュール
JP2019184344A (ja) 2018-04-05 2019-10-24 ミネベアミツミ株式会社 ひずみゲージ及びその製造方法
KR102619449B1 (ko) * 2018-06-04 2023-12-28 삼성전자주식회사 반도체 패턴 형성 방법 및 이를 이용한 적층 세라믹 콘덴서 제조 방법
JP6947984B2 (ja) * 2018-09-27 2021-10-13 日亜化学工業株式会社 発光装置の製造方法
WO2020085247A1 (ja) 2018-10-23 2020-04-30 ミネベアミツミ株式会社 アクセルペダル、ステアリング、６軸センサ、エンジン、バンパー等
JP6897659B2 (ja) * 2018-12-13 2021-07-07 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP6947986B2 (ja) * 2018-12-18 2021-10-13 日亜化学工業株式会社 発光装置の製造方法
JP6863420B2 (ja) 2019-07-31 2021-04-21 日亜化学工業株式会社 発光モジュール及びその製造方法、液晶表示装置
JP7335498B2 (ja) * 2019-09-03 2023-08-30 日亜化学工業株式会社 発光装置、及びその製造方法
JP2021162303A (ja) 2020-03-30 2021-10-11 ミネベアミツミ株式会社 ひずみゲージ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5019535A (en) * 1989-03-28 1991-05-28 General Electric Company Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5221426A (en) * 1991-11-29 1993-06-22 Motorola Inc. Laser etch-back process for forming a metal feature on a non-metal substrate

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JP2016225598A (ja) 2016-12-28

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