JP6327825B2 - Flexible substrate, flexible substrate assembly, and substrate inspection apparatus - Google Patents

Description

  The present invention relates to a structure of a flexible substrate and a substrate inspection apparatus that performs inspection by bringing a plurality of probes fixed to a test head into contact with a substrate to be inspected.

  In order to inspect the quality of a board (also called a printed board or a circuit board) on which a conductor pattern is formed, a board inspection apparatus is used. The board inspection device contacts the inspection point on the conductor pattern and measures the electrical characteristics such as the resistance and inductance of the conductor pattern and the capacitance between the conductor patterns, and the value is within the allowable range. Whether or not the substrate is inspected. The inspection point is set in advance at a portion on the conductor pattern where the resist is not formed on the surface, such as a component mounting land or via, and the probe can be contacted.

  A substrate inspection apparatus called a jig type includes a large number of probes corresponding to the number of inspection points. These many probes are fixed to a test head (pin head). The test head supports each probe in alignment with the position of each inspection point so that each probe can contact each inspection point together. When the inspection point is set on one side of the board, the test head is arranged on one side of the board, and when the inspection point is set on both sides of the board, the pair of opposing test heads sandwich the board. It is arranged on both sides. In the substrate inspection apparatus, the test head is brought close to the substrate by the moving mechanism, and each probe is brought into contact with each inspection point together.

  In such a substrate inspection apparatus, a connection switching unit is provided between a plurality of probes and a measurement unit that measures electrical characteristics. The board inspection apparatus controls the connection switching unit to arbitrarily switch (select) a probe that is electrically connected to the measurement unit. The board inspection apparatus electrically connects a set of probes corresponding to each inspection item to the measuring unit in order according to a predetermined order of inspection items, and sequentially performs measurement for each inspection item (each inspection point). To go.

  For example, in Patent Document 1, a test head (contact terminal support portion) that supports a probe (contact terminal) is provided in a movable unit (movable portion) that is moved by a moving mechanism, and a connection switching portion (connection switching device). There is also described a printed circuit board inspection device provided in the movable unit. The measuring unit of the apparatus is provided in a fixed unit (fixed unit). In order to connect the connection switching unit and a large number of probes, a large number of wires equal to the number of probes are required. Therefore, when the connection switching unit is provided in the fixed unit, many long wires are required to connect the fixed unit and the movable unit. On the other hand, since the connection switching unit and each probe are connected in the movable unit by providing the connection switching unit in the movable unit as in the device of Patent Document 1, the wiring for connecting the connection switching unit and the probe is connected. The length can be shortened, and the number of wires connecting the fixed unit and the movable unit can be greatly reduced.

Japanese Patent No. 4338051

  In order to connect an arbitrary probe to the measurement terminal of the measurement unit, the connection switching unit is provided with an electric circuit in which, for example, a number of switches multiplied by the number of terminals of the measurement unit and the number of probes are connected in a matrix. There is a need. In the case of a measurement circuit that measures by the four-terminal method, since it is necessary to bring two probes into contact with one inspection point, the number of switches is further increased. Further, it is necessary to provide an electrical circuit for controlling these switches in the connection switching unit. Although depending on the number of inspection points on the substrate to be inspected, in order to switch hundreds to tens of thousands of probes corresponding to the number of inspection points, switches many times the number of probes are required. Even if a semiconductor switch is used as a switch and a semiconductor integrated circuit (IC) in which a plurality of semiconductor switches are integrated is used, the number of components used is enormous. Further, since the number of probes is large, the number of input / output wires (connector terminals) for connecting the connection switching unit and the probe is increased, and the number of connectors is extremely increased. For this reason, it is not practical to configure the connection switching unit with a single board due to space limitations. In practice, switches, control electric circuits, and connectors are distributed and arranged on a large number of boards. It is configured. Therefore, the connection switching part is large in shape and heavy.

  On the other hand, it is necessary to move the movable unit including the connection switching unit. Therefore, there is a problem that the connection switching unit is desired to be small and light.

  The present invention has been made to solve the above-described problems, and is provided with a movable unit, and a connection inspection unit for switching a plurality of probes can be made small and light, a substrate inspection apparatus, An object of the present invention is to provide a flexible substrate and a flexible substrate assembly that can make a substrate on which an electric circuit is mounted small and light.

In order to achieve the above object, the flexible substrate according to claim 1 is a flexible base material that can be folded in two and a plurality of terminals that the first connector has. A plurality of first connector connection pads formed on a pair of opposing portions of the base material that face each other when folded in half, and a plurality of terminals that the second connector has In order to connect, a plurality of second connector connection pads formed in other parts other than the pair of opposing portions, and the surface of the base material that becomes an outer surface when the base material is folded in half A component pad for mounting the component, and the protruding piece is formed such that a protruding piece protruding outward from a bent side formed by folding the base material in half is formed. Notches for partitioning There have been formed on the substrate, the protruding piece, characterized that you have been the second connector connection pad formation.

  A flexible substrate according to a second aspect is the one according to the first aspect, wherein the pair of opposing portions are a pair of end portions sandwiching a bent portion for folding the base material in two. It is characterized by being.

A flexible substrate according to a third aspect is the one according to the first or second aspect , wherein the second connector connection pad is inserted into the second connector and connected to a terminal of the second connector by contact. It is characterized by being.

According to a fourth aspect of the present invention, there is provided a flexible substrate assembly in which a component is mounted on the component pad of the flexible substrate according to any one of the first to third aspects, and the base material is folded in half. The terminal of the said 1st connector is connected to the pad for 1 connector connection, It is characterized by the above-mentioned.

A flexible substrate assembly according to a fifth aspect is the one according to the fourth aspect , wherein an elastic body is used so that a terminal of the first connector is electrically connected to an external connector by contact. It is comprised by the urging | biasing terminal urged | biased by the said external connector direction.

According to a sixth aspect of the present invention, there is provided a substrate inspection apparatus comprising: a test head including a plurality of probes; a moving mechanism that moves the test head to bring the plurality of probes into contact with a substrate to be inspected; and measurement of electrical characteristics. A measuring unit to perform, and a connection switching unit that connects any of the plurality of probes to the measuring unit, and the movable unit that is moved by the moving mechanism includes the test head and the connection switching unit. A flexible circuit board assembly according to claim 4 or 5 , wherein a component constituting the connection switching unit is mounted on the component pad, and the connection switching unit. It is provided in the said movable unit as.

According to a seventh aspect of the present invention, there is provided the substrate inspection apparatus according to the sixth aspect , wherein the plurality of terminals of the first connector of the flexible substrate assembly are electrically connected to the plurality of probes of the test head. are the are those, a plurality of terminals of the second connector, characterized in that the measuring unit及beauty control part is intended to be electrically connected.

A substrate inspection apparatus according to an eighth aspect is the one according to the sixth or seventh aspect, wherein the movable unit holds the surface of the flexible substrate vertically.

According to a ninth aspect of the present invention, there is provided the substrate inspection apparatus according to any one of the sixth to eighth aspects, wherein the movable unit can mount any number of 1 to n flexible substrate assemblies. It is comprised by these.

  According to the flexible substrate and the flexible substrate assembly of the present invention, it is possible to connect to the first connector having a large number of terminals by using a pair of opposing portions of the base material folded in half. Furthermore, since the flexible substrate is lighter than the rigid substrate, it can be made much lighter than when a rigid substrate is used. Further, since the flexible substrate is thinner than the rigid substrate, it can be reduced in size. In addition, in a multi-layer rigid board, if through holes are formed, the through holes become dead spaces in other layers. Therefore, in order to increase the wiring density, blind via holes, It is necessary to use a build-up board. In the flexible substrate of the present invention, even if a through hole is formed, it does not penetrate into the overlapping surface when folded in half, so the through hole does not become a dead space, and the effect of using a blind via via or a build-up substrate And the wiring density can be increased, which contributes to the miniaturization of the substrate.

  When the pair of opposed portions are a pair of end portions sandwiching the bent portion of the base material, both ends (a pair of end portions) that become open ends when folded in two are bag-bound by the first connector. Since it is fixed to the shape, the shape of the flexible substrate that is lightweight and flexible is easily maintained. Further, when the base material is folded in half, the degree of freedom of movement between the pair of end portions is high, so that the operation of connecting to the first connector can be easily performed.

  A notch for partitioning the projecting piece is formed in the base material so that a projecting piece projecting outward from the bent side formed by folding the base material in half is formed on the base material. When the second connector connection pad is formed, the second connector can be connected even at the bent side.

  When the second connector connection pad is inserted into the second connector and connected to the terminal of the second connector by contact, the connector can be easily connected. In addition, when the terminal of the first connector is constituted by a biasing terminal biased in the direction of the external connector by an elastic body so that the terminal is electrically connected to the external connector by contact, Connection with the connector can be easily performed.

  When the flexible substrate assembly is provided in the movable unit as a connection switching unit, the movable unit can be reduced in weight and size. Therefore, the moving mechanism can be downsized, and the motor that drives the moving mechanism can be downsized.

  The plurality of terminals of the first connector are electrically connected to the plurality of probes of the test head, and the plurality of terminals of the second connector are electrically connected to the measurement unit and the control unit. In this case, it is easy to cope with the number of probes that are often used.

  When the movable unit holds the flexible substrate with the surface of the flexible substrate vertical, the flexible substrate that is easily bent can be used without being bent.

  Since the movable unit is configured to be capable of mounting an arbitrary number of 1 to n flexible substrate assemblies, the number of probes can be easily accommodated.

It is a block diagram which shows the board | substrate inspection apparatus to which this invention is applied. It is a block diagram which shows the measurement part of the board | substrate inspection apparatus to which this invention is applied. It is a block diagram which shows the movable unit of the board | substrate inspection apparatus to which this invention is applied. It is a block diagram which shows a part of connection switching part of the board | substrate inspection apparatus to which this invention is applied. It is a block diagram which shows a part of movable unit of the board | substrate inspection apparatus to which this invention is applied. It is the front view (FIG. 6 (a)) and side view (FIG. 6 (b)) which show the connection switching part comprised with the flexible substrate assembly to which this invention is applied. It is an expanded view which shows the flat state before bending to two of the flexible substrates to which this invention is applied. It is the front view (Drawing 8 (a)) and side view (Drawing 8 (b)) of the 1st connector used for the flexible substrate assembly to which the present invention is applied. It is a side view which shows the manufacturing process (FIG. 9 (a) is before a connection, FIG.9 (b) is after a connection) which connects a flexible substrate to a 1st connector. It is a bottom view of a back board. FIG. 3 is a side view showing a state in which a plurality of flexible board assemblies to which the present invention is applied are attached to a backboard and the backboard is attached to the main board. It is a top view of the test head to which a flexible substrate assembly is connected. It is a figure which shows the other flexible substrate (FIG. 13 (a)) to which this invention is applied, and a flexible substrate assembly (FIG. 13 (a)). It is a figure which shows further another flexible substrate (FIG. 14 (a)) to which this invention is applied, and a flexible substrate assembly (FIG. 14 (a)).

  Hereinafter, although the form for implementing this invention is demonstrated in detail, the scope of the present invention is not limited to these examples.

  FIG. 1 shows a substrate inspection apparatus 1 to which the present invention is applied. The substrate inspection apparatus 1 includes a substrate fixing mechanism 2, a movable unit 3, a moving mechanism 4, a measurement unit 5, a control unit 6, a display unit 7, and an operation unit 8, and inspects a substrate 200 to be inspected. is there.

  The substrate fixing mechanism 2 and the moving mechanism 4 are provided at the inspection stage (inspection place) of the substrate 200. The measurement unit 5, the control unit 6, the display unit 7, and the operation unit 8 are provided in a fixed unit (fixed unit) that is fixed. The fixed unit may have a plurality of cases.

  The substrate fixing mechanism 2 is a well-known one, and positions and fixes the substrate 200 at a predetermined inspection position. The substrate fixing mechanism 2 is provided at a position where it does not interfere with a probe P described later. The board fixing mechanism 2 includes, for example, a motor (not shown), grips one or two opposite sides or corner edges of the board 200, and faces the board 200 while applying tension to prevent the board 200 from bending. The substrates 200 are fixed at a predetermined inspection position by pulling each other moderately.

  The movable unit 3 includes a test head 14, an attachment / detachment mechanism 13, and a connection switching unit 11.

  The test head 14 includes a plurality of probes P. The attachment / detachment mechanism 13 attaches the test head 14 to the movable unit 3 in a detachable manner. The connection switching unit 11 electrically connects an arbitrary probe P to be used for measurement among the plurality of probes P to the measuring unit 5.

  The moving mechanism 4 moves the movable unit 3 (test head 14) to bring the plurality of probes P of the test head 14 into contact with the substrate 200. The moving mechanism 4 is a known mechanism, and includes a motor (not shown) as a driving power source for each of the XYZ axes (moving axes), and the test head 14 can be moved in the XYZ axis directions shown in FIG. Has been.

  The figure shows an example in which the inspection point T is provided on one side (upper side in the figure) of the substrate 200 and the movable unit 3 and the moving mechanism 4 are provided on one side (upper side in the figure) of the substrate 200. However, when the inspection points T are provided on both surfaces of the substrate 200, the pair of movable units 3 and the moving mechanism 4 are disposed on both surfaces (upper and lower sides in the figure) so that the substrate 200 is sandwiched between them. ).

  The measurement unit 5 is the same as the measurement unit of the conventional board inspection apparatus, and measures electrical characteristics such as resistance, inductance, and capacitance. A measurement terminal of the measurement unit 5 is connected to the connection switching unit 11.

  The control unit 6 controls the operation of each unit of the substrate inspection apparatus 1 and performs arithmetic processing, and includes a CPU (Central Processing Unit), a storage unit, an interface circuit with each unit, and the like (not shown). . The storage unit is a rewritable nonvolatile memory, and as an example, is a semiconductor memory such as a flash memory or a hard disk. In the storage unit, an operation program, a fixed position of the substrate, inspection items, a measurement order of inspection items, inspection points and positions for the inspection items, an allowable range of measurement values for inspection, and the like are recorded in advance. At the same time, measurement values and inspection results are recorded during inspection. The control unit 6 performs fixing control of the substrate fixing mechanism 2, movement control of the moving mechanism 4, switching control of the connection switching unit 11, and measurement control of the measuring unit 5. Moreover, the control part 6 performs the quality determination process of a board | substrate from a measurement result. Further, the control unit 6 performs a display process of a display screen displayed on the display unit 7 and displays, for example, the inspection result on the display unit 7. Further, the control unit 6 performs an input process for determining an input from the operation unit 8 and determines, for example, an operation for starting an inspection or an operation for setting an inspection condition. The control unit 6 may be configured with a general-purpose computer or may be configured with dedicated hardware.

  The display unit 7 is a liquid crystal panel, a plasma panel, a CRT (cathode ray tube) or the like having a display screen capable of displaying an image. The operation unit 8 is for inputting to the board inspection apparatus 1 by an operator's operation, and is, for example, a keyboard or a mouse. The display unit 7 and the operation unit 8 may be configured with a touch panel.

FIG. 2 shows a specific example of the measurement unit 5. As an example, the measurement unit 5 includes a plurality (two circuits) of measurement circuits 20 (20 ₁ and 20 ₂ ) necessary for inspection. Depending on the necessity, the measurement unit 5 may be provided with only one measurement circuit 20 or may be provided with three or more circuits. When a plurality of measurement circuits 20 are provided, the same type of measurement circuit 20 may be provided, or different types of measurement circuits 20 may be provided. Measuring circuit ₂₀ 1 of the drawing, 20 _2, for example, measurement circuit 20 ₁ for a small resistance measurement, the measurement circuit 20 ₂ or a circuit for large resistance measurement, the measurement circuit 20 ₁ is direct current signal for measurement, the measurement circuit 20 ₂ or a circuit for AC signals measured and to provide redundancy measurement circuit 20 ₁ working, or a circuit for measuring circuit 20 ₂ is spare, for measurement circuit 20 ₁ for resistance measurement (for electrical characteristic measurement), the measurement circuit 20 ₂ may also be or be a circuit of the capacitance measurement (other for measuring electrical characteristics). The type and number of measurement circuits 20 provided in the measurement unit 5 are determined depending on the necessity of inspection items. Provided to the measurement unit 5 and the measuring circuit 20 ₁ of the same type and the measuring circuit 20 _2, it may be used alternately for the inspection order to increase the inspection speed.

Measuring circuit 20 _1, as an example, with a circuit capable of measuring electrical characteristics by the 4-terminal method, a circuit capable of outputting a guard voltage. Measuring circuit 20 ₁ is, for example, a measuring circuit for the small resistance measurement, the signal source 21 1 to output a measurement _signal, a current meter 22 1 which measures the current output of the signal source 21 _1, the voltage measuring the voltage A total of 23 ₁ and a guard amplifier 24 ₁ are provided. The signal source 21 ₁ has one end connected to the terminal Hc1 and the other end connected to the terminal Lc1 via the ammeter 22 ₁ . Voltmeter 23 _1, the one end terminal HpI, the other end is connected to the terminal Lp1. The guard amplifier 24 ₁ has a non-inverting input terminal is connected to the terminal HpI, an inverting input terminal connected to the terminal Gp1, an output terminal connected to the terminal Gc 1. Signal source 21 _1, the control of the control unit 6, the value of the current (or voltage) to be output is controlled. Ammeter 22 ₁ outputs the value of the measured current to the control unit 6 by a digital signal by an analog / digital converter. Voltmeter 23 ₁ outputs the value of the measured voltage to the control unit 6 by a digital signal by an analog / digital converter. Each terminal Hp1, Hc1, Lp1, Lc1, Gp1, Gc1 is connected to the connection switching unit 11 of the movable unit 3 by a wiring cable.

Measuring circuit 20 _2, as an example, with a circuit capable of measuring electrical characteristics by the 4-terminal method, a circuit capable of outputting a guard voltage. Measuring circuit 20 _2, for example, than the measurement circuit 20 ₁ is a measuring circuit for a large resistance measurement, as shown in the figure, the signal source 21 _2, the ammeter 22 _2, the voltmeter 23 _2, and guard an amplifier 24 _2. These connections are connected in the same manner as the measuring circuit 20 _1. Signal source 21 ₂ is controlled by the control unit 6. Measured value of the ammeter 22 ₂ and the voltmeter 23 ₂ are respectively outputted to the control unit 6 by a digital signal. Measuring circuit 20 ₂ is provided with a terminal Hp2, Hc2, Lp2, Lc2, Gp2, Gc2, they are connected by cables to the connection switching part 11 of the movable unit 3.

  The measurement circuit 20 may not include the guard voltage circuit (guard amplifier 24), or the measurement circuit 20 may be a circuit that performs measurement by the two-terminal method. The measurement circuit 20 may be any circuit as long as it measures electrical characteristics necessary for inspection.

In FIG. 3, the specific example of the movable unit 3 provided with the connection switching part 11 is shown. The movable unit 3 includes a plurality of connection switching units 11 </ b _{> A 1 to} 11 </ b _{> An} obtained by dividing the connection switching unit 11 as the connection switching unit 11. Each of the connection switching units 11A _{1 to} 11A _n is configured similarly. These connection switching units 11A _{1 to} 11A _n are mounted on a corresponding number of flexible substrate FPCs. In this movable unit 3, the number of flexible circuit boards FPC (FPC _{1 to} FPC _n ) is increased or decreased in the range of _{1 to n,} thereby increasing or decreasing the switchable number of connection switching units 11 (11 A _{1 to} 11 A _n ). It is possible to easily cope with an increase or decrease in the number of probes P to be used. For example, when the connection switching unit 11A of one flexible substrate FPC is configured to be connectable (switchable) to a predetermined number (128 in this example) of probes P that perform measurement by the four-terminal method, the flexible substrate FPC The number of probes P can be increased or decreased by a predetermined number (128).

  A first connector 62 is attached to each flexible board FPC. The first connector 62 includes a plurality (128 terminals) (biasing terminals B) connected to the connection switching unit 11A. The bias terminal B is connected to a terminal (pin terminal C) of the test head 14.

  The terminals Hp1, Hc1, Lp1, Lc1, Gp1, Gc1, Hp2, Hc2, Lp2, Lc2, Gp2, and Gc2 of the measurement unit 5 are connected to each flexible substrate FPC. Further, a terminal (instruction signal Cnt1) of the control unit 6 is connected to each flexible substrate FPC. When each flexible substrate FPC is accommodated in the movable unit 3, the movable unit 3 is provided with a second connector 92 for connecting to each flexible substrate FPC, and the measurement unit 5 and the second connector 92 are connected via the second connector 92. Each terminal of the control unit 6 is electrically connected.

FIG. 4 shows a detailed circuit example of the connection switching unit 11A (connection switching unit 11A ₁ as an example). Connection switching part 11A ₁ is provided with switching control circuit 31, and the switch circuit 32. The switching control circuit 31 is connected to the control unit 6 (see FIG. 1), and controls switching of the switch circuit 32 in accordance with the instruction signal Cnt1 output from the control unit 6.

The switch circuit 32 includes a number of switches S1 _{1 to} S1 ₆ , S2 _{1 to} S2 ₆ , S3 ₁ to S <b> ₁ to selectively switch the probe P so as to connect an arbitrary probe P to the measurement unit 5 (see FIG. 2). and a S3 _{3, S} P1-1 _{~S P128-3.} In order to reduce the size of the movable unit 3, each of the switches S1 _{1 to} S1 ₆ , S2 _{1 to} S2 ₆ , S3 _{1 to} S3 ₃ , and S _{P1-1 to} S _P128-3 is preferably small. For example, it is preferable to use a semiconductor switch. Further, it is preferable to use a semiconductor integrated circuit in which a large number of semiconductor switches are integrated.

The switch circuit 32 is connected to the terminals Hp1, Hc1, Lp1, Lc1, Gp1, and Gc1 of the measuring unit 5 and the terminals Hp2, Hc2, Lp2, Lc2, Gp2, and Gc2. When measurement is performed using the measurement circuit 20 ₁ (see FIG. 2) of the measurement unit 5, the switches S1 _{1 to} S1 ₆ connected to the terminals Hp1 to Gc1 are turned on (connected) and the terminals Hp2 to Gc2 are connected by the control unit 6. The switches S2 _{1 to} S2 ₆ are controlled to be turned off (disconnected). When measurement is performed using the measurement circuit 20 ₂ (see FIG. 2), the control unit 6 controls the switches S1 _{1 to} S1 _{6 to} be off and the switches S2 _{1 to} S2 ₆ to be on. When the measurement circuits 20 ₁ and 20 ₂ measure by the four-terminal method, the switches S3 ₁ and S3 ₂ are controlled to be off, and when the measurement is performed by the two-terminal method, the switches S3 ₁ and S3 ₂ are controlled to be on. When using the guard voltage, switch S3 ₃ is controlled to be off, if you do not use the guard voltage, switch S3 ₃ is controlled to be on.

When the measurement circuits 20 ₁ and 20 _{2 of the} measurement unit 5 measure by the four-terminal method, two sets of probes P and P (see FIG. 5) arranged close to one inspection point T of the substrate 200 are provided. Need to contact. Therefore, the switch circuit 32 switches the connection of the set of terminals Hp1 and Hc1 that need to be in contact with the same inspection point T to the arbitrary set of probes P and P, and the set of terminals Lp1 and Lc1 to the arbitrary set of probes P. and connection changeover to P, the set of terminals Gp1, Gc 1 any set of probes P, to allow connection changeover to P, switch _S p1-1 _{to SP 128-3,} as indicated in the figure are connected . For example, using the measurement circuit 20 _1, and connects the terminal Hp1 the biasing terminal B4 (probe P4), connects the terminal Hc1 to urge the terminal B3 (probe P3), urging the terminal Lp1 terminal B2 (probe P2) and connecting the terminal Lc1 to the biasing terminal B1 (probe P1) and inspecting, the control unit 6 switches S1 _{1 to} S1 ₄ , S _p4-1 , S _p3-1 , S _{p2-. 2} , _{Sp 1-2} is controlled to ON, and others are controlled to OFF.

The connection switching units 11A _{2 to} 11A _n are configured in the same manner as the connection switching unit 11A ₁ and are connected to the corresponding energizing terminals B as shown in FIG. The control unit 6 controls each switch S in accordance with a predetermined inspection order, connects the probe P used for the inspection to the measurement unit 5, causes the measurement unit 5 to perform measurement, and determines pass / fail from the measurement result. To do.

FIG. 5 shows a configuration example of the attachment / detachment mechanism 13. In the figure, it is illustrated for connection switching part 11A _1, and is configured similarly other connection switching part _11A 2 _{~11A n.} The attachment / detachment mechanism 13 is a mechanism for attaching the test head 14 to the movable unit 3 in a detachable manner. The attachment / detachment mechanism 13 includes a fixing member 46 for physically attaching the test head 14 to the movable unit 3 in a removable manner, and a first connector for electrically connecting the test head 14 and the movable unit 3 in a removable manner. 62.

  The fixing member 46 may have any structure as long as the test head 14 can be detachably attached to the movable unit 3, but the test member 14 can be easily attached and can be easily removed. preferable. For example, it is preferable that the fixing member 46 has a structure that can be attached with one touch only by inserting the test head 14 into the groove or by hanging a fixing lever as shown in FIG. Although the detachability is not good, the fixing member 46 may be configured to fix the test head 14 to the movable unit 3 by tightening screws, nuts, bolts or the like.

  The first connector 62 includes a plurality of biasing terminals B (B1 to B128) and a biasing terminal support base 45. The urging terminal B has a conductive rod-like member placed in the outer cylinder so as to project the tip (lower end in the figure), and a spring spring (elastic body) provided in the outer cylinder in the direction of the test head 14. It is what is energized. When the tip of the rod-shaped member is pushed upward in the figure against the biasing force, the biasing terminal B moves so that the rod-shaped member is pushed inwardly in the outer cylinder. The outer cylinder of the urging terminal B is supported by an urging terminal support base 45 made of an insulating resin. The energizing terminal support base 45 is formed with holes having a diameter that the outer cylinder of the energizing terminal B just passes at equal intervals, and the energizing terminals B are passed through the holes, and the energizing terminal B is fixed by bonding or the like. Has been.

  The test head 14 includes a plurality of pin terminals C, a pin terminal support base 51, a plurality of probes P, and a probe support base 52. These are provided in a frame or a container of the test head 14 formed of a metal such as aluminum or a resin, for example. In the drawing, pin terminals C1 to C128 are shown as a part of the pin terminal C, and probes P1 to P128 are shown as a part of the probe P.

  The pin terminal C is a conductive metal rod. The pin terminal C is a connector connected to the biasing terminal B. Each pin terminal C is disposed at a position just opposite to the urging terminal B so as to contact the urging terminal B of the attaching / detaching mechanism 13. The upper part of the pin terminal C (the upper part in the figure) is formed in a flat countersunk shape, and the tip of the biasing terminal B is easy to contact. The pin terminal support base 51 is a flat plate made of insulating resin. In the pin terminal support base 51, holes having diameters through which the pin terminals C pass are formed at equal intervals, the pin terminals C are passed through the holes, and the pin terminals C are fixed by bonding or the like. The pin terminal support base 51 is fixed to the test head 14 such that the countersunk portion of the pin terminal C is exposed above the test head 14 (upward in the drawing). When the test head 14 is attached to the attaching / detaching mechanism 13, the tip of the biasing terminal B is biased, so that the biasing terminal B and the pin terminal C are reliably in contact with each other. The urging terminal B and the pin terminal C may have any structure as long as they are electrically connectable terminals.

  The probe P is a conductive metal rod. The probe P has elasticity that slightly bends when pressed against the substrate 200 (see FIG. 5) in order to reliably contact and conduct the inspection point T (see FIG. 7). The probe support base 52 is a flat plate made of an insulating resin. A hole having a diameter through which the probe P just passes is formed in the probe support base 52 so as to correspond to the position and number of the inspection points T of the substrate 200, and the probe P passes through each hole, and the probe P is bonded by adhesion or the like. It is fixed. The probe support base 52 is fixed to the test head 14 such that the tip of the probe P protrudes below the test head 14 (downward in the drawing).

  Each pin terminal C (C1 to C128) and each probe P (P1 to P128) are connected by wiring in the test head 14 so as to correspond to each other.

  FIG. 6 shows a front view (FIG. 6A) and a side view (FIG. 6B) of the flexible board assembly 61 that becomes the connection switching portion 11 </ b> A.

  In the flexible substrate assembly 61, a component 64 is mounted on a component pad of the flexible substrate FPC, the flexible substrate FPC is folded in two (folded), and the first connector 62 is connected. .

The flexible substrate FPC is a substrate in which a conductor pattern (not shown) made of a copper foil film is formed on a flexible base material 71 that can be folded in two. The base material 71 is for a known flexible substrate formed in a film shape with an insulator such as polyimide. A plurality of components 64 for surface mounting are mounted on the flexible substrate FPC. The plurality of components 64 are components of the connection switching unit 11A, and the switches S1 _{1 to} S1 ₆ , S2 _{1 to} S2 ₆ , S3 _{1 to} S3 ₃ , S _{P1-1 to} S _{P128-3 illustrated in FIG.} And a switching control circuit 31. The plurality of components 64 are connected by a conductor pattern, and the connection switching unit 11A is configured on the flexible substrate FPC. In FIG. 6, each component 64 is schematically shown in the same shape, but the shape may differ depending on the type of component. The component 64 is, for example, a single electric element such as a resistor, a capacitor, or a transistor, a semiconductor integrated circuit, or a circuit module in which a plurality of components are mounted on a small substrate.

  FIG. 7 shows the flexible substrate FPC in a flat state before being folded in half. A component pad for mounting the component 64 on the front surface (observation surface in the figure) of the base material 71 that becomes the outer surface when the base material 71 is folded in half on the base material 71 of the flexible substrate FPC (Not shown) is formed. In the drawing, a state in which the component 64 is mounted on each component pad is illustrated. The component 64 is not mounted on the back surface (non-observation surface in the figure) of the base material 71 that becomes the inner surface when the base material 71 is folded in half. The flexible substrate FPC may be a single-sided substrate with a conductor pattern formed on one side, a double-sided substrate with a conductor pattern formed on both sides, or a multilayer substrate.

  Although the shape of the base material 71 is arbitrary, the figure shows an example in which the external shape of the base material 71 is formed in a substantially square shape. In order to connect to the plurality of biasing terminals B of the first connector 62, the base material 71 has a plurality of first portions on a pair of opposing portions of the base material 71 that face each other when folded in half. One connector connection pad 73 is formed. It is preferable to form the first connector connection pads 73 in a pair of opposing portions located at the ends of the base material 71 because the first connector connection pads 73 and the first connector 62 can be easily connected. In this example, a pair of end portions 72a and 72b sandwiching a bent portion 74 for folding the base material 71 in half is a pair of opposing portions, and the pair of end portions 72a and end portions In any of 72b, a plurality of first connector connection pads 73 for connection to a plurality of urging terminals B of the first connector 62 are formed by a conductor pattern. The first connector connection pad 73 is formed only on the front surface of the base 71 as an example. In the drawing, illustration of a conductor pattern connected to the first connector connection pad 73 is omitted.

  In the same figure, an imaginary fold line for making the base material 71 into a mountain fold is shown as a bent portion 74 at the center of the base material 71. This fold line may be actually applied to the front surface (or back surface) of the base material 71 by silk printing (symbol printing) with a line such as white, black, or yellow.

  Further, the base member 71 is formed with an engaging portion 79 for positioning with the first connector 62. As an example, the engaging portion 79 is formed in a shape in which the side portions on the base side of the end portion 72a and the end portion 72b are cut out in an arc shape. The engaging portion 79 may be formed in a shape that is formed in a round hole or a square hole.

  The base material 71 includes a plurality of second terminals 92 connected to a plurality of terminals of the second connector 92 (see FIG. 10) at portions other than the pair of end portions 72 a and 72 b (a pair of opposed portions). Two connector connection pads 76 are formed by a conductor pattern. In the example of the figure, the protruding piece 75 is formed such that the protruding piece 75 protruding outward from the bent side 78 (see FIG. 6) formed by folding the base material 71 into two at the bending portion 74 is formed. The base part 71 is formed with a punching part 77 for partitioning the surface. When the base material 71 is folded in half, the projecting piece 75 is not folded, and the surface of the base material 71 connected to the projecting piece 75 and the surface of the projecting piece 75 are maintained on the same surface. The protruding piece 75 is formed in such a size that it can be inserted into (connected to) the second connector 92. The protruding pieces 75 are portions other than the pair of opposed portions, and a plurality of second connector connecting pads 76 are formed on the protruding pieces 75. The protruding piece 75 may be formed on the side portion of the bent portion 74 as in the example of FIG. Although the example of the groove-shaped punching hole (punching groove) was shown as the punching part 77, the punching part 77 may be a notch cut by a cutting blade such as a cutter.

  The number of terminals of the first connector 62 is larger than the number of terminals of the second connector 92. This is because the first connector connection pads 73 are formed at the two end portions 72a and 72b, so the number is larger than the number of the second connector connection pads 76 formed at one protruding piece 75. This is because many can be formed.

  As shown in the figure, the flexible substrate FPC is mounted by soldering the component 64 to the component pad in a flat state before the base material 71 is folded in half. Subsequently, the end portion 72a and the end portion 72b are overlapped so as not to be displaced, and the base portion 71 is folded in half by folding the bent portion 74 into a mountain. The back surfaces of the base material 71 other than the end portions 72a and 72b may be bonded together with a fixing member such as a double-sided tape so that the folded flexible substrate FPC does not open.

  FIG. 8 shows a front view (FIG. 8A) and a side view (FIG. 8B) of the first connector 62 alone. The first connector 62 includes the plurality of biasing terminals B (B1 to B128) and the biasing terminal support base 45 described above. As an example, the first connector 62 includes 128 urging terminals B1 to B128 arranged in two rows of 64, and arranged on the urging terminal support base 45. As an example, odd-numbered biasing terminals B1, B3,... B127 are arranged in a line on the viewing surface side of the front view shown in FIG. Are arranged in a line on the opposite side (not shown) of even-numbered energizing terminals B2, B4,... B128.

  The urging terminal support base 45 is formed with a plate-like support base 81 positioned between the end portion 72a and the end portion 72b of the flexible substrate FPC. Columnar protrusions for engaging the engaging portion 79 of the flexible substrate FPC and aligning the flexible substrate FPC at two corners on the front surface and the corner on the back surface of the support base 81. A portion 82 is formed. The side surface of the columnar protrusion 82 is formed in a shape (arc shape) that matches the shape (arc shape) of the engaging portion 79. The support base 81 and the columnar protrusion 82 are formed integrally with the urging terminal support base 45. In addition, fixing holes 83 for passing fixing screws are formed in the left and right ends of the biasing terminal support base 45.

  FIG. 9 illustrates an enlarged view of attaching the flexible board FPC to the first connector 62. As shown in FIG. 9A, a gap for inserting the end portion 72a (end portion 72b) of the flexible printed circuit board FPC is formed between the support base 81 of the first connector 62 and the biasing terminal B. Yes. This gap is formed at substantially the same distance as the thickness of the flexible substrate FPC. As shown in FIG. 9B, the end 72a and the end 72b are inserted into the gap between the support base 81 and the urging terminal B, respectively. At this time, the flexible substrate FPC is aligned with the first connector 62 by fitting the engaging portion 79 of the flexible substrate FPC into the columnar protrusion 82 of the first connector 62. Subsequently, the urging terminal B is soldered and connected to the flexible substrate FPC (first connector connection pad 73). The rear end (upper end in the figure) of the outer terminal of the bias terminal B is preferably formed in a flat shape so as to be in contact with the first connector connection pad 73 so that it can be easily soldered. When the support base 81 is provided between the urging terminal B for connecting to the end portion 72a and the urging terminal B for connecting to the end portion 72b, the end portion 72a and the end portion 72b are connected to the first portion 72a. This is preferable because it can be easily aligned with the connector 62 and can be easily soldered. As a result, the flexible substrate assembly 61 shown in FIG. 6 is completed.

  FIG. 10 shows a bottom view of the back board 91 to which the flexible board assembly 61 is attached, and FIG. 11 shows a part of the movable unit 3 in a state where the flexible board assembly 61 is attached to the back board 91 in a side view.

  As shown in FIG. 10, the backboard 91 includes a plurality (for example, 16) of second connectors 92 on the bottom surface side. The second connector 92 is a known connector for connecting a flexible substrate, and includes a known lock mechanism (not shown) for preventing the inserted flexible substrate from coming off. When the lock mechanism is released, the flexible board can be removed from the second connector 92. Further, the back board 91 is provided with third connectors 93 connected in parallel to the respective second connectors 92 on the plane side (the non-observation surface side in the figure).

  As shown in FIG. 11, the protruding piece 75 of the flexible board FPC is inserted into the second connector 92 of the backboard 91 and locked. As a result, each second connector connection pad 76 formed on the protruding piece 75 of the flexible substrate FPC reliably contacts the terminal of the second connector 92 and is electrically connected. The figure shows an example in which the flexible board assembly 61 is attached to all of the plurality of second connectors 92 provided in the backboard 91. The number of the flexible substrate assemblies 61 attached to the back board 91 may be increased or decreased according to the number of probes P. Since it is easy to fix the protruding piece 75 of the flexible board FPC to the second connector 92, the flexible board assembly 61 can be easily increased or decreased.

  The plurality of flexible board assemblies 61 are attached to the backboard 91 so that the first connectors 62 are just in contact with each other without a gap. That is, the plurality of second connectors 92 are arranged on the backboard 91 at intervals at which the plurality of first connectors 62 are arranged without gaps. Each flexible board assembly 61 is screwed and fixed to a fixing member (not shown) through a fixing hole 83 of the first connector 62. This fixing member (not shown) is fixed to the backboard 91. Since the backboard 91 and the plurality of flexible board assemblies 61 are connected and fixed by a fixing member (not shown), the backboard 91 and the plurality of flexible board assemblies 61 are attached to / detached from the main board 95 in units of the backboard 91. Can be carried and can be carried. This fixing member is fixed to the movable unit 3 with screws.

  A main board 95 including a fourth connector 96 is fixed to the movable unit 3. The fourth connector 96 is electrically connected to the measurement unit 5 and the control unit 6 (both see FIG. 1) via a wiring cable (not shown) connected to the main board 95. Accordingly, by connecting the third connector 93 of the backboard 91 to the fourth connector 96, the plurality of terminals of the second connector 92 are electrically connected to the measuring unit 5 and the control unit 6, and the flexible substrate assembly 61 has the first terminal. A two-connector connection pad 76 (see FIG. 6) is electrically connected to the measurement unit 5 and the control unit 6.

  In the figure, only one fourth connector 96 provided on the main board 95 is illustrated, but the main board 95 includes a plurality of (for example, six) fourth connectors 96 connected in parallel. A plurality of backboards 91 can be attached. The number of backboards 91 may be increased or decreased according to the number of probes P. When the maximum number (for example, six) of backboards to which the backboard 91 can be added is mounted on the main board 95, the 16 flexible board assemblies 61 can be attached to one backboard 91, so that the movable unit 3 The maximum number of flexible board assemblies 61 can be 16 × 6 = 96.

  As shown in the figure, the movable unit 3 preferably has the second connector 92 disposed in the top direction and the first connector 62 disposed in the ground direction, and is held with the surface of the flexible substrate FPC vertical. When the movable unit 3 is disposed on the lower side of the substrate 200, the first connector 62 may be disposed in the top direction and the second connector 92 may be disposed in the ground direction to hold the surface of the flexible substrate FPC vertically. preferable. The flexible substrate FPC is easily bent because it is in the form of a film, but can be prevented from being bent by holding the surface vertically.

  FIG. 12 shows a plan view of the test head 14 (see FIG. 5) (the top view of FIG. 5). As shown in the figure, the pin terminal C is fixed to the pin terminal support base 51 for each group U (U1 to U6), and the number of pin terminals C can be increased in group U units. Each group U is fixed to the frame 101 of the test head 14 by screwing the pin terminal support base 51 with screws. One group U corresponds to one backboard 91 (see FIG. 11). As described above, 16 flexible substrate assemblies 61 can be connected to one backboard 91 as an example. Since one flexible board assembly 61 is provided with 64 × 2 rows = 128 urging terminals B, one backboard 91 has a maximum of 64 × 2 rows × 16 = 64. This number x 32 rows = 2048 urging terminals B are arranged. One group U is provided with 64 × 32 rows = 2048 pin terminals C so as to be connected corresponding to the 2048 biasing terminals B. When six backboards 91 that are the maximum number that can be added are mounted on the movable unit 3, all the groups U1 to U6 are mounted on the test head 14. In this case, 2048 × 6 groups = 12288 pin terminals C (that is, probes P) are mounted on the test head 14. Note that the number of terminals shown here is an example, and may be increased or decreased as appropriate according to necessity.

  By attaching the test head 14 to the attachment / detachment mechanism 13 (see FIG. 5), the biasing terminal B and the pin terminal C come into contact with each other, and the substrate 200 can be inspected.

  Since the flexible substrate FPC is thin and light, the flexible substrate assembly 61 can be made much lighter than a conventional rigid substrate such as glass epoxy, epoxy, or polyimide. In addition, the size can be reduced by the amount thinner than the conventional rigid substrate. In particular, since the movable unit 3 of the substrate inspection apparatus 1 is provided with a large number of flexible substrate assemblies 61, the effects of weight reduction and size reduction are high. By using the flexible substrate assembly 61 of the present invention, the movable unit 3 can be reduced in weight and size. Accordingly, the mechanism of the moving mechanism 4 (see FIG. 1) and the driving motor can be reduced in size, and the entire apparatus can be reduced in size.

  Further, since the flexible substrate FPC is folded in half and used, the wiring area of the conductor pattern increases twice as compared with the case where the conductor pattern is not folded in half, so that the number of layers of the substrate can be reduced. For example, when a 4-layer rigid board has been used in the past, a 2-layer (double-sided) flexible board FPC to which the present invention is applied is folded in half to use a circuit of the same scale (parts and Conductor pattern) can be mounted. In addition, since the flexible substrate FPC is used by being folded in two, even if a through hole is formed in the flexible substrate FPC, it does not penetrate into the overlapping surface when folded in two, so the through hole does not become a dead space on the overlapping surface. Therefore, the effect of using blinds, vias, through holes and build-up substrates can be obtained, and the wiring density can be increased. For example, when a two-layer (double-sided) flexible substrate FPC is used, a circuit of a scale that can be mounted on an expensive four-layer buildup substrate can be mounted.

Furthermore, by using a flexible substrate, the withstand voltage, volume resistivity, dielectric constant, and tan δ between layers are improved as compared with a rigid substrate (for example, a build-up substrate). Table 1 below shows performance examples of the flexible substrate and the build-up substrate.

  In addition, a large number of flexible board assemblies 61 can be mounted on the movable unit 3, and a detachable mechanism for connecting the first connector 62 attached to the flexible board FPC to the test head 14 (see FIG. 5). Since the connector has 13 connectors, the structure for connecting to the test head 14 can be simplified, and the apparatus can be easily manufactured. Further, the flexible substrate assembly 61 can be easily increased / decreased (added).

  Next, modified examples of the flexible substrate FPC and the flexible substrate assembly 61 are shown in FIGS. In addition, the same code | symbol is attached | subjected about the structure similar to the already demonstrated structure, and detailed description is abbreviate | omitted. Further, only a part of the component 64 is illustrated.

  FIG. 13 (a) shows another flexible substrate FPCa to which the present invention is applied, and FIG. 13 (b) shows a manufacturing process of another flexible substrate assembly 61a to which the present invention is applied.

  A flexible board FPCa shown in FIG. 13A has a first connector connection pad 73 formed at the same position as the flexible board FPC, and a second connector at the end of a side 121 orthogonal to the sides of both ends 72a and 72b. A connection pad 76 is formed. In the example of the figure, a projecting piece 75a projecting to the outside is formed on one side of the side 121 defined by the bent portion 74 (an area of ½ or less of the side 121), and a second connector is connected to the projecting piece 75a. A pad 76 is formed.

  As shown in FIG. 13 (b), the flexible board FPCa is folded in a mountain at the bent portion 74, and the first connector connection pads 73 at the end portions 72 a and 72 b are soldered to the biasing terminal B of the first connector 62. (See FIG. 9), the flexible substrate assembly 61a is completed. The second connector 92 is arranged on the movable unit 3 so as to correspond to the position of the protruding piece 75a, and the flexible substrate assembly 61a is used.

  FIG. 14A shows still another flexible board FPCb to which the present invention is applied, and FIG. 14B shows a manufacturing process of still another flexible board assembly 61b to which the present invention is applied.

  The flexible substrate FPCb shown in FIG. 14A is shown in a flat state before being folded in half. The sides 125 of the substantially rectangular flexible substrate FPCb are in a straight line in a flat state before being bent. The base material 71b is folded in half at the center of the straight side 125. In order to fold the base material 71b into a mountain fold, the bent portion 74b is indicated by a virtual broken line in the figure. The first connector connection pad 73 is formed at the end 126a of the side 125a on one side (left half) of the sides 125 divided into two sides with the bent portion 74b as a boundary, and the other side (right half) The first connector connection pad 73 is formed at the end 126b of the side 125b. The end 126a and the end 126b of the straight side 125 correspond to a pair of facing portions in the present invention.

  As an example, the flexible substrate FPCb has a second connector connection pad 76 formed at the end of the side 127 facing the side 125. In the example of the figure, a projecting piece 75b projecting to the outside is formed on one side of the side 127 defined by the bent portion 74b (an area of ½ or less of the side 127), and a second connector is connected to the projecting piece 75b. A pad 76 is formed. The protruding piece 75 b may be formed on the side 128 orthogonal to the side 125. Moreover, you may form the protrusion piece 75b in the bending part 74b like a flexible substrate FPC (refer FIG. 7).

  As shown in FIG. 14B, the flexible board FPCb is folded in a mountain at a bent portion 74b, and the first connector connection pads 73 at the end portions 126a and 126b are connected to the urging terminals of the first connector 62 as shown in FIG. Soldering to B completes the flexible board assembly 61b. The second connector 92 is arranged on the movable unit 3 so as to correspond to the position of the protruding piece 75b, and the flexible substrate assembly 61a is used.

  Although the example in which the first connector connection pad 73 of the flexible substrate FPC and the urging terminal B of the first connector 62 are connected by soldering has been described, the first connector 62 is similar to the second connector 92. You may replace with the type of connector connected by contact. Further, the example in which the second connector connection pad 76 of the flexible board FPC and the terminal of the second connector 92 are connected by contact has been described. However, the second connector 92 is connected by soldering like the first connector 62. The type of connector may be replaced. Further, the example in which the first connector 62 includes the biasing terminal B as a terminal has been described, but the terminal may be any known terminal.

  Moreover, although the protrusion piece 75 (75a, 75b) showed the example protruded with the same surface as the surface of the base material 71, if it can be connected to the 2nd connector 92, it is arbitrary with respect to the surface of the base material 71 It may be used by bending (starting up) at an angle of. The protruding piece 75 may be formed by cutting and raising from the base material 71. Moreover, although the example which formed the pad 76 for the 2nd connector connection in the protrusion piece 75 which protrudes from the base material 71 folded in half was shown, if it can connect to the 2nd connector 92, it will protrude from the base material 71. You may form without. The flexible board assembly 61 may include a second connector 92. The number of terminals of the first connector 62 may be further increased by forming the first connector connection pads 73 on both surfaces of the base 71. The number of terminals and the number of columns of the first connector 62 are arbitrary. In this case, the terminals B of the first connector 62 are arranged in four rows. Although the example which equips the movable unit 3 with the some flexible substrate assembly 61 was demonstrated, the structure provided with the one flexible substrate assembly 61 may be sufficient.

  Moreover, although the example which applied the flexible substrate FPC and the flexible substrate assembly 61 to the connection switching part 11A of the board | substrate inspection apparatus 1 was shown, you may use it for another apparatus or another circuit. The electric circuit mounted on the flexible substrate FPC and the flexible substrate assembly 61 is arbitrary. When the flexible substrate FPC and the flexible substrate assembly 61 are used, the weight and size can be reduced, so that the device and the circuit can be reduced in weight and size.

1 is a substrate inspection apparatus, 2 is a substrate fixing mechanism, 3 is a movable unit, 4 is a moving mechanism, 5 is a measurement unit, 6 is a control unit, 7 is a display unit, 8 is an operation unit, and 11 · 11A _{1 to} 11A _n are Connection switching unit, 13 is an attachment / detachment mechanism, 14 is a test head, 20 ₁ and 20 ₂ are measurement circuits, 21 ₁ and 21 ₂ are signal sources, 22 ₁ and 22 ₂ are ammeters, and 23 ₁ and _{2 2} are voltmeters , 24 ₁ and 24 ₂ are guard amplifiers, 31 is a switching control circuit, 32 is a switch circuit, 45 is a biasing terminal support base material, 46 is a fixing member, 51 is a pin terminal support base material, and 52 is a probe support base material. 61, 61a and 61b are flexible board assemblies, 62 is a first connector, 64 is a component, 71 and 71b are base materials, 72a and 72b are end portions, 73 is a first connector connection pad, and 74 and 74b are bent portions. , 75 ・ 75a ・ 75b The protruding piece, 76 is the second connector connection pad, 77 is the extraction part, 78 is the bent side, 79 is the engaging part, 81 is the support base, 82 is the columnar protrusion, 83 is the fixing hole, 91 is the back board, 92 is a second connector, 93 is a third connector, 95 is a main board, 96 is a fourth connector, 101 is a frame, 121, 125, 127, and 128 are sides, 125a is a left half side, and 125b is a right half side 126a and 126b are end portions, 200 is a substrate, B · B1 to B [128 × n] are energizing terminals, C · C1 to C [128 × n] are pin terminals, Cnt1 is an instruction signal, FPC · FPCa · FPCb _· FPC 1 ~FPC _n flexible substrate, Gc1 · Gc2 · Gp1 · Gp2 · Hc1 · Hc2 · Hp1 · Hp2 · Lc1 · Lc2 · Lp1 · Lp2 are terminals for measuring, P · P1~P [128 × n _{Probe, S1 1 ~S1 6 · S2 1} ~S2 6 · S3 1 ~S3 3 · S P1-1 ~S P128-3 · S4 1 ~S4 8 switches, T · T1~T64 inspection point, U1～ U6 is a group.

Claims (9)

A flexible base material that can be folded in half;
A plurality of first connector connection pads formed on a pair of opposing portions of the base material facing each other when folded in half to connect to a plurality of terminals of the first connector;
A plurality of second connector connection pads formed in a portion other than the pair of opposed portions in order to connect to a plurality of terminals of the second connector;
A component pad for mounting a component formed on the surface of the substrate that becomes an outer surface when the substrate is folded in half.
A notch for partitioning the projecting piece is formed in the base material so that a projecting piece projecting outward from a bent side formed by folding the base material in half is formed,
It said projecting portions, a flexible substrate, wherein Rukoto the second connector connection pads are formed.   2. The flexible substrate according to claim 1, wherein the pair of facing portions are a pair of end portions sandwiching a bent portion for folding the base material in two. The second connector connection pads, flexible substrate according to claim 1 or 2, characterized in that said plugged into the second connector is to be connected by contact to the terminals of the second connector. Claim 1 are components mounted on the component pads of the flexible substrate according to any one of 3, bent the substrate is folded in two, the first connector terminal to the first connector connection pad A flexible substrate assembly characterized by being connected. The terminal of the first connector is composed of an urging terminal urged in the direction of the external connector by an elastic body so as to be electrically connected to the external connector by contact. The flexible substrate assembly according to claim 4 . A test head comprising a plurality of probes;
A moving mechanism for moving the test head and bringing the plurality of probes into contact with a substrate to be inspected;
A measurement unit for measuring electrical characteristics;
A connection switching unit that connects any of the plurality of probes to the measurement unit;
A substrate inspection apparatus provided with the test head and the connection switching unit in a movable unit that is moved by the moving mechanism,
The flexible substrate assembly according to claim 4 or 5 , wherein a component constituting the connection switching unit is mounted on the component pad, and the movable unit is provided as the connection switching unit. A board inspection apparatus that is characterized. A plurality of terminals of the first connector of the flexible substrate assembly are electrically connected to the plurality of probes of the test head;
Wherein the plurality of terminals of the second connector, the measuring unit substrate inspection apparatus according to claim 6, characterized in that the及beauty control part is intended to be electrically connected. The substrate inspection apparatus according to claim 6 or 7 , wherein the movable unit holds the surface of the flexible substrate in a vertical direction. Wherein the movable unit, a substrate inspection apparatus according to claim 6, characterized by being composed of any number of the flexible substrate assembly of the 1~n pieces can be mounted 8.

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