JP6313169B2 - 表面上でマイクロ物体を操作する間に静摩擦を抑える方法 - Google Patents

表面上でマイクロ物体を操作する間に静摩擦を抑える方法 Download PDF

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Publication number
JP6313169B2
JP6313169B2 JP2014179275A JP2014179275A JP6313169B2 JP 6313169 B2 JP6313169 B2 JP 6313169B2 JP 2014179275 A JP2014179275 A JP 2014179275A JP 2014179275 A JP2014179275 A JP 2014179275A JP 6313169 B2 JP6313169 B2 JP 6313169B2
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Prior art keywords
micro object
micro
electric field
driving force
force
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JP2014179275A
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English (en)
Japanese (ja)
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JP2015061509A (ja
JP2015061509A5 (https=
Inventor
ジェイソン・トムソン
ユージン・エム・チャウ
ジェンピン・ルー
グレゴリー・エル・ホワイティング
デイヴィッド・ケイ・ビーゲルセン
ジャノス・ベレス
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Palo Alto Research Center Inc
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Palo Alto Research Center Inc
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/004—Electrostatic motors in which a body is moved along a path due to interaction with an electric field travelling along the path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
    • B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K1/00—Details of the magnetic circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2014179275A 2013-09-19 2014-09-03 表面上でマイクロ物体を操作する間に静摩擦を抑える方法 Active JP6313169B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/031,392 US9473047B2 (en) 2013-09-19 2013-09-19 Method for reduction of stiction while manipulating micro objects on a surface
US14/031,392 2013-09-19

Publications (3)

Publication Number Publication Date
JP2015061509A JP2015061509A (ja) 2015-03-30
JP2015061509A5 JP2015061509A5 (https=) 2017-10-12
JP6313169B2 true JP6313169B2 (ja) 2018-04-18

Family

ID=51625787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014179275A Active JP6313169B2 (ja) 2013-09-19 2014-09-03 表面上でマイクロ物体を操作する間に静摩擦を抑える方法

Country Status (3)

Country Link
US (1) US9473047B2 (https=)
EP (1) EP2851336B1 (https=)
JP (1) JP6313169B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431283B2 (en) 2013-09-19 2016-08-30 Palo Alto Research Center Incorporated Direct electrostatic assembly with capacitively coupled electrodes
US10141285B2 (en) 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices
WO2015112538A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate transport vacuum platform
US10558204B2 (en) 2016-09-19 2020-02-11 Palo Alto Research Center Incorporated System and method for scalable real-time micro-object position control with the aid of a digital computer
US10043687B2 (en) * 2016-12-27 2018-08-07 Palo Alto Research Center Incorporated Bumped electrode arrays for microassemblers
CN108675023B (zh) * 2018-05-02 2019-12-27 孝感量子机电科技有限公司 书写纸传送装置及书写装置
US11302554B2 (en) 2018-12-17 2022-04-12 Palo Alto Research Center Incorporated Micro assembler with fine angle control
US11203525B2 (en) * 2018-12-31 2021-12-21 Palo Alto Research Center Incorporated Method of controlling the placement of micro-objects
JP7723602B2 (ja) 2019-02-14 2025-08-14 パーシモン テクノロジーズ コーポレイション 磁気によりガイドされた材料取扱いロボット
US12020399B2 (en) 2020-11-16 2024-06-25 Xerox Corporation System and method for multi-object micro-assembly control with the aid of a digital computer
US11893327B2 (en) 2020-12-14 2024-02-06 Xerox Corporation System and method for machine-learning enabled micro-assembly control with the aid of a digital computer
US11921488B2 (en) 2020-12-15 2024-03-05 Xerox Corporation System and method for machine-learning-enabled micro-object density distribution control with the aid of a digital computer
US12334377B2 (en) 2023-01-17 2025-06-17 Xerox Corporation Chiplet loader for microassembler

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05184163A (ja) * 1991-12-27 1993-07-23 Masafumi Yano 静電アクチュエータ
JPH05207760A (ja) * 1992-01-27 1993-08-13 Ricoh Co Ltd 静電力アクチュエータ
JPH07203689A (ja) * 1993-12-31 1995-08-04 Toshiro Higuchi 静電アクチュエータ
JPH10271850A (ja) * 1997-03-26 1998-10-09 Oki Electric Ind Co Ltd 媒体搬送装置
JPH11163100A (ja) * 1997-11-27 1999-06-18 Toshiba Mach Co Ltd 静電移動ステージ装置
JPH11215853A (ja) * 1998-01-28 1999-08-06 Oki Electric Ind Co Ltd 搬送装置
JP2000143024A (ja) * 1998-11-10 2000-05-23 Oki Electric Ind Co Ltd 媒体搬送装置
US6923979B2 (en) 1999-04-27 2005-08-02 Microdose Technologies, Inc. Method for depositing particles onto a substrate using an alternating electric field
GB2354114A (en) * 1999-09-13 2001-03-14 Gareth John Monkman Micro-scale electrostatic gripper
US6687987B2 (en) * 2000-06-06 2004-02-10 The Penn State Research Foundation Electro-fluidic assembly process for integration of electronic devices onto a substrate
JP2006025578A (ja) * 2004-07-09 2006-01-26 Olympus Corp エレクトレットアクチュエータ
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US7332361B2 (en) * 2004-12-14 2008-02-19 Palo Alto Research Center Incorporated Xerographic micro-assembler
US7728427B2 (en) * 2007-12-07 2010-06-01 Lctank Llc Assembling stacked substrates that can form cylindrical inductors and adjustable transformers
US7861405B2 (en) 2008-03-03 2011-01-04 Palo Alto Research Center Incorporated System for forming a micro-assembler
US8581167B2 (en) 2010-11-16 2013-11-12 Palo Alto Research Center Incorporated Optically patterned virtual electrodes and interconnects on polymer and semiconductive substrates
US10014261B2 (en) 2012-10-15 2018-07-03 Palo Alto Research Center Incorporated Microchip charge patterning
US9431283B2 (en) 2013-09-19 2016-08-30 Palo Alto Research Center Incorporated Direct electrostatic assembly with capacitively coupled electrodes
US10141285B2 (en) 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices

Also Published As

Publication number Publication date
US20150076961A1 (en) 2015-03-19
EP2851336A3 (en) 2015-04-22
EP2851336B1 (en) 2016-11-30
JP2015061509A (ja) 2015-03-30
US9473047B2 (en) 2016-10-18
EP2851336A2 (en) 2015-03-25

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