JP6308286B2 - Light emitting device - Google Patents

Description

  The present disclosure relates to a light emitting device.

  For example, Patent Document 1 describes a side-emitting type light emitting device in which a connecting portion of a lead member connected to a circuit board is formed by being pulled out from a reflection case and bent forward.

JP 2008-258233 A

  In recent side-emitting light emitting devices, the concave portion of the reflection case is formed larger than the concave portion of the conventional light emitting device in order to increase the light emission efficiency. For this reason, when the lead member is bent forward to form the connection portion, contamination of the reflective case or the lead member due to a solder component such as flux and / or corrosion due to sulfuration of the lead member tends to affect the light emitting performance. As a result, the reliability of the apparatus may be reduced.

  An object of one embodiment of the present invention is to provide a highly reliable side-emitting light emitting device having an outer lead bent forward.

  One embodiment of the present invention includes a resin molded body having a first outer surface facing in a first direction and a second outer surface facing in a second direction perpendicular to the first direction, and the resin molded body And a light-emitting element that is housed in the recess and is electrically connected to the lead electrode. The lead electrode includes an outer lead portion that extends from the first outer surface and is bent toward the second outer surface, and faces the first outer surface in the outer lead portion. An inward surface to be covered is covered with a light-transmitting film, an outward surface opposite to the inward surface is exposed from the film, and the first direction is a mounting direction of the light emitting device.

  According to the light emitting device of one embodiment of the present invention, a highly reliable side light emitting light emitting device can be obtained while having an outer lead bent forward.

It is a schematic front view of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing in the AA cross section of FIG. 1A. It is a schematic sectional drawing in the BB cross section of FIG. 1A. 1B is a schematic plan view of a mounting-side main surface of the light emitting device shown in FIG.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the size, positional relationship, and the like of members illustrated in the drawings may be exaggerated for clarity of explanation.

  Hereinafter, the visible wavelength range is a wavelength range of 380 nm to 780 nm, the blue range is a wavelength range of 420 nm to 480 nm, the green to yellow range is a wavelength range of 500 nm to 590 nm, and the red range is a wavelength of 610 nm. The range is 750 nm or less.

<Embodiment 1>
1A is a schematic front view (schematic front view) of light-emitting device 100 according to Embodiment 1. FIG. 1B is a schematic cross-sectional view taken along a line AA in FIG. 1A. 1C is a schematic cross-sectional view taken along the line BB in FIG. 1A. FIG. 1D is a schematic plan view of the main surface on the mounting side of the light emitting device 100 shown in FIG. 1A.

In the figure, in the light emitting device 100, the width direction is indicated as the X direction, the thickness direction is indicated as the Y direction, and the depth (front-rear) direction is indicated as the Z direction. More specifically, the rightward direction X ₊ direction, the leftward direction X _- is the direction _- direction, the upward direction Y ₊ direction, the downward direction Y _- direction, the front direction Z ₊ direction, the rearward direction Z. These X, Y, and Z directions (axes) are directions (axes) perpendicular to the other two directions (axes), respectively. In the following description, it is assumed that the first direction is the Y _- direction and the second direction is the Z ₊ direction. The first direction is the mounting direction of the light emitting device 100. The second direction is the main light emission direction of the light emitting device 100.

  As illustrated in FIGS. 1A to 1D, the light emitting device 100 according to Embodiment 1 includes an element container 10 and a light emitting element 40. The element container 10 includes a resin molded body 20 and a lead electrode 30. The lead electrode 30 is held by the resin molded body 20. The resin molded body 20 has a first outer surface 20a facing in the first direction and a second outer surface 20b facing in a second direction perpendicular to the first direction. A recess 10r including the lead electrode 30 at the bottom is formed on the second outer surface 20b of the resin molded body. The light emitting element 40 is accommodated in the recess 10r of the element container. The light emitting element 40 is electrically connected to the lead electrode 30. The lead electrode 30 includes an outer lead portion 30a and an inner lead portion 30b. The outer lead portion 30a is a portion of the lead electrode 30 that extends outward from the first outer surface 20a of the resin molded body. The inner lead portion 30 b is a portion other than the outer lead portion 30 a in the lead electrode 30 and is a portion inside the resin molded body 20. A part of the inner lead portion 30b is exposed from the resin molded body 20 and constitutes the bottom of the recess 10r. The outer lead portion 30a extends from the first outer surface 20a and is bent toward the second outer surface 20b. An inward surface 30ai facing the first outer surface 20a in the outer lead portion 30a is covered with a coating 50. The coating 50 is translucent. On the other hand, the outward face 30ao opposite to the inward face 30ai is exposed from the coating 50.

  In the light emitting device 100 having such a configuration, since the inward surface 30ai of the outer lead portion is covered with the coating 50, solder components such as flux can be prevented from spreading on the inward surface 30ai. Contamination of the resin molded body 20 and the lead electrode 30 due to the component (contamination of the lead electrode 30 includes not only the outer lead portion 30a but also the contamination of the inner lead portion 30b due to the solder component that has entered the resin molded body 20 inside. Can be suppressed. As a result, it is possible to suppress light absorption by the solder component and the discoloration of the solder component by light, heat, or the like. Further, discoloration and / or corrosion due to sulfidation or the like of the inward surface 30ai of the outer lead portion can be suppressed. As a result, it can suppress that the discoloration and / or corrosion progress to the inner lead part 30b. As a result, light absorption and / or deterioration of electrical characteristics due to the discoloration / corrosion portion of the lead electrode 30 can be suppressed. On the other hand, since the outward surface 30ao of the outer lead portion is exposed from the coating 50, the solder is easily wetted and can function well as a joining region. As described above, a light-emitting device that easily maintains initial performance and has high reliability can be obtained.

  In addition, although the coating range of the inward surface 30ai of the outer lead portion by the coating 50 can be appropriately selected, it is preferably 75% or more of the total area of the inward surface 30ai, more preferably 90% or more, and all Even more preferably. In particular, it is preferable that the boundary portion between the inward surface 30ai of the outer lead portion and the first outer surface 20a of the resin molded body is covered with the coating 50. Thereby, it is easy to suppress the penetration of solder components such as flux and / or corrosive gas into the recess 10r from the gap formed at the boundary between the outer lead portion 30a and the first outer surface 20a of the resin molded body.

  Hereinafter, the preferable form of the light-emitting device 100 is explained in full detail.

  As shown in FIGS. 1A to 1D, it is preferable that the inward surface 30ai and the coating 50 of the outer lead portion facing the first outer surface 20a exist at positions facing the recess 10r. The inside of the recess 10r of the element container is a part that becomes a light source region of the light emitting device 100. For this reason, if the inward surface 30ai of the outer lead portion facing the first outer surface 20a is present at a position facing the recess 10r, contamination of the resin molded body 20 and the lead electrode 30 due to solder components such as flux, and lead Discoloration and corrosion due to sulfurization or the like of the electrode 30 are more likely to affect the performance of the light emitting device. Therefore, when the inward surface 30ai of the outer lead portion facing the first outer surface 20a and the coating 50 are present at positions facing the recess 10r, the configuration of the present embodiment is more effective.

As shown in FIGS. 1A, 1B, and 1D, the resin molded body 20 has a third outer surface 20c that faces a third direction perpendicular to the first direction and the second direction. And the outer lead part 30a has the 1st terminal area | region bent so that the 1st outer surface 20a of a resin molding may be followed, and the 2nd terminal area | region bent so that the 3rd outer surface 20c might be met. The outwardly facing surface 30ao in the second terminal region is exposed from the coating 50, and solder called “side fillet” effective for facilitating mounting of the side-emitting type light emitting device 100 in parallel with the circuit board surface. It can function as a joining region for forming the hem spreading part (crawling up part). On the other hand, if the inward surface 30ai in the second terminal region is covered with the coating 50, it is possible to suppress the wetting and spreading of the solder components such as flux from the solder hem spreading portion onto the inward surface 30ai. Therefore, it is preferable that the inward surface 30ai and the coating 50 of the outer lead portion exist at positions facing the third outer surface 20c. The third direction here may be either the X ₊ direction or the X ₋ direction. However, the inward surface 30ai of the outer lead portion of one lead electrode 30 and the coating 50 face the third outer surface 20c facing the X ₊ direction, and the inward surface 30ai and the coating 50 of the outer lead portion of another lead electrode 30 are X _−. It is even better if they face the third outer surface 20c facing in the direction.

  The inwardly facing surface 30ai and the outwardly facing surface 30ao of the outer lead part are preferably made of silver or a silver alloy. Silver has excellent bondability with solder and / or wire 60, and has the highest reflectance in the visible wavelength region among metals, but is easily discolored and corroded by sulfidation, and easily deteriorates its excellent initial characteristics. Therefore, when the inward surface 30ai and the outward surface 30ao of the outer lead portion are made of silver or a silver alloy, the configuration of the present embodiment is more effective. Similarly, the surface constituting the bottom of the recess 10r of the inner lead portion 30b is preferably made of silver or a silver alloy.

As shown in FIGS. 1B and 1C, the surface constituting the bottom of the recess 10 r of the lead electrode 30 is preferably covered with a coating 50. Thereby, discoloration and corrosion due to sulfuration or the like of the surface constituting the bottom of the recess 10r of the lead electrode 30 can be suppressed. As a result, it is possible to suppress light absorption and / or deterioration of electrical characteristics due to discoloration / corrosion of the inner lead portion 30b, and further, disconnection of the wire 60. In particular, when the surface constituting the bottom of the recess 10r of the inner lead portion 30b is made of silver or a silver alloy, the surface constituting the bottom of the recess 10r of the lead electrode 30 is covered with the coating 50. It is preferable.
More preferably, the coating 50 continuously covers from the surface constituting the bottom of the recess 10r of the lead electrode 30 to the surface constituting the inner wall and bottom of the recess 10r of the resin molded body 20. The coating 50 covers the boundary between the resin molded body 20 constituting the recess 10r and the inner lead portion 30b, thereby suppressing the entry of solder components such as flux and / or corrosive gas into the recess 10r from the gap generated at the boundary. Because it is easy to do.

  As shown in FIG. 1B, the light emitting element 40 is preferably covered with a film 50. Thereby, the corrosion by the corrosive gas of the light emitting element 40 can be suppressed. In particular, in order to further suppress the corrosion of the light emitting element 40 by the corrosive gas, the coating 50 continuously covers from the surface constituting the bottom of the recess 10 r of the lead electrode 30 to the light emitting element 40. It is more preferable.

  As shown in FIG. 1B, the light emitting device 100 includes a wire 60 that connects the light emitting element 40 and the lead electrode 30 at the bottom of the recess 10r. The wire 60 is preferably covered with the coating 50. Thereby, the corrosion by the corrosive gas of the wire 60 can be suppressed. In particular, it is preferable that the connection portion of the wire 60 with the lead electrode 30 is covered with the coating 50 in order to further suppress the disconnection of the wire 60. Further, as in the case of the lead electrode 30, when the surface of the wire 60 is made of silver or a silver alloy, the configuration of the present embodiment is more effective.

  The coating 50 may be an organic film such as a resin, but is preferably an inorganic film and more preferably a nonmetal from the viewpoint of heat resistance and light resistance. The coating 50 may be a conductive film, but is preferably an electrically insulating film from the viewpoint of avoiding an unintended short circuit. Further, the coating 50 preferably has lower solder wettability than the metal material constituting the surface of the lead electrode 30 from the viewpoint of suppressing the wetting and spreading of the solder components. Examples of such a film 50 include metal or silicon oxide, nitride, oxynitride, fluoride, and the like. More specifically, the coating 50 is preferably made of an oxide, nitride, or oxynitride of at least one element of silicon, aluminum, gallium, niobium, tantalum, yttrium, and hafnium. The coating 50 is preferably made of a fluoride of at least one element selected from magnesium, calcium, barium, and lithium. In particular, the coating 50 is particularly preferably made of an oxide, nitride, or oxynitride of at least one element of silicon and aluminum, which has excellent translucency and relatively high gas barrier properties. preferable.

  The thickness (upper limit value) of the resin molded body 20 in the direction parallel to the first direction can be appropriately selected, but is preferably 1.2 mm or less, more preferably 1.0 mm or less, and More preferably, it is 8 mm or less. The smaller the thickness of the resin molded body 20 in the direction parallel to the first direction is, the smaller the thickness of the side wall of the recess 10r is, and the more light leaks from the side wall. This is because it becomes easier to enter into 10r. From the viewpoint of moldability or strength of the resin molded body 20, the lower limit value of the thickness in the direction parallel to the first direction of the resin molded body 20 is, for example, 0.2 mm or more.

  As shown in FIGS. 1A to 1C, the light emitting device 100 further includes a sealing member 70 filled in the recess 10r. And it is preferable that the sealing member 70 contains the fluorescent material 80 which absorbs the light of the light emitting element 40, and light-emits. Since the light emitting device 100 includes the fluorescent material 80 in addition to the light emitting element 40, light emission is performed in a wide range in the recess 10r, and the light emission amount and the heat generation amount are increased. Since discoloration of solder components such as flux is promoted, the configuration of the present embodiment is more effective.

  The light emitting device 100 can be manufactured as follows, for example. First, a plurality of resin molded bodies 20 for a plurality of light emitting devices are formed on a flat lead frame including a plurality of lead electrodes 30 for the light emitting devices to form a plurality of element containers 10. At this time, it is assumed that the recess 10r is opened on the upper surface side of the lead frame. Next, the light emitting element 40 is mounted in the recess 10r of each element container. Next, a film 50 is formed over almost the entire upper surface of the lead frame. Next, the sealing member 70 is filled in the recess 10r of each element container. Finally, after the outer lead portion 30a of each element container 10 is cut from the frame portion of the lead frame and bent to the opening side of the recess 10r, each element container 10 is removed from the suspension lead of the frame portion of the lead frame.

  Hereinafter, each component in the light-emitting device which concerns on one embodiment of this invention is demonstrated.

(Element container 10)
The element container 10 is a container that houses the light emitting element 40 and has terminals (electrodes) for supplying power to the light emitting element 40 from the outside. The element container 10 includes at least a resin molded body 20 and a lead electrode 30. The element container 10 may be a so-called “package” or the like, for example. The element container 10 of the present embodiment is for a side-emitting type (also referred to as “side-view type”) light-emitting device.

(Resin molding 20)
The resin molded body 20 forms a matrix of the container in the element container 10. The resin molded body 20 constitutes a part of the outer shape of the element container 10. From the viewpoint of forward light extraction efficiency, the resin molded body 20 has a light reflectance at the emission peak wavelength of the light emitting element 40 of preferably 70% or more, more preferably 80% or more, and 90%. The above is even more preferable. Furthermore, it is preferable that the resin molding 20 is white. The resin molded body 20 is in a fluid state, that is, in a liquid state (including a sol form or a slurry form) before being cured or solidified. The resin molded body 20 can be molded by an injection molding method, a transfer molding method, or the like.

  As the base material of the resin molded body 20, a thermosetting resin or a thermoplastic resin can be used. In addition, the resin shown below includes the modified resin and the hybrid resin. Thermosetting resins are preferable because they are superior in heat resistance and light resistance, have a long life, and have high reliability compared to thermoplastic resins. Examples of the thermosetting resin include epoxy resin, silicone resin, polybismaleimide triazine resin, polyimide resin, polyurethane resin, and unsaturated polyester resin. Especially, any one of an epoxy resin, a silicone resin, and an unsaturated polyester resin is preferable. In particular, unsaturated polyester resins and modified resins and hybrid resins thereof are preferable because they can be molded by an injection molding method and have excellent mass productivity while having excellent heat resistance and light resistance of thermosetting resins. Specific examples include resins described in JP2013-153144A, JP2014-207304A, JP2014-123672A, and the like. Moreover, as a base material of a resin molding, a cheap thermoplastic resin compared with a thermosetting resin is also preferable. Examples of the thermoplastic resin include aliphatic polyamide resin, semi-aromatic polyamide resin, aromatic polyphthalamide resin, polycyclohexylenedimethylene terephthalate, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polycarbonate resin, and the like. Among these, any one of aliphatic polyamide resin, polycyclohexane terephthalate, and polycyclohexylene dimethylene terephthalate is preferable. From the viewpoint of light reflectivity, mechanical strength, thermal stretchability, and the like, the resin molded body 20 preferably contains the following white pigment and filler in the base material, but is not limited thereto.

White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, etc. Is mentioned. A white pigment can be used alone or in combination of two or more thereof. Among these, titanium oxide is preferable because it has a relatively high refractive index and is excellent in light shielding properties. The shape of the white pigment can be selected as appropriate, but may be indefinite (crushed), but is preferably spherical from the viewpoint of fluidity. White pigment particle size (hereinafter "particle size" is defined by the mean particle diameter _{D 50} for example) may be appropriately selected, preferably 0.01μm or 1μm or less, more preferably 0.1μm or 0.5μm or less . The content of the white pigment in the resin molded body 20 can be selected as appropriate, but it is better from the viewpoint of light reflectivity of the resin molded body 20, but considering the influence on the fluidity, it is 20 wt% or more and 70 wt% or less. Is preferable, and 30 wt% or more and 60 wt% or less is more preferable. Note that “wt%” is weight percent and represents the ratio of the weight of each material to the total weight of all constituent materials.

  Examples of the filler include silicon oxide, aluminum oxide, glass, potassium titanate, calcium silicate (wollastonite), mica, and talc. The filler can be used alone or in combination of two or more thereof. However, the filler is different from the white pigment. In particular, as a reducing agent for the thermal expansion coefficient of the resin molded body 20, silicon oxide (particle diameter is preferably 5 μm to 100 μm, more preferably 5 μm to 30 μm) is preferable. As the reinforcing agent, glass, potassium titanate, and calcium silicate (wollastonite) are preferable. Among these, calcium silicate (wollastonite) or potassium titanate has a relatively small diameter and is suitable for a thin or small resin molded body 20. Specifically, the average fiber diameter of the reinforcing agent can be appropriately selected. For example, the average fiber diameter is 0.05 μm to 100 μm, preferably 0.1 μm to 50 μm, more preferably 1 μm to 30 μm, and more preferably 2 μm to 15 μm. Even more preferable. The average fiber length of the reinforcing agent can be selected as appropriate. For example, the average fiber length is from 0.1 μm to 1 mm, preferably from 1 μm to 200 μm, more preferably from 3 μm to 100 μm, and even more preferably from 5 μm to 50 μm. The average aspect ratio (average fiber length / average fiber diameter) of the reinforcing agent can be appropriately selected. For example, it is 2 or more and 300 or less, preferably 2 or more and 100 or less, more preferably 3 or more and 50 or less, and more preferably 5 or more and 30 or less. Even more preferable. The shape of the filler can be selected as appropriate, but may be indefinite (crushed), but is preferably fibrous (needle-like) or plate-like (scale-like) from the viewpoint of function as a reinforcing agent, and from the viewpoint of fluidity. A spherical shape is preferred. The content of the filler in the resin molded body 20 may be determined as appropriate in consideration of the thermal expansion coefficient, mechanical strength, etc. of the resin molded body 20, but is preferably 10 wt% or more and 80 wt% or less, and 30 wt% or more and 60 wt%. The following is more preferable (of which the reinforcing agent is preferably 5 wt% or more and 30 wt% or less, more preferably 5 wt% or more and 20 wt% or less).

(Lead electrode 30)
The lead electrode 30 constitutes a pair of positive and negative terminals (electrodes) in the element container 10. There may be at least one pair of lead electrodes 30 in one element container 10, but there may be three or more lead electrodes 30. The plurality or all of the lead electrodes 30 in one element container 10 may extend from a plurality of outer surfaces facing different directions of the resin molded body 20, but face one direction of the resin molded body 20. It is preferable to extend from one outer surface. The lead electrode 30 is obtained by subjecting a flat plate of copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, or an alloy thereof to various processes such as pressing (including punching), etching, and rolling. It becomes. The lead electrode 30 may be composed of a laminate of these metals or alloys, but it may be simple to be composed of a single layer. In particular, copper alloys (phosphor bronze, iron-containing copper, etc.) mainly composed of copper are preferable. Further, a light reflecting film such as silver, aluminum, rhodium or an alloy thereof may be provided on the surface, and silver or a silver alloy excellent in light reflectivity is particularly preferable. In particular, a silver or silver alloy film (for example, a plating film) using a sulfur-based brightener has a smooth film surface and extremely high light reflectivity. In addition, sulfur and / or sulfur compounds in the brightener are scattered in the crystal grains of silver or silver alloy and / or in the crystal grain boundaries (the sulfur content is, for example, 50 ppm or more and 300 ppm or less). The glossiness of the light reflecting film can be appropriately selected, but is preferably 1.5 or more, and more preferably 1.8 or more. The glossiness is a value measured using a digital densitometer model 144 manufactured by GAM (Graphic Arts Manufacturing). The thickness of the lead electrode 30 can be selected as appropriate. For example, the thickness is 0.05 mm to 1 mm, preferably 0.07 mm to 0.3 mm, and more preferably 0.1 mm to 0.2 mm. The lead electrode 30 may be a small piece of a lead frame, for example.

(Light emitting element 40)
The light emitting element 40 may be a semiconductor light emitting element such as a light emitting diode (LED) element. The light emitting element 40 includes a substrate in many cases, but may be any element having at least an element structure composed of various semiconductors and a pair of positive and negative (pn) electrodes. In particular, a light emitting element of a nitride semiconductor (In _x Al _y Ga _1-xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of emitting light in the ultraviolet to visible region is preferable. The emission peak wavelength of the light emitting element 40 is preferably in the range of 445 nm to 465 nm from the viewpoints of light emission efficiency, color mixing relationship with light from other light sources, excitation efficiency of fluorescent materials, and the like. In addition, a light emitting element of green to red light emitting gallium arsenide or gallium phosphorus semiconductor may be included. In the case of the light emitting element 40 in which a pair of positive and negative electrodes is provided on the same surface side, each electrode is connected to the pair of lead electrodes 30 with a wire 60 (face-up mounting). Each electrode may be connected to the pair of lead electrodes 30 by a conductive adhesive member (flip chip mounting (face-down mounting)). In the case of the light emitting element 40 having a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, the lower electrode is bonded to one lead electrode 30 with a conductive adhesive member, and the upper electrode is connected to the other with a wire 60. The lead electrode 30 is connected. The number of light emitting elements 40 mounted in one element container 10 may be one or plural. The plurality of light emitting elements 40 can be connected in series or in parallel by wires 60. For example, three light emitting elements 40 of blue, green, and red light emission may be mounted in one element container 10.

(Coating 50)
The coating 50 may be a simple single layer film, but the gas barrier property can be further enhanced by using a multilayer film. The film thickness of the coating 50 can be selected as appropriate, but from the viewpoint of gas barrier properties and translucency, it is preferably 1 nm to 1000 nm, more preferably 5 nm to 500 nm, and more preferably 10 nm to 100 nm. Is even more preferred. The film 50 can be formed by at least one of sputtering, vapor deposition, atomic layer deposition, printing, and spraying, for example. Among these, the sputtering method is preferable from the viewpoints of both mass productivity and film quality. The atomic layer deposition method is preferable from the viewpoint of easily forming a dense and extremely high gas barrier property film.
When the coating 50 is provided on the outward face 30ao of the outer lead portion, the solderability of the light emitting device may be reduced. Therefore, the coating 50 is preferably formed on the inward surface 30ai of the outer lead portion facing the first outer surface 20a by an anisotropic film forming method such as sputtering or printing.
When an isotropic film formation method such as atomic layer deposition is used, after the coating 50 is formed on the entire outer lead portion 30a, the coating provided on the outward surface 30ao of the outer lead portion is removed by blasting or the like. Then, it is preferable to expose the outward face 30ao of the outer lead portion from the coating 50.

(Wire 60)
The wire 60 is a conducting wire that connects the electrode of the light emitting element 40 and the lead electrode 30. The wire 60 can also be used for connection between the electrode of the protection element 90 and the lead electrode 30. Specifically, a metal wire of gold, copper, silver, platinum, aluminum, palladium, or an alloy thereof (herein, “metal” includes an alloy) can be used. In particular, a gold wire or a gold alloy wire that is less likely to break due to stress from the sealing member 70 and has excellent thermal resistance or the like is preferable. In order to improve light reflectivity, at least the surface may be made of silver or a silver alloy. The wire diameter of the wire 60 can be selected as appropriate, but is preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 30 μm or less.

(Sealing member 70)
The sealing member 70 is a member that seals the light emitting element 40 and protects it from dust, moisture, external force, and the like. The sealing member 70 has electrical insulation and is light-transmitting with respect to light emitted from the light emitting element 40 (light transmittance at the emission peak wavelength of the light emitting element 40 is preferably 60% or more, 70% or more is more preferable, and 80% or more is even more preferable. The sealing member 70 preferably contains at least a fluorescent substance in the base material, but is not limited thereto. The sealing member 70 is preferably present, but is not always necessary.

  Examples of the base material of the sealing member 70 include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, and modified resins or hybrid resins thereof. Among these, the silicone resin (silicone resin and its modified resin and hybrid resin) has a low elastic modulus and particularly excellent heat resistance and light resistance, but has a relatively high gas permeability. It is easy to produce an effect. Silicone resins containing a phenyl group (methyl / phenylsilicone resin to diphenylsilicone resin) are preferable among silicone resins because of their relatively high heat resistance and gas barrier properties. Of all organic groups bonded to silicon atoms in the silicone resin containing a phenyl group, the phenyl group content is, for example, 5 mol% to 80 mol%, preferably 20 mol% to 70 mol%, preferably 30 mol%. More preferably, it is 60 mol% or less.

(Fluorescent substance 80)
The fluorescent material 80 absorbs at least a part of the primary light emitted from the light emitting element 40 and emits secondary light having a wavelength different from that of the primary light. Thereby, it can be set as the light-emitting device which radiate | emits the mixed color light (for example, white light) of the primary light of the visible wavelength, and secondary light. The fluorescent substance 80 can be used alone or in combination of two or more of the specific examples shown below. Specific examples of phosphors emitting green light to yellow light include yttrium aluminum garnet phosphors (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce), lutetium aluminum garnet phosphors (for example, Lu). ₃ (Al, Ga) ₅ O ₁₂ : Ce), silicate phosphor (eg (Ba, Sr) ₂ SiO ₄ : Eu), chlorosilicate phosphor (eg Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu ), Β sialon-based phosphors (for example, Si _6-z Al _z O _z N _8-z : Eu (0 <Z <4.2)) and the like. Specific examples of phosphors emitting red light include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (for example, (Sr, Ca) AlSiN ₃ : Eu), potassium activated fluorosilicate phosphors (For example, K ₂ SiF ₆ : Mn). In addition, the fluorescent material 80 may include quantum dots. Quantum dots are particles having a particle size of about 1 nm to about 100 nm, and the emission wavelength can be changed depending on the particle size. Examples of the quantum dot include cadmium selenide, cadmium telluride, zinc sulfide, cadmium sulfide, lead sulfide, lead selenide, cadmium telluride / mercury, and the like.
When the sealing member 70 contains a potassium fluorosilicate phosphor as the fluorescent material 80, the portion of the inner lead portion 30 b that is exposed from the resin molded body 20 and forms the bottom of the recess 10 r is covered with the coating 50. It is preferable. This reduces the risk that the fluorine produced by the reaction of the potassium fluorosilicate phosphor with moisture or the like reacts with and corrodes the metal (especially silver or silver alloy) on the surface of the inner lead portion 30b. Can do. In order to avoid the influence of moisture outside the light emitting device 100, the potassium fluorosilicate phosphor having low water resistance is unevenly distributed in a position near the bottom of the recess 10r in the sealing member 70, that is, in the vicinity of the inner lead portion 30b. In such a case, it is particularly preferable.

  Examples of the filler for the sealing member 70 include silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide. As the filler for the sealing member 70, one of these may be used alone, or two or more of these may be used in combination. In particular, silicon oxide is preferable as a reducing agent for the thermal expansion coefficient of the sealing member 70. The shape of the filler of the sealing member 70 can be selected as appropriate, but may be indefinite (crushed), but spherical is preferable from the viewpoint of fluidity. The content of the filler in the sealing member 70 can be selected as appropriate, but may be determined as appropriate in consideration of the thermal expansion coefficient, fluidity, etc. of the sealing member 70, but is preferably 0.1 wt% or more and 50 wt% or less. 1 wt% or more and 30 wt% or less is more preferable. In addition, by using nanoparticles (particles having a particle diameter of 1 nm to 100 nm) as a filler for the sealing member 70, scattering of light having a short wavelength such as blue light (including Rayleigh scattering) of the light emitting element 40 is increased. Accordingly, the amount of the fluorescent material 80 used can be reduced. As the nanoparticle filler, for example, silicon oxide or zirconium oxide is preferable.

(Protective element 90)
The light emitting device 100 according to the present embodiment includes a protective element 90 housed in the recess 10r and electrically connected to the lead electrode 30. The protection element 90 is an element for protecting the light emitting element 40 from static electricity or a high voltage surge. Specifically, for example, a Zener diode (ZD) may be used. The protection element 90 can increase the reliability of the light emitting device 100.

(Adhesive member)
The adhesive member is a member that adheres the light emitting element 40 to the lead electrode 30. The adhesive member can also be used for bonding the protective element 90 to the lead electrode 30. As the insulating adhesive member, an epoxy resin, a silicone resin, a polyimide resin, or a modified resin or a hybrid resin thereof can be used. As the conductive adhesive member, a conductive paste such as silver, gold, palladium, tin-bismuth, tin-copper, tin-silver, gold-tin, or the like can be used.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

<Example 1>
The light emitting device of Example 1 is a side-emitting LED having the structure of the light emitting device 100 of the example shown in FIGS. The light emitting device (element container) has a width of 2.8 mm, a depth of 1.2 mm, and a thickness of 1.0 mm.

  The element container is formed by integrally molding a resin molded body with a first lead electrode (negative electrode) and a second lead electrode (positive electrode). The element container has a recess having a length of 0.87 mm, a width of 2.16 mm, and a depth of 0.55 mm on the front surface. The resin molded body contains 40 wt% titanium oxide white pigment, 25 wt% spherical silicon oxide, and 10 wt% fibrous glass filler in the base material of unsaturated polyester resin. The resin molded body is molded by an injection molding method, and has a gate mark at substantially the center of the rear surface. The gate mark is a protrusion formed by a gate which is a resin injection port of a mold. The first lead electrode and the second lead electrode are small pieces of metal having a thickness of 0.15 mm in which a silver reflective film is formed by plating on a copper alloy base. The 1st lead electrode has the 1st inner lead part in the inside of a resin fabrication object, and the 1st outer lead part in the outside of a resin fabrication object. The second lead electrode has a second inner lead portion inside the resin molded body and a second outer lead portion outside the resin molded body. The inner wall of the recess is configured by the surface of the resin molded body. The bottom of the recess is constituted by the surface of the resin molded body and the surfaces of the first inner lead portion and the second inner lead portion. The first outer lead portion and the second outer lead portion extend from the lower surface, which is the main surface on the mounting side of the resin molded body, and bend forward along the lower surface, and further bend along the left / right side surface.

  One light emitting element and one protective element are accommodated in the recess of the element container. The light-emitting element has an n-type layer, an active layer, and a p-type layer of a nitride semiconductor stacked on a sapphire substrate in order to emit blue light (emission peak wavelength of about 455 nm), 0.55 mm long and 0.55 mm wide. A rectangular parallelepiped LED chip having a thickness of 0.20 mm. The light emitting element is bonded to the first inner lead portion with an adhesive member, and the n electrode and the p electrode are connected to the first inner lead portion and the second inner lead portion by wires. The adhesive member is an epoxy-silicone hybrid resin. The wire is a gold wire having a wire diameter of 25 μm. The protective element is a rectangular parallelepiped ZD chip having a length of 0.15 mm, a width of 0.15 mm, and a thickness of 0.10 mm. The protective element is bonded to the second inner lead part with an adhesive member of silver paste, and is connected to the first inner lead part by a wire (the same gold wire as that for the light emitting element).

  A sealing member is filled in the recess of the element container so as to cover the light emitting element, the protection element, and the wire. The sealing member has a methyl phenyl silicone resin as a base material, a YAG: Ce-based phosphor capable of emitting yellow-green (emission peak wavelength of about 560 nm), and 0.4 wt% spherical oxidation. And a silicon filler. The front surface of the sealing member is substantially the same surface as the front surface of the resin molding (specifically, a slight concave surface due to curing shrinkage). A large amount of fluorescent material is present on the bottom side of the recess in the sealing member.

  The inwardly facing surfaces of the first outer lead portion and the second outer lead portion facing the resin molded body are covered with a silicon oxide film having a thickness of about 50 nm formed by sputtering. Further, the inwardly facing surfaces of the first outer lead portion and the second outer lead portion facing the lower surface of the resin molded body and the coating thereon extend from the boundary with the lower surface of the resin molded body to a position facing the recess. ing. Further, the coating continuously forms the surface of the resin molded body constituting the inner wall and bottom of the recess, the surfaces of the first inner lead portion and the second inner lead portion constituting the bottom of the recess, the light emitting element, the protection element, and the wire. Covered. On the other hand, the outward surfaces of the first outer lead portion and the second outer lead portion are not covered with such a coating, that is, the silver surface is exposed.

  The light emitting device of Example 1 configured as described above can achieve the same effects as the light emitting device 100 of Embodiment 1.

  A light emitting device according to an embodiment of the present invention includes a backlight device for a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guidance, a projector device, a digital video camera, a facsimile, a copy It can be used for an image reading apparatus in a machine, a scanner or the like.

10 ... Element container (10r ... Recess)
20 ... Resin molding (20a ... 1st outer surface, 20b ... 2nd outer surface, 20c ... 3rd outer surface)
30 ... Lead electrode (30a ... Outer lead portion (30ai ... Inward surface, 30ao ... Outward surface), 30b ... Inner lead portion)
DESCRIPTION OF SYMBOLS 40 ... Light emitting element 50 ... Film 60 ... Wire 70 ... Sealing member 80 ... Fluorescent substance 90 ... Protection element 100 ... Light emitting device

Claims (13)

A resin molded body having a first outer surface facing the first direction and a second outer surface facing the second direction perpendicular to the first direction; and a lead electrode held by the resin molded body. An element container in which a recess including the lead electrode at the bottom is formed on the second outer surface;
A light emitting device comprising a light emitting element housed in the recess and electrically connected to the lead electrode,
The lead electrode includes an outer lead portion extending from the first outer surface and bent toward the second outer surface;
In the outer lead portion, the inward surface facing the first outer surface is covered with a translucent film, and the outer surface opposite to the inward surface is exposed from the film,
The light emitting device, wherein the first direction is a mounting direction of the light emitting device.   The light-emitting device according to claim 1, wherein the inward surface and the coating are present at positions facing the recess. The resin molded body has a third outer surface facing a third direction perpendicular to the first direction and the second direction;
The light-emitting device according to claim 1, wherein the inward surface and the coating film are present at positions facing the third outer surface.   The light emitting device according to any one of claims 1 to 3, wherein the inward surface and the outward surface are made of silver or a silver alloy.   5. The light emitting device according to claim 1, wherein a surface of the lead electrode that forms a bottom of the concave portion is covered with the coating film.   The light emitting device according to claim 1, wherein the light emitting element is covered with the film. Further comprising a wire connecting the light emitting element and the lead electrode at the bottom of the recess,
The light emitting device according to claim 1, wherein the wire is covered with the film.   The light emitting device according to claim 7, wherein a surface of the wire is made of silver or a silver alloy.   The coating is an oxide or nitride or oxynitride of at least one element of silicon, aluminum, gallium, niobium, tantalum, yttrium, and hafnium, or at least one of magnesium, calcium, barium, and lithium The light emitting device according to any one of claims 1 to 8, wherein the light emitting device is made of an elemental fluoride.   The light emitting device according to any one of claims 1 to 9, wherein a thickness of the resin molded body in a direction parallel to the first direction is 1.2 mm or less.   The light-emitting device according to claim 1, further comprising a sealing member that contains a fluorescent material that emits light by absorbing light of the light-emitting element and is filled in the recess.   The light-emitting device according to claim 1, wherein a base material of the resin molded body is a thermosetting resin.   The light emitting device according to any one of claims 1 to 12, wherein a base material of the resin molded body is an unsaturated polyester resin, a modified resin thereof, or a hybrid resin.

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